Abstract: The present invention may include acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals using a plurality of overlay algorithms, generating a plurality of overlay estimate distributions, and generating a first plurality of quality metrics utilizing the generated plurality of overlay estimate distributions, wherein each quality metric corresponds with one overlay estimate distribution of the generated plurality of overlay estimate distributions, each quality metric a function of a width of a corresponding generated overlay estimate distribution, each quality metric further being a function of asymmetry present in an overlay metrology measurement signal from an associated metrology target.

Abstract: A method and system includes a first substrate and a second substrate, each substrate comprising a predetermined baseline transmittance value at a predetermine wavelength of light, processing regions on the first substrate by combinatorially varying at least one of materials, process conditions, unit processes, and process sequences associated with the graphene production, performing a first characterization test on the processed regions on the first substrate to generate first results, processing regions on a second substrate in a combinatorial manner by varying at least one of materials, process conditions, unit processes, and process sequences associated with the graphene production based on the first results of the first characterization test, performing a second characterization test on the processed regions on the second substrate to generate second results, and determining whether at least one of the first substrate and the second substrate meet a predetermined quality threshold based on the second res

Abstract: A monitoring system for a packaging system comprising a plurality of machine units comprises an output sensor for measuring packages output from the packaging system, a number of pairs of machine unit sensors, each pair of sensors comprising an input sensor and an output sensor, wherein the number of pairs of machine unit sensors is arranged at a number of machine units, respectively, a processing apparatus configured to receive information from the sensors, and a communications network configured to send information from the sensors to the processing apparatus. Based on the information from the number of pairs of machine unit sensors a number of wasted packages may be determined, which in turn imply that a reliable efficiency measure may be determined.

Abstract: A semiconductor wafer fabrication metrology method in which process steps are characterized by a change in wafer mass, whereby during fabrication mass is used as a measurable parameter to implement statistical process control on the one or more of process steps. In one aspect, the shape of a measured mass distribution is compared with the shape of a predetermined characteristic mass distribution to monitor the process. An determined empirical relationship between a control variable of the process and the characteristic mass change may enable differences between the measured mass distribution and characteristic mass distribution to provide information about the control variable. In another aspect, the relative position of an individual measured wafer mass change in a current distribution provides information about individual wafer problems independently from general process problems.

Abstract: Solutions for integrating manufacturing feedback into an integrated circuit design are disclosed. In one embodiment, a computer-implemented method is disclosed including: defining an acceptable yield requirement for a first integrated circuit product; obtaining manufacturing data about the first integrated circuit product; performing a regression analysis on data representing paths in the first integrated circuit product to define a plurality of parameter settings based upon the acceptable yield requirement and the manufacturing data; determining a projection corner associated with the parameter settings for satisfying the acceptable yield requirement; and modifying a design of a second integrated circuit product based upon the projection corner and the plurality of parameter settings.

Abstract: A packet loss frequency calculation unit (102) which counts, from an extracted packet loss pattern, packet losses generated in a predetermined interval representing the interval of a plurality of continuous IP packets as a packet loss of one time, thereby calculating the value as a packet loss frequency. The packet loss frequency calculation unit (102) also calculates a burst packet loss length representing the number of continuously lost packets from the packet loss pattern. An average burst packet loss length within a quality estimation interval is calculated from the burst packet loss length. A packet loss variation index calculation unit (106) derives a packet loss variation index from the average burst packet loss length. On the other hand, an encoding quality calculation unit (103) calculates an encoded video quality value based on the extracted encoding bit rate and frame rate.

Abstract: Methods of monitoring an acceptance criteria of vaccine manufacturing processes are disclosed herein. Consequently, the methods and systems provide a means to perform high-quality manufacturing on an integrated level whereby vaccine manufacturers can achieve data and product integrity and ultimately minimize cost.

Abstract: A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.

Abstract: A system is provided for improved quality assurance (QA) in remote-access elections by a QA unit that evaluates an election service provider (ESP) that tallies votes, each of which includes a vote-identification number (VIN) and a vote content. The QA unit assures a likelihood that no votes have been deleted, inserted or changed by the ESP. The QA unit does this by allocating QA VINs and voting QA votes and then checking the ESP's report of all VINs included in the tally and the content of all QA votes. The ESP, if unaware of which votes are QA votes and which are voter voters, is prevented from deleting, inserting, or changing votes without risk of detection by the check of the QA votes. The system includes capability of ensuring defined confidence levels for a given quantity of voters and an expected voter turnout by incorporation of a suitable number of QA VINs.

Abstract: A fault detection method of semiconductor manufacturing processes is disclosed. The method includes the steps of providing a storage device, collecting a fault detection and classification(FDC) parameter by the storage device, setting up a measurement site for measuring an online measurement parameter, collecting a wafer acceptance test(WAT) in correspondence to the FDC parameter, establishing a first relationship equation between the FDC parameter and the online measurement parameter, establishing a second relationship equation of the online measurement parameter and the WAT by using the first relationship equation, establishing a third relationship equation between the FDC parameter and the WAT, establishing a waning region of the manufacturing processes by using the first, second, and third relationship equations, and determining the situation of generating wafer defects according to the warning region. The present invention discloses a system architecture for the method.

Abstract: An apparatus, method and an image quality guide document are disclosed. The method includes, for at least one image in a set of images undergoing image enhancement, identifying image quality-related features for the image based on enhancements being applied to the image, identifying image content-related features based on content of the image, determining a content-based degradation of the image based on the identified image quality-related features and image content-related features, and generating a thumbnail of the image. The method further includes generating an image quality guide document for the set of images in which at least one of the thumbnails is associated with a respective text description that is based on the determined content-based degradation.

Abstract: Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics. The method includes measuring a density of at least one chip. The method further includes computing a difference in density between the density of the at least one chip and a density of at least one kerf structure. The method further includes calculating an offset value to modify a Wafer Acceptance Criteria (WAC) to match the density difference between the at least one chip and the at least one kerf structure. The method further includes applying the offset value to the WAC for a wafer level measurement in order to increase chip yield performance.

Abstract: The present invention provides an inspection method for a pixel array and an inspection apparatus thereof. The inspection method firstly charges a sample pixel area containing a flawed pixel unit and normal pixel units with different testing voltages, then creates a lookup table of brightness threshold value according to the brightness values of the pixel units under those testing voltages ; and then charges a pixel area under test when inspecting the pixel area under test, selects a suitable brightness threshold value from the lookup table according to the current voltage value and the brightness value thereof, and then determines if pixel units of the pixel area under test have any defect according to the brightness threshold value. Therefore, the present invention reduces defect-identifying error and enhances inspection accuracy.

Abstract: A detected data processing apparatus includes a selecting unit that calculates mutual correlation between a plurality of groups of detected data acquired from a detecting unit that detects an operational state of a circuit board, and then selects as analysis data the detected data of a group whose value indicating correlation with other groups is smaller than a threshold value set up in advance; and a first calculating unit that calculates a first Mahalanobis distance on a basis of a first Mahalanobis space generated by using the analysis data selected by the selecting unit from the detected data obtained when a normal circuit board is operated and on a basis of the detected data obtained when a circuit board of diagnosis target is operated.

Abstract: A substrate processing system provided with a plurality of modules for substrate processing. The substrate processing system includes an inspection substrate, which is transferred to the plurality of modules for processing therein, provided with a plurality of measuring devices which carry out a plurality of different kinds of measurements and a recorder which records measured data provided by the measuring devices. The substrate processing system includes a controller that executes control operations to subject the inspection substrate to predetermined processes in the plurality of modules. The controller obtains through data communication a plurality of different kinds of measured data recorded by the recorder as the inspection substrate is processed by the predetermined processes by the plurality of modules.

Abstract: A method and system for incorporating electronic signature analysis in a low voltage power supply to centrally monitor current consumption is disclosed. The electrical loads powered by the low voltage power supply can be tested individually via an automatic test routine by measuring and scaling of current through a differential amplifier. The current consumption of each electrical load can be measured by analyzing a “delta” in the current draw of each electrical load's ON and OFF condition. This value can be compared against a stored table of high and low limits for each electrical load. If a load's current is outside the limits, it will be logged for repairs. A current sensing device can be inserted in series with the output(s) of the low voltage power supply, while in test mode, to allow the automatic test routine to run, and then be shorted out for normal operation.

Abstract: An apparatus for measuring a wavefront of light traveling through test optics includes: a light source; a lenslet array where light from the light source travels through; a detector array configured to acquire a light intensity distribution through the lenslet array; and a processing unit, wherein the processing unit executes data processing with the acquired light intensity distribution, the data processing comprising an estimation process using a beamlet-based propagation model or a ray-based propagation model as a forward propagation model.

Abstract: A method for determining a corrected weight of a mixed volume, by gravimetrically measuring a total weight of the mixed volume, creating an image of the mixed volume, detecting at least one selected component within the image of the mixed volume, estimating a component weight of the at least one selected component from the image of the mixed volume, and subtracting the component weight from the total weight to yield the corrected weight.

Abstract: A health monitoring system for monitoring the health of an electronic system. The health monitoring system includes an analog-to-digital converter, and a monitoring circuit within the electronic system. The monitoring circuit includes fatigue life characterized electrical components representative of electrical components comprising the balance of the electronic system. The fatigue life characterized electrical components are employed solely to monitor the health of the electronic system. The monitoring circuit output is electrically connected to the analog-to-digital converter.

Abstract: A method involves, via a sensor application interface, 1) receiving, from an application, a measurement request associated with a quality-of-service control; 2) in accord with the quality-of-service control, obtaining measurement data from a sensor; and 3) returning to the application i) the measurement data obtained from the sensor, and ii) an indicator of accuracy of the measurement data.

Abstract: The present invention is a method and system for detecting an abnormal on-line analysis or laboratory measurement and for predicting an abnormal quality excursion due to an abnormal process condition.

Abstract: The present invention is to provide a lens evaluation method capable of easily evaluating whether there is a difference which greatly changes locally in a lens, and evaluating the degree of the difference. According to the lens evaluation method of the present invention, first, power a distribution of a plurality of measurement point in an arbitrary direction. Next, a calculation power distribution (a design power distribution) is created. Further, a difference distribution between an actually measured power distribution, which indicates an actual power distribution, and a calculation power distribution is obtained. Further, the difference distribution is differentiated to obtain a difference index, and an evaluation is performed based on the difference index to evaluate whether there is a difference which greatly changes locally in a lens, and evaluate the degree of the difference.

Abstract: In a method for measurement of flatness of objects on a measuring machine, at least two objects are fixed on a worktable of the measuring machine. The method establishes a first coordinate system for the worktable location, sets two groups of horizontal scanning points for each object, and sets two groups of vertical scanning points for each object. By controlling at least two laser heads of the measuring machine, the objects are measured and coordinate values for each of the points scanned are obtained. The method calibrates a first coordinate system and establishes a second coordinate system based on the first coordinate system. In the second coordinate system, the at least two laser heads measure the objects and obtain data, and an indication of the flatness of each object is calculated and displayed on a display device.

Abstract: Disclosed in this invention is a controlling device for abnormality prediction of semiconductor processing equipment. The controlling device includes a multiplexer connecting a plurality of vibration sensors to a spectrum analyzer. Therein, the vibration sensors are non-destructively installed to a variable-frequency rotating mechanism inside the semiconductor processing equipment. The multiplexer includes an adapter and at least a modularized multi-channel connecting assembly plugged into the adapter where the number of the connected vibration sensors is less than the number of the signal connecting terminals of the multiplexer so that at least one terminal is unconnected with the vibration sensors. Additionally, a control signal wire connects the unconnected terminal to a corresponding controller of the variable-frequency rotating element.

Abstract: Provided is a sampling apparatus that samples a signal under measurement, including a sample processing section that outputs sample data obtained by sampling the signal under measurement with a sampling timing at non-uniform intervals obtained by thinning a reference clock, a storage section that stores the sample data, and a waveform generating section that generates a waveform of the signal under measurement based on the sample data read from the storage section. The sample processing section includes a sampler that samples the signal under measurement in synchronization with the reference clock and a data thinning section that thins the sample data output by the sampler and outputs this thinned data as sample data with the sampling timing at non-uniform intervals.

Abstract: A weld detecting method that detects a weld on a work includes: obtaining in advance at least one correlation, from among a correlation between a width of the neck and an amount of elongation of the work and a correlation between the width of the neck and an amount of change in at least one of a sheet thickness and a sheet width of the work before and after elongation of the work, and calculating the width of the neck based on the at least one correlation by obtaining at least one of the sheet thickness, the sheet width, or the amount of elongation of the work from the obtained at least one correlation; setting a conveying speed, according to the calculated width of the neck; and detecting the neck by measuring the sheet width of the work at predetermined intervals, while conveying the work the set conveying speed.

Abstract: A method and system is provided for assuring the integrity of data used to evaluate financial risk or exposure in trading portfolios such as portfolios of derivative contracts by looking for sweeping changes or statistically significant trends suggestive of possible errors. The method and system uses Content Analysis to measure the changes in the information content or entropy of data to detect abnormal changes that may require human intervention. A graphical user interface can also be provided that provides a mechanism for alerting users of possible errors and also gives an indication of the severity of the detected abnormality.

Abstract: A system for determining occurrence factors of particles includes a user interface device, and an apparatus for detecting the occurrence factors of particles. The apparatus for detecting the occurrence factors of particles includes a storage unit that stores a program for executing a calculation method for calculating a likelihood of each of the occurrence factors of particles in the form of a score; and a calculation unit for calculating the score for each of the occurrence factors of particles based on particle distributions at least on a surface of a substrate using the stored program. The user interface device displays the calculated score for each of the occurrence factors of particles.

Abstract: According to one embodiment, a quality estimation apparatus includes: a storage module which stores designation information for designating inspection targets to be subjected to sampling inspection in estimation targets including the inspection targets and non-inspection targets, characteristic values obtained by the sampling inspection of the inspection targets and criterion information for determining qualities of the inspection targets based on the characteristic values; a threshold value calculator which calculates threshold values indicating qualities of the inspection targets from the characteristic values of the inspection targets by using the criterion information; and a clustering module which classifies the estimation targets in clusters so that the clusters have probability distributions with the threshold values used as a variable.

Abstract: A system and method for performing spatial signature analysis, the system including a memory unit for storing wafer defect density maps of multiple resolutions, derived from a defect map obtained by an inspection tool; an analyzer for analyzing the wafer defect density maps to identify zones of interest; and a spatial signature generator for generating spatial signatures in response to relations between zones of interest of different density resolution.

Abstract: A method and system for automatically determining an optimal re-training interval for a fault diagnoser based on online monitoring of the performance of a classifier are disclosed. The classifier generates a soft measure of membership in association with a class based on a training data. The output of the classifier can be utilized to assign a label to new data and then the members associated with each class can be clustered into one or more core members and potential outliers. A statistical measure can be utilized to determine if the distribution of the outliers is sufficiently different than the core members after enough outliers have been accumulated. If the outliers are different with respect to the core members, then the diagnoser can be re-trained; otherwise, the output of the classifier can be fed to the fault diagnoser.

Abstract: Provided is an image quality evaluation method for evaluating image qualities of a second image by using a difference from a first image. In the image quality evaluation method, a representative pixel component value indicating a pixel component value that represents pixels in the image frame of one of the images, and pixel position information indicating a pixel position where the representative pixel component value appears are extracted as a feature quantity. By using the representative pixel component value and the pixel position information, which are the image feature quantity, and based on a difference between a pixel component value at the pixel position indicated by the pixel position information in the image frame of the other image and the representative pixel component value, a difference of the entire second image from the first image is estimated.

Abstract: A method of determining whether a part satisfies tolerance criteria includes making a multiplicity of measurements of the part, reducing the number of measured points to a number of boundary points that define a boundary within which all measured points are encompassed and comparing the boundary to a tolerance limit of a normal surface to determine whether the part conforms to the tolerance.

Abstract: Methods for predicting the performance risk of a paint component are disclosed. The methods include providing a proposed paint formulation, wherein the proposed paint formulation comprises at least one paint component, and identifying previous paint formulations comprising the paint component. The methods further include evaluating formulation similarities between the previous paint formulations and the proposed paint formulation, assigning formulation similarity scores based on the formulation similarities, and determining a paint component risk score for the paint component based on the formulation similarity scores. The proposed paint formulation may be utilized in a manufacturing application when the paint component risk score satisfies a manufacturing threshold value.

Abstract: Certain embodiments provide a semiconductor device manufacturing system including processing devices used in processing processes, a wafer transfer device, a processing characteristic measuring unit, a device characteristic measuring unit, data server, and an analysis server. The wafer transfer device conveys the wafer to the processing devices such that a direction of the wafer differs according to each processing process. The data server stores data. The data include processing characteristic data that is the processing characteristic of the wafer for each processing process measured by the processing characteristic measuring unit, the direction of the wafer for each processing process, and device characteristic data that is the device characteristic of the wafer measured by the device characteristic measuring unit.

Abstract: A method, apparatus, and a system for generating a binary mapping of wafer regions using measured value. A first measured value relating to processing a first workpiece is acquired. A second measured value relating to a second workpiece is acquired. At least a first region common to the first and second workpieces is defined. A determination is made as to whether the results associated with the first or second measured value is above a predetermined threshold. A first binary value is assigned to the first region based upon a determination that the results associated the first or second measured value data is above the threshold.

Abstract: A method includes passing a lot through a production process and evaluating a statistical quality of the production process. Additionally, the method includes calculating an advanced process control (APC) recipe parameter adjustment (RPA) distribution value and determining if sampling is indicated. Furthermore, the method includes, if sampling is indicated, performing a measurement process of the lot.

Abstract: Suitability of determination standard value for intermediate inspection is determined. A correlation between measured values X for intermediate inspection and measured values Y for final inspection is derived. For each of calculation target points on X-axis, a distribution pattern of measured values Y is specified for measured value Xn of the point based on the correlation, and probabilities of a range determined to be non-defective by determination standard value of final inspection and a range determined to be defective that are included in the distribution are calculated. For each of the ranges of measured values X determined to be non-defective and defective based on the determination standard value of the intermediate inspection, a degree of consistency and a degree of inconsistency between results of inspections are determined using the probabilities. Suitability of the determination standard value is determined based on the two degrees.

Abstract: The method for forming the optimal characteristic curve of a solar cell comprises the steps of: providing a first acceptable error; and determining a current-voltage polynomial regression equation, whose square root of the residual sum of square is less than the first acceptable error for a set of solar cell measured data. The order of the current-voltage polynomial regression equation is gradually increased until the square root of the residual sum of square of the current-voltage polynomial regression equation is less than the first acceptable error.

Abstract: A tone signal received in a telecommunications network is bandpass filtered based on an identified type of the received tone signal, providing a bandpass filtered tone signal. The tone signal is also bandstop filtered based on the identified type of the received tone signal, providing a bandstop filtered tone signal. The bandpass filtered tone signal and the bandstop filtered tone signal are analysed and the received tone signal is quantified based on the analysis result.

Abstract: An information processing device stores an extracted feature of each inspection item of the process inspection, and a determination result of a final inspection in a memory device, calculates a separation degree between a distribution of features of products which were determined as good products at the final inspection and a distribution of features of products which were determined as defective products at the final inspection for every inspection item or every combination of inspection items based on data of the products stored in the memory device, selects an inspection item whose inspection standard is to be reset from the inspection items or the combinations of the inspection items based on a value of the separation degree. Thus providing a method of appropriately setting an inspection standard for detecting a defect sign during process inspection. Further a process inspection device and inspection standard setting device which implements the same.

Abstract: A monitoring method for Through-Silicon Vias (TSVs) of a three-dimensional integrated circuit (3D IC) is provided, wherein the 3D IC includes a plurality of TSVs, and the method includes: providing a plurality of inverters; connecting the inverters with the TSVs as a circuit; enabling the circuit to oscillate; measuring an output signal on an output end of one of the inverters; and determining the characteristic of TSVs of the 3D IC based on the output signal.

Abstract: System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing an inter-metal (“IM”) WAT on a plurality of processed wafer lots; selecting a subset of the plurality of wafer lots using a lot sampling process; and selecting a sample wafer group using the wafer lot subset, wherein IM WAT is performed on wafers of the sample wafer group to obtain IM WAT data therefore. The method further comprises estimating final WAT data for all wafers in the processed wafer lots from IM WAT data obtained for the sample wafer group and providing the estimated final WAT data to a WAT APC process for controlling processes.

Abstract: A method, system and computer program product for generating device fingerprints and authenticating devices uses initial states of internal storage cells after each of a number multiple power cycles for each of a number of device temperatures to generate a device fingerprint. The device fingerprint may include pairs of expected values for each of the internal storage cells and a corresponding probability that the storage cell will assume the expected value. Storage cells that have expected values varying over the multiple temperatures may be excluded from the fingerprint. A device is authenticated by a similarity algorithm that uses a match of the expected values from a known fingerprint with power-up values from an unknown device, weighting the comparisons by the probability for each cell to compute a similarity measure.

Abstract: A data management tool is provided. The tool comprises a first processor, a server application that, when executed on the first processor, manages allocation of equipment serial numbers (ESNs) used in executing test cases related to mobile devices, aggregates test progress data in a defect board, maintains a test chat forum, and sends a notification of a defect when the defect is reported to the server application, a second processor, and a thick client that, when executed on the second processor, receives the notification of the defect, participates in the test chat forum and requests one of the equipment serial numbers from the server application.

Abstract: A process for redesigning a distressed component, such as a turbine blade in a gas turbine engine, in which the distressed component is under thermal and structural loads, for improving the life of the component. The process includes obtaining the operating conditions of the machine in which the distressed component is used, finding the boundary conditions under which the distressed component operates, producing a 3-dimensional model of the distressed component with such detail that the distress levels are accurately represented on the model, subjecting the model to a series of technical analysis to predict a life for the component, reiterating the technical analysis until the levels of distress on the model accurately represent the distress that appears on the actual component, and then predicting a remaining life of the component based on the analysis, or redesigning the model and reanalyzing the model until a maximum life for the component has been found.

Abstract: According to exemplary methods and systems of the present principles, the location of defective field repairable units (FRUS) of a circuit that have varying sizes or varying numbers of scan cells may be identified by employing tiles including scan cells from different FRUS. A set of test patterns may be scanned through the scan cells such that cells belonging to FRUs within a tile may be concealed while analyzing the response of scan cells in the tile contributed by a different FRU. Further, defective tiles are discoverable at any tile location and in any quantity within a maximal capacity using a compressed signature. In addition, signature registers that process data at a rate that is faster than the scan shift rate of the circuit may be employed during compression to multiply a circuit response by a plurality of components of a compression matrix during one scan shift cycle.

Abstract: Method for managing a group of swimming pools, characterized in that it includes the following steps: measurement or estimation of at least one datum representing the water quality of each swimming pool (11; 13; 15; 17) in the group by its own local monitoring means (21; 23; 25; 27), transmission by the local monitoring means (21; 23; 25; 27) of this at least one datum to a remote server of a management centre (30; 40, 40?) via a communication network (20).

Abstract: A method of extracting a feature from a point cloud comprises receiving a three-dimensional (3-D) point cloud representing objects in a scene, the 3-D point cloud containing a plurality of data points; generating a plurality of hypothetical features based on data points in the 3-D point cloud, wherein the data points corresponding to each hypothetical feature are inlier data points for the respective hypothetical feature; and selecting the hypothetical feature having the most inlier data points as representative of an object in the scene.

Abstract: Measuring apparatus for monitoring the position of the center of mass of a semiconductor wafer is disclosed. The apparatus includes a wafer support (14) with a ledge for supporting an edge of a wafer (2) when it is lifted at a detection point by a probe (16). The probe (16) is connected to a force sensor (18) which senses a force due to a moment of the wafer about a fulcrum (4) on the wafer support (14). Moment measurements are taken at a plurality of detection points and a processing unit calculates the position of the center of mass from the moment measurements. Changes in wafer mass distribution (e.g. due to faulty treatment steps) which cause movement of the center of mass can be detected.