Abstract: The temperature of a flowing material, such as coating and filling materials, is regulated by having it pass through a metal block that is cooled or heated by adjacent thermoelectric elements. A temperature regulator uses, as inputs, a desired material temperature (T—ref) as well as one or more of a set of temperature signals including temperature signals measured at the inlet and outlet to the block, and internally within a cooling arrangement adjacent to the block. The temperature of the material downstream from the regulator, that is, the temperature to be regulated, is either measured directly or is estimated as a function of the other measured and input signals.

Abstract: A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.

Abstract: A semiconductor device test apparatus, has: a socket, which connects to a semiconductor device undergoing testing mounted thereon; a test tray, which houses the semiconductor device undergoing testing and which is provided, in a position on which the semiconductor device undergoing testing is mounted, with a first electronic cooling element that absorbs heat via one surface thereof and releases heat via the other surface thereof; and a contact block, which is provided with a second electronic cooling element that makes contact with the top of the semiconductor device undergoing testing in a state in which the semiconductor device undergoing testing is mounted on the socket.

Abstract: The present invention provides systems and methods of controlling local environment. In one embodiment, incoming air enters a contactor such the Direct Contact Cooler-Condenser (DCCC) where the air contacts water distributed on the contact media. After passing through the DCCC, the air is saturated at a temperature equal or close to that of the water. Depending on the state of the incoming air, in the DCCC will be humidified or dehumidified to yield saturated air at the desired humidity ratio. In one embodiment, a blower draws air through the DCCC and blows into the heater. The heater heats the air to the desired dry-bulb temperature. Before exiting, the air may pass through a filter.

Abstract: The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Abstract: A number of compact, high-efficiency and high-power density thermoelectric systems utilizing the advantages of thermal isolation are described. Such configurations exhibit high system efficiency and power density. Some configurations exhibit a substantial reduction in the amount of thermoelectric material required.

Abstract: The invention relates to a casing for receiving at least one energy storage device, whereof the temperature in the casing interior can be regulated to a predetermined temperature level. For this purpose the casing interior is thermally insulated and is in direct heat conducting connection with a heat transfer device, substantially the entire heat flow into and out of the casing interior taking place through the heat transfer device when the casing interior is closed.

Abstract: A method, system, and apparatus for controlling the temperature within a remotely located enclosure that contains temperature sensitive equipment is provided. For some embodiments, the system includes an array of thermoelectric cooling (TEC) devices that act as an active cooling device and an active heating device. The system may also include a temperature controller that receives signals from a temperature sensor located at or near the temperature sensitive equipment. The controller may be configured to supply DC power to the thermoelectric coupling devices based on the output signal of the temperature sensor. The polarity of the DC power can be reversed by the controller in order to cause the thermoelectric device to heat or to cool the enclosure. The system also contains a passive cooling device. The system includes an independent electrical power source with a battery and solar cell to supply power to the temperature control devices and the equipment contained in the enclosure.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: A cooling device for cooling a microelectronic complex including a plurality of discrete functional modules. The cooling device includes a plurality of independent cooling modules, each cooling module in a thermal exchange relationship with a respective one of the plurality of discrete functional modules. During operation of the microelectronic complex, a cooling requirement of each discrete functional module is dynamically assessed, and the amount of cooling provided by each cooling module is adjusted on the basis of the assessed cooling requirements. Thus, the discrete functional modules are cooled independently from one another.

Abstract: Disclosed is a system for thermally conditioning and pumping a fluid. The system includes a thermoelectric heat exchanger having a thermoelectric device configured to pump heat. Heat exchangers are provided for transferring heat to and from the thermoelectric device and for generating a fluid flow across the thermoelectric device. The conditioned fluid may be placed in thermal communication with a variety of objects, such as a vehicle seat, or anywhere localized heating and cooling are desired. Thermal isolation may also be provided in the direction of flow to enhance efficiency.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.

Abstract: A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.

Abstract: A personal computer provided with heat-generating parts such as a CPU, a cooling unit that releases the heat generated by the heat-generating part to the outside of the personal computer has a container structure so that the cooling liquid in the interior does not leak to the outside. Also, part of the container structure is provided with a heat connection part for receiving the heat transferred from the outside of the cooling unit. Furthermore, there is provided means of heat transfer for transferring the heat generated by the heat-generating part to the cooling unit, one end of this means of heat transfer being thermally connected to the heat connection part of the cooling unit and the other end thereof being thermally connected to the heat-generating part. This prevents troubles in the personal computer due to the moisture permeation of the cooling liquid of cooling unit and leakage of the cooling liquid. Also, disassembly and assembly is made easy by forming the cooling unit as a separate structure.

Abstract: A temperature controller module for electronically controlling the temperature of a device, such as a pump laser or laser diode, controls the device temperature based on low heat dissipation inductors and current sources. The temperature controller module shuts off the thermoelectric cooler when the temperature of the laser exceeds a predetermined amount. Further, the temperature controller module is integrated in a compact, self-contained modular form to allow use in space critical applications.

Abstract: A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor chamber and increases the temperature of the fins for improved efficiency. The vapor chamber is defined between concentrically positioned tubes, and a tunnel region is located within the inner tube. Additional TEC elements within the tunnel region further dissipate heat. In two-phase natural convection embodiments, TEC elements may further cool liquid returning to the heat source. Parallel heat dissipation paths may also be provided. In a two-phase forced convection embodiment, a TEC element may further cool liquid returning to the heat source, and additional TEC elements may be provided on the condenser. In some embodiments, active feedback controls the amount of energy transferred by a TEC element.

Abstract: A temperature adjustment device has a first thermoelectric cooling module, a second thermoelectric cooling module on which the first thermoelectric cooling module is provided, and a heat generating element which is provided on the first thermoelectric cooling module and a temperature thereof is adjusted, where assuming that a substrate area of the first thermoelectric cooling module on which the heat generating element is provided is S1(mm2) and that an amount of generated heat of the heat generating element is Qd(mW), the relationship of 20?Qd/S1?200 is met.

Abstract: A cooling device has a cooling area with a predefined periphery, and a cooling circuit surrounding the cooling area. The cooling circuit includes a medium and a plurality of N conductors in parallel alignment and located within the medium, the medium being a plurality of N+1 segments, with each segment being separated from other segments by a member of the plurality of conductors.

Abstract: A Peltier module comprising: thermoelectric elements in which plural p-type and n-type thermoelectric elements are alternately arranged, metal electrodes placed in both ends of the thermoelectric elements in order to connect the thermoelectric elements in series, and metal substrates on at least a part of which surfaces an insulating thin film is formed, the metal substrates being oppositely placed so as to be connected to the metal electrodes and sandwich the metal electrodes and the thermoelectric elements.

Abstract: The present invention relates to a non-mechanical blower for use in heating the interior of a motor vehicle, and more particularly, to the use of thermoelectric devices used in tandem to replace conventional electromechanical blower devices.

Abstract: A cool air-supplying device for a computer system. The computer system includes a computer apparatus and the computer apparatus includes a housing. The cool air-supplying device includes a casing connected to the housing of the computer system. The casing has an intake vent for receiving air and an outlet vent for outputting air. The cool air-supplying device further includes a thermoelectric cooler for cooling refrigerantwithin a heat pipe, the heat pipe installed inside the casing for transferring refrigerant cooled by the thermoelectric cooler to the outlet vent. A first fan installed at one end of the heat pipe transfers air cooled by the heat pipe to the housing of the computer system via the outlet vent.

Abstract: To provide a temperature control device and a temperature control method, which are capable of applying temperature control with high accuracy to an object of temperature control and facilitating removal of the object of temperature control to reduce cost at the time of replacement, and an ink-jet recording apparatus.

Abstract: A heat exchange apparatus (10, 10, 10b) for selectively heating and/or cooling a process fluid (38). A process fluid tubing 14 is wrapped around a primary thermally conductive cylinder (12) having a spiral groove (24) therein adapted for closely accepting the process fluid tubing (14) and increasing the area in thermal contact therebetween. The process fluid tubing (14) is a generally chemically inert tubing. The spiral groove (24) supports the process fluid tubing (14) such that the process fluid tubing (14) can be bent in a radius smaller than the natural minimum bend radius of the process fluid tubing (14). Various embodiments have a cooling apparatus (26, 26a) for cooling the process fluid (38). The cooling apparatus (26, 26a) has a outer thermally conductive cylinder (16) or an outer thermal reservoir (50) cooled alternatively by coolant fluid (44) passing through cooling fluid tubing (18), by a plurality of thermoelectric modules (54), or by a combination thereof.

Abstract: A semiconductor device is described in which an integrated circuit executes dummy operating cycles in order to generate heat if the temperature of the semiconductor device drops below a lower limit value. In this manner the semiconductor device can be rated for lower temperatures than the construction tolerances of the semiconductor device would allow.

Abstract: A temperature adjustment device has a first thermoelectric cooling module, a second thermoelectric cooling module on which the first thermoelectric cooling module is provided, and a heat generating element which is provided on the first thermoelectric cooling module and a temperature thereof is adjusted, where assuming that a substrate area of the first thermoelectric cooling module on which the heat generating element is provided is S1 (mm2) and that an amount of generated heat of the heat generating element is Qd (mW), the relationship of 20≦Qd/S1≦200 is met.

Abstract: An air conditioner contains one or more vertically positioned manifolds. Each manifold defines a vapor space, a liquid space, and capillary tubes connecting the two spaces. The manifold is filled with a refrigerant or heating fluid. The manifold is either cooled or heated by thermoelectric modules. The fluid cycles through evaporation and condensation within the manifold, without the aid of a condenser or pump. Alternating banks of heating and cooling manifolds may be combined so that thermoelectric modules positioned between the manifolds will heat the heating manifolds and cool the cooling manifolds. A combined air conditioner and heater may be used in automobiles and buildings. The heating manifolds my be used to heat air, water or other fluid streams.

Abstract: A heat exchange apparatus (10, 10, 10b) for selectively heating and/or cooling a process fluid (38). A process fluid tubing 14 is wrapped around a primary thermally conductive cylinder (12) having a spiral groove (24) therein adapted for closely accepting the process fluid tubing (14) and increasing the area in thermal contact therebetween. The process fluid tubing (14) is a generally chemically inert tubing. The spiral groove (24) supports the process fluid tubing (14) such that the process fluid tubing (14) can be bent in a radius smaller than the natural minimum bend radius of the process fluid tubing (14). Various embodiments have a cooling apparatus (26, 26a) for cooling the process fluid (38). The cooling apparatus (26, 26a) has a outer thermally conductive cylinder (16) or an outer thermal reservoir (50) cooled alternatively by coolant fluid (44) passing through cooling fluid tubing (18), by a plurality of thermoelectric modules (54), or by a combination thereof.

Abstract: A thermoelectric assembly is provided for an electronic device, having a surface with a non-uniform thermal distribution between at least one first region and at least one second region, with the at least one first region having a higher heat flux than the at least one second region. The assembly includes at least one first area of thermoelectric elements and at least one second area of thermoelectric elements, which are configured to align over the at least one first region of higher heat flux, and the at least one second region, respectively, when the assembly is coupled to the device. The at least one first area of thermoelectric elements includes a greater density of thermoelectric elements than the at least one second area of thermoelectric elements for handling the higher heat flux.

Abstract: A device is disclosed for reducing overheating in a passenger compartment of a parked vehicle. The device has a temperature sensor, a temperature comparator, and a control system in electrical communication with the comparator for controlling the actuation and operation of an existing air conditioner fan within the vehicle. The control system incorporates a power supply management arrangement designed to draw energy in pulses from a battery unit of the vehicle to energize the motor when the temperature in the passenger compartment exceeds a predetermined level, and to cease drawing energy when the temperature falls below the predetermined level.

Abstract: Heat exchanger, which has a cooling body (9) that is in contact with a medium (11) to be cooled, on the one hand, and with a cooling medium (20), on the other hand, and transfers the heat of the medium to be cooled to the cooling medium, whereby the cooling body is composed of at least two materials, of which one is a better conductor of heat than the other, and the material of better thermal conductivity is essentially in contact with the medium to be cooled and dissipates the heat from the latter to the material of poorer thermal conductivity, which is essentially in contact with the cooling medium, to which for its part it transfers the heat, and the cooling body furthermore has sintered parts that form a porous sintered structure through which the cooling medium can flow, sintered parts being composed of the material of better thermal conductivity and of the material of poorer thermal conductivity, and the sintering temperature of the material of better thermal conductivity being less than or equal to the

Abstract: A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor chamber and increases the temperature of the fins for improved efficiency. The vapor chamber is defined between concentrically positioned tubes, and a tunnel region is located within the inner tube. Additional TEC elements within the tunnel region further dissipate heat. In two-phase natural convection embodiments, TEC elements may further cool liquid returning to the heat source. Parallel heat dissipation paths may also be provided. In a two-phase forced convection embodiment, a TEC element may further cool liquid returning to the heat source, and additional TEC elements may be provided on the condenser. In some embodiments, active feedback controls the amount of energy transferred by a TEC element.

Abstract: A CPU cooling structure is constructed having a thermoelectric cooling panel installed in a heat sink and controlled by a control circuit to cool the CPU to which the heat sink is fastened.

Abstract: Apparatus to provide effective removal of heat from a high power density device. The apparatus has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.

Abstract: Cooling device, comprising a housing with at least one cooling channel for a cooling liquid, and with at least one thermoelectric cooling element comprising a layer of semiconductor material that is sandwiched between two plates. At least one of the plates presents an electrically insulation contact surface that, in use, is in direct contact with the cooling liquid. The at least one cooling element is along its outer perimeter flexibly and sealingly framed in a carrier such that the contact surface remains free to contact the cooling liquid. The carrier and the contact surface define a wall portion of the cooling channel.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A heat exchange apparatus (10, 10, 10b) for selectively heating and/or cooling a process fluid (38). A process fluid tubing 14 is wrapped around a primary thermally conductive cylinder (12) having a spiral groove (24) therein adapted for closely accepting the process fluid tubing (14) and increasing the area in thermal contact therebetween. The process fluid tubing (14) is a generally chemically inert tubing. The spiral groove (24) supports the process fluid tubing (14) such that the process fluid tubing (14) can be bent in a radius smaller than the natural minimum bend radius of the process fluid tubing (14). Various embodiments have a cooling apparatus (26, 26a) for cooling the process fluid (38). The cooling apparatus (26, 26a) has a outer thermally conductive cylinder (16) or an outer thermal reservoir (50) cooled alternatively by coolant fluid (44) passing through cooling fluid tubing (18), by a plurality of thermoelectric modules (54), or by a combination thereof.

Abstract: A refrigerator includes at least one storage chamber for accommodating cosmetics. The refrigerator further includes electrical parts for maintaining cosmetics accommodated in the storage chamber at appropriate temperature, a control means for controlling operations of checking and displaying failures of the electrical parts, and a display unit for displaying the results of the checking of the failures.

Abstract: An improved torus multi-element semiconductor thermoelectric heater and chiller utilizes torus thermoelectric generator to provide high current to force heat flow. Overall efficiency of heat conversion is improved by coupling a thermoelectric generator directly to a torus heater and chiller. A thermoelectric generator exhaust heat drives a second thermoelectric generator connected to a thermoelectric heater and chiller to produce heat flow in the heater and chiller using air, gas, or liquid to convey heat into and away from the thermoelectric device.

Abstract: A system, method and apparatus for temperature regulation of physiological fluids is disclosed. In an exemplary system for use in cardiopulmonary procedures, blood is entered into a proportionally long, narrow disposable container, is heated or cooled to a desired temperature, and exits from an opposite end. The disposable container includes a pair of long, flat surfaces facing each other in relatively, close proximity. The blood is transitioned from transport tubing into a thin laminar flow layer and back into tubing, inside the container. This container is placed in a heat exchange device having thermoelectric modules that contact the majority of surface area, opposite the blood side in the container. The thermoelectric modules act as fully reversible heat pumps and move heat from one side of the module to the other, dependant on the direction of the current supplied to the modules. Feedback from sensors in the fluid path independently control each thermoelectric module.

Abstract: The temperature of a Peltier element is regulated by two control loops. In the ranges where only heating or only cooling are intended to be carried out, the regulation is provided via a voltage converter. In the critical operating range which covers the transition between heating and cooling, a low operating voltage is converted to a drive AC voltage with the aid of a polarity reversal switch and both heating and cooling are carried out, depending on the polarity. The temperature is then regulated by varying the duty ratio.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A portable heater/cooler system comprises a thermal electric module conducting a current through the module; a heater/cooler cavity coupled to the thermal electric module; a variable speed fan for blowing air over the thermal electric module and into the cavity; a first temperature sensor coupled to the thermal electric module for measuring the temperature of the module; a second temperature sensor coupled to the heater/cooler cavity for measuring the temperature in the cavity; and a microprocessor for adjusting a speed of the fan and the current flow through the thermal electric module as a function of the measured temperatures of the thermal electric module and the cavity.

Abstract: A thermoelectric module (1) has a plurality of thermoelectric devices (2) integral with heat conducting surfaces (5, 5′) of fluid chambers (3, 3′). The thermoelectric devices (2) are operable to transfer heat to or from fluids in the chambers (3, 3′). A product, eg a beverage, flowing through one of the chambers (3, 3′) can be heated or cooled to achieve a desired product temperature by selective operation of the thermoelectric devices (2). The module (1) provides an integrated unit that avoids inefficient boundaries between the heat conducting surfaces (5, 5′) and the thermoelectric devices (2).

Abstract: A heating and cooling apparatus to be applied to an object to control the temperature of the object. A number of thermoelectric modules are adapted to be positioned in contact with the object in a pattern. A voltage source is adapted to apply a voltage to the thermoelectric modules to cause a temperature change in each thermoelectric module so as to control the temperature of the object in accordance with the pattern and with the voltage applied to thermoelectric modules.

Abstract: An apparatus to substantially minimize low-cycle fatigue of at least one electrical connection between a first component and a second component includes at least one thermoelectric device to thermally contact at least the first component and includes at least one sensor that is coupled to at least one of the first component or the second component. A controller is provided and coupled to the at least one thermoelectric device and to the at least one sensor. The controller controls operation of the thermoelectric device to substantially minimize low-cycle fatigue by transferring heat from at least the first component in response to signals from the at least one sensor.

Abstract: A temperature conditioned insulated container in a vehicle selectively heats or cools items stored therein. A thermoelectric energy module is coupled to a heat exchanger plate disposed in a compartment of the container. A power control circuit controls power to the thermoelectric energy module and a cooling fan motor. The drive circuit drives the thermoelectric energy module with a decaying drive signal for a predetermined time after the vehicle is shut down to prevent damage to the thermoelectric energy module. In a defrost operation, the drive circuit provides a decaying drive signal to the thermoelectric module during the beginning of a defrost cycle. After providing no cooling for a predetermined time, the drive signal is increased until the refrigerator operating system returns to full operation. By slowly varying the drive power in these situations, thermal stresses within the thermoelectric energy module are reduced.

Abstract: A compact refrigeration unit attachable to furniture, medicine cabinets, backpacks or other pre-existing objects. The compact refrigeration unit includes racks or shelves specifically designed to hold cosmetics or medicines includes a security mechanism to prevent un-authorized access an information input assembly, and a display assembly to input and display information such as dosage, frequency, expiration date, interactions, etc. about the cosmetics or medicines stored in the compact refrigeration unit.

Abstract: A system, method and apparatus for temperature regulation of physiological fluids is disclosed. In an exemplary system for use in cardiopulmonary procedures, blood is entered into a proportionally long, narrow disposable container, is heated or cooled to a desired temperature, and exits from an opposite end. The disposable container includes a pair of long, flat surfaces facing each other in relatively, close proximity. The blood is transitioned from transport tubing into a thin laminar flow layer and back into tubing, inside the container. This container is placed in a heat exchange device having thermoelectric modules that contact the majority of surface area, opposite the blood side in the container. The thermoelectric modules act as fully reversible heat pumps and move heat from one side of the module to the other, dependant on the direction of the current supplied to the modules. Feedback from sensors in the fluid path independently control each thermoelectric module.