Abstract: A securing apparatus is used to secure an electronic component, such as a thermoelectric cooler in a thermoelectric cooling system. The securing apparatus includes a clamping mechanism that clamps the electronic component between a first plate, such as a heat sink plate, and a second plate, such as a mounting plate. The clamping mechanism applies compression forces to the electronic component to secure the electronic component without using shear forces capable of damaging the electronic component. The clamping mechanism preferably provides thermal isolation between the heat sink plate and the mounting plate.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: According to an exemplary embodiment of the present invention, an apparatus for controlling the temperature of a thermoelectric cooler includes a current sensing circuit which is adapted to control the current through the thermoelectric cooler using proportional, integral, derivative (PID) processing.

Abstract: A dual pulse width modulated driver controls the operation of a thermo-electric cooler for stabilizing the operating temperature of a laser. The pulse width modulator has complementary outputs coupled to control inputs of dual pairs of complementary polarity electronic switching elements, that are coupled in circuit between first and second power supply terminals, and a pair of output nodes. The output nodes are coupled in common through a low pass filters to drive terminals of a thermoelectric cooling element. The thermal output generated by the thermoelectric cooling element is coupled to the laser. The thermal output of the cooling element is monitored by a temperature sensing element mounted with the laser and provides an output voltage in linear proportion of its thermal input. This output voltage is fed back through a temperature control servo loop to a differential summing circuit, which is also coupled to receive a reference voltage used to control the duty cycle of the pulse width modulator.

Abstract: A low-cost thermoelectric module utilizing a greatly reduced quantity of thermoelectric material as compared to similar prior art thermoelectric modules. An egg crate design containing thermoelectric elements is utilized in the present invention. However, the walls of the egg crate in the parts of the module separating the thermoelectric elements are made thick so that the total cross sectional area of the elements is less than 75 percent of the total module cross sectional area. The spaces above and below the elements are filled with a high heat and electric conducting material such as aluminum. This produces funnel-shaped conductors funneling heat and electric current into and out of each of the thermoelectric elements. The payoff to this approach is that the heat flux through the hot and cold module surfaces can be maintained while producing the same power output with about half the thermoelectric material or less.

Abstract: An air conditioner contains one or more vertically positioned manifolds. Each manifold defines a vapor space, a liquid space, and capillary tubes connecting the two spaces. The manifold is filled with a refrigerant or heating fluid. The manifold is either cooled or heated by thermoelectric modules. The fluid cycles through evaporation and condensation within the manifold, without the aid of a condenser or pump. Alternating banks of heating and cooling manifolds may be combined so that thermoelectric modules positioned between the manifolds will heat the heating manifolds and cool the cooling manifolds. A combined air conditioner and heater may be used in automobiles and buildings. The heating manifolds my be used to heat air, water or other fluid streams.

Abstract: A refrigerator includes a housing that defines an enclosable storage space. The refrigerator includes a closed manifold which defines a chamber to contain refrigerant. The chamber is made up of three parts, a cooling pipe, a head pipe, and one or more heat pipes to communicate fluid between the cooling and head pipes. The heat pipes are flat, elongated, and are divided internally to form capillary channels to permit flow of refrigerant between the cooling and head pipes. An array of thermoelectric modules contacts a surface of the manifold to chill refrigerant within the manifold. A pump or compressor is not required to circulate the refrigerant within the system. A blower forces an air stream to cool the heating faces of the thermoelectric modules. A control unit may be used to maintain the operating temperature of the refrigerator. A refrigerator may be portable, with a portable power source or adapters. The manifold design is useful for modular refrigerator appliance designs.

Abstract: A thermoelectric module includes a first board having a first electrode, a second board having a second electrode opposing the first electrode, and a plurality of thermoelectric chips made of thermoelectric material, each outer surface of the thermoelectric chips being plated with an Ni system plating layer.

Abstract: A thermoelectric air conditioning apparatus is comprised of a housing having a plurality of air inlets and a plurality of air outlets; a plurality of thermoelectric elements; two heat exchangers; a temperature regulator, having first and second air inlets, a main air outlet and at least one exhaust outlet; two air circulation units and a control unit. Thermoelectric elements are energized, and cause a reduction of temperature on one side and an increase of temperature on the other side. One air flow is forced to flow through one of the housing air inlets, over a heat exchanger and to the first air outlet of the temperature regulator. Another air flow is forced to flow through one of the housing inlets, over the other heat exchanger and to the second air outlet of the temperature regulator.

Abstract: An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body.

Abstract: A substrate cooling unit comprises a cooling plate on which the substrate is placed, a cooling temperature adjusting element which adjusts the cooling plate to a predetermined temperature, a temperature controller which controls a temperature of the cooling temperature adjusting element according to a transfer function, a temperature sensor attached to the cooling plate, and a control parameter changing section which changes at least any one setting of a proportional operation coefficient, integral time or derivative time among control parameters in the transfer function based on a temperature of the cooling plate detected by the temperature sensor after the substrate that is an object to be cooled is placed on the cooling plate.

Abstract: A number of compact, high-efficiency thermoelectric system utilizing the advantages of thermal isolation in the direction of a working medium flow or movement, in manufacturable systems, are described. Such configurations exhibit high system efficiency and power density. Several different embodiments and applications are disclosed utilizing a plurality of thermoelectric modules or thermoelectric elements sandwiched between heat exchangers.

Abstract: The present invention relates to a device in performing a process in a process medium by varying the parameters of said process medium over time in a laboratory scale, according to a predetermined scheme. The device comprises at least one reaction receptacle, a heat transfer plate, a peltiere element, a temper sensor, a magnetic stirrer and a data processing unit. The data processing unit is adapted to send out signals to the peltiere element in response to incoming signals from the temperature sensor. The invention further relates to a method for controlling the data processing unit.

Abstract: A compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout.

Abstract: A thermoelectric cooler and a system and method for fabricating the thermoelectric cooler are provided. In one embodiment, the thermoelectric cooler includes a first magnetic element, a second magnetic element composed of magnetic or magnetically susceptible material, a first thermoelectric sub-component, and a second thermoelectric sub-component. The first thermoelectric sub-component and the second thermoelectric sub-component are situated between the first and second magnetic elements. The first and second magnetic elements are selected such that a compressive force is exerted on the first and second thermoelectric elements. The magnetic elements are selected and adjusted in magnetic attraction such that the force exerted on the first and second thermoelectric elements establishes and maintains a contact of selected pressure between the first and second thermoelectric sub-components.

Abstract: A thermoelectric module (7) having exothermic and endothermic surfaces, which are heated and cooled, respectively, when an electric current is supplied thereto is built in a manifold body (17), and a cavity (10c, 10d, 20d) is defined therein for entry of a fluid medium in cooperation with at least one of the exothermic and endothermic surfaces, together with a hollow (10a, 10b, 20a, 20b) that extends from an outside to the cavity. A stirring member (5) having a stirring portion (15) integrated together with a rotor (16) within the manifold body (17) for stirring the fluid medium within the cavity is disposed within the manifold body, so that a motor can be formed by the rotor (16) and a stator (8). In this structure, the stirring member (5) is rotated by supplying electric power to the stator (8), to allow the fluid medium to reach the cavity (10c, 10d) through the interior of the rotor (16).

Abstract: A thermoelectric cooling and heating device including a substrate, a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element includes a thermoelectric material, a Peltier contact contacting the thermoelectric material and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact. As such, the thermoelectric cooling and heating device selectively biases the thermoelectric elements to provide on one side of the thermolectric device a grid of localized heated or cooled junctions.

Abstract: A sealing structure of the thermoelectric conversion device, which has high sealing capability and is easy to manufacture, is provided. A thermoelectric conversion circuit utilizing Peltier effect is interposed between two metal heat exchanger plates. The O-ring interposed between the outer edge portions of the heat exchanger plates seals the gap formed between the outer edge portions of the heat exchanger plates along the whole periphery. The connector for connecting the thermoelectric conversion circuit to the external power supply is inserted into the through hole formed on the heat exchanger plate. The O-ring fitted on the connector seals the gap between the connector and the through hole spontaneously, when the connector is inserted into the through hole.

Abstract: A Peltier module comprising: thermoelectric elements in which plural p-type and n-type thermoelectric elements are alternately arranged, metal electrodes placed in both ends of the thermoelectric elements in order to connect the thermoelectric elements in series, and metal substrates on at least a part of which surfaces an insulating thin film is formed, the metal substrates being oppositely placed so as to be connected to the metal electrodes and sandwich the metal electrodes and the thermoelectric elements.

Abstract: A high performance thermoelectric system is taught which is capable of rapidly cooling a thermal load with a thermoelectric module. A thermal ballast is in simultaneous thermal communication with both the thermoelectric module and the thermal load, and compensates for the difference between the characteristics of the thermoelectric module and the demands of the thermal load, allowing a thermoelectric module to handle significantly larger thermal loads than would normally be possible, albeit for a reduced period of time. Also taught is a means to implement a demand cooler for drinking water. Also taught is a means to implement a high performance cooler for removable fluid containers, adaptable to the rapid cooling of wine bottles and the like.

Abstract: Application of a potential difference across a doped region formed on an integrated circuit allows management of thermal energy directly on the chip surface. Individual temperature control cells are formed by ion implanting N- and P- type dopant into adjacent regions, and then forming a metal bridge across the similarly positioned ends. Placing a potential drop across metal contacts of the cell changes the temperature of the contacts relative to that of the electrically conducting bridge. Fabrication of arrays of temperature control cells of various shapes and sizes permits extremely precise heating and cooling of specific regions of the integrated circuit. Management of thermal energy on the IC in accordance with the present invention may be enhanced by forming arrays of temperature control cells possessing multiple tiers.

Abstract: An apparatus for dense chip packaging using heat pipes and thermoelectric coolers is provided. The apparatus includes an evaporator region, a condenser region, and a capillary region. The evaporator region includes one or more hot point elements used to transfer heat from a heat source to a transport fluid. The transport fluid changes state to a vapor when heat is applied to the transport fluid. The vapor travels to the condenser region via vapor channels and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. The condensed fluid is then returned to the evaporator region by way of capillary forces and capillaries formed in a capillary structure. The capillaries formed in the capillary structure have a tree-like or fractal geometry. The apparatus may further include a flexible region that allows the apparatus to be bent around corners and edges.

Abstract: A cooling exchanger comprised of a cooling base plate, two units of water pans and two units of water pumps. Within, Said cooling base plate include two units of contact plats incorporated with multiple units of SbBi crystals and bridged with a conductor. Outer edges between said two contact plates are coated with insulation resin to close and separate a shortage. A DC source is connected to said two units of SbBi crystal containing opposite polarities connected and a relative temperature difference (&Dgr;T) takes place at where both contact plates connected to the crystals. Said two units of water pan are locked in position on two contact plates of the cooling base plate. A water inlet and a water outlet provided on the front of each eater pan are respectively connected to form a close pipeline for the water controlled by a water pump to circulate inside the pipeline.

Abstract: A thermoelectric device is provided. In one embodiment, the thermoelectric device includes a first portion of a thermoelement and a second portion of the thermoelement. The first portion of the thermoelement is thermally coupled to a hot plate. The second portion of a thermoelement is thermally coupled to a cold plate. One of the first and second portions of the thermoelement comprises a plurality of tips and the other one of the first and second portions of the thermoelement comprises a substantially planar surface. The tips and the substantially planar surface are arranged in proximity such that the first and second portions of the thermoelement are electrically coupled.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.

Abstract: Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.

Abstract: On the basis of any conventional suitable container (1), this system incorporates a set of elements which act in a distributed manner (2), which using the information supplied by a series of temperature sensors (4) and activated by a data acquisition and control system (3) make it possible to pump heat out of the container or into the same, these elements preferentially taking the form of Peltier cells, and a series of distributed sensors (6), consisting of a humidity sensor (7), a vibration sensor (8), a pressure sensor (9) and a control (10) of the opening and closing of the container (1), which makes it possible control maneuvres of this type which are carried out during transport, and a series of interfaces that make it possible for the data acquisition and control system (3) to communicate with the exterior, more specifically a PC interface (12) for connection to a computer (16), and an operator card interface (14) which makes it possible to extract information on the conditions of the merchandise in rea

Abstract: Disclosed is an optical device module having a heat transfer medium via a phase transformation for overcoming the non-uniform temperature distribution. The optical device module includes an optical device that requires temperature control; a temperature sensor for detecting the temperature of the optical device; a heat source for generating heat; and, a heat transfer medium, disposed between the heat source and the optical device, with a number of heat pipes inside thereof.

Abstract: A contained beverage cooling apparatus for cooling and keeping cool a beverage placed in the apparatus. The contained beverage cooling apparatus includes a housing. The housing has a bottom wall and a top wall. A peripheral side wall extends between and is integrally coupled to a periphery of the top and bottom walls. The housing has a front side and a back side. The top wall has a hole therein for receiving a cylindrical can or cup. The hole is positioned generally adjacent to the front side of the housing. A cooling means for cooling a beverage placed in the hole includes a duct. The duct has an open first end and an open second end. The duct is positioned in a spaced relationship with the top wall such that the second end extends away from the back side of the housing. A first heat sink is securely attached to an interior of the top wall. A second heat sink is securely mounted to an interior surface of the duct. A thermo-electric device is positioned between the duct and the top wall.

Abstract: An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.

Abstract: A temperature balance device is disclosed. The temperature balance device has a device body. Within the device body has a temperature adjusting piece, a first fan, a temperature sensor, a heat pipe, a first fin set, and a control circuit. One end of the heat pipe is adhered with a temperature adjusting piece. Another end thereof is adhered with an operating element. The first fin set is placed between the temperature adjusting piece and the first fan. The control circuit is connected to the temperature adjusting piece, first fan, and temperature sensor through leads. External the device body has a second fan and a second fin set. The second fin set is connected to a lead. The lead passes the device body to be connected to the control circuit. The second fin set is placed between the second fan and the device body with respect to a temperature adjusting piece.

Abstract: A system for actively heating and cooling an object contains a thermoelectric device having a Peltier junction. The system is capable of reversing the direction of DC current flow through the Peltier junction so that the thermoelectric cooler/heater either heats or cools the object, as selected. The DC power supply is preferably operated in switch-mode. The thermoelectric device is disposed in a laser diode module or in heat-conductive contact with a laser housing mounting plate in a high-density laser source bank.

Abstract: An interruptible thermal bridge system including: a first thermally conductive surface positioned proximate an object which absorbs energy; a second thermally conductive surface thermally connected to the first conductive surface positioned proximate to an object which dissipates energy, a thermal switch positioned between the first and second conductive surfaces for regulating a thermal connection between the first and second surfaces by alternatively switching between a first position, blocking the conductive path and thermally insulating the first conductive surface from the second conductive surface, and a second position, opening the conductive surface with the second conductive surface.

Abstract: An improved efficiency thermoelectric system operates the thermoelectric elements in the system in a non-steady state manner. The thermoelectric elements are powered for predefined periods of time to obtain increased efficiency. This benefit can be improved by also altering the resistance of the thermoelectric elements during the power-on period such that resistive heating is minimized.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: An apparatus for transporting and rejecting heat energy is provided. In one embodiment, the heat transporter includes a photonic microheatpipe and a source of photons. The photonic microheatpipe is a photonic crystal that shows pronounced Raman effect and is thermally coupled to a heat source. Photonic crystals disallow certain frequencies of light from being transmitted through the crystal. When a photon scatters back from phonons (lattice vibrations) in the crystal, the properties of the reflected spectrum are governed by the Raman effect. The reflected spectrum have two pronounced components: a Stoke's line and an Anti-Stokes line. The Stokes lines correspond to frequencies that are the difference between the frequency of the incident photons and that of the phonons, while the anti-Stokes lines correspond to frequencies that are sum of the frequency of the incident photons and that of the phonons.

Abstract: A temperature modification system for modifying the temperature of fluids includes at least one thermally conductive carbon foam element, the carbon foam element having at least one flow channel for the passage of fluids. At least one temperature modification device is provided, the temperature modification device thermally connected to the carbon foam element and adapted to modify the temperature of the carbon foam to modify the temperature of fluids flowing through the flow channels. Thermoelectric and/or thermoionic elements can preferably be used as the temperature modification device. A method for the reversible temperature modification of fluids includes the steps of providing a temperature modification system including at least one thermally conductive carbon foam element having flow channels and at least one temperature modification device, and flowing a fluid through the flow channels.

Abstract: Disclosed is an optical device module having a heat transfer medium via a phase transformation for overcoming the non-uniform temperature distribution. The optical device module includes an optical device that requires temperature control; a temperature sensor for detecting the temperature of the optical device; a heat source for generating heat; and, a heat transfer medium, disposed between the heat source and the optical device, with a number of heat pipes inside thereof.

Abstract: A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.

Abstract: Disclosed is a system for thermally conditioning and pumping a fluid. The system includes a thermoelectric heat exchanger having a thermoelectric device configured to pump heat. Heat exchangers are provided for transferring heat to and from the thermoelectric device and for generating a fluid flow across the thermoelectric device. The conditioned fluid may be placed in thermal communication with a variety of objects, such as a vehicle seat, or anywhere localized heating and cooling are desired. Thermal isolation may also be provided in the direction of flow to enhance efficiency.

Abstract: An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.

Abstract: The present invention relates to a thermoelectric cooler, and more particularly, to a thermoelectric cooler, in which a thermoelectric module is applied to a blow system of a fan blade set and a motor, for converting a current blow system into a blow system having a cooling function with a low noise.

Abstract: A flexible thermoelectric module having a pair of flexible substrates, a plurality of electrically conductive contacts on one side of each of the flexible substrates, and a plurality of P-type and N-type thermoelectric elements electrically connected between opposing sides of the pair of flexible substrates having the plurality of conductive contacts where the plurality of conductive contacts connect adjacent P-type and N-type elements to each other in series and where each of the P-type and N-type elements has a first end connected to one of the plurality of conductive contacts of one of the substrates and a second end connected to one of the plurality of electrical contacts of the other of the substrates.

Abstract: A computer enclosure cooling unit adapted to current dimensional standards which is capable of controlled cooling of individual semiconductor devices as well as of the air circulated within the computer housing. The disclosed invention utilizes Peltier devices, a controller unit, both liquid and gaseous heat exchangers, and low cost construction methods to provide a compact, effective computer enclosure cooling system meeting the cooling needs of current high-speed, heat producing computer systems and components.

Abstract: A method and apparatus for controlling the temperature of a system are described. The method and apparatus use the Seebeck effect of a thermoelectric cooler. The apparatus includes a current source that generates current; a thermoelectric cooler having a first end and a second end connecting to the current source; and a control circuit. The control circuit monitors a voltage difference across the thermoelectric cooler and controls the current source according to the voltage difference. The voltage difference results in a temperature difference between the two ends of the thermoelectric cooler.

Abstract: A thermoelectric cooling system includes a control assembly and a direct current (“d.c.”) power source providing direct current to an interface that creates a thermal flow across a thermoelectric module having at least one heat sink and at least one heat source. The d.c. power source, the interface, the control assembly, and the thermoelectric module are connected to each other in series. The control assembly optionally includes a relay and a voltage generating thermocouple. When voltage from the thermocouple reaches a predetermined threshold, the relay trips and supplies sufficient voltage to the interface to prevent thermal reversal of the heat source and heat sink. To control moisture, a metal strap may be used to restrict heat flow. Alternatively or additionally, a moisture control pad may be used to absorb and re-evaporate moisture to substantially maintain a desired humidity range. In an optional embodiment, the load to be cooled may be placed below the heat source and cooled by convection.

Abstract: An apparatus for dense chip packaging using heat pipes and thermoelectric coolers is provided. The apparatus includes an evaporator region, a condenser region, and a capillary region. The evaporator region includes one or more hot point elements used to transfer heat from a heat source to a transport fluid. The transport fluid changes state to a vapor when heat is applied to the transport fluid. The vapor travels to the condenser region via vapor channels and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. The condensed fluid is then returned to the evaporator region by way of capillary forces and capillaries formed in a capillary structure. The capillaries formed in the capillary structure have a tree-like or fractal geometry. The apparatus may further include a flexible region that allows the apparatus to be bent around corners and edges.

Abstract: A sealing structure of the thermoelectric conversion device, which has high sealing capability and is easy to manufacture, is provided. A thermoelectric conversion circuit utilizing Peltier effect is interposed between two metal heat exchanger plates. The O-ring interposed between the outer edge portions of the heat exchanger plates seals the gap formed between the outer edge portions of the heat exchanger plates along the whole periphery. The connector for connecting the thermoelectric conversion circuit to the external power supply is inserted into the through hole formed on the heat exchanger plate. The O-ring fitted on the connector seals the gap between the connector and the through hole spontaneously, when the connector is inserted into the through hole.

Abstract: The electrical junctions of either or both sides of a thermoelectric module are placed in direct thermal contact with a heat source or sink or a material to be thermally modified (that is, heated or cooled), thereby eliminating the conventional substrate typically found in such modules and its associated thermal resistance. In one embodiment, the conductive junction passes through a conduit carrying a material to be heated or cooled. In the conduit, the conductive material can be configured into an effective heat transfer shape such as a vane which extends through non-conducting conduit walls. In another embodiment, the geometry of the conductor forming the electrical junction forms a pipe or tube through which material to be heated or cooled is passed. A protection layer of high thermal conductivity can be applied to the conductive surfaces in order to prevent corrosion or short-circuiting of the device in applications where an electrolytic or ionic fluid is passed by the junction.