Abstract: By performing a two-step approach for predicting a quality distribution during the fabrication of semiconductor devices, enhanced flexibility and efficiency may be accomplished. The two-step approach first models electrical characteristics on the basis of measurement data, such as inline measurement data, and, in a second step, an appropriate distribution for the electrical characteristics may be established, thereby obtaining modeled wafer sort data which may then be used for predicting a quality distribution of the semiconductor devices under consideration.

Abstract: Methods and systems for controlling the synchronization of diagnostic cycles and data conversion for redundant I/O applications are provided. An exemplary system comprises a first analog input module adapted to request mastership with respect to a second analog input module, output a synchronization pulse to said second analog input module, initiate a diagnostic cycle of said second analog input module, and initiate a data conversion cycle, and wherein said second analog input module, said second analog input module are adapted to assume a slave role with respect to said first analog input module. Numerous other aspects are provided.

Abstract: An embodiment of the present invention discloses a method for monitoring measurement data in a semiconductor process, which includes: updating measurement data of wafer performance parameters periodically from a real time system into an analysis database; retrieving from the analysis database the measurement data of a predetermined performance parameter for analysis covered in a time range required in a selected analysis rule according to information on the performance parameter for analysis and information on the selected analysis rule; determining whether the measurement data of the performance parameter retrieved from the analysis database violates a control range of the selected analysis rule, and if so, then transmitting alarm information for the performance parameter violating the control range of the selected analysis rule.

Abstract: In a surface mount technology (SMT) measurement system and method, the number of PCBs input to an SMT production line, the frequency of solder paste printing of the PCBs, the frequency of surface mount component placement of the PCBs, and a yield of the PCBs are calculated. Accordingly, production performance of the SMT production line is determined. The production performance is output to an output device.

Abstract: A method for automatically measuring and quantitatively evaluating the optical quality of an ophthalmic lens, such as, for example, a contact lens. The method measures an ophthalmic lens with an optical phase measurement instrument to derive measured data. The method creates a set of objective optical quality metrics within a computational software. And, the method applies the measured data to at least one of the objective optical quality metrics to determine lens quality.

Abstract: Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.

Abstract: A method, apparatus, and a system for generating a binary mapping of wafer regions using measured value. A first measured value relating to processing a first workpiece is acquired. A second measured value relating to a second workpiece is acquired. At least a first region common to the first and second workpieces is defined. A determination is made as to whether the results associated with the first or second measured value is above a predetermined threshold. A first binary value is assigned to the first region based upon a determination that the results associated the first or second measured value data is above the threshold.

Abstract: A yield loss prediction method includes: performing a plurality of types of defect inspections upon a plurality of batches of wafers which begin to be processed during different periods to generate defect inspection data, respectively; for a specific batch of wafers different from the plurality of batches of wafers, calculating defect prediction data of at least one type of defect inspection according to the defect inspection data of at least the type of defect inspections; and predicting a yield loss of the specific batch of wafers according to at least the defect prediction data.

Abstract: A method for monitoring a wind turbine is provided. An operating parameter, including a parameter value and a data quality value, is created by a controller. The parameter value is based on a signal received by the controller from a source. The data quality value indicates the source and/or a reliability of the parameter value. The operating parameter is processed based on the data quality value. Processing may include, for example, creating a graphical representation of the operating parameter or assigning a weight to the operating parameter for use in a calculation.

Abstract: A calculation method of electromagnetic interference reduction through spectrum diffusion that is for reducing the electromagnetic interference, in which, when a center frequency of a measurement bandwidth is changed so that a spectrum having the maximum amplitude is included in the measurement bandwidth, of a plurality of spectra generated from the frequency spectrum of an electromagnetic interference signal through the spectrum diffusion, the amplitudes of all spectra included in the measurement bandwidth are added up and the maximum total sum of the amplitudes is divided by the amplitude of the electromagnetic interference signal, hence to estimate the electromagnetic interference reduction.

Abstract: An apparatus and method for preparing a stain to match a target color of a selected substrate (e.g., wood species). The apparatus may include a computer and hardware and/or software to store a database of stain records, create or load spectral data (e.g., a digital image) of a target sample, and display images and/or process spectral data. The apparatus may facilitate stain selection, and may also dispense colorant agents and/or vehicles to create stains. The apparatus may be used in a “manual” mode (whereby a human compares database and target images and makes a selection); an “automatic” mode (whereby the computer suggests a match based on the selected substrate); or a “combination” mode (whereby the computer suggests a match and the user can then compare the suggested match with various images to achieve a final selection).

Abstract: A defect inspection apparatus includes: stages each mounting an inspecting object on which a circuit pattern having a group of parallel lines is formed, and each running perpendicular or parallel to the group of lines; an illumination optical system which illuminating a surface of the inspecting object with a slit beam being slit light so that a longitudinal direction of the slit beam is substantially perpendicular to the running directions of the stages, and which has a first inclined angle formed by the direction of the group of lines and a projection line, of an optical axis of the slit beam, to the inspecting object; a spatial filter that shields or transmits reflected and scattered light of the inspecting object according to a difference in distribution of orientation; and a detection optical system that detects the reflected and scattered light transmitted through the spatial filter by image sensors.

Abstract: A wireless tag determination system includes a detection information storage configured to store information detected from a wireless tag by a tag reader, as detection information. A determination requesting unit is configured to request a determination for reliability of existence of the wireless tag within a detection range of the tag reader. A reliability determination unit is configured to determine the reliability by use of the detection information, in response to the request.

Abstract: Systems and methods are disclosed that monitor movement of a person, or of a vehicle ridden by the person, to determine speed, distance traveled and/or airtime of the person or vehicle. Accelerometer-based sensors, pressure sensors or Doppler sensors may be employed in these systems and methods. A liquid crystal display may attach to the person to display speed, distance traveled and/or airtime.

Abstract: Measuring apparatus for monitoring the position of the centre of mass of a semiconductor wafer is disclosed. The apparatus includes a wafer support (14) with a ledge for supporting an edge of a wafer (2) when it is lifted at a detection point by a probe (16). The probe (16) is connected to a force sensor (18) which senses a force due to a moment of the wafer about a fulcrum (4) on the wafer support (14). Moment measurements are taken at a plurality of detection points and a processing unit calculates the position of the centre of mass from the moment measurements. Changes in wafer mass distribution (e.g. due to faulty treatment steps) which cause movement of the centre of mass can be detected.

Abstract: A monitoring system and data archive system for a stent crimping process. The information concerning the crimped stent is used in deciding whether the stent is acceptable for insertion into the body cavity of a human or animal.

Abstract: An average fault ratio is calculated from product characteristics of a product as a target of yield prediction, in order to predict yield accurately in the course of manufacturing the prediction target product. With respect to a reference product, whose wiring pattern is different from the prediction target product but manufactured by the same manufacturing process, a monthly electric fault density is calculated from actually measured data. Respective average fault ratios are obtained from product characteristics of the prediction target product and the reference product. A monthly electric fault density of the prediction target product is obtained by multiplying the monthly electric fault density of the reference product by the ratio of the average fault ratios. The yield is calculated by using the monthly electric fault density of the month in which a yield prediction target lot of the prediction target product was processed.

Abstract: Classification of spatial patterns on wafer maps is generally described. In one example, a method includes applying K-means type clustering to wafer maps comprising one or more spatial patterns to group one or more clusters comprising wafer maps having similar spatial patterns and producing a dendrogram using a clustering process to display the one or more clusters.

Abstract: A charging method for a semiconductor device manufacturing apparatus, which can appropriately and promptly distribute profits between a customer and a manufacturer according to the yield of semiconductor devices. An indicator related to the yield of the semiconductor devices is measured, and a fee is charged for the usage of the semiconductor device manufacturing apparatus according to the measured indicator.

Abstract: A system for preferentially marking defects on a web is described. The system includes a web of material to be converted into individual sheets of a plurality of different grade levels, a database storing anomaly data of anomalies on the web, wherein an anomaly is a potential defect in at least one of the plurality of different grade levels, a marker that associates a unique mark with at least one of the grade levels, and a controller to retrieve the anomaly data from the database and to signal the marker as to where to make a mark, wherein the marker applies the mark associated with at least one of the grade levels for which the anomaly may cause a defect. The system may provide advantages, such as that a converter of various products from a single web roll may determine which regions of the web satisfy each grade level.

Abstract: Methods and systems to detect abnormal operations in a process of a process plant include collecting on-line process data. The collected on-line process data is generated from a plurality of dependent and independent process variables of the process, such as a coker heater. A plurality of multivariate statistical models of the operation of the process are generated using corresponding sets of the process data. Each model is a measure of the operation of the process when the process is on-line at different times, and at least one model is a measure of the operation of the process when the process is on-line and operating normally. The models are executed to generate outputs corresponding to loading value metrics of a corresponding dependent process variable, and the loading value metrics are utilized to detect abnormal operations of the process.

Abstract: A method for monitoring machine conditions provides additional information using a one-class classifier in which an evaluation function is learned. In the method, a distance is determined from an anomaly measurement x to a boundary of a region R1 containing all acceptable measurements. The distance is used as a measure of the extent of the anomaly. The distance is found by searching along a line from the anomaly to a closest acceptable measurement within the region R1.

Abstract: Brings the response time of a Web server and the like closer to a targeted value. A controller controlling the average response time elapsed between reception by information processing apparatus of a processing request and response of information processing apparatus to the processing request. The controller including: a section for obtaining a response time goal which is a target value of the average response time; a section for calculating a predicted response time which is a predicted value of the average response time at the time point when a predetermined reference period has elapsed from setting an operation mode in the information processing apparatus, the operation mode being any of a plurality of operation modes which provide different throughputs; and a section for setting the operation mode in the information processing apparatus if predicted response time calculated by the predicted response time calculating section is less than goal.

Abstract: A quality control method using a plurality of analyzers and a control device connected to the analyzers via a network, the method comprising: (a) measuring quality control samples by the analyzers; (b) collecting a plurality of quality control data obtained by measuring the quality control samples; (c) implementing a quality control by the control device based on the collected quality control data; (d) obtaining uncertainty of measurement of analyzer based on uncertainty of analyzer calibration and the quality control data; (e) outputting a result of the quality control; and (f) outputting the uncertainty of measurement is disclosed. A quality control system and an analyzer are also disclosed.

Abstract: A computer implemented system for segmenting data collected from a document production environment is provided. The system includes determining, with a computer implemented data processing platform, that a set of document production related data should be represented as a non-normal distribution. A first test is performed and it is determined that the non-normal distribution should not be analyzed pursuant to a first analytic category. A second test is performed and when it is determined that the non-normal distribution should be analyzed pursuant to a second analytic category, an output, indicating that the non-normal distribution should be analyzed pursuant to the second analytic category is provided.

Abstract: A method for utilizing fabrication defect of an article comprises steps of obtaining a defect image from a fabrication process for fabricating the article, wherein the defect image comprises a defect and fabricated circuit patterns around the defect; obtaining coordinates of the defect; retrieving a layout of the article comprising design circuit patterns; extracting a contour of the defect from the defect image; superposing the contour of the defect on the layout according to the coordinates of the defect; and determining whether the defect causes a open failure or a short failure on the layout by analyzing overlaps between the contour of the defect and the design circuit patterns. Therefore, the article's health can be monitored during the fabrication process, not until the end of the fabrication process.

Abstract: A maintenance engineer can analyze an abnormal state with less difficulty in a rapid and correct manner independent of his/her skill. A substrate processing system comprises: a substrate processing apparatus configured to operate according to a recipe defining a process sequence and process conditions, and a group managing apparatus connected to the substrate processing apparatus. The group managing apparatus comprises an analysis support unit. The analysis support unit is configured to extract check item information relating to both abnormal state information for identifying an abnormal state occurring when the recipe is executed and apparatus type information for identifying the type of the substrate processing apparatus at which the abnormal state occurs, and to prepare a check item table comprising the extracted check item information.

Abstract: A method for dynamically providing feedback is presented. The method includes monitoring one or more steps performed by one or more components in a machine, where the one or more steps are associated with a workflow. Further, the method includes analyzing the one or more steps performed by the one or more components to dynamically determine feedback based on the one or more steps performed by the one or more components, where the feedback comprises other steps in the workflow. In addition, the method includes presenting the feedback. Systems and computer-readable medium that afford functionality of the type defined by this method is also contemplated in conjunction with the present technique.

Abstract: A process for a prognosis of faults in electronic circuits identifies parameters of a circuit under test. An upper and a lower limit is determined for one or more components of the circuit under test. A population of faulty and non-faulty circuits are generated for the circuit under test, and feature vectors are generated for each faulty and non-faulty circuit. The feature vectors are stored in a fault dictionary, and a feature vector for an implementation of the circuit under test in a field operation is generated. The feature vector for the implementation of the circuit under test in the field operation is compared to the feature vectors in the fault dictionary.

Abstract: An optical metrology model is created for a structure formed on a semiconductor wafer. The optical metrology model comprises one or more profile parameters, one or more process parameters, and dispersion. A dispersion function is obtained that relates the dispersion to at least one of the one or more process parameters. A simulated diffraction signal is generated using the optical metrology model and a value for the at least one of the process parameters and a value for the dispersion. The value for the dispersion is calculated using the value for the at least one of the process parameter and the dispersion function. A measured diffraction signal of the structure is obtained. The measured diffraction signal is compared to the simulated diffraction signal. One or more profile parameters of the structure and one or more process parameters are determined based on the comparison of the measured diffraction signal to the simulated diffraction signal.

Abstract: A defect testing apparatus for testing defects of optical film sheet-shaped product of an optical displaying apparatus, which includes a defect detecting means for detecting defects of a monolayer body and/or a laminate body constituting the sheet-shaped product in a state in which a protective layer on a surface of the sheet-shaped product is not disposed and defect information preparing means for preparing defect information which is information related to the defects detected by the defect detecting means, and the defect information is used for producing the sheet-shaped product provided in a roll form or in separate sheets.

Abstract: A power consumption analyzing apparatus has a clock gating cell detector configured to detect a clock gating cell which is not present in RTL data but present in a gate-level netlist, a test bench description generation unit configured to add a description concerning the clock gating cell, a monitor signal generation unit configured to specify a monitor signal used for power consumption analysis from the RTL data, an RTL simulation unit configured to execute operational simulation of the target circuit, a monitor unit configured to detect a logic of the monitor signal during the execution of the operational simulation, and a power consumption analysis unit configured to analyze power consumption.

Abstract: Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. The defects do not include defects detected on the wafer. The method also includes determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.

Abstract: Methods, computer-readable media, and systems for automatically performing Human Factors Process Failure Modes and Effects Analysis for a process are provided. At least one task involved in a process is identified, where the task includes at least one human activity. The human activity is described using at least one verb. A human error potentially resulting from the human activity is automatically identified, the human error is related to the verb used in describing the task. A likelihood of occurrence, detection, and correction of the human error is identified. The severity of the effect of the human error is identified. The likelihood of occurrence, and the severity of the risk of potential harm is identified. The risk of potential harm is compared with a risk threshold to identify the appropriateness of corrective measures.

Abstract: A method, apparatus, and a system for generating a binary mapping of wafer regions using measured value. A first measured value relating to processing a first workpiece is acquired. A second measured value relating to a second workpiece is acquired. At least a first region common to the first and second workpieces is defined. A determination is made as to whether the results associated with the first or second measured value is above a predetermined threshold. A first binary value is assigned to the first region based upon a determination that the results associated the first or second measured value data is above the threshold.

Abstract: The present disclosure describes a semiconductor manufacturing apparatus. The apparatus includes a processing chamber designed to perform a process to a wafer; an electrostatic chuck (E-chuck) configured in the processing chamber and designed to secure the wafer, wherein the E-chuck includes an electrode and a dielectric feature formed on the electrode; a tuning structure designed to hold the E-chuck to the processing chamber by clamping forces, wherein the tuning structure is operable to dynamically adjust the clamping forces; a sensor integrated with the E-chuck and sensitive to the clamping forces; and a process control module for controlling the tuning structure to adjust the clamping forces based on pre-measurement data from the wafer and sensor data from the sensor.

Abstract: A box inspector for detecting at an inspection station an unacceptable skew in, an item missing from, and/or an unacceptable gap in a box. The box inspector has pairs of aligned emitters and receivers generating a signal when an unacceptable skew is detected, at least two item present sensors corresponding to the number of items adapted to be located in a single row within the box and generating an item absent signal when an item is missing from the box, a gap detect sensor generating an unacceptable gap signal when the gap is larger than a predetermined gap size, and a box present sensor generating a box present signal when a box arrives at the inspection station. A controller receives signals from these components and generates indications when the box is unacceptably skewed, an item is missing from the box, and/or an unacceptable gap exists in the box.

Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: A method for implementing program execution integrity (PEI) for a communication-based sensor includes receiving an output communication message from the sensor, the output communication message including sensor output data internally processed within the sensor. The output communication message further includes raw data used by the sensor in internally processing the sensor output data. The raw data is independently processed, and the results thereof are compared with the internally processed sensor output data so as to verify the processing integrity of the sensor to a desired tolerance.

Abstract: A system and method for optimizing and implementing a metrology sampling plan. A system is provided that includes a system for collecting historical metrology data from a metrology tool; and a reduction analysis system that compares an initial capability calculated from the historical metrology data with a recalculated capability for a reduced data set, wherein the reduced data set is obtained by removing a subset of data from the historical metrology data.

Abstract: A method for processing a two-parameter spectrum including selecting a profile parameter for the spectrum and an initial correction function, for any profile selected according to this parameter, carrying out at least a correction operation by multiplying this selected profile by a correction function, equal to the sum of at least a portion of the already corrected profiles.

Abstract: A process is provided for testing or operating an integrated circuit that includes providing a passive radio frequency identification transponder in electrical communication with the integrated circuit. The integrated circuit is associated with a printed circuit board or analog circuitry. The passive radio frequency identification transponder is shielded from the integrated circuit with a ferrite material ground in power planes as well as radiated emissions from the printed circuit board when the printed circuit board is energized. Information about the function of the integrated circuit is communicated to a remote location with an antenna coupled to the transponder in response to an external signal that provokes the communication so as to test or operate the integrated circuit.

Abstract: A method of determining an overlay error in a set of superimposed patterns. The patterns are divided into two and a first part of the pattern has a bias of d+s/2 between the first layer and second layer. A second part of the pattern has a bias of d?s/2 between the first and second layer. The two parts of the pattern are of equal size. To eliminate a particular harmonic s is chosen to be T/(2n) where T is the period of the pattern and n is a positive integer.

Abstract: A global system model equation including model equations, which contain parameters, of individual components that form the global system. The parameters of the individual components are detected using sensor values from the sensors that are allocated to the individual components and it is determined whether it is possible to adapt the parameters to the sensor values and to solve the global system model equation.

Abstract: A method is proposed for manufacturing and testing of complex products, in particular motor vehicles in series production, wherein all the data for the individual manufacturing stations in the manufacturing line is stored in a central computer. In this case, different models are manufactured on the manufacturing line, such that the correspondingly configured data is provided at each manufacturing and test station for this model, after identification of the model. A technical test is carried out in conjunction with the manufacturing installation by monitoring the vehicle functions or else the equipment for their function. An attributive test is carried out by the worker at the manufacturing stations, with all the recorded test data being supplied to the central computer for central evaluation, and with the data being stored on the basis of individual categories in the central computer, such that it is possible to evaluate the manufacturing process with respect to the individual manufacturing steps.

Abstract: A quality assurance system includes an internet/wide area network interface configured to provide bidirectional communication with user terminals; a wireless interface configured to provide bidirectional communication with mobile user terminals; and a quality assurance database cooperatively coupled with a database manager. The data base manager is configured to populate the quality assurance database with identifications of individual ones of a plurality of construction project welders, weld inspectors and a plurality of weld data logs individual ones of which are associated with a specific welding operation of a construction project. Each weld data log is configured to store information that is at least descriptive of a welder, material used during the specific welding operation, specifics of a completed weld including at least weld location, weld type and weld dimensions, and information descriptive of a weld examination.

Abstract: The present invention is concerned with the estimation of health parameters p(k) representing symptoms of a slowly degrading system, in particular industrial gas turbines. According to the invention, an estimation of a true health or independent parameter vector at time step k uses the estimation of the true health or parameter vector at a previous time step k?1 as a starting value for the production of a predicted health parameter vector at time step k. Based on the latter and a set of measured values of input variables of an extended model of the system, a prediction of output variables of the model is produced. This predicted model output is compared with measured values of the output variables to yield an error. From this error, a health parameter estimator in turn produces a health parameter estimate as a revision of the predicted health parameters.

Abstract: System and method for carrying out a process on an integrated circuit. The method includes reading a data key including subkeys, determining a process parameter set using a parameter directory in a manner dependent on the data key read in, and setting the parameters required for the process in accordance with the process parameter set determined. The parameter directory includes rule keys each having subkeys, which are each assigned predeterminable values from a plurality of values, and at least one subkey is assigned a wildcard, and a plurality of process parameter sets each respectively assigned at least one rule key. The step of determining a parameter set includes comparing the data key read in with the rule keys stored in the parameter directory, determining the rule key(s) whose subkeys match those of the data key read in, and outputting the process parameter set(s) assigned to the rule key(s) determined.

Abstract: A test system and a failure parsing method. The test system may comprise a cell array including defective cells formed according to various failure causes, a test apparatus configured to measure electric characteristics from the defective cells and make the measured electric characteristics numerical, and a database apparatus configured to store the numerical electric characteristics. The failure parsing method may include forming defective cells to have at least one failure cause, measuring electric characteristics of each of the defective cells, storing the measured electric characteristics of each of the defective cells in a database, and judging failure causes of a failed chip of a semiconductor wafer based on the database.

Abstract: A chip diagnostics management system includes secure design information that define production features of integrated circuit devices and are accessible according to selected levels of access privilege. A database of device defect information includes information of defects of devices produced according to the production features of the design information and associated wafers, production lots, and dies in or with which the devices were produced. A diagnostic manager correlates device defect information from plural wafers with the design information to identify a device location with a probability of being associated with the device defect information. A diagnostic manager viewer indicates the device location together with an amount of design information correlated the level of access privilege assigned to a selected user.