Abstract: The electrical junctions of either or both sides of a thermoelectric module are placed in direct thermal contact with a heat source or sink or a material to be thermally modified (that is, heated or cooled), thereby eliminating the conventional substrate typically found in such modules and its associated thermal resistance. In one embodiment, the conductive junction passes through a conduit carrying a material to be heated or cooled. In the conduit, the conductive material can be configured into an effective heat transfer shape such as a vane which extends through non-conducting conduit walls. In another embodiment, the geometry of the conductor forming the electrical junction forms a pipe or tube through which material to be heated or cooled is passed. A protection layer of high thermal conductivity can be applied to the conductive surfaces in order to prevent corrosion or short-circuiting of the device in applications where an electrolytic or ionic fluid is passed by the junction.

Abstract: An improved continuous process and apparatus for treating an impure liquid to produce purified liquid, particularly, water, the process having an electrically activating a thermoelectric module to provide a first heated surface and a cooler surface; feeding the impure liquid to the first heated surface to produce vapour of the liquid; and transferring the vapour to the cooler surface to effect heat transfer to the cooler surface, the improvement being directing a minor portion of the vapour to the cooler surface to maintain the cooler surface at a temperature at or near the boiling point of the liquid; and transferring a major portion of the vapour to a condenser remote from the module to effect heat transfer and condensation of the vapour to produce the purified liquid and collecting the purified liquid from the condenser. The process is continuous in that it does not need to be intermittently stopped, or require auxiliary cooling of the module.

Abstract: A heat exchanger for executing heat exchange between heat exchange between heat exchange bodies (6) on a heat radiation side and heat exchange bodies (3) on a heat absorption side, having low thermal resistance and high performance of heat conduction includes heat exchange bodies 6 on a heat radiation side and heat exchange bodies 3 on a heat absorption side, each being disposed hierarchically, thermoelectric conversion element modules 2 interposed between the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side through an insulating coat 16, and having a plurality of thermoelectric conversion elements 12, 13, wherein the insulating coat 16 is formed integrally on a surface of at least one of the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side, and a metal coat 17 keeping electric contact with a surface of the thermoelectric conversion elements 12, 13 on either the heat radiation side or the heat absor

Abstract: The present invention is directed to method and apparatuses for modifying the air of a localized zone to suit personal comfort. This invention includes the heating or cooling of the air in the localized zone with a novel apparatus and inhibiting the concurrent release of byproduct air at undesirable temperatures while using a heat pump. The apparatus includes a thermal storage mass that provides a reservoir for the undesirable heating or cooling effects for later restoration. This restoration would occur at a predetermined time in predetermined amounts, typically when the localized zone is unoccupied.

Abstract: A compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout.

Abstract: A thermal control unit for regulating the temperature of a component or device under test is disclosed. The thermal control unit includes a three-dimensional control structure having a base member and an extension member extending from one surface of the base member to divide the base member into first and second portions. The base member has another surface to thermally couple to the device. The thermal control unit further includes at least one heat transfer assembly in thermal contact with the first portion of the base member and one face of the extension member and at least one other heat transfer assembly in thermal contact with the second portion of the base member and another face of the extension member.

Abstract: A thermoelectric cooling device using heat pipes for heat conducting and dispersing, comprising a multi-bundle of the heat pipe conducting plates installed at the cold end of the thermoelectric cooling member and converged to condenser, a multi-bundle of the heat pipe heat exchangers installed at the hot end of the thermoelectric cooling member with fin plates or fin stripes and converged to the evaporator. It performs a fast cooling and heat dispersing by heat pipes and high efficient phase change and heat transport of the working medium. It can eliminate the heat exchange produced by the heat accumulation on the cold and hot ends, so as to run at the minimum operation temperature differences in order to obtain the maximum cooling capacity.

Abstract: An interruptible thermal bridge system including: a first thermally conductive surface positioned proximate an object which absorbs energy; a second thermally conductive surface thermally connected to the first conductive surface positioned proximate to an object which dissipates energy, a thermal switch positioned between the first and second conductive surfaces for regulating a thermal connection between the first and second surfaces by alternatively switching between a first position, blocking the conductive path and thermally insulating the first conductive surface from the second conductive surface, and a second position, opening the conductive surface with the second conductive surface.

Abstract: The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1.

Abstract: Disclosed is a system for thermally conditioning and pumping a fluid having use as a ventilation system for vehicle seats and other applications. The system includes a thermoelectric heat exchanger having a thermoelectric element configured to pump heat from one body to another body. A pair of heat exchanger elements comprising rotor units are coupled to the thermoelectric element for both transferring heat to and from the thermoelectric element and generating a fluid flow across the thermoelectric element. The conditioned fluid may be placed in thermal communication with a variety of objects, one of which is a vehicle seat to provide localized heating and cooling of a person sitting on the seat.

Abstract: An apparatus for controlling the temperature of a fluid by use of a thermoelectric device comprises at least one temperature control unit, which is composed of a first heat-transfer member having at least one channel, through which the fluid flows, a pair of thermo-modules each incorporating the thermoelectric device, which are placed on opposite surfaces of the first heat-transfer member, and a pair of second heat-transfer members, each of which has a flange on its periphery and is placed on the thermo-module. The temperature control unit is stably held between a pair of holding frames each having an aperture such that each of the holding frames is pressed against the flange of the second heat-transfer member through a sealing material having elasticity, and a part of the second heat-transfer member is exposed through the aperture. This apparatus is capable of cooling the fluid without chlorofluorocarbons (CFCs) used as a coolant for conventional refrigerators.

Abstract: A compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout.

Abstract: A water/air dual cooling method CPU cooling arrangement includes a metal water accumulator attached to the CPU to be cooled, a heat exchanger, a pump adapted to pump water through the metal water accumulator and the heat exchanger, keeping cooling water continuously circulated through the metal water accumulator to carry heat away from the CPU, a heat sink attached to the metal water accumulator, and a fan mounted on the heat sink and adapted to cause currents of air toward the heat sink.

Abstract: A thermal transfer comb includes numerous upwardly extending pins received in spaces around and between the sample containing wells of a well plate. Peltier effect modules are in contact with a base panel of the thermal transfer comb to apply heat to or remove heat from the comb. A heat sink and fan transfer heat from or to the modules.

Abstract: A thermoelectric stirrer for cooling a substance includes a housing formed of thermoelectric material for absorbing heat from the substance and includes a conduit 38 between an input port 18 and an output port 20. A fan 36 is positioned adjacent the input port and is adapted to draw air into the conduit. The air carries heat absorbed by the housing through the output port. A switch 26 is provided for selectively controlling power to the stirrer. A clip 22 is provided to engage the rim of a container and another clip 58 is provided to secure the stirrer to the clothing of a user.

Abstract: A thermoelectric-cooling temperature control apparatus for a semiconductor device fabrication facility maintains a temperature condition, such as the temperature of a wafer, stable during the fabrication process.

Abstract: An electronic device includes a thermally isolated element formed above a substrate such that the thermally isolated element is isolated from the substrate by a cavity, a thermal-to-electrical transducer for converting heat to an electrical signal, an electrical-to-thermal transducer for converting an electrical signal to heat, a functional material whose physical property changes at a particular temperature, and a circuit, formed on the substrate, for controlling the electrical-to-thermal transducer in accordance with a signal received from the thermal-to-electrical transducer. The thermal-to-electrical transducer, the electrical-to-thermal transducer, and the functional material are formed in the thermally isolated element.

Abstract: A first Peltier device Pe1 and at least one second Peltier device Pe2 having a current consumption smaller than that of the first Peltier device Pe1 are connected to each other in series, while a bypass circuit B for diverting an excess current I3 with respect to the second Peltier device Pe2 is connected to the second Peltier device Pe2 in parallel, so that a driving current I1 from a current control section A drives the first Peltier device Pe1 at its optimum operating point, and the excess current I3 with respect to the second Peltier device Pe2 in the driving current I1 is diverted into the bypass circuit B, so as to allow the second Peltier device Pe2 to be driven at its optimum operating point as well, where by the cooling efficiency can be improved. Also, the first and second Peltier devices Pe1, Pe2 are stacked on each other, while all the Peltier devices Pe1, Pe2 are driven by the single common current control section A, so as to attain a smaller size.

Abstract: A heat dissipating apparatus includes a base member that has an upright surrounding wall portion confining a receiving space, and a top wall for closing a top side of the receiving space. The base member is adapted to be disposed on a circuit board with an integrated circuit device accommodated within the receiving space. The top wall is formed with a serpentine fluid groove that opens downwardly, and that has a fluid inlet in fluid communication with a first groove end, and a fluid outlet in fluid communication with a second groove end. A thermoelectric cooling unit is disposed in the receiving space, and has a heat-absorbing side adapted to be placed in contact with a heat-generating side of the integrated circuit device, and a heat-releasing side opposite to the heat-absorbing side. The cooling unit is adapted to separate the integrated circuit device from the fluid groove. A washer member is disposed in the receiving space below the cooling unit.

Abstract: A solar heated sleeping apparatus has a sleeping bag having a rectangular lower portion and a rectangular upper portion wherein the lower and upper portions are partially connected on corresponding edges and partially fastened by a zipper along the remaining edges thereof. The sleeping apparatus includes a plurality of heating elements disposed within an inner liner of the upper portion. The apparatus further includes a solar cell mounted to a flexible panel and being removably coupled to the sleeping bag. The flexible panel with the solar cell may be removed from the sleeping bag and positioned at a selected angle upon adjustable support legs for receiving solar rays thereon. Solar energy received by the solar cell is connected to an inverter for recharging a battery. A control unit coupled to the battery and to the heating coils allows selected heating coils to be energized for heating the sleeping bag.

Abstract: A device for cold and warm fomentations is disclosed. The device has a fomentation head and a heat exchange element control unit. The fomentation head includes a semiconductor heat exchange element. A coolant tank is mounted on the top surface of the heat exchange element. A heat conducting plate is fixed to the bottom surface of the heat exchange element. A far infrared radiation ceramic or metal-coated layer is positioned on the bottom surface of the heat conducting plate. The heat exchange element control unit includes a direct current electric source. A power polarity converting switch circuit is connected to the heat exchange element in parallel with the electric source. A program circuit is connected to the power polarity converting switch circuit at its output terminal. A rush current restricting element is connected to the heat exchange element.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A container useful for keeping food or beverages warm or cold includes a combination lid and tray door assembly. The lid and tray are both coupled to the container and to each other. The tray may be pivoted independently of the lid into a table top position and it may be separated from the container and used as a separate tray. The tray and lid are also pivotable together as an integral door assembly, and the lid is pivotable independently of the tray when the tray is removed or deployed as a table top. The overall height of the container is less than the overall length and the overall width so that the container has a low, stable center of gravity which permits it to be used on an unstable surface, such as an automobile seat, and so that the container does not obstruct movement or view of occupants of an automobile when it is used in an automobile.

Abstract: A Peltier element 4 is fixedly brought in close contact with a surface of a heat exchange block 3 with a large heat capacity which performs heat exchange with an end portion 2a of a heat pipe 2, heat transferring means 5 is disposed on a side of the Peltier element 4 which is opposed to the heat exchange block 3, the heat pipe 2 has at least one heat conduction extending portion 2b projecting from the heat exchange block 3, and heating medium about the heat conduction extending portion 2b is temperature-controlled by the operation control of the Peltier element 4 via the heat exchange block 3 and the heat conduction extending portion 2b of the heat pipe 2.

Abstract: Apparatus and method for sub-ambient cooling using thermoelectric dynamics in conjunction with novel configuration schemes to maximize energy transport to thereby increase the efficiency of thermoelectric cooling. In one form, a junction maximizes energy transport being positioned between and coupled to thermoelectric elements having minimal spacing to provide efficient thermoelectric cooling.

Abstract: A cooler of an optical fiber draw tower, situated below a melting furnace for melting a preform for an optical fiber, for cooling the optical fiber drawn from the preform melted in the melting furnace, includes at least one heat exchanger installed with a predetermined length surrounding the optical fiber drawn from the melting furnace, for cooling the drawn optical fiber. The heat exchanger is formed of a thermoelectric cooler (TEC) for taking electrical energy through one heat absorbing surface to emit heat to the other heat emitting surface and has a tubular shape in which the heat absorbing surface of the TEC surrounds the optical fiber drawn from the melting furnace along the drawing direction by a predetermined length, and the drawn optical fiber is cooled as it passes through the tubular TEC. Also, the cooler further includes an auxiliary cooler attached to the heat emitting surface of the TEC, for cooling the emitted heat.

Abstract: A heat exchanger for executing heat exchange between heat exchange between heat exchange bodies (6) on a heat radiation side and heat exchange bodies (3) on a heat absorption side, having low thermal resistance and high performance of heat conduction includes heat exchange bodies 6 on a heat radiation side and heat exchange bodies 3 on a heat absorption side, each being disposed hierarchically, thermoelectric conversion element modules 2 interposed between the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side through an insulating coat 16, and having a plurality of thermoelectric conversion elements 12, 13, wherein the insulating coat 16 is formed integrally on a surface of at least one of the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side, and a metal coat 17 keeping electric contact with a surface of the thermoelectric conversion elements 12, 13 on either the heat radiation side or the heat absor

Abstract: Apparatus, method, and signal for sub-ambient cooling using thermoelectric dynamics in conjunction with configurations and activation schemes to maximize the mean time between failure (MTBF) of thermoelectric coolers. In one form, a signal is provided which periodically alters the state of the Peltier devices from an active state to a passive state. During the active state the Peltier device provides maximum cooling and during the passive state the Peltier device minimizes thermal leakage while reducing cooling. Preferable implementations provide multiple signals to thermoelectric arrays such that, for a predetermined time, a first set of the arrays are in the active state while a second set of the arrays are in the passive state to thereby minimize failures and maximize the MTBF of the thermoelectric arrays.

Abstract: A computer enclosure cooling unit adapted to current dimensional standards which is capable of controlled cooling of individual semiconductor devices as well as of the air circulated within the computer housing. The disclosed invention utilizes Peltier devices, a controller unit, both liquid and gaseous heat exchangers, and low cost construction methods to provide a compact, effective computer enclosure cooling system meeting the cooling needs of current high-speed, heat producing computer systems and components.

Abstract: Thermoelectric cooler for providing sub-ambient cooling and method of fabricating same. In one form, sub-micron thermoelectric coolers are formed using doped thin films as thermoelectric elements. The thin film thermoelectric elements are created on thermally and electrical isolating materials using an electrochemical deposition process with a junction formed between the thermoelectric elements. The sub-micron thermoelectric coolers can then be used to locally cool nanoscopic geometric regions such as regions of an integrated circuit or can be configured in an array for large scale microscopic cooling applications.

Abstract: An electrical system is disclosed which includes a supply voltage and electronic circuitry which requires an operational voltage that is less than the supply voltage. A thermoelectric heat pump is interposed between the supply voltage and the electronic circuitry to produce heating or cooling using the excess power which would otherwise be dissipated in a regulator. A voltage regulator is provided between the output of the thermoelectric heat pump and the electronic circuitry to provide the operational voltage to the electronic circuitry.

Abstract: Thermoelectric coolers are distributed within a semiconductor or an optical chip at anticipated hot spots. Each cooler is responsive to normal operating conditions or to signals from a heat sensor to remove heat from the associated hot spot. In an alternative embodiment, a cooler is placed within the semiconductor package rather than being defined within the chip itself. The closer the cooler to the hot spot, the more efficient the heat removal. As smaller and smaller line width technology leads to denser and denser circuitry, heat removal, already an operation-limiting consideration, will become an increasingly significant issue.

Abstract: A method and apparatus for providing integrated bake and chill thermal cycling applied to a material substrate is provided. The apparatus is a module comprising an integrated bake and chill plate with one or more fluid channels in a generally spiraling arrangement. The fluid channels have inlets and outlets near the center and perimeter of the integrated bake and chill plate. Additionally, the fluid channels can have microchannels through portions thereof. The module can also comprise one or more thermoelectric devices, a thermally conductive plate on which the substrate directly or indirectly rests, a printed circuit board, and a variable power source. The integrated bake and chill plate, the thermally conductive plate and the thermoelectric devices are all in thermal contact with each other.

Abstract: A thermoelectric module unit is provided with a thermoelectric module that comprises a partitioning plate, a thermoelectric semiconductor element fixed to the partitioning plate in a state passing through the partitioning plate but also in a state that is electrically insulated from the partitioning plate. A first metal electrode is connected to a first surface of the thermoelectric semiconductor element, and a second metal electrode is connected to a second surface of the thermoelectric semiconductor element. A first confined portion encloses a region from the partitioning plate towards the first surface and is also connected to a first heat pipe. An operating fluid is vacuum-sealed within the first confined portion and the first heat pipe.

Abstract: A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.

Abstract: An electric apparatus such as an inverter includes a cooler unit including a cooler, and a semiconductor component and an electrical component disposed on two opposite sides of the cooler respectively, and a housing for supporting the cooler unit. The cooler unit is pivotally supported on the housing so as to be taken into and out of the housing. The cooler unit is caused to pivot so as to be taken out of the housing when the semiconductor component is to be replaced.

Abstract: A method and apparatus for monitoring and controlling temperatures at a semiconductor circuit (22) by an array (32) of thermoelectric cooler cells (34) which are disposed proximate the semiconductor circuit (22). At least one thermoelectric cooler (38) is located at the individual thermoelectric cooler cells (34) for removing and adding heat from cell areas associated with the thermoelectric coolers. A memory device (50) is associated with the cooler cells (34) and stores operational settings for the cooler cells. A controller (28) is coupled with the thermoelectric cooler cells (34) to individually control the operational settings for the cooler cells in the array (32).

Abstract: A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air.

Abstract: Disclosed is a system for thermally conditioning and pumping a fluid having use as a ventilation system for vehicle seats and other applications. The system includes a thermoelectric heat exchanger having a thermoelectric element configured to pump heat from one body to another body. A pair of heat exchanger elements comprising rotor units are coupled to the thermoelectric element for both transferring heat to and from the thermoelectric element and generating a fluid flow across the thermoelectric element. The conditioned fluid may be placed in thermal communication with a variety of objects, one of which is a vehicle seat to provide localized heating and cooling of a person sitting on the seat.

Abstract: Thermoelectric cooler for providing sub-ambient cooling to an object and method of fabricating same. In one form, the thermally conducting but electrically insulating substrate interfaces used in conventional thermoelectric coolers are replaced by ultra-thin semiconductor substrates having a plurality of doped regions. Diodes formed in the semiconductor substrates are maintained in a reverse biased state to provide the desired electrical isolation necessary for operating the thermoelectric coolers. The reverse biased state is maintained by either the inherent properties resulting from forming the diode in the semiconductor material or through application of a bias voltage to the semiconductor substrates though a layer of conductive material deposited on the outermost surfaces of the substrates.

Abstract: A System for capturing, storing and delivering energy, comprises a capture means (1; 9; 15) for capturing energy; storage means (22) for storing captured energy; and charging means (20, 21; 23, 24, 25, 26) for charging said captured energy into said storage means (22), wherein said capture means (1; 9; 15) provides electrical energy and said storage means is an electrolyte-based rechargeable battery (22) in which the electrolyte comprises adenosine triphosphate (ATP). A Solar panel (1; 9; 15) used in this system comprises reflectors (2, 3; 7, 8) directing reflected photons onto the panel (1; 9).

Abstract: An electronic appliance includes a heat-dissipating apparatus mounted in a housing that has a heat-producing electronic component disposed therein. The heat-dissipating apparatus includes a thermoelectric semiconductor module operable so as to provide low and high temperature surfaces, a cool air blower unit including a first fan casing in heat-conductive contact with the low temperature surface, and a hot air exhaust unit including a second fan casing in heat-conductive contact with the high temperature surface. The cool air blower unit further includes a first fan mounted in the first fan casing and operable so as to draw air into the first fan casing via a first air inlet and so as to blow the air out of the first fan casing via a first air outlet. The air passing from the first air inlet to the first air outlet is cooled when the thermoelectric semiconductor module is operated due to contact between the first fan casing and the low temperature surface.

Abstract: The temperature of a thermo-electric cooler that is used to cool a laser is effectively controlled using a monitor which accurately and continuously measures the temperature of the thermo-electric cooler and using apparatus that determines the difference between the measured temperature and a desired thermo-electric cooler temperature. A discriminator circuit causes the thermo-electric cooler to enter (a) a heating cycle when such difference is below a first reference level or (b) a cooling cycle when such difference reaches a reaches a second reference level. Power consumption within the associated cooling/heating system is also accurately controlled using a pulse width modulated power supply to provide the voltage signal that drives the thermoelectric cooler.

Abstract: A package for housing a device (e.g., an integrated circuit chip or die) is disclosed including a ball grid array substrate and a thermoelectric cooler (e.g., a Peltier effect device). The thermoelectric cooler is housed within the package. The thermoelectric cooler is coupled to the ball grid array substrate and includes a hotter portion and a cooler portion in response to an electric potential difference. The thermoelectric cooler receives the electric potential difference from the package.

Abstract: A computer enclosure cooling unit adapted to current dimensional standards which is capable of controlled cooling of individual semiconductor devices as well as of the air circulated within the computer housing. The disclosed invention utilizes Peltier devices, a controller unit, both liquid and gaseous heat exchangers, and low cost construction methods to provide a compact, effective computer enclosure cooling system meeting the cooling needs of current high-speed, heat producing computer systems and components.

Abstract: A transportable cart assembly is described which controls various environmental conditions within an enclosure while transporting items such as semiconductor wafers or flat panel displays. A fan and filter unit is used to control the spread of small particles within the cart and a heating and cooling unit, such as a thermoelectric heater, is used to control the temperature within the enclosure. The fan and filter unit works in conjunction with the heating and cooling unit in a single-pass flow or recirculating cycle to maintain the temperatures within the enclosure at predetermined levels. The cart also has lighting and an ionization unit to control electrostatic discharge. The cart assembly is powered by an external power supply through a retractable power cord or through its on-board power supply.

Abstract: With an object to provide a thermoelectric converter excellent in performance, this invention provides a thermoelectric converter provided with a first thermal converter 1, a blocked second thermal conductor 2 connected to a predetermined position of the first conductor 1, a frame 6 made of a synthetic resin and surrounding the second conductor 2, a thermally-conductive substrate 5 with the frame 6 fixed at a basal end portion 8 thereof on the substrate and also with a group of thermoelectric elements 4 supported inside the substrate, and a heat-insulating layer 31 interposed between the first thermal conductor 1 and the thermally-conductive substrate 5 such that the frame 6 is surrounded at an outer periphery thereof by the heat-insulating layer. The second thermal conductor 2 and the thermally-conductive substrate 5 are opposing each other and are maintained in close contact with each other via the group of thermoelectric elements 4.

Abstract: A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel.