Including Specific Circuitry Or Heat Exchanger Material Patents (Class 62/3.7)
  • Patent number: 6725669
    Abstract: A method and apparatus for controlling the temperature of a system are described. The method and apparatus use the Seebeck effect of a thermoelectric cooler. The apparatus includes a current source that generates current; a thermoelectric cooler having a first end and a second end connecting to the current source; and a control circuit. The control circuit monitors a voltage difference across the thermoelectric cooler and controls the current source according to the voltage difference. The voltage difference results in a temperature difference between the two ends of the thermoelectric cooler.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: April 27, 2004
    Assignee: Nortel Networks Limited
    Inventor: William Melaragni
  • Patent number: 6725682
    Abstract: An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: April 27, 2004
    Assignee: Coolit Systems Inc.
    Inventor: Alexander Robin Walter Scott
  • Publication number: 20040068991
    Abstract: A heat exchanger for use with an electronic heat pump including a plurality of narrow channels defined between adjacent walls. The channel heights are between 0 mm and 10 m to ensure thermal resistance is below 0.1° C./W for a 40 mm heat exchange width. The acceptable geometry for the channels is described by one or more variables, including the minimum number of channels and the minimum wall thickness for a given channel width. These variables control the surface area of the boundary of the channels in direct contact with the fluid and the cross-sectional area available for transmission of heat by conduction up the walls of the channels.
    Type: Application
    Filed: August 8, 2003
    Publication date: April 15, 2004
    Inventors: Ben Banney, Tilak T. Chandratilleke, Peter Terence Clarke
  • Patent number: 6715299
    Abstract: A refrigerator for cosmetics that has a storage chamber and a cooling unit to cool the storage chamber. The refrigerator includes an input unit, a storage unit, a temperature detecting unit and a control unit. The input unit receives one or more storage conditions from a user. The storage unit stores storage temperatures predetermined to correspond to possible storage conditions. The temperature detects unit detects a temperature of the storage chamber. The control unit controls an operation of the cooling unit on the basis of the storage conditions inputted through the input unit, a corresponding storage temperature stored in the storage unit and the temperature of the storage chamber detected by the temperature detecting unit.
    Type: Grant
    Filed: April 3, 2002
    Date of Patent: April 6, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-Young Kim, Jae-Seung Lee, Byung-Young Kang, So-Yeon Sim
  • Patent number: 6711904
    Abstract: The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal management of the package is performed by a controller, which monitors temperature(s) of the semiconductor die and increases or adjusts cooling such that desired performance levels can be obtained. The invention can also thermally manage one or more regions of a semiconductor die and can thermally manage a plurality of semiconductor dies.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: March 30, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Jonathan Michael Law, Nigel Henry Harley
  • Publication number: 20040055312
    Abstract: Disclosed is a system for thermally conditioning and pumping a fluid. The system includes a thermoelectric heat exchanger having a thermoelectric device configured to pump heat. Heat exchangers are provided for transferring heat to and from the thermoelectric device and for generating a fluid flow across the thermoelectric device. The conditioned fluid may be placed in thermal communication with a variety of objects, such as a vehicle seat, or anywhere localized heating and cooling are desired. Thermal isolation may also be provided in the direction of flow to enhance efficiency.
    Type: Application
    Filed: June 27, 2003
    Publication date: March 25, 2004
    Inventor: Lon E. Bell
  • Patent number: 6708501
    Abstract: A system to provide effective removal of heat from a high power density device. The system has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: March 23, 2004
    Assignee: Nanocoolers, Inc.
    Inventors: Uttam Ghoshal, Andrew Carl Miner
  • Publication number: 20040050076
    Abstract: A device and method is provided for sensing or predicting when condensation having a given physical state is present or imminent and for suppressing such condensation from a surface, such as a vehicle windscreen, eyewear, goggles, helmet visor, computer monitor screen, window, electronic equipment, etc, by preventing or removing it. A first thermal sensor is in thermally conductive contact with the surface. A second thermal sensor is in an environment separated from the surface. A humidity sensor is in the environment of the second thermal sensor. A circuit causes a condensation suppression mechanism to be activated for preventing or removing condensation having the given physical state from the surface when a temperature sensed by the first thermal sensor, a temperature sensed by the second thermal sensor, and a humidity sensed by the humidity sensor indicate that a condensation condition is either present or imminent and requires prevention or removal at the surface.
    Type: Application
    Filed: August 18, 2003
    Publication date: March 18, 2004
    Inventors: Valerie Palfy, Don A. Skomsky
  • Patent number: 6698224
    Abstract: An electronic apparatus includes a thermally insulated vessel having a cooling part therein. Disposed inside the thermally insulated vessel are a first electronic part and a second electronic part. The second electronic part is spaced apart from the cooling part while the first electronic part is in direct contact with the cooling part, such that the two electronic parts can operate at different cooling temperatures.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: March 2, 2004
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Noriyuki Kagaya, Yoichi Okubo, Masaki Suto, Hideaki Takahashi, Takashi Uchida
  • Patent number: 6694747
    Abstract: A liquid container comprising a base having openings that communicate from the front surface to the back surface, and first and second sealing plates that seal the openings from both sides of the base to form internal spaces, wherein the sealing plates comprise a first heat exchanging member for heating or cooling the internal space from the front surface of the base and a second heat exchanging member for heating or cooling the internal space from the back surface of the base.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: February 24, 2004
    Assignee: Sysmex Corporation
    Inventors: Takaaki Nagai, Hiroaki Tobimatsu
  • Publication number: 20040031272
    Abstract: A highly efficient thermoelectric cooler controller for temperature stabilization. The circuit comprises a temperature sensor and a thermoelectric cooler, both in thermal communication with a component to be temperature stabilized. The circuit further comprises a power amplifier electrically coupled to the thermoelectric cooler. The power amplifier is employed as a controlled current source to efficiently supply current to the thermoelectric cooler when maximum cooling is required.
    Type: Application
    Filed: August 13, 2003
    Publication date: February 19, 2004
    Applicant: fSONA Communications Corporation
    Inventors: George Stephen Mecherle, Terry Lee Holcomb, Robert T. Carlson, Fang-Xin Wang, Vladimir Draganov
  • Publication number: 20040020217
    Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.
    Type: Application
    Filed: July 31, 2003
    Publication date: February 5, 2004
    Inventor: Lon E. Bell
  • Patent number: 6679065
    Abstract: A temperature controlled apparatus comprises a reversible solid state device having a first section and a second section; portions of the first and the second sections are disposed in intimate contact. The first section is disposed adjacent to a portion of an external wall surface of a compartment and the second section is disposed adjacent to a portion of an internal wall surface of the compartment. A compartment fan is disposed within the compartment. The reversible solid state device and the compartment fan are coupled to a controller. The controller is configured to modify a compartment air temperature inside the compartment by controlling the reversible solid state device and the compartment fan to flow a compartment air across the second section. The controller is configured to control the reversible solid state device and the compartment fan in at least one temperature operational mode.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: January 20, 2004
    Assignee: General Electric Company
    Inventors: Warren Frank Bessler, Martin Mitchell Zentner, Venkataramana Rachakonda, Debra Ann Miozza, Anand Ganesh Joshi, Sanjay Manohar Anikhindi, Venkata Ramakrishna Ramayanam
  • Publication number: 20040006996
    Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.
    Type: Application
    Filed: July 11, 2002
    Publication date: January 15, 2004
    Inventor: Dana G. Butcher
  • Patent number: 6677555
    Abstract: An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so that the optical device can avoid performance degradation due to nonuniform temperature distribution. The amount power consumption can be reduced and excellent workability can be ensured.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: January 13, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Oh-Dal Kwon, Sun-Tae Jung, Tae-Gyu Kim
  • Patent number: 6678628
    Abstract: Apparatus for monitoring, characterizing, and testing coolant recirculation systems has, in combination, a heat load, a flow meter measuring flow rate of the coolant, inlet and outlet thermometers, and a data recorder connected to the flow meter, inlet thermometer, and outlet thermometer for recording their data outputs. The data recorder has an output representing flow rate, coolant inlet temperature, and coolant outlet temperature, whereby the coolant-recirculating heat exchanger system is characterized. A computer connected to the data recorder output is operable for computing heat removal capacity. The apparatus is specially adapted for methods of monitoring, characterizing, and testing coolant recirculation systems, including determining their maximum heat removal capacities.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: January 13, 2004
    Inventors: William J. Ryan, John W. Berube, Peter D. Hazelton
  • Patent number: 6672076
    Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: January 6, 2004
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6666031
    Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: December 23, 2003
    Assignee: Komatsu, Ltd.
    Inventors: Hideaki Ohkubo, Kazuhiko Kubota
  • Patent number: 6666032
    Abstract: A thermally insulated container includes a payload volume (36) that, in use, is to be maintained within a predetermined temperature range, at least one heat reservoir (44, 54), and a control device (48, 58) for controlling the flow of heat between the payload volume (36) and the heat reservoir (44, 54) so as to maintain the temperature in the payload volume (36) within the predetermined range.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: December 23, 2003
    Assignee: Kryotrans Limited
    Inventors: Colin David Rickson, John Bernard Pring
  • Publication number: 20030226363
    Abstract: A refrigerator includes at least one storage chamber for accommodating cosmetics. The refrigerator further includes electrical parts for maintaining cosmetics accommodated in the storage chamber at appropriate temperature, a control means for controlling operations of checking and displaying failures of the electrical parts, and a display unit for displaying the results of the checking of the failures.
    Type: Application
    Filed: December 12, 2002
    Publication date: December 11, 2003
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Seung Lee, Myung-Chul Kim, Yoon-Young Kim, Chang-Hak Lim
  • Patent number: 6658860
    Abstract: Counter-current heat flow systems are disclosed, where heat containing medium flows in adjacent conduits arranged anti-parallel to one another so that the medium flowing from a warm zone to a cool zone flows adjacent to the medium flowing from the cool to the warm zone in the opposite direction. A plurality of heat pumps are distributed along the conduits to actively pump heat between adjacent points of the conduits. Little energy is required to pump heat between the adjacent points yet a large temperature difference can be maintained between the warm and the cool zones. The heat containing medium can be a fluid or an electric current. The medium in one conduit may have a different heat capacity than the medium in the other conduit. A controller may be included to regulate the plurality of heat pumps and/or the flow of the media to maintain a desired temperature at the warm zone or the cool zone.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: December 9, 2003
    Inventor: Stephen P. McGrew
  • Patent number: 6658861
    Abstract: A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: December 9, 2003
    Assignee: Nanocoolers, Inc.
    Inventors: Uttam Ghoshal, Andrew Carl Miner
  • Patent number: 6658857
    Abstract: A portable thermoelectric cooling and heating appliance device and associated method of using the device are disclosed. The device comprises: a generally rectangular box, a hinge, a generally rectangular lid, a locking means, and a power cord. The box has a divider wall which defines a partition between a left and a right chamber within the box. The box further includes: an outer shell; an insulation layer; a inner shell; a power input plug; a first heat transfer unit; a first network of cooling/heating coils; a first control knob having a first voltage regulator and a first thermostat operationally connected to each other; a first spigot having a first button and a first drain; a second heat transfer unit; a second network of cooling/heating coils; a second control knob having a second voltage regulator and a second thermostat operationally connected to each other; and a second spigot having a second button and a second drain. The hinge is attached to the outer shell of the box.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: December 9, 2003
    Inventor: Hatho M. George
  • Patent number: 6651446
    Abstract: An electrical equipment cabinet is provided that includes an enclosure adapted to contain electrical equipment. A battery compartment, which is located in the enclosure, is adapted to contain at least one battery electrically coupled to the electrical equipment. The battery compartment has first and second opposing side walls, a bottom surface, and a first pair of vents located in the first and second side walls through which external air flows to remove heat. In addition, a second pair of vents, which are also located in the first and second side walls, allow gas emitted by the battery to escape by diffusion. A thermal stabilizing unit is disposed in the battery compartment for regulating the temperature of the battery in contact therewith. The thermal stabilizing unit has a conduit therein for conducting the external air flow between the vents in the first pair of vents.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: November 25, 2003
    Inventor: Mark C. Woods
  • Patent number: 6637210
    Abstract: An improved efficiency thermoelectric system operates the thermoelectric elements in the system in a non-steady state manner. The thermoelectric elements are powered for predefined periods of time to obtain increased efficiency. This benefit can be improved by also altering the resistance of the thermoelectric elements during the power-on period such that resistive heating is minimized.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: October 28, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6615590
    Abstract: An object of the present invention is to provide a heat exchanger for a temperature control which can take a large area for transferring the heat to the fluid while it is compact, has a good efficiency for exchanging the heat, can increase and decrease the heat transferring area in conformity to the user's needs and the manufacturing cost thereof is low. The heat exchanging boards 2, 3 with a plate constitution and plural thermo modules are superposed alternately so that they have a laminate constitution. The heat exchanging board has a construction such that a flowing path defining board 5, in which a flowing path with a labyrinth construction is formed, is folded by a thin shell 7. The shell has an inflow hole into which the fluid flows and an outflow hole from which a fluid flows out passing through said flowing path with the labyrinth construction. A peltier element is used as the thermo module.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: September 9, 2003
    Assignee: SMC Corporation
    Inventors: Shigesuke Yaegashi, Hiroyuki Sakama
  • Publication number: 20030154726
    Abstract: A temperature controller module for electronically controlling the temperature of a device, such as a pump laser or laser diode, controls the device temperature based on low heat dissipation inductors and current sources. The temperature controller module shuts off the thermoelectric cooler when the temperature of the laser exceeds a predetermined amount. Further, the temperature controller module is integrated in a compact, self-contained modular form to allow use in space critical applications.
    Type: Application
    Filed: January 8, 2003
    Publication date: August 21, 2003
    Inventors: John Finn, Renfeng Gao, Renyuan Gao, Joseph Chang
  • Publication number: 20030154723
    Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kun-Tzu Lin, Jung-Huang Peng, Yu-Chih Huang, Chu-Song Shih
  • Publication number: 20030154725
    Abstract: Counter-current heat flow systems are disclosed, where heat containing medium flows in adjacent conduits arranged anti-parallel to one another so that the medium flowing from a warm zone to a cool zone flows adjacent to the medium flowing from the cool to the warm zone in the opposite direction. A plurality of heat pumps are distributed along the conduits to actively pump heat between adjacent points of the conduits. Little energy is required to pump heat between the adjacent points yet a large temperature difference can be maintained between the warm and the cool zones. The heat containing medium can be a fluid or an electric current. The medium in one conduit may have a different heat capacity than the medium in the other conduit. A controller may be included to regulate the plurality of heat pumps and/or the flow of the media to maintain a desired temperature at the warm zone or the cool zone.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Inventor: Stephen P. McGrew
  • Patent number: 6606866
    Abstract: Disclosed is a system for thermally conditioning and pumping a fluid. The system includes a thermoelectric heat exchanger having a thermoelectric device configured to pump heat. Heat exchangers are provided for transferring heat to and from the thermoelectric device and for generating a fluid flow across the thermoelectric device. The conditioned fluid may be placed in thermal communication with a variety of objects, such as a vehicle seat, or anywhere localized heating and cooling are desired. Thermal isolation may also be provided in the direction of flow to enhance efficiency.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: August 19, 2003
    Assignee: Amerigon Inc.
    Inventor: Lon E. Bell
  • Publication number: 20030145605
    Abstract: Disclosed is an air conditioner using a thermoelectric module enabling to supply users individually with fresh and pleasant air for cooling/heating. The present invention includes a thermoelectric module having high and low temperature parts discharging and absorbing heat by an electric power, a heat-absorption accelerating means connected thermally to the low temperature part of the thermoelectric module so as to accelerate heat exchange between the low temperature part and an air, and a heat-dissipation accelerating means connected to the high temperature part of the thermoelectric module to accelerate heat exchange between the high temperature part and air so as to cool the high temperature part.
    Type: Application
    Filed: July 19, 2002
    Publication date: August 7, 2003
    Inventors: Dong Soo Moon, Mun Kee Chung
  • Patent number: 6598405
    Abstract: An improved efficiency thermoelectric power generation system is disclosed wherein convection is actively facilitated through a thermoelectric array, and the thermoelectric array is used to generate electrical power. Thermal power is convected through the thermoelectric array or arrays toward at least one side of the thermoelectric array, which leads to increased efficiency. Thermal power is applied to the array, creating a temperature gradient across the array. The thermoelectric system may also be combined with other power generation systems, forming a co-generation system.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: July 29, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6598403
    Abstract: A thermoelectric cooling system integrating quantum cold point connections with lateral thermoelectric element formation. A preferred system has an n-type and p-type thermoelectric element, each connected to a common conducting section. The thermoelectric elements are each tapered at the end where they contact the common conducting section. The thermoelectric elements preferably all occupy substantially the same plane as each other and as the common conducting section.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: July 29, 2003
    Assignee: International Business Machines Corporation
    Inventor: Uttam Shyamalindu Ghoshal
  • Patent number: 6598404
    Abstract: Described herein is a temperature control system for cooling magnetic elements (14) in MRI apparatus (10). The control system comprises a wax (16) in contact with the elements (14) which is substantially maintained at its phase transition temperature between a solid state and a liquid state, but in a substantially solid state. A sensor (18) is immersed in the wax (16) and operates to provide a signal on the change of state of the wax (16). The sensor (18) is connected to a controller (20) which controls the operation of a heating element (26) also immersed in the wax (16) to control the temperature thereof. When the MRI apparatus is operational, heat is generated by the magnetic elements (14) is used to change the wax (16) to a liquid, this change being detected by the sensor (18) which sends signals to the controller (20) to turn off the heating element (26).
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: July 29, 2003
    Assignee: Oxford Magnet Technology Limited
    Inventor: Marcel Jan Marie Kruip
  • Patent number: 6595005
    Abstract: A method and apparatus for measuring the cooling efficacy of air comprising coupling a resistive element to a temperature sensing element, applying a voltage across the resistive element, adjusting the voltage across the resistive element so that the temperature indicated by the temperature sensing element is nearly proportional to the temperature of a locally disposed heat sensitive component for a change in environmental parameters, and coupling the output of the temperature sensing element to a control circuit wherein the control circuit controls a space cooling element.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: July 22, 2003
    Assignee: InFocus Corporation
    Inventor: Eric Immel
  • Patent number: 6591615
    Abstract: In an electrical appliance, a thermal conductor includes a hollow heat-conducting member that has inner and outer walls confining an enclosed chamber therebetween, and a superconductor disposed in the chamber. A heat-insulating layer is provided on an outer peripheral surface of the outer wall. A temperature control device includes a thermoelectric unit disposed on and in thermal communication with the outer wall of the heat-conducting member. A control unit is connected to the thermoelectric unit and is operable so as to enable the thermoelectric unit to operate in either a heat-absorbing mode, where the thermoelectric unit absorbs heat from the thermal conductor so as to reduce temperature in the heat-conducting member, or a heat-radiating mode, where the thermoelectric unit radiates heat to the thermal conductor. A power source is connected to the temperature control device for supplying electric power thereto.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: July 15, 2003
    Inventor: Chin-Kuang Luo
  • Publication number: 20030126866
    Abstract: A temperature conditioned insulated container in a vehicle selectively heats or cools items stored therein. A thermoelectric energy module is coupled to a heat exchanger plate disposed in a compartment of the container. A power control circuit controls power to the thermoelectric energy module and a cooling fan motor. The drive circuit drives the thermoelectric energy module with a decaying drive signal for a predetermined time after the vehicle is shut down to prevent damage to the thermoelectric energy module. In a defrost operation, the drive circuit provides a decaying drive signal to the thermoelectric module during the beginning of a defrost cycle. After providing no cooling for a predetermined time, the drive signal is increased until the refrigerator operating system returns to full operation. By slowly varying the drive power in these situations, thermal stresses within the thermoelectric energy module are reduced.
    Type: Application
    Filed: August 3, 2001
    Publication date: July 10, 2003
    Inventor: Michael B. Spry
  • Patent number: 6588217
    Abstract: An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: July 8, 2003
    Assignee: International Business Machines Corporation
    Inventor: Uttam Shyamalindu Ghoshal
  • Patent number: 6581388
    Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: June 24, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: Shlomo Novotny, John Dunn, Marlin Vogel
  • Patent number: 6584128
    Abstract: The preferred embodiment describes a regulating device (400) that regulates current flow through a thermoelectric cooler (TEC) (420) with higher power efficiency than conventional regulating methods. The regulating device includes a voltage controller (415) that receives an input voltage from a comparator (435) that has determined whether there has been a change in temperature surrounding a temperature sensitive device, such as a laser, by way of a thermistor (425). The controller (415) then controls two pulse width modulated (PWM) synchronous rectifiers (405, 410). The combination of the controller (415) and the synchronous rectifiers (405, 410) improves the power efficiency of the regulating device (400). Each PWM synchronous rectifier (405, 410) includes two field effect transistors (FETs) that supply substantially a constant current flow through the TEC (420) to either heat or cool a control surface (430).
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: June 24, 2003
    Assignee: Scientific-Atlanta, Inc.
    Inventor: Richard Kroeger
  • Patent number: 6574967
    Abstract: A cooling and heating apparatus using a thermoelectric module, in which the thermoelectric module, a heat emitting member and a heat conducting block are integrated into a single unit, to improve the performance and durability of the thermoelectric module. The cooling and heating apparatus includes a thermoelectric module. The heat emitting member is attached to a first surface of the thermoelectric module. The heat conducting block is attached to a second surface of the thermoelectric module. The heat absorbing member is attached to the heat conducting block. A cover integrates the thermoelectric module and the heat conducting block into the single unit by fixedly covering side surfaces of the thermoelectric module and the heat conducting block and a part of an inner surface of the heat emitting member.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: June 10, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Rae-Eun Park, Jae-Seung Lee, Su-Il Lee
  • Publication number: 20030097846
    Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.
    Type: Application
    Filed: November 27, 2001
    Publication date: May 29, 2003
    Inventors: Shlomo Novotny, John Dunn, Marlin Vogel
  • Publication number: 20030097845
    Abstract: A heating and cooling apparatus to be applied to an object to control the temperature of the object. A number of thermoelectric modules are adapted to be positioned in contact with the object in a pattern. A voltage source is adapted to apply a voltage to the thermoelectric modules to cause a temperature change in each thermoelectric module so as to control the temperature of the object in accordance with the pattern and with the voltage applied to thermoelectric modules.
    Type: Application
    Filed: July 2, 2002
    Publication date: May 29, 2003
    Inventors: John Saunders, Jamey D. Jacob, Dayong Gao, Michel A. Myers
  • Patent number: 6564010
    Abstract: An aquarium thermostat comprises a ventilation box and a transforming mechanism disposed in the ventilation box such that the transforming mechanism is regulated by a microcomputer control mechanism to effect the generation of heating or cooling energy by which the aquarium water flowing into the aquarium thermostat is heated or cooled to a present level. The heated or cooled water is then sent back to the interior of the aquarium via a pipe.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: May 13, 2003
    Assignee: U-Long Co., Ltd.
    Inventors: Bin-Juine Huang, Tse-Ju Huang, Shueh-Cheng Lu, Chin-Ting Lin
  • Publication number: 20030084670
    Abstract: A refrigerator for cosmetics that has a storage chamber and a cooling unit to cool the storage chamber. The refrigerator includes an input unit, a storage unit, a temperature detecting unit and a control unit. The input unit receives one or more storage conditions from a user. The storage unit stores storage temperatures predetermined to correspond to possible storage conditions. The temperature detects unit detects a temperature of the storage chamber. The control unit controls an operation of the cooling unit on the basis of the storage conditions inputted through the input unit, a corresponding storage temperature stored in the storage unit and the temperature of the storage chamber detected by the temperature detecting unit.
    Type: Application
    Filed: April 3, 2002
    Publication date: May 8, 2003
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon-Young Kim, Jae-Seung Lee, Byung-Young Kang, So-Yeon Sim
  • Patent number: 6557354
    Abstract: A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: May 6, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Patent number: 6556752
    Abstract: An optoelectronic device comprising a laser and a lens for generating collimated light, a locker including an etalon for wavelength locking the collimated light, a first thermoelectric cooler coupled to the laser, and a second thermoelectric cooler coupled to the locker, wherein the first and second thermo-electric coolers arc independently controlled and the second thermo-electric cooler provides for temperature tuning of the etalon.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: April 29, 2003
    Assignee: Agility Communications, Inc.
    Inventors: Lu Fang, Joseph Edward Riska, John W. Herman, Timothy Butrie, Rory Keene Schlenker
  • Patent number: 6546737
    Abstract: Cooler for a beverage, e.g. beer, which enables dispense at low temperature with good appearance of the dispensed beverage, comprises an inlet and an outlet, at least one heat exchanger (10, 30, 32) between the inlet and the outlet through which the beverage can be passed to cool it and at least one Peltier plate assembly (12, 14, 42) connected to a voltage supply whereby a cold side and a hot side may be generated at the assembly, characterised in that the assembly (12, 14) is positioned whereby the beverage can also be cooled by passage past the cold side of the assembly (12, 14) on its passage to the outlet or whereby the coolant after passage through the heat exchanger (32) is cooled by passage past the cold side of the assembly (42) before being recirculated to the heat exchanger (32).
    Type: Grant
    Filed: March 6, 2001
    Date of Patent: April 15, 2003
    Assignee: IMI Cornelius Inc.
    Inventors: Keith James Heyes, Joseph Eugene Holland, William Robert Mooney
  • Patent number: 6539725
    Abstract: An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: April 1, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6532747
    Abstract: The present invention relates to a device in performing a process in a process medium by varying the parameters of said process medium over time in a laboratory scale, according to a predetermined scheme. The device comprises at least one reaction receptacle, a heat transfer plate, a peltiere element, a temper sensor, a magnetic stirrer and a data processing unit. The data processing unit is adapted to send out signals to the peltiere element in response to incoming signals from the temperature sensor. The invention further relates to a method for controlling the data processing unit.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: March 18, 2003
    Assignee: AB Implementa Hebe
    Inventors: Dario Kriz, Christer Ljung