Abstract: A heat exchanger comprises a housing, a guide member, a return member and a discharge member. The housing includes a plurality of parallel flow passages. The housing includes a first end face and a second end face each having openings. The guide member, the return member and the discharge member are fixed to the first end face or the second end face. The plurality of flow passages are connected by the return member into a single flow passage. The guide member and the discharge member are provided in the opening on a most upstream side and a most downstream of the single flow passage, respectively. At least one of the guide member, the return member and the discharge member integrally includes an attachment portion attached to the housing; and a protruding portion protruding more than the attachment portion toward the housing and including an inclined surface.

Abstract: A multi-functional touch cooling cup holder includes an annular socket that can accommodate a beverage can or water bottle. At the top of the socket there is a bended edge that is larger than a cylinder of the socket and at the bottom of the socket there is an annular bottom cap. On the cylinder of the socket there is a vertical slot, within which there is a control circuit of the cup holder that is equipped with IC chip. A thermal radiator is installed under the bottom cap. The radiator contains multiple paralleled radiation fins and a cooling fan. A thermoelectric cooler that is installed between the thermal radiator and the thermal conductor and is electrically connected with the control circuit of the cup holder. The cooling side of the thermoelectric cooler faces up, the thermal side faces down and is adhered to the top of the thermal radiator.

Abstract: In certain embodiments, a system for cooling heat-generating components includes an engine cooling system operating to circulate a liquid coolant at a first temperature for the cooling of one or more engine components within the vehicle. A liquid cooler unit may receive the liquid coolant at the first temperature and decrease the temperature of the liquid coolant to a second temperature. A heat-generating component may be coupled to the liquid cooler unit and receive the liquid coolant at the second temperature. Heat generated by the heat-generating component may be transferred to the liquid coolant. A fluid return line may couple the heat-generating component to the engine cooling system. The fluid return line returns the liquid coolant that has received the heat from the heat-generating component to the engine cooling system.

Abstract: A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

Abstract: A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements.

Abstract: A distributed refrigeration appliance system in a residential kitchen and other locations in a dwelling including multiple separate refrigeration appliance modules, a central cooling system and a cooling circuit. The system can also include one or more satellite stations having a heat exchanger and arranged for supplying chilled air to one or more refrigeration appliance modules. One or more refrigeration appliance modules can include a thermal cascade cooling device to cool the module to lower temperatures than the cooling circuit can attain. One or more refrigeration appliance modules can be refrigeration/storage modules that can provide refrigerated, unconditioned or heated storage space. The central cooling system can be a vapor compression system having a refrigerant circuit connecting the modules. Alternately, the central cooling system can cool a secondary cooling medium circuit.

Abstract: The air-conditioning core includes a plurality of first Peltier devices, a plurality of first fins and a tube. Each of the first Peltier devices has a first surface and a second surface. The first fins are located on the first surfaces of the first Peltier devices. The tube is located adjacent to the second surfaces of the first Peltier devices. The tube has a main portion extending around the second surfaces of the first Peltier devices and also around the first fins for holding the first Peltier devices, an inlet portion connected to the main portion for allowing heat exchange medium of liquid to flow into the main portion, and an outlet portion connected to the main portion for allowing the heat exchange medium of liquid to flow out of the main portion. The outlet portion is located adjacent to the inlet portion.

Abstract: In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.

Abstract: A first cooling unit is provided for an exothermic member and has a capability of cooling the exothermic member to a temperature less than an ambient temperature of the exothermic member by absorbing heat from the exothermic member. A second cooling unit has a capability of cooling the exothermic member by blowing air onto the exothermic member. A temperature of the exothermic member is detected. It is determined that whether or not the exothermic member is in a supercooled state based on a detection result. The cooling capability of the first cooling unit is decreased and the cooling capability of the second cooling unit is increased, when the exothermic member is in the supercooled state.

Abstract: A modular solid-state lamp has a plurality of replaceable and rearrangeable modules. The modular lamp uses active cooling and passive cooling for thermal management. One cooling system for the modular lamp includes at least one active cooling device and a graphite heat sink in thermal contact with the at least one active cooling device to further enhance the efficiency of the cooling system. The modular solid-state lamp includes at least two modules, a power supply module and a light source module. The power supply module includes a power supply and LED driver that are able to power one or more light source modules. The power supply module further includes sensors that further improve the energy-efficiency of the lamp.

Abstract: This invention is intended to provide a mechanical building block system independent of mechanical tolerances of generator stack elements consisting of multiple parallel in plane elements that can be mass produced and mass assembled without sorting or lapping or machining in place. This implementation allows for simple maintenance of interchangeable unmatched parts.

Abstract: The invention relates to a method and an apparatus for detecting the point in time of commencement of crystallization of a heat storage material (40), in particular a latent heat storage material, which is supercooled by means of a Peltier element (32). The profile (10) of the current I of the Peltier element (32) is measured. The commencement of the crystallization process in the heat storage material (40) is deduced when a discontinuity (20, 22) which follows a continuous decrease (16) in the current and after which the current (I) increases again (18) is detected in the current profile (10).

Abstract: According to certain aspects of the disclosure, an ice and cold water dispensing assembly for a refrigeration appliance is disclosed including a reservoir holding water having a water level and an ice maker for making ice cubes to be held within the water within the reservoir. Structure is provided on the reservoir allowing the reservoir to be removably attached to the refrigeration appliance. A handle and a spout are attached to the reservoir and are configured for allowing manual dispensing of ice cubes or water from the reservoir when the reservoir is removed from the refrigeration appliance. An ice dispenser and a water dispenser are provided in the refrigeration appliance for dispensing ice cubes or water respectively from the reservoir when the reservoir is attached to the refrigeration appliance. Related refrigeration devices are also disclosed.

Abstract: A temperature control system (400) for a liquid comprises two sets of temperature control elements oppositely disposed to one another and define between them a temperature control zone. A conduit system within the temperature control zone defines a liquid flow path (300, 302) that is configured to have one or more first segments in proximity to and in heat-conducting association with one of the two sets and one or more second segments in proximity to and in heat-conducting association with the other of the two sets. The temperature control system (400) may be used as a liquid cooling or heating module in a cold liquid dispensing device or system, such as a drinking water or other beverage dispensing device.

Abstract: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.

Abstract: A heat exchanger for installation in a motor vehicle includes a cooling channel, a heating channel, and heat pipes to thermally couple the cooling channel with the heating channel. A thermoelectrical generator is arranged on a cold side of at least one of the heat pipes and coupled with the heat pipe by a material joint. The material joint is realized by a liquid metal.

Abstract: A cooling system for cooling a heat source and a projection apparatus having the same are disclosed. The cooling system includes a heat dissipating device and a thermoelectric cooler (TEC). The heat source is disposed on the side of the heat dissipating device. The TEC is disposed on the other side of the heat dissipating device corresponding to the heat source. The TEC is initiated as the temperature of the heat source is greater than the first value, while the TEC is shut off as the temperature of the heat source is lower than the second value. Therefore, the cooling system economizes the energy by controlling the operation of the TEC according to the temperature of the heat source.

Abstract: A Thermoelectric Cooling (TEC) device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end; a cooling medium is disposed in the second heat exchange device, and is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner; and the evaporation end adjoins the hot end of the TEC module.

Abstract: A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers.

Abstract: The air conditioner includes an air-conditioning core, a first air-conditioning passage, a liquid passage and a second air-conditioning passage. The core includes a Peltier device having first and second surfaces, a first surface-side passage and a second surface-side passage. The second surface-side passage has a first passage and a second passage that transfer heat therebetween. The first air-conditioning passage is connected to the first surface-side passage for allowing first air-conditioning air in the first air-conditioning passage to flow through the first surface-side passage. The liquid passage is connected to the first passage for allowing liquid that serves as a heat transfer medium to flow through the first passage. The second air-conditioning passage is connected to the second passage for allowing second air-conditioning air in the second air-conditioning passage to flow through the second passage.

Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Abstract: The air-conditioning heat exchanger includes a plurality of Peltier devices, a plurality of first heat transfer members, a plurality of second heat transfer members, an air-conditioning passage and a heat exchange medium passage. The air-conditioning passage has therein the Peltier devices and the first heat transfer members. The air-conditioning passage allows air to be air-conditioned to flow therethrough. The air-conditioning passage has a plurality of divided passages at least at positions that are downstream of upstream ends of the first heat transfer members with respect to an air flowing direction in which the air flows through the air-conditioning passage. The Peltier device in each divided passage is controlled separately from the Peltier device in other divided passage. The heat exchange medium passage has therein the second heat transfer members and allows fluid to flow through the heat exchange medium passage.

Abstract: A self-cooled electronic component comprising a vertical monolithic circuit, in which the vertical monolithic circuit is electrically connected in series with a Peltier cooler so that the D.C. current flowing through the circuit supplies the cooler and in which the circuit and the cooler are placed against each other so that the cold surface of the cooler is in thermal contact with the circuit.

Abstract: A dynamic switching thermoelectric thermal management system and method is disclosed. The thermal management system includes a heat dissipation device, a thermoelectric module, an ambient temperature sensor, a heat source temperature sensor, an energy storage device and a controller. One side of the thermoelectric module is thermally coupled to the heat source and another side is thermally coupled to the heat dissipation device. The controller periodically samples the temperature sensors and dynamically switches the thermoelectric module between a power generation mode in which the thermoelectric module uses the temperature difference between the heat source and ambient to charge the energy storage device, a cooling mode in which the thermoelectric module is powered to create a voltage difference across the thermoelectric module to cool the heat source, and an idle mode. The thermal management system can be integrated into a portable electronic device, for example a portable computing device.

Abstract: According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.

Abstract: A cooling system including a first cooling apparatus thermally exposed to a space to be cooled. The cooling system further includes a second cooling apparatus thermally exposed to the space to be cooled and thermally exposed to the first cooling apparatus. Heat discharged from the second cooling apparatus powers the first cooling apparatus.

Abstract: The invention discloses a temperature variation apparatus for varying the temperature of a liquid. The temperature variation apparatus includes a metal tube, a power supply, a heat conductor, and a thermo-electric cooler (TEC). The liquid is poured into the metal tube. The power supply has an anode and a cathode respectively connected to two ends of the metal tube, so that the metal tube can be electrified to generate heat. The heat conductor encircles and contacts with the metal tube, and the thermo-electric cooler contacts with the heat conductor.

Abstract: An auxiliary air conditioning apparatus may include a blower unit, wherein a blower may be provided therein to forcibly blow intake air, a temperature control unit fluid-connected to the blower unit to receive air blown from the blower unit, wherein the temperature control unit includes an evaporator and a heater therein and may be connected to an air duct to exhaust air that may be cooled by the evaporator or heated by the heater, an auxiliary temperature control unit fluid-connected to the blower unit to receive air blown from the blower unit and fluid-connected to the air duct, wherein the auxiliary temperature control unit includes a heat exchanger core provided therein, the heat exchanger core having a thermoelectric device, an auxiliary power supply supplying electrical power to the blower and the heat exchanger core, and an auxiliary cooling/heating control unit controlling operation of the blower and the heat exchanger unit.

Abstract: Provided is an apparatus for controlling temperature of a black body. The apparatus includes a black body emitting radiant energy of infrared rays; a first Peltier element adjacent to the black body, the first Peltier element having a 1a surface and a 1b surface that selectively emit or absorb heat; a copper plate adjacent to the 1b surface; a second Peltier element adjacent to the 2b surface, the second Peltier element having a 2a surface and a 2b surface that selectively emit or absorb heat; a heat transfer member comprising a bent surface adjacent to the 2a surface, and an arm extending toward both ends of the black body to be adjacent to the both ends of the black body and a control unit controlling the 2a surface to emit heat when the 1a surface emits heat, and the 2a surface to absorb heat when the 1a surface absorbs heat.

Abstract: A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

Abstract: The invention is new types of split-thermo-electric structures for cooling, heating, or stabilizing the temperature of an object or for electric power generation. In a first type of structure the transport of the electric current between the heat absorbing and the heat dispersing sides of the structure is disengaged from the flow of heat between the sides of the thermo-electric structure. In a second type of structure a layer of thermo-electric material on the heat absorbing side of the structure is connected by connection layers to two or more layers of thermo-electric material on the heat dispersing side of the structure. In a third type of structure the elements of which the structure is comprised are arranged to cause different values of electric current to flow at the heat absorbing and the heat dispersing sides of the structure and through different elements in the interior of the structure.

Abstract: Disclosed herein are a cooling and heating water system using a thermoelectric module and a method of manufacturing the same. The cooling and heating water system using a thermoelectric module includes first and second substrates disposed to be spaced apart from each other, while facing each other; a cooling water line formed in the first substrate so as to flow cooling water therethrough; a heating water line formed in the second substrate so as to flow heating water therethrough; first and second insulating layers disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric device interposed between the first and second insulating layers, whereby it is possible to variously control a temperature of drinking water without generating noise by using the thermoelectric module in cooling the drinking water.

Abstract: A system for controlling the temperature of a passenger cabin has a tube for receiving a heat transfer fluid from an engine and a number of heating coils being thermally connected to the tube. The system also has a number of thermo-electric heat pumps connected to the tube. The heat transfer fluid is modulated for controlling the temperature of the passenger cabin at a number of different points of the passenger cabin.

Abstract: A thermoelectric module includes a first substrate, a second substrate having a second surface which is apart from and faces a first surface of the first substrate, a plurality of thermoelectric elements arranged on the first and the second surfaces, a plurality of electrodes on the first and second surfaces each electrically connected to at least one of the plurality of thermoelectric elements, and a ground electrode on at least the first surface. The plurality of electrodes on at least the first surface comprises a plurality of columns each of which comprises two or more electrodes aligned in a longitudinal direction, and the ground electrode is between two adjacent columns among the plurality of columns.

Abstract: A chilled probe for quickly and conveniently cooling a liquid is positioned to permit a user to insert the probe into the liquid to be cooled. Feedback, in the form of an indication of a representative liquid temperature, is also provided to increase the value of the method and apparatus. Individual sleeves are conveniently provided on a roll to keep the chilled probe from coming into direct contact with the liquid, thereby avoiding contamination between liquid samples being cooled.

Abstract: A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.

Abstract: Embodiments of the present invention provide a device for personal heat control, including a flexible housing comprising a cooling surface, a heating surface thermally insulated from the cooling surface, and a heat transfer unit configured to transfer heat from cooling surface to heating surface. Other embodiments of the present invention provide a system for cooling wearers of impact-resistant helmets, including an impact-resistant outer shell, foam pads affixed to an inside of the impact-resistant outer shell and configured to rest on a wearer's head, thermoelectric cooling devices spaced to avoid interference with foam pads and configured to rest against the head, a heat sink, and heat pipes thermally coupled at one end to thermoelectric cooling devices and at another end to the heat sink, and configured to transfer heat from thermoelectric cooling devices to heat sink with minimal heat loss, the heat pipes spaced to avoid interference with the foam pads.

Abstract: A system and method for controlling ventilation in a bed (mattress) includes an user-controlled air conditioning control system for generating and supplying a conditioned air flow to a distribution layer/system located on or near the mattress. The distribution layer/system includes a spacer structure surrounded by fabric material(s) and configured to receive the conditioned air flow and provide a cooling or heating effect to a body adjacent the mattress.

Abstract: Provided are methods, devices and systems for controlled removal of thermal energy from a fluid within a thermally conducting metal conduit. The system allows for the in situ formation of a reversible plug that can stop the flow of fluid through the conduit, particularly without inducing thermally induced stress fractures or breaches in the conduit. The devices and systems include a thermal transfer device that can be adapted to be in thermal communication with a thermal conducting metal conduit containing a fluid, particularly a flowing fluid. The devices and systems allows for controlled re-heating of the conduit without inducing thermally induced stress fractures or breaches in the conduit to restore fluid flow through the conduit.

Abstract: A thermal management system includes a first thermoelectric module, a second thermoelectric module, and a heat exchanger. The heat exchanger has a pipe having a first section, a second section and an intermediate section arranged between the first section and the second section. The intermediate section maintains the first section and the second section in spaced apart planes and the first thermoelectric module is thermally attached to the first section and the second thermoelectric module is thermally attached to the second section. The first thermoelectric module is spaced apart from the second thermoelectric module to enable fluid to flow between the first thermoelectric module and the second thermoelectric module.

Abstract: Example personal beverage warmers and coolers for vehicle seats are disclosed. A disclosed example apparatus to regulate the temperature of a beverage near a seat of a vehicle, the apparatus includes: a base including a thermally conductive material that conducts heat in a direction that is at least one of to or from a container seated thereon, a thermoelectric device thermally coupled with the base and to be energized to exchange heat with the base, and a heat exchanger thermally coupled with the thermoelectric device and a liquid medium to exchange heat therebetween.

Abstract: In a stacked semiconductor device, a Peltier element may be incorporated as a distributed element so as to provide active heat transfer from a high power device into a low power device, thereby achieving superior temperature control in stacked device configurations. For example, a CPU and a dynamic RAM device may be provided as a stacked configuration, wherein waste heat of the CPU may be efficiently distributed into the low power memory device.

Abstract: A refrigerated point-of-use food holding cabinet keeps food products cold in compartments having cross sections that are substantially U-shaped. Food products are kept refrigerated using heat-absorbing, heat-exchangers thermally coupled to the U-shaped compartment. Refrigeration is provided by either a conventional reversed-Brayton cycle, one or more Peltier devices or a chilled, re-circulating liquid that does not change phase as it circulates but which is chilled by another refrigeration system, such as a conventional refrigeration system. An optional cover helps prevent food flavor transfers between compartments. Semiconductor temperature sensors and a computer effectuate temperature control.

Abstract: A temperature control apparatus for a hard disk drive includes a thermal chamber for receiving the hard disk drive. The apparatus also includes an oscillatory air movement generator for generating air movement within a region between the thermal chamber and the hard disk drive when the hard disk is received in the thermal chamber, thereby to facilitate heat transfer between the thermal chamber and the hard disk drive.

Abstract: A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: The sports fan cooling station is specifically designed for the sports fan(s) who enjoys outdoor sporting events. This cooling station utilizes the thermoelectric cooler peltier effect and AC power to cool individuals and beverages. The cooling station has a cooling hood that blocks the sunlight and cools the sports fan in a high heat stress environment. It also has a beverage cooler that cools beverages for the sports fan. In addition, the cooling station can be connected to multiple cooling hoods which can cool multiple sports fans at the same time. The cooling station is compact and portable. With this cooling station, sports fans can enjoy a sporting event and not worry about suffering from heat stress caused by hot weather.

Abstract: An auxiliary cooling device is used in another main cooling device, such as a refrigerator. The auxiliary cooling device includes a thermoelectric element, such as a Peltier element, which includes a heat source and a heat sink. The heat sink is used to directly or indirectly cool an item, such as a bottle of liquid. The heat source, which is insulated from the heat sink, is in close thermal contact with a heat exchange fluid in a container. The heat exchange fluid is used as a thermal buffer for the waste heat generated by the cooling process. That waste heat may be transmitted into the main storage chamber of the main cooling device.

Abstract: A current source and method of producing the current source are provided. The current source includes a metal source, a buffer layer, a filter and a collector. An electrical connection is provided to the metal layer and semiconductor layer and a magnetic field applier may be also provided. The source metal has localized states at a bottom of the conduction band and probability amplification. The interaction of the various layers produces a spontaneous current. The movement of charge across the current source produces a voltage, which rises until a balancing reverse current appears. If a load is connected to the current source, current flows through the load and power is dissipated. The energy for this comes from the thermal energy in the current source, and the device gets cooler.

Abstract: A temperature control system is provided for efficiently controlling the temperature of an optical transmitter such as a laser diode. The temperature control system of the present invention reduces power consumption and achieves a higher efficiency by employing a voltage controller and a high-efficiency DC-DC step-down converter between the TEC controller, which drives the thermoelectric cooler, and the microcontroller, which governs the optical transmitter operation. The voltage controller converts an analog voltage command signal into a current-based command signal, which is then sent to the DC-DC step-down converter. The DC-DC converter produces a stepped-down voltage which it supplies to the TEC controller. The TEC controller receives the stepped-down voltage input from the DC-DC converter and outputs a corresponding current signal to the thermoelectric cooler.