Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: A heat potential value for each of a set of available server locations is calculated via a data center controller based upon at least one active server in a data center. A minimal calculated heat potential value for the set of available server locations is identified. An available server location associated with the identified minimal calculated heat potential value is selected from the set of available server locations.

Abstract: The apparatus and method of the present invention provides accurate consumption and efficiency data for a given system by taking into account many of the external factors described. The apparatus receives inputs from a number of different sources including environmental sensors, utility meters and other device sensors. The input data are transmitted to a central base-station that communicates the data to a remote server. The server uses the sensor data and calculates system performance values, for example energy consumption and cost, and compares these to a number of preset values, for example user defined targets or ‘Best-In-Class’ performance. The data are then available to a user online via a secure web-based interface.

Abstract: A method for discovering thermal relationships in a data processing environment is provided in the illustrative embodiments. An output temperature of a cooling unit operating in the data processing environment is changed from a previous output temperature to a new output temperature. The difference between the previous and the new output temperatures is a change in the output temperature. A change in an ambient temperature proximate to a data processing system is measured. The change in the ambient temperature is a difference between a previous ambient temperature and a new ambient temperature. An expression that represents a relationship between the change in the output temperature and corresponding change in the ambient temperature is determined. The expression is used to determine a cooling correspondence between the cooling unit and the data processing system.

Abstract: A system and method for evaluating equipment in an improper cluster in a data center, the equipment including a plurality of equipment racks, and at least one cooling provider. In one aspect, the method includes receiving data regarding each of the plurality of equipment racks and the at least one cooling provider, the data including a layout of the improper cluster of equipment racks and the at least one cooling provider, storing the received data, identifying at least one gap in the layout, determining cooling performance of at least one of the plurality of equipment racks based, at least in part, on characteristics of the at least one gap, and displaying the layout of the data center, wherein the layout includes an indication of the cooling performance of the at least one of the plurality of equipment racks.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.

Abstract: A vehicle includes a power inverter module (PIM), a motor/generator unit (MGU), vehicle components, temperature sensors, and a controller. The sensors measure temperatures of a motor winding of the MGU, and temperatures of the multiple phase outputs of the PIM. The second plurality of temperature sensors measures temperatures of the vehicle components. The controller calculates an average temperature of the components, and individually diagnoses each temperature sensor using the average temperature. A control circuit for the vehicle includes the first and second plurality of sensors and the controller. A temperature performance diagnostic method includes using the first plurality to measure a temperature of the motor winding and the phase outputs of the PIM, using the second plurality to measure a temperature of the components, calculating an average temperature of the components, and individually diagnosing the performance of each of the first plurality of sensors using the average temperature.

Abstract: A system and method for detecting abnormal operation of a hydrocracker includes a hydrocracker model. The model may be configurable to include one or more regression models corresponding to different operating regions of the portion of the hydrocracker. The system and method may also determine if a monitored temperature difference variable deviates significantly from the temperature difference variable predicted by the model. If there is a significant deviation, this may indicate an abnormal operation.

Abstract: Due to their exposure to extreme environments, it is expected that parts or all of a solar power system will experience degradation in performance. The degradation may be due to temporary environmental factors, such as cloud cover; damage or localized soiling; a general dirty condition; or ageing of the components. A method is disclosed wherein a remote system may detect degraded performance and determine the cause, thereby enabling a decision as to the appropriate corrective action to be taken, if any.

Abstract: System and method for controlling a fan. A value may be received for controlling the fan. The value may include a first number of bits and may correspond to a linear function of temperature. A first value may be determined using a first number of bits of the value. A modification to the first value may be determined based on a second number of bits of the value. A new output value may be generated based on the first value and the modification to the first value. The new output value may correspond to a first nonlinear function of temperature. The new output value may be provided for controlling the fan.

Abstract: The present invention relates to a method for monitoring photovoltaic modules (1, 2), which are used in an arrangement comprising several photovoltaic modules, which are connected in particular in series by means of electrical conducting means (3), wherein a separate microcontroller (5) is associated with the respective photovoltaic module (1, 2), an in particular continual determination of at least one status parameter of the respective photovoltaic module (1, 2) is performed by the microcontroller (5), the data concerning the status parameter are transmitted to an evaluating unit (10), the data intended to be transmitted to the evaluating unit (10) are designed in the form of data blocks (7, 8), the electrical conducting means (3) present for connecting the individual photovoltaic modules (1) are used to transmit the data blocks (7, 8), and the data blocks (7, 8) are transmitted independently of each other so that the probability of data blocks (7, 8) colliding with each other is greater than 0.

Abstract: According to one embodiment of the invention, a method for preventing the failure of a system, which includes one or more pipes, or one or more cooling jackets, or one or more fluid cooled system components carrying a fluid, involves detecting one or more pressure levels of the fluid in the one or more pipes at one or more points, then comparing the detected pressure levels to a corresponding one or more predetermined limitation values. If the detected pressure levels exceed the corresponding limitation values, a shut-down signal is generated. The shut-down signal triggers the adjusting of one or more systems responsible for causing thermal variations of the fluid, preventing the system from failing while allowing the system to continue operation shortly thereafter.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.

Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.

Abstract: A method and system for managing one or more thermal policies of a portable computing device (PCD) includes monitoring temperature of the portable computing device with internal thermal sensors and external thermal sensors. If a change in temperature has been detected by at least one thermal sensor, then a thermal policy manager may increase a frequency in which temperature readings are detected by the thermal sensors. The thermal policy manager may also determine if a current temperature of the portable computing device as detected by one or more of the thermal sensors falls within one or more predetermined thermal states. Each thermal state may be assigned a unique set of thermal mitigation techniques. Each set of thermal mitigation techniques may be different from one another. The sets of thermal mitigation techniques may differ according to quantity of techniques and impacts on performance of the PCD.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: A system and method of measuring atmospheric parameters in an enclosed space using instrumented objects having measurement sensors. The instrumented objects travel through the space randomly or along defined flight paths. As the instrumented objects travel through the space, the measurement sensors measure atmospheric parameters and store the measurements to a memory. The devices periodically upload the measured atmospheric parameters to a controller circuit. By using self-propelled objects to carry measurement sensors, the system and method disclosed herein allow for periodically sampling atmospheric parameters in the interior of an enclosed space at a number of locations greater than the number of measurement devices employed. With data points taken from various locations within a volume of an enclosed space, the system and method can realize a more efficient utilization of energy by adjusting mechanical controls of an HVAC system or a ventilation system, for example.

Abstract: A temperature sensor circuit includes a band-gap reference voltage circuit. The resistor and diode-connected bipolar transistor of the band-gap reference voltage circuit are separated into a transistor-resistor series circuit and a transistor-diode series circuit. The transistor-resistor series circuit is configured such that an emitter of the bipolar transistor Q21 is connected to a power supply voltage terminal VCC, a collector thereof is grounded via the resistor R2. The transistor-diode series circuit is configured such that an emitter of the bipolar transistor Q20 is connected to the power supply voltage terminal VCC, a collector thereof is connected to a collector of the diode-connected bipolar transistor Q19, and an emitter of the diode-connected bipolar transistor is grounded. A voltage divider circuit 5 having a plurality of output terminals is connected to the transistor-resistor series circuit and the transistor-diode series circuit via first and second buffer circuits 3 and 4, respectively.

Abstract: An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.

Abstract: An apparatus for detecting a temperature using transistors includes a plurality of temperature detecting units that become selectively active according to predetermined temperature intervals; and a detection signal output unit that generates detection signals according to the signals transmitted by the plurality of temperature detecting units, and outputs the detection signals.

Abstract: A design structure for a processor may be embodied in a machine readable medium for designing, manufacturing or testing a processor integrated circuit. The design structure may control heat generation in a multi-core processor. The design structure may specify that each processor core includes a temperature sensor that reports temperature information to a processor controller. The design structure may also specify that if a particular processor core exceeds a predetermined temperature, the processor controller disables that processor core to allow that processor core to cool. The design structure may also specify that the processor controller enables the previously disabled processor core when the previously disabled processor core cools sufficiently to a normal operating temperature. In this manner, a multi-core processor may avoid undesirable hot spots that impact processor life.

Abstract: A laser beam with a wavelength capable of exciting atoms of helium in the metastable state is directed to a generated plasma, and atoms in the metastable state are excited. Absorption amount information representing the amount of laser beam absorbed is acquired, and the density of atoms of helium in the metastable state in the plasma is computed from the absorption amount. The emissions of light from helium gas in the plasma caused by transition from two different excited states to the lower level are measured, and the ratio between the intensities of the emissions is determined. The electron temperature of the produced plasma is computed from the computed density of the atoms of helium gas in the metastable state and the computed emission intensity ratio. With this, the plasma electron temperature can be computed with a relatively high accuracy irrespective of the condition of the plasma atmosphere.

Abstract: Aspects of the invention relate generally to diagnostic methods and systems for determining the operating condition and performance of a cooling element in a metallurgical reactor during operation of the reactor. In a system aspect, the system comprises sensing means, processing means and display means. The sensing means is located in or approximate the cooling element for sensing operating conditions of the cooling element. The processing means is in communication with the sensing means for receiving data corresponding to the sensed operating conditions and for processing the data to determine a relative condition indicator of the cooling element. The display means is in communication with the processing means and displays the relative condition indicator to a user of the diagnostic system. The display means can display a first, second or third state representative of the relative health indicator.

Abstract: A method and apparatus are disclosed for predicting the service life of a metallic structure subjected to cyclic loading. Such structures experience fatigue, which can lead to failure after a number of loading cycles. The disclosed invention allows for an accurate prediction of the number of cycles to failure for a metallic structure by observing the slope of the rise in surface temperature of the structure after the cyclic loading has begun. The method of this invention provides early and accurate predictions of service life and does not require destructive testing. The method and apparatus of the present invention may be installed on working equipment, thus providing service life predictions for materials in real world use. The invention uses an empirically derived relationship that was confirmed using analytical relationships and material properties. The derived formula uses two constants that may be determined empirically using a disclosed process. The constants also may be estimated mathematically.

Abstract: A method for measuring the temperature rise induced by bias current/bias voltage in a magnetic tunnel junction, the method includes the steps of: (a) applying an external time-changing magnetic field to the magnetic tunnel junction; (b) measuring different first outer pin flip field values under different temperature values; (c) calculating the correlation between the temperature and the outer pin flip field according to the temperature values and the first outer pin flip field values; (d) measuring different second outer pin flip field values under different bias current/bias voltage values; (e) calculating the correlation between the bias current/bias voltage and the outer pin flip field according to the bias current/bias voltage values and the second outer pin flip field values; (f) calculating the correlation between the temperature and the bias current/bias voltage according to the results produced by the steps (c) and (e).

Abstract: The invention comprises a system for calculating a value for the effective thermal mass of a building. The climate control system obtains temperature measurements from at least a first location conditioned by the climate system. One or more processors receive measurements of outside temperatures from at least one source other than the control system and compare the temperature measurements from the first location with expected temperature measurements. The expected temperature measurements are based at least in part upon past temperature measurements obtained by said HVAC control system and said outside temperature measurements. The processors then calculate one or more rates of change in temperature at said first location.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal sensor power savings using a toggle control. In some embodiments, an integrated circuit (e.g., a memory device) includes an on-die thermal sensor, a storage element (e.g., a register), and toggle logic. The toggle logic may transition the thermal sensor from a first power consumption level to a second power consumption level responsive, at least in part, to a toggle indication.

Abstract: A method and a device for temperature prediction or measurement are disclosed. The method comprises: acquiring temperature data outputted from a thermometer probe; selecting some temperature data within a valid time period from the acquired data; determining a first specific time point according to the slope change rate of the temperature curve within the valid time period and an initial temperature within the valid time period; determining a second specific time point according to the slope at or before the first specific time point; calculating a value of temperature y according to an hyperbolic formula; determining a final temperature of the object according to the maximum slope of the temperature curve in the valid time period, the initial temperature of the temperature curve in the valid time period, and the value of temperature y.

Abstract: The invention relates to a method and a system for detecting the risk of icing on aerodynamic surfaces lapped by a fluid flow (F), in particular on load-bearing surfaces of fluid machines, of the type comprising a temperature sensor (20). The system is characterized in that the temperature sensor (20) is located close to the aerodynamic surface (5S) to be monitored for detecting the temperature of the surface (5S), and that the system comprises a rain sensor (30) located close to the surface (5S) for detecting the presence of water on that surface (5S). The system can thus detect the risk of icing on aerodynamic surfaces.

Abstract: Temperature detection circuitry is selectively coupled to a thermistor and one of two sources representing the impedance at respective ends of the expected range of temperature to which the thermistor is to be exposed. The offset of an amplifier and a scale factor to account for gain set of the amplifier are determined in an automatic calibration process while coupled to the source(s), and thereafter temperature readings are taken from the thermistor. During the calibration process, if the gain or scale factor are outside of expected ranges, a failure is determined and an alarm given and/or a heater is disabled.

Abstract: The invention relates to a measurement system for the wireless and position-independent measurement of the temperature of the load of an oven with high accuracy using passive temperature probes. The measurement system for the wireless measurement of the temperature of food or workpieces in ovens has an interrogation unit located outside the oven chamber, one or more interrogation antennas located in the oven chamber and at least one passively operated temperature probe with a probe antenna and at least one temperature sensor designed as a resonator, said temperature probe being freely movable within the oven, characterized in that the temperature sensor has at least two resonances with different temperature coefficients of frequency, wherein the electrical equivalent circuit diagrams of the resonance elements differ only slightly from each other.

Abstract: A sensing device transmits wireless signals when an error between at least one sampled parameter value and at least one predicted parameter value is too great, such that the sensing device transmits wireless signals to a load control device using a variable transmission rate that is dependent upon the amount of change in a value of the parameter. The sensing device uses the one or more estimators to determine the predicted parameter value, and may transmit the estimators to the load control device if the error is too great. The load control device uses the estimators to determine at least one estimated parameter value and controls the electrical load in response to the estimated parameter value. The sensing device may comprise, for example, a daylight sensor for measuring a total light intensity in the space around the sensor or a temperature sensor for measuring a temperature around the sensor.

Abstract: A method of the present invention using a prediction process including a battery equivalent circuit model used to predict a voltage and a state of charge of a battery. The equivalent circuit battery model includes different equivalent circuit models consisting of at least an ideal DC power source, internal resistance, and an arbitrary number of representative parallel resistors and capacitors. These parameters are obtained a priori by fitting the equivalent circuit model to battery testing data. The present invention further uses a correction process includes determining a corrected predicted state of charge of the battery; and storing the corrected state of charge of the battery in a storage medium. In the present invention, an expectation of the predicted voltage of the battery and an expectation of the predicted state of charge of the battery are obtained by an unscented transform with sigma points selected by a Gaussian process optimization.

Abstract: A method for examining water heater safety includes the steps of: setting a desired temperature and sensing a cold water temperature and a flow rate of water to calculate a theoretical gas consumption, and then supplying a combustor the theoretical gas consumption to heat water; sensing a hot water temperature, and calculating a temperature ratio by the desired temperature, the cold water temperature and the hot water temperature. Examining the temperature ratio may find that the water heater is abnormal or malfunctioning. An efficiency ratio may also be calculated by the theoretical gas consumption and the actual gas consumption. Examining the efficiency ratio may find that the water heater is abnormal or malfunctioning as well.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: A device and method for measuring the back pressure in chemical reactor tubes includes many automated features. Inflatable tube seals may be automatically inflated. The device may measure several tubes at once. It may transmit data electronically to a remote computer for analysis and graphic display.

Abstract: A system and a method for generating a microenvironment condition report. The microenvironment condition report is generated from information related to a plurality of vehicle conditions. The vehicle condition information is gathered from a plurality of in-vehicle technologies such as a stability control system, ABS, and navigation system. The vehicle condition information is sent to a remote terminal that organizes the information with respect to a set of microareas. The information for each microarea is analyzed and used to generate the microenvironment condition report.

Abstract: A method implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable medium being operable to perform a thermal analysis of a data center and overlay the thermal analysis on a map of the data center to provide an overlaid thermal analysis. Additionally, the computer executable code is operable to dynamically control at least one blower and at least one vent in the data center based on the overlaid thermal analysis to direct cool air to a section of the data center in need of cooling.

Abstract: According to one aspect of the present disclosure, a device and technique for monitoring temperature of an environment of a sensitive object is disclosed. The device includes a housing configured to be disposed within or affixed to a transport container for the object, a sensor coupled to the housing and configured to obtain a plurality of temperature readings, and monitor logic configured to compare the plurality of temperature readings to a temperature threshold. The device also includes counter logic configured to generate an excursion count indicating a quantity of time periods the temperature readings exceeded the temperature threshold, generate a consecutive count indicating a quantity of consecutive temperature readings exceeding the temperature threshold, and generate a cumulative count indicating a cumulative quantity of temperature readings exceeding the temperature threshold.

Abstract: A modular rack-level server and storage framework is disclosed. The modular rack system includes a plurality of chassis placed in one or more racks and a plurality of sleds placed in each chassis. Each sled includes an information handling system, a shared fan module, a shared power module, and a shared management module. The shared fan module cools the plurality of sleds in each chassis and the shared power module supplies power to one or more sleds in one or more chassis. The shared management module manages the operation of the plurality of chassis.

Abstract: Embodiments of a method and apparatus for variable sensing using the frequency domain are taught herein. An exposure of a system to a physical variable is determined by periodically sensing the physical variable to produce a plurality of digital samples. The plurality of digital samples is converted to respective frequency domain representations. The exposure is calculated using the frequency domain representations.

Abstract: In a running test, vehicle wheels are mounted on rollers. Each roller receives torque corresponding to the running resistance, which is a value corresponding to the running resistance applied to the vehicle on actual ground. The actual friction coefficient between the wheels and the rollers is calculated. The running resistance is corrected such that the actual friction coefficient becomes equal to the friction coefficient on actual ground that is calculated based on the slip ratio of the wheels with respect to the rollers. This approximates the running resistance applied to the vehicle by the rollers to the running resistance applied to the vehicle on actual ground as the torque is applied to the rollers in correspondence with the corrected running resistance. This prevents the drive force produced by the vehicle in the running test from becoming different than the drive force that is produced when running on actual ground.

Abstract: In order to plan the performance of heat treatment of metal workpieces before the beginning of the heat treatment in the particular industrial furnace and perform it autonomously thereafter, the invention proposes a method and computer program and an apparatus having a computer (1) for the automatic preparation of technological formulas for the heat treatment, firstly loading parameters of a selected material of the metal workpiece and a formula structure template of a selected treatment method from a material databank (10) and providing data from a user interface and compiling a formula structure, then establishing the parameters of the metal workpiece, the compiled formula structure, and the data from the user interface as values of formula segments, from which the technological formula for heat treatment is finally generated, this technological formula being able to be readjusted, stored in a program databank (12), and retrieved for the heat treatment of metal workpieces in industrial furnaces (5)(FIG. 1).

Abstract: A temperature measurement device includes a temperature measurement part, a calculation part, and a control part for controlling the operation of the temperature measurement part and the calculation part; wherein the temperature measurement part has a substrate having a first surface as a contact surface with a measured body, and a second surface as an environment-lateral surface which is opposite the first surface; a first temperature sensor; a second temperature sensor; and a third temperature sensor; and the first temperature sensor, the second temperature sensor, and the third temperature sensor measure a first temperature, a second temperature, and a third temperature a plurality of times under conditions in which the temperature of the environment varies; and the calculation part calculates a deep temperature in a deep part of the measured body by using the measured temperatures.

Abstract: Described herein are systems and methods for calculating a relative temperature of a fiber-optic cable using bi-directional analysis traces with an optical time-domain reflectometer (“OTDR”). Analysis of bi-directional traces along a length of fiber-optic cable yields a scaled local backscatter coefficient of the fiber. Accordingly, an initial set of measurement data is collected at a first time interval and a base scaled local backscatter along a fiber is calculated. A subsequent set of measurement data is collected at a second time interval and a subsequent scaled local backscatter along the fiber is calculated. The exemplary systems and methods described herein determines a change in scaled local backscatter as a function of a difference between the base scaled local backscatter and at least the subsequent scaled local scaled local backscatter along the fiber, and then determines a relative temperature variation of the fiber as a function of the change in scaled local backscatter.

Abstract: Methods and systems for dynamically estimating the core temperature of at least one cell in a battery. In one aspect, the method includes using a combination of estimations including one based on ohmic resistance and another based on a function of thermal energy transfer through the battery. A weighting factor may be used for each of the estimations as a way to calculating a core temperature. The estimation based on ohmic resistance may be made determined independently of a measured surface temperature of the battery or any of the cells in the battery.

Abstract: A temperature sensor includes a band gap reference (BGR) circuit, a voltage generation unit and a digital CDS circuit. The band gap reference (BGR) circuit generates a reference voltage proportional to a temperature. The voltage generation unit generates a first voltage and a second voltage based on the reference voltage, where the first voltage and the second voltage are proportional to the temperature. The digital CDS circuit generates a digital signal corresponding to the temperature by performing a digital correlated double sampling (CDS) operation on the first voltage and the second voltage. The temperature sensor is able to detect a temperature accurately.

Abstract: A system for evaluating bearing metal temperature (BMT) to diagnose rotor misalignment and/or bearing wipe in an electrical machine. A first system is provided that includes: an input system for obtaining bearing metal temperature (BMT) readings from a first BMT sensor located proximate the turbine and a second BMT sensor located proximate the generator, and for obtaining operational data including lube oil inlet temperature, speed and power; a filter system for filtering bad input data; and a misalignment analysis system that issues a misalignment warning in response to one of the BMT sensor reporting an increasing temperature and the other BMT sensor reporting a decreasing temperature.

Abstract: Methods and systems for producing a digital temperature reading are provided. In an embodiment, one or more current sources and one or more switches are used to selectively provide a first amount of current (I1) and a second amount of current (I2) to the emitter of a transistor (Q1), during different time slots of a time period, to thereby produce a first base-emitter voltage (Vbe1) and a second base-emitter voltage (Vbe2), where I1=I2*M, and M is a known constant. An analog-to-digital converter (ADC) digitizes analog signals representative of the magnitudes Vbe1 and Vbe2. A difference is determined between the magnitudes of Vbe1 and Vbe2. A digital calculator produces a digital temperature reading (DTR) based on the difference between the magnitudes of Vbe1 and Vbe2.