Abstract: A mobile terminal includes an instrument specifying information acquiring portion that acquires instrument specifying information for specifying an instrument as a diagnostic subject, an equipment information acquiring portion that acquires, from a controlling device that controls equipment information pertaining to equipment that are provided with instruments, equipment information corresponding to the instrument specifying information, a diagnostic data acquiring portion that collects diagnostic data for the instrument using a data collecting device corresponding to a data categorization that is included in the equipment information acquired by the equipment information acquiring portion, an evaluating portion that evaluates whether or not there is a problem with the instrument by comparing proper-operation data for the instrument, included in the equipment information acquired by the equipment information acquiring portion, to the diagnostic data collected by the diagnostic data acquiring portion, and an o

Abstract: In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.

Abstract: Provided is a detecting method of abnormality of a machine tool operation, and the detecting method includes a preparing step S100; a reference waveform obtaining step S200 of measuring a drive voltage and a drive current, while machining the material in a normal state of the machine tool, and obtaining a reference waveform; a monitoring section setting step S300 of setting a monitoring section and thus automatically calculating a maximum load value and a minimum load value; a permissible limit setting step S400 of setting maximum and minimum permissible limits; and a monitoring step S500 of obtaining a machining load generated and determining whether a difference between maximum and minimum load values of the machining load is out of the maximum or minimum permissive limit and then outputting normality or abnormality thereof.

Abstract: A coolant apparatus of a machine tool includes a coolant pump that sends out a coolant from a coolant tank, a controller that drives or stops the coolant pump, and a condition setting unit that sets conditions for driving or stopping the coolant pump. Then, the controller drives or stops the coolant pump based on content set by the condition setting unit.

Abstract: A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.

Abstract: A tool management system configured to managing a life of a tool in a processing device includes an acquisition unit configured to, when it is detected that a target tools is in use, acquire a stocker number of a position at which the target tool in use is accommodated from a processing program, a determination unit configured to acquire a time for replacement of the target tool corresponding to the stocker number and determine whether or not the total use time of the target tool has reached the time for replacement; and an output unit configured to, when the determination unit determines that the total use time has reached the time for replacement, output an instruction to provide a display urging replacement of the target tool.

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract: A method of machining a work part in a numerically-controlled machining process with a selected tool, includes steps of inspecting actual geometric parameters of the selected tool and predicting cutting forces and this tool deflections based on given tool/part engagement conditions and pre-measured static stiffness of the selected tool, then modifying a tool path of the numerically-controlled machining process to compensate for the predicted tool deflections, and finally machining the work part to a desired profile by use of the selected tool to follow the modified tool path.

Abstract: A machining condition estimating apparatus, for estimating a long life-time machining condition, by suppressing boundary wears, from among plural numbers of choices of machining conditions, without building up database, comprise: a means for defining an analysis model presenting shapes of a tool and a cutting material, to be a target of analysis, and various kinds of machining condition parameters relating to relative positions between the tool and the cutting material; a means for setting up an initial value for use of analysis and change volume of the machining condition parameter as analysis parameters; a means for conducting geometric calculation of contact length, over which the tool and the cutting material of the model contact with, for each analysis parameter; a means for producing a distribution waveform, plotting the contact length “Lci” for each position “?i” of a point on each blade edge calculated, on “?i”?“Lci” coordinates, thereby to calculate a ratio of movement length of a boundary portion wi

Abstract: A method for operating a plant to produce tablets that has at least one rotary press and one computer system, wherein the computer system contains operating and control software for controlling and monitoring the operation of the rotary press, and wherein the rotary press is designed for installing different types of rotors, wherein a record adapted to the respective rotor type is saved in a memory and communication component on the rotors, and before the rotor type is initially operated, the record is read out and is saved in the computer system to automatically adapt the operating and control software and user interface to the rotor type.

Abstract: A method for properly locating a flexible fixture on a CNC machine comprises probing a plurality of locators on a flexible fixture to determine a locator position on a coordinate system for the CNC machine. The position for each of the plurality of locators is analyzed to determine if all of the plurality of locators are within a predetermined offset limit from a nominal position. A controller is programmed with an offset compensation amount based upon the probed position for each locator when each of the plurality of locators is within the predetermined offset limit. The locator positions are adjusted if one of the probed locations is not within the predetermined offset limit. The CNC probing programs are generated by a computer language to accommodate various fixture configurations.

Abstract: A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.

Abstract: A controller for a machine tool outputs an operation instruction signal to the machine tool. The machine tool transmits a signal indicating that the instructed operation is compete. The controller determines a response time of operation to be a difference in time between a point in time when the numerical controller outputs an operation instruction signal and a point in time when the numerical controller receives a signal from the machine tool. When the response time of operation exceeds a preset value, the numerical controller determines that a corresponding maintenance component needs to be replaced and informs a user of the need for replacement by means of a display unit.

Abstract: In mill stands of a continuous rolling train, a product passes through the train is rolled such that the product upon leaving the train has predetermined final characteristics. To remove one of the stands, the mill stand to be removed is completely relieved of load according to a defined temporal load relieving sequence. Locally simultaneously with the load relieving, at least one other mill stand is placed under load according to a defined temporal loading sequence. The load-relieving and loading sequence are mutually adjusted to preserve the final product characteristics. A circumferential roll velocity is controlled until the stand has been completely relieved such that a discharge velocity corresponds always to a predetermined desired discharge velocity. After the complete load-relieving, a correspondence of the circumferential roll velocity to the desired discharge velocity is maintained and the working rolls are lifted off. The mill stand is then deactivated.

Abstract: A process for controlling a lens manufacturing process comprising the steps of: a) manufacturing a master lens according to a manufacturing process using a manufacturing device, b) measuring by using at least a measuring device at least one parameter of the master lens of step a), c) recording the value of the parameter, d) repeating regularly step a) to c) and checking the evolution of the parameter over time, wherein the evolution of at least one parameter of the manufacturing device used during the lens manufacturing process is checked over time and the evolution over time of at least one parameter of the master lens is related with the evolution over time of the at least one parameter of the manufacturing device.

Abstract: A vibration suppressing device includes a memory unit storing a stable rotation speed calculated by an arithmetical unit in association with a rotation speed range that includes the stable rotation speed, in which, when a command rotation speed that is a rotation speed of a rotary shaft is inputted in starting machining operation by rotation of the rotary shaft and, the arithmetical unit determines whether the command rotation speed is included in the rotation speed range or not, reads out the stable rotation speed when the command rotation speed is included in the rotation speed range and outputs the stable rotation speed to an NC device instead of the command rotation speed, and starts the machining operation at the stable rotation speed.

Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.

Abstract: A method and system for autonomously monitoring, evaluating, storing and testing tools and other units operated at a rig-site. The system may include a storage facility communicatively coupled to one or more tools, status flags identifying the health and operational status of the tools, and a computer for performing a self-check for determining the operational status for the one or more tools. The system may further include a remotely positioned computer system in communication with the operational status of the tools, and a user terminal in communication with the computer system.

Abstract: A method of determining conditions for machining a part so as to avoid vibration appearing during the machining. A machining stage is simulated by provisionally setting parameters of a function for modulating cutting speed, by deducing a corresponding surface state, by modifying parameters iteratively with the machining stage being simulated each time until the surface state reaches an acceptable value, and by performing the machining stage by causing the cutting speed to vary in application of the corresponding modulation function.

Abstract: Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.

Abstract: A method of operating a machining system includes comparing one or more features of a cutting tool to information stored on a data chip secured to a tool holder of the cutting tool. The cutting tool is loaded into the machining system, and the information stored on the data chip is compared to cutting tool requirements of a machining program for instructing operation of the machine. When a result of one or more of the comparisons is outside of a predetermined threshold, operation of the machining system is stopped.

Abstract: System and method for automated provision of a monitoring function for a machining process which is to be executed by a machine tool. A computer-aided manufacturing (CAM) program of the machining process is automatically analyzed by means of a postprocessor in order to determine processing steps to be monitored. At least one monitoring instruction may be automatically inserted into a control program of the machine tool by the postprocessor, wherein the control program is executed during the machining process.

Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.

Abstract: A method for uniformly planarizing a wafer that includes determining a first wafer warped value at a first zone on the wafer, determining a second wafer warped value at a second zone on the wafer, and calculating a pressure difference based on the first and second wafer warped values at the first and second zones is provided. The method also includes performing a chemical mechanical polishing of the wafer, applying a first pressure based on the first wafer warped value to the wafer at the first zone during the chemical mechanical polishing, and applying a second pressure based on the second wafer warped value to the wafer at the second zone during the chemical mechanical polishing, a difference between the first pressure and the second pressure based on the pressure difference.

Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract: A machine controller includes a memory and a processor configured for operating a machine control for automatically controlling apparatus for performing a machining process on a workpiece at least partially as a function of data relating to a parameter of the workpiece, and a gage control for automatically controlling gaging apparatus for collecting and processing the data relating to the parameter of the workpiece and storing the data in the memory. At least a portion of the memory in which the data relating to the parameter of the workpiece is stored, is configured as a shared memory so as to allow the machine control to immediately retrieve and use the stored data relating to the parameter of the workpiece. The controller has particular utility for use in controlling a honing process and a gaging process, which can be in-process or post-process, and which can be used for bore sizing and other parameters.

Abstract: A workpiece measuring apparatus has an external module provided outside an NC device to acquire position data of one or more movable axes of a movable unit having a measuring head attached thereto. The position data of the measuring head is acquired at the same time interval as that for the distance measurement by the measuring head. The position of the workpiece is acquired by calculation from the acquired distance measurement data and the position data of the measuring head. The continuous shape of the workpiece can be measured by performing continuous measurement while moving the measuring head. Therefore, no modification or change is required such as adding a new function to the NC device. In addition, the present invention is applicable to any machine tool equipped with an NC device of any configuration, without being restricted by constraints of the NC device.

Abstract: A cutter chatter monitoring method comprises the steps of capturing a cutting vibration acceleration signal; dividing the cutting vibration acceleration signal in each predetermined time period into a plurality of segments; determining whether the vibration acceleration signal of each segment is increased by a multiple greater than a threshold value; performing a Fast Fourier Transform of the cutting vibration acceleration signal in each predetermined time period; calculating a vibration frequency; determining whether the vibration frequency of the cutting vibration acceleration signal is a multiple of a cutter passing frequency; and increasing a main shaft rotating speed of a cutter to avoid cutter chatters if both aforementioned conditions are satisfied.

Abstract: An online real-time cutter breakage monitoring method uses a plurality of signals generated in three consecutive time periods by a vibration acceleration during a cutting process conducted by a CNC machine tool, and compares a difference between a maximum value of signals in each time period and an average value of the signals and a difference between the average value of signals thereafter and an idling critical value to output a first cutter breakage signal and a second cutter breakage signal simultaneously and determine the occurrence of a cutter breakage and shut down the CNC machine tool immediately to improve the determination speed and accuracy, so as to avoid unnecessary shutdowns or hindering the manufacturing flow.

Abstract: It is provided that a machining conditions setting system and a machining conditions setting method with which it is possible to select a machining condition for machining according to a target degree of hardness and obtain a predetermined degree of hardness by performing only the machining. The machining conditions setting system includes: a machining conditions database that, by determining in advance a relationship between the machining condition and a degree of hardness of the workpiece machined under the machining condition, stores the machining condition corresponding to the material of the workpiece and a range of degree of hardness for machining; and machining conditions selection means into which a material of a workpiece and a target degree of hardness are input, and which outputs a machining condition under which machining with the target degree of hardness can be performed, referring to the machining conditions database.

Abstract: A method and apparatus for inspecting a surface of an object. Data from measuring the surface of the object is obtained to form surface data for the object. A range of frequencies for features on the object is selected based on a range of distances between adjacent peaks for the features. The features are formed by a tool moving along a number of paths. Desired surface data for the features is obtained from the surface data using the range of frequencies selected. A determination is made as to whether the desired surface data for the features meets a policy specifying a desired surface for the object. In response to an absence of a determination that the desired surface data for the features meets the policy, the object is reworked.

Abstract: A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.

Abstract: The present invention provides a method of drilling a hole in a workpiece in order to control breakthrough of the workpiece comprising the steps of: a) initiating contact between a drill bit of a drill unit and the workpiece; b) operating the drill unit to rotate the drill bit to drill the workpiece; c) during drilling of the workpiece measuring the force, F and torque, T, experienced by the drill bit; d) calculating a variable F?, based on the measured force, F, representing the rate of change of F; e) calculating a variable, T? based on the measured torque, T, representing the rate of change of T; f) calculating a variable F? representing the rate of change of F?; g) calculating a variable T? representing the rate of change of T?; h) detecting the onset of breakout of the workpiece by use of the variables F?, F?, T? and T?; i) thereby controlling the speed of rotation of the drill bit during breakthrough of the workpiece to control the degree of breakout of the drill bit from the workpiece.

Abstract: A mounting condition determining method including: obtaining mounting information including information related to component mounting operations scheduled to be performed by a mounter (S1); judging, using the mounting information obtained in the obtaining: which production mode between a synchronous mode and an asynchronous mode is suitable for the scheduled component mounting operations; or which production mode between an alternating mode and an independent mode is suitable for the scheduled component mounting operations (S2, S3); and selecting the production mode indicated by a result of the judgment in the judging, as the production mode to be executed by the mounter (S5, S6).

Abstract: A method of determining whether a part satisfies tolerance criteria includes making a multiplicity of measurements of the part, reducing the number of measured points to a number of boundary points that define a boundary within which all measured points are encompassed and comparing the boundary to a tolerance limit of a normal surface to determine whether the part conforms to the tolerance.

Abstract: A method for processing a workpiece in which a tool smaller than the workpiece is caused to scan the workpiece includes the steps of dwelling a tool on a dummy work for a predetermined time to process the dummy work, measuring the dummy work to determine a unit removal shape, causing the tool to scan the dummy work, and processing the dummy work while continuously changing a dwell time of the tool so that the dwell time is a linear function with respect to a scanning position of the tool.

Abstract: A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.

Abstract: There are provided a system, method and computer program product for detecting foreign materials in a semiconductor manufacturing process. The manufacturing process uses a plurality of semiconductor manufacturing tools. The system categorizes at least one monitoring wafer according to one or more categories. The system supplies the categorized monitoring wafer to a semiconductor manufacturing tool. The system observes a level of contamination on the categorized monitoring wafer. The system compares the level of contamination to a threshold. The system cleans the tool in a response to determining that the level of contamination is larger than the threshold. The system determines which category of the wafer leaves a highest level of contamination on the tool. The system identifies a root cause of the highest level of contamination on the tool.

Abstract: A method for utilizing a bending machine die layout includes designating a die layout of a bending machine, the designated die layout being defined by arrangements of replaceable punches and replaceable dies installed on the bending machine. The method also includes extracting, in the designated die layout, segments in each of which a punch and a die face overlapping to each other to be actually used for one of bending processes, as virtual die stages based on punch attachment positions and punch lengths of the punches, and die attachment positions and die lengths of the dies. The method further includes assigning, by using a sheet metal shape model of a bent product planned to be made by the bending machine, bend lines on the sheet metal shape model corresponding to actual bend lines of the bent product, to the virtual die stages.

Abstract: A headset includes a voice print match application or speech recognition application. The voice print match application receives a user speech corresponding to a submitted voice print phrase key upon determining a donned condition, where the user speech is compared to the predetermined voice print phrase key to validate an identity of the headset user. The speech recognition application receives a user speech corresponding to a password or PIN and recognizes the password or PIN. The recognized password or PIN is compared to a valid password or PIN to validate the identity of the headset user.

Abstract: A scheduling optimizer system, method and program product that analyzes a device for sensitivities, such as ESD sensitivities, and allows for modification of a floor schedule of the assembly unit of the device based on the sensitivity of the device while improving the overall performance of the assembly unit are disclosed. The scheduling optimizer analyzes sensitivity data for a device during operation of the assembly unit on the floor schedule. The floor schedule is then optimized based on the analyzed sensitivity data.

Abstract: A medical robotic system comprises a number of components that may be monitored to determine their preventive maintenance needs by recording usage-related information for the monitored components into associated non-volatile memories. When usage of the component exceeds a specified usage threshold, the system displays a warning message on its display screen to have preventive maintenance performed for the component. If the usage continues without such maintenance and exceeds a higher usage threshold, the system displays an error message on its display screen and the system transitions into an error state during which medical procedures are not allowed to be performed. The usage-related information may also be communicated to a remote computer which gathers and processes usage-related information from a number of medical robotic systems to estimate resource requirements for timely performing preventive maintenance on the medical robotic systems, and anticipated service revenues from such maintenance.

Abstract: A method and system for evaluating a performance of a semiconductor manufacturing tool while manufacturing microelectronic devices are disclosed. At least one report is generated based on executions of at least one statistical test. The report includes at least one heat map having rows that correspond to sensors, columns that correspond to trace data obtained during recipe steps, and cells at the intersection of the rows and the columns. At least one sensor in the tool obtains trace data of a recipe step while manufacturing at least one microelectronic device. A computing device analyzes the obtained trace data to determine a level of operational significance found in the data and assigns a score to the trace data that indicates a level of operational significance. Then, the computing device places the score in a corresponding cell of the heat map. A user uses the cell for evaluating the tool performance.

Abstract: A vibration suppressing device and a vibration suppressing method that are capable of obtaining an accurate optimum rotation speed and shortening a time period from generation of chatter vibration to calculation of the optimum rotation speed are provided. The vibration suppressing device includes: vibration sensors for detecting time-domain vibrational accelerations of a rotary shaft in rotation; and a control device for calculating a chatter frequency and a frequency-domain vibrational acceleration of the rotary shaft at the chatter frequency on the basis of the time-domain vibrational accelerations detected by the vibration sensors, and when the calculated frequency-domain vibrational acceleration exceeds a predetermined threshold value, calculating an optimum rotation speed on the basis of a predetermined parameter, and rotating the rotary shaft at the calculated optimum rotation speed.

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract: A thermal error compensation method for machine tools is disclosed, which comprises the steps of: disposing at least a thermal sensor at positions neighboring to the at least one heat source of a machine tool; driving the machine tool to operate under a specific operation condition for enabling the at least one heat source to generate heat; generating a thermal signal according to the temperature detected by the at least one thermal sensor; using a heat conducting calculation unit to access the thermal signal and the information relating to the specific operation condition to be used in a calculation for obtaining and thus outputting at least a node temperature; and using an error compensation unit to access the at least one node temperature to be used in a calculation for obtaining thermal error compensation values for the machine tool.

Abstract: An abnormality detection system includes a measurement unit, a decision unit, an alarm unit, and storage units, and serves to detect the abnormality in a control characteristic value of a plurality of products manufactured on the same production line. The decision unit receives the control characteristic value stored in the storage unit, and decides whether an abnormality exists, based on that value. More specifically, the decision unit decides that the control characteristic value is abnormal when, with respect to m (m is a natural number) pieces of the products that are consecutively manufactured, an absolute value of a difference in control characteristic value between each of the products and another manufactured immediately before the former is equal to or less than a predetermined constant.

Abstract: A thermal displacement correcting apparatus includes a correction amount estimating device and a parameter automatic selecting device that, in a machine tool having two different sets of specifications that differ due to the presence/absence of a scale and different methods of measuring the lengths of a bed and a table, estimate a thermal displacement correction amount of the machine tool of each set of specifications. The two devices store a collection of parameters for an estimated thermal displacement calculation corresponding to each of the bed, the scale, the table, and a workpiece, as a database, and select the parameters belonging to the set of specifications from the database based on machine information according to each set of specifications, calculate estimated thermal displacements of the bed, the table, and the workpiece, or also the scale, according to the selected parameters, and combine the estimated thermal displacements.

Abstract: A method for classification of defects and running of grinding of lamination cylinders includes identifying defect areas in a map illustrating a plurality of surface measurements of a cylinder. The method includes calculating, for each area identified, a plurality of parameters. The method includes identifying a type of defect associated with the areas identified, on the basis of the parameters calculated. The method includes determining an acceptability threshold of a specific defect for each type of defect identified. The method includes defining a corrective action for each area on the basis of a comparison between the acceptability threshold associated with the type of defect of the area, and a measurement of the surface measurements of the cylinder associated with the area. The method includes determining grinding parameters on the basis of the surface measurements of the cylinder, if the corrective action is a grinding operation to remove the defects.