Abstract: An apparatus and methods are disclosed for a bidirectional front-end circuit included within a system on chip (SoC). The bidirectional front-end circuit includes a differential bidirectional terminal for receiving and transmitting signals. The bidirectional front-end circuit is configured to provide a first communication path between a first controller and a connector through the differential bidirectional terminal when operating in a first mode. And, the bidirectional front-end circuit is reconfigured to provide a second communication path between a second controller and the connector through the differential bidirectional terminal when operating in a second mode.

Abstract: A test instrument measures performance of a transponder without direct access to a line interface of the transponder. The test instrument learns parameters of internal signal conversion processes of the transponder and measures performance of the transponder based on the learned parameters.

Abstract: Aspects of the invention relate to techniques of defect injection for transistor-level fault simulation. A circuit element in a circuit netlist of a circuit is first selected for defect injection. Next, a defect is determined based on whether the selected circuit element is a design-intent circuit element or a parasitic circuit element. After the defect is determined, the defect is injected into the circuit netlist and then the circuit is simulated.

Abstract: System and method for confirming radio frequency (RF) signal connections with multiple devices under test (DUTs) tested concurrently using replicas of a RF test signal. Cabled signal connections between the signal source and the DUTs are monitored by sensing levels of outgoing and related reflection RF signals. These signal levels are compared against similar signal levels when the outgoing RF signals are provided to reference impedances. Alternatively, the cabled signal connections have lengths of known signal wavelengths and the RF test signal frequency is swept such that minimum and maximum time delays between the outgoing and reflection RF signals go through minimum and maximum signal cycles with a difference of at least one full cycle. The reflection RF signal magnitude and phase are monitored, from which peak and valley signal level differences and phase changes are identified to determine return loss and phase changes indicative of DUT connection.

Abstract: A server stores multiple configuration data. A tester hardware is configured to be capable of changing at least a part of its functions according to configuration data stored in rewritable nonvolatile memory, to supply a power supply voltage to a DUT, to transmit a signal to the DUT, and to receive a signal from the DUT. An information technology equipment is configured such that, (i) when the test system is set up, the information technology equipment acquires the configuration data from the server according to the user's input, and writes the configuration data to the nonvolatile memory. Furthermore, the information technology equipment is configured such that, (ii) when the DUT is tested, the information technology equipment executes a test program so as to control the tester hardware, and to process data acquired by the tester hardware.

Abstract: A test apparatus that tests a plurality of devices under test formed on a wafer under test includes a test substrate that faces the wafer under test and is electrically connected to the devices under test, a programmable device that is provided on the test substrate and changes a logic relationship of output logic data with respect to input logic data, according to program data supplied thereto, a plurality of input/output circuits that are provided on the test substrate to correspond to the devices under test and that each supply the corresponding device under test with a test signal corresponding to the output logic data of the programmable device, and a judging section that judges pass/fail of each device under test, based on operation results of each device under test according to the test signal.

Abstract: Exemplary method, system, and computer program product embodiments for an incremental modification of an error detection code operation are provided. In one embodiment, by way of example only, for a data block requiring a first error detection code (EDC) value to be calculated and verified and is undergoing modification for at least one randomly positioned sub-blocks that becomes available and modified in independent time intervals, a second EDC value is calculated for each of the randomly positioned sub-blocks. An incremental effect of the second EDC value is applied for calculating the first EDC value and for recalculating the first EDC value upon replacing at least one of the randomly positioned sub-blocks. The resource consumption is proportional to the size of at least one of the randomly positioned sub-blocks that are added and modified. Additional system and computer program product embodiments are disclosed and provide related advantages.

Abstract: A chip with a built-in self-test (BIST) component capable of testing the linearity of an ADC is described herein. The BIST component uses hardware registers to facilitate a sliding histogram technique to save space on the chip. A subset of detected digital codes are analyzed, and DNL and INL calculations are performed by a controller to determine whether any of the digital codes in the subset exceed maximum or minimum DNL and INL thresholds. New digital codes being detected by the ADC are added to the subset as lower-value digital codes are pushed out of the subset, maintaining the same number of digital codes being analyzed as the subset moves from lower codes detected during lower voltages to higher codes detected at higher voltages. A synchronizer and pointer ensure that the subset moves through the digital codes at the same rate as the analog input ramp source.

Abstract: An integrated circuit comprises scan test circuitry and additional circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises at least one scan chain having a plurality of scan cells, wherein the scan chain is separated into a plurality of scan segments with each such segment comprising a distinct subset of two or more of the plurality of scan cells. The scan test circuitry further comprises scan segment bypass circuitry configured to selectively bypass one or more of the scan segments in a scan shift mode of operation. The scan segment bypass circuitry may comprise a plurality of multiplexers and a scan segment bypass controller. The multiplexers are arranged within the scan chain and configured to allow respective ones of the scan segments to be bypassed responsive to respective bypass control signals generated by the scan segment bypass controller.

Abstract: A delay setting data generator generates delay setting data based on rate data. A variable delay circuit delays the test pattern data by a delay time determined by the delay setting data with reference to a predefined unit amount of delay. First rate data designates the period of the test pattern data with a precision determined by the unit amount of delay. Second rate data designates the period of the test pattern data with a precision higher than that determined by the unit amount of delay. The delay setting data generator outputs a first value and a second value in a time division manner at a ratio determined by the second rate data, the first and second values being determined by the first rate data.

Abstract: A defect portion in a signal is processed by receiving an input signal. A location of a defect portion within the input signal and an amplitude of the defect portion is determined. An adjusted signal is generated by adjusting the amplitude of the defect portion using the determined location of the defect portion and the determined amplitude of the defect portion. Information associated with the adjusted signal is decoded.

Abstract: Special test circuitry in an IC for wafer level testing selectively connects the specialized test circuitry to the functional circuitry during wafer test. Following wafer test the special test circuitry is electrically isolated from the functional circuitry and power supplies such that it does not load functional circuit signals nor consume power.

Abstract: Methods and apparatus for processing failures during semiconductor device testing are described. Examples of the invention can relate to testing a device under test (DUT). Fail capture logic can be provided, coupled to test probes and memory, to indicate only first failures of failures detected on output pins of the DUT during a test for storage in the memory.

Abstract: Special test circuitry in an IC for wafer level testing selectively connects the specialized test circuitry to the functional circuitry during wafer test. Following wafer test the special test circuitry is electrically isolated from the functional circuitry and power supplies such that it does not load functional circuit signals nor consume power.

Abstract: An integrated apparatus for testing image devices is disclosed, in which a plurality of testing apparatuses needed when an image-related device is installed are integrated into one construction for thereby achieving a good portability as compared to a conventional art in which a plurality of testing apparatuses such as a multi-meter, a portable monitor, a communication tester, etc. are separately needed.

Abstract: There is provided a signal generating apparatus for generating an output signal corresponding to pattern data supplied thereto. The signal generating apparatus includes a timing generating section that generates a periodic signal, a shift register section including a plurality of flip-flops in a cascade arrangement through which each piece of data of the pattern data is propagated sequentially in response to the periodic signal, a waveform generating section that generates the output signal whose value varies in accordance with a cycle of the periodic signal, based on data values output from the plurality of flip-flops, and an analog circuit that enhances a predetermined frequency component in a waveform of the output signal generated by the waveform generating section.

Abstract: A method for allowing simultaneous parameter-driven and deterministic simulation during verification of a hardware design, comprising: enabling a plurality of random parameter-driven commands from a random command generator to execute in a simulation environment during verification of the hardware design through a command managing device; and enabling a plurality of deterministic commands from a manually-driven testcase port to execute in the simulation environment simultaneously with the plurality of random parameter-driven commands during verification of the hardware design through the command managing device, the plurality of deterministic commands and the plurality of random parameter-driven commands each verify the functionality of the hardware design.

Abstract: An Algorithmic Reactive Testbench (ART) system is provided for the simulation/verification of an analog integrated circuit design. The ART system is a high level simulation/verification environment with a user program in which one or more analog testbenches are instantiated and operated as prescribed in an algorithmic reactive testbench program, and the properties of the unit testbenches (test objects) can be influenced by prior analysis of themselves or other tests. The test object may also contain various properties including information reflecting the status of the test object. The modification of a property of a test object is an act of communication in the ART system from the algorithmic reactive testbench program to the test object.

Abstract: A method, apparatus and computer program product are provided for use in a system that includes one or more processors, and multiple threads that are respectively associated with the one or more processors. One embodiment of the invention is directed to a method that includes the steps of generating one or more test cases, wherein each test case comprises a specified set of instructions in a specified order, and defining a plurality of thread hardware allocations, each corresponding to a different one of the threads. The thread hardware allocation corresponding to a given thread comprises a set of processor hardware resources that are allocated to the given thread for use in executing test cases. The method further includes executing a particular one of the test cases on a first thread hardware allocation, in order to provide a first set of test data, and thereafter executing the particular test case using a second thread hardware allocation, in order to provide a second set of test data.

Abstract: An integrated circuit is used to monitor and process parametric variations, such as temperature and voltage variations. An integrated circuit may include a temperature-sensitive oscillator circuit and a temperature-insensitive oscillator circuit, and frequency difference between the two sources may be monitored. In some embodiments, a parametric-insensitive reference oscillator is used as a reference to measure frequency performance of a second oscillator wherein the second oscillator performance is parametric-sensitive. The measured frequency performance is then compared to a tamper threshold and the result of the comparison is indicative of tampering.

Abstract: A testing system for a device under test (DUT) includes a test parameter-generating device and a platform module. The test parameter-generating device stores test information, and is operable so as to execute a test algorithm, so as to generate a transmission signal upon execution of the test algorithm, and so as to generate a test environment with reference to the transmission signal. The platform module is operable so as to conduct testing of the DUT using the test information stored in the test parameter-generating device under the test environment generated by the test parameter-generating device.

Abstract: Cell-aware fault models directly address layout-based intra-cell defects. They are created by performing analog simulations on the transistor-level netlist of a library cell and then by library view synthesis. The cell-aware fault models may be used to generate cell-aware test patterns, which usually have higher defect coverage than those generated by conventional ATPG techniques. The cell-aware fault models may also be used to improve defect coverage of a set of test patterns generated by conventional ATPG techniques.

Abstract: A semiconductor integrated circuit having a low maximum allowable operating frequency such as an analog circuit can be prevented from being destroyed during a scan test. When a scan test mode signal is “1”, output signals of a first AND circuit and a second AND circuit are fixed to a low level and an output of an OR circuit is fixed to a high level. Therefore, output signals of fourth through sixth flip-flops FF4-FF6 are not transferred to first through third analog circuits during the scan test. On the other hand, the output signals of the fourth through sixth flip-flops FF4-FF6 are transferred to the first through third analog circuits during a normal operation.

Abstract: A system and method for self-test of an integrated circuit are disclosed. As one example, an integrated circuit is disclosed. The integrated circuit includes a digital signal processing chain, a random sequence generator coupled to an input of the digital signal processing chain, and a checksum calculator coupled to an output of the digital signal processing chain.

Abstract: The present disclosure describes novel methods and apparatuses for directly accessing JTAG Tap domains that exist in a scan path of many serially connected JTAG Tap domains. Direct scan access to a selected Tap domain by a JTAG controller is achieved using auxiliary digital or analog terminals associated with the Tap domain and connected to the JTAG controller. During direct scan access, the auxiliary digital or analog terminals serve as serial data input and serial data output paths between the selected Tap domain and the JTAG controller.

Abstract: Embodiments of an integrated circuit that includes a debug circuit are described. This debug circuit is configured to test an asynchronous circuit by performing analog measurements on asynchronous signals associated with the asynchronous circuit, and includes a triggering module configured to gate the debug circuit based on one or more of the asynchronous signals. This triggering module has a continuous mode of operation and a single-shot mode of operation. A timing module within the debug circuit has a timing range exceeding a pre-determined value, and is configured to provide signals corresponding to a first time base or signals corresponding to a second time base. Furthermore, control logic within the debug circuit is configured to select a mode of operation and a given time base for the debug circuit, which is either the first time base or the second time base.

Abstract: A testing system includes an integrated circuit having an analog design under test and a processor; an digital-to-analog converter (DAC), coupled to the analog design under test and the processor, for converting a digital testing sequence output of the processor into an analog testing sequence fed into the analog design under test; a analog-to-digital converter (ADC), coupled to the analog design under test and the processor, for converting an analog testing response of the analog design under test into a digital testing response fed into the processor; and an external tester, coupled to the processor of the integrated circuit, for sequentially outputting a program sequence to the processor; wherein the processor executes the program sequence without un-predictable conditional jump to get a testing result of the testing system and then outputs the testing result to the external tester.

Abstract: An apparatus comprising a comparator circuit, a reference circuit, a plurality of elements and a logic circuit. The comparator circuit may be configured to generate a difference signal in response to (i) a reference signal and (ii) a test signal. The reference circuit configured to generate the reference signal in response to a first control signal. The plurality of elements may each be configured to generate an intermediate test signal. One of the intermediate test signals may be presented as the test signal by activating one of the test elements, in response to a second control signal. The logic circuit may be configured to generate (i) the first control signal and (ii) the second control signal, each in response to the difference signal.

Abstract: This invention relates to fault detection in electrical circuits. The invention provides a method and apparatus for testing an input circuit by generating a periodic test signal having a predetermined phase and a predetermined amplitude; summing the test signal and an input signal to provide a summed signal; processing the summed signal to provide an output signal; generating an extracted test signal from the output signal; comparing the extracted test signal with a reference signal representing said periodic test signal; generating an error signal in dependence upon the result of said comparing step. The invention also provides a method and apparatus for testing a plurality of adjacent input circuits.

Abstract: Disclosed herein is a semiconductor test apparatus for simultaneously testing a plurality of semiconductor devices. The semiconductor test apparatus includes a plurality of pattern generation boards, a DUT board, a backplane board, and a power supply unit.

Abstract: A method of testing an analog and/or mixed-signal circuit can be used in either a production or a built-in self test environment. The method includes generating an excitation signal for testing by using dynamic element matching for performance enhancement of the test signal generator that applies an excitation, and/or by measuring an output of the DUT using dynamic element matching for performance enhancement of an output measurement device. Signal generators and circuits using aspects of the method are also discussed.

Abstract: Special test circuitry in an IC for wafer level testing selectively connects the specialized test circuitry to the functional circuitry during wafer test. Following wafer test the special test circuitry is electrically isolated from the functional circuitry and power supplies such that it does not load functional circuit signals nor consume power.

Abstract: A circuit that includes a controller and at least one control I/O pin. When the controller is placed into an initial state, the controller initializes the circuit into an initial operation mode. Depending on whether or not signal(s) satisfying predetermined criteria are applied to at least one of the control I/O pins, the controller will cause the circuit to enter one of two or more post-initial operation modes. Accordingly, by initializing the controller, and by controlling a signal on the control I/O pin(s), the operating mode of the circuit may be controlled. In one embodiment, a given control pin might be configurable to be both analog and digital, depending on the circuit's operation mode.

Abstract: An integrated circuit 2 including functional circuits 4, 6 and a diagnostic circuit 10 passes a functional signal and a diagnostic signal to/from the integrated circuit using a shared integrated circuit pin 14. The functional signal and the diagnostic signal have relative forms such that they can be simultaneously communicated and respective independent physical communication channels provided therefore. Examples are the diagnostic signal being used to frequency, phase, amplitude or otherwise modulate a functional signal being passed. A diagnostic interface circuit 18 is provided to recover the diagnostic signal from the combined functional and diagnostic signal or to combine the functional and diagnostic signals.

Abstract: A boundary scan test system including a transmitter and a receiver. The system performs DC and AC boundary scan testing of the interconnections between devices. The system addresses fault masking that can occur during testing. Of concern are AC coupled interconnections while providing IEEE 1149.1 DC test compatibility. The test receiver includes an input test buffer and an interface mechanism. The input test buffer has a built-in null detection capability. The interface mechanism includes a technology mapper, one or more detectors, and an integrator. The receiver provides at least partial, if not complete, coverage for at least one of five fault syndromes that can result from single defect conditions in the system.

Abstract: A method suitable for testing an integrated circuit device is disclosed, the device comprising at least one module, wherein the at least one module incorporates at least one associated module monitor suitable for monitoring a device parameter such as temperature, supply noise, cross-talk etc. within the module.

Abstract: A test system with multiple instruments. Some instruments act as controller instruments and others act as controlled instruments. Each instrument includes a clock generator that synthesizes one or more local clocks from a reference clock. The reference clock is a relatively low frequency clock that can be inexpensively but accurately generated and distributed to all of the instruments. A communication link between instruments is provided. Timing circuits within instruments that are to exchange time information are synchronized to establish a common time reference. Thereafter, instruments communicate time dependent commands or status messages asynchronously over the communication link by appending to each message a time stamp reflecting a time expressed relative to the common time reference. The test system includes digital instruments that contain pattern generators that send command messages to analog instruments, which need not include pattern generators.

Abstract: A compactor includes test data inputs that are connectable to circuit outputs of an electrical circuit, test comparison inputs, and test data outputs. The compactor further includes a number of H matrix XOR gates arranged as a switching mechanism between the test data inputs and the test data outputs such that data applied to the test data inputs is produced at the test data outputs compressed in accordance with coefficients of an H matrix of an error-correcting code, and compensation XOR gates arranged between the test data inputs and the test data outputs, each compensation XOR gate including an input for receiving a compensation value.

Abstract: A built-in-self test (BIST) scheme for analog circuitry functionality tests such as frequency response, gain, cut-off frequency, signal-to-noise ratio, and linearity measurement. The BIST scheme utilizes a built-in direct digital synthesizer (DDS) as the test pattern generator that can generate various test waveforms such as chirp, ramp, step frequency, two-tone frequencies, sweep frequencies, MSK, phase modulation, amplitude modulation, QAM and other hybrid modulations. The BIST scheme utilizes a multiplier followed by an accumulator as the output response analyzer (ORA). The multiplier extracts the spectrum information at the desired frequency without using Fast Fourier Transform (FFT) and the accumulator picks up the DC component by averaging the multiplier output.

Abstract: An apparatus for testing a display device includes a display device to display test patterns, a graphic process unit to supply analog mode signals and digital mode signals to the display device, and a control unit to allow test patterns of an analog testing mode and test patterns of a digital testing mode to be sequentially displayed on the display device upon receiving a control signal from the graphic process unit, and to output a control signal to the display device to sequentially change display characteristics of an image according to an on-screen-display mode testing menus.

Abstract: A method for Built-In Speed Grading (BISG) comprises a Circuit Under Test (CUT) with Built-In Self-Test (BIST) circuitry, an All-Digital Phase-Locked Loop (ADPLL), and a BISG, to automatically decide the maximum operating frequency of the CUT. The search process for this maximum operating frequency is conducted by a binary search in which the next frequency to test CUT is determined automatically by the BISG controller based on whether the CUT passes or fails the BIST session at current frequency. The maximum operating frequency the CUT can operate is narrowed down to a fine-tuning range out of a number of clock frequencies that the ADPLL can offer. The frequencies an ADPLL can offer is divided into a plurality of coarse ranges, with each of them further having a plurality of fine-tuning frequencies.

Abstract: Methods, system, and computer programs for compensating for introducing data dependent jitter into a test signal using a testing instrument are disclosed. The method includes generating a test pattern that comprises a plurality of intervals. Each of the intervals includes a number of redundant samples that correspond to a sample in a test source pattern. The test pattern is digitally modified to generate a modified test pattern that includes data dependent jitter.

Abstract: There is provided an arbitrary waveform generator that generates an arbitrary waveform. The arbitrary waveform generator includes a waveform pattern generating section that generates pattern data showing a pattern of the arbitrary waveform, a digital-analog converting section that outputs the arbitrary waveform based on the pattern data, and a correction processing section that corrects the pattern data and inputs the corrected data into the digital-analog converting section based on a value made by differentiating the pattern data and a time constant of a path through which the arbitrary waveform output from the digital-analog converting section passes.

Abstract: A programmable source/measurement module for automatic test equipment is disclosed. A high resolution low frequency source, high resolution low frequency measurement capability, low resolution high frequency source, and a low resolution high frequency measurement capability are provided in a single module. The module comprises an input/output switch matrix selectively coupled to a low frequency filter block and a high frequency filter block. Each filter block may be used for either source or measurement. The filter blocks are selectively coupled to a plurality of analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). The ADCs and DACs are coupled to a digital interface.

Abstract: The present disclosure relates to apparatus and methods for measurement of analog voltages in an integrated circuit. In particular, the apparatus includes an on-chip digital-to-analog converter configured to receive a variable digital input code and output a corresponding analog voltage corresponding to the variable digital input code. The apparatus also includes an on-chip comparator circuit configured to receive the analog voltage output by the digital-to-analog converter and a test analog voltage as inputs and to provide an output indicating the test analog voltage. Further, the apparatus includes an on-chip logic operative to determine the test analog voltage based on the output of the comparator circuit. A corresponding method is also disclosed.

Abstract: A portion of a test head utilized to perform simultaneous automated at-speed testing of a plurality of devices that generate serial data signals having gigabit per second baud rates. The portion of the test head includes connection sections that couple an external testing system to the portion of the test head, a restricted section positioned between said connection sections, a device interface board (DIB) having a device under test (DUT) holding section that secures the devices, said DIB positioned below said restriction section and a multi-layered rider board coupled to the devices via a coupling section, said rider board forming signal paths to route testing signals between at least the devices and the external testing system.

Abstract: A testing apparatus including a plurality of testing module slots to which different types of testing modules for testing a device under test are optionally mounted, includes an operation order holding unit for holding information indicating that a test operation by a first testing module should be performed before a test operation by a second testing module, a trigger return signal receiving unit for receiving a trigger return signal from the first testing module, the trigger return signal indicating that the first testing module has completed the test operation thereof, when the test operation of the first testing module has been completed, and a trigger signal supplying unit for supplying a trigger signal to the second testing module, the trigger signal indicating that the second testing module should start the test operation thereof, when the trigger return signal receiving unit receives the trigger return signal.

Abstract: Methods and structures are provided to improve the transfer functions of analog-to-digital converter systems. They address the converter error function that corresponds to a converter's transfer function. In particular, they provide a corrector with a corrector transfer function that defines a corrector error function which substantially mirrors at least a portion of the converter error function. The corrector processes the converter's output digital signals to realize corrector digital signals which are then combined with the original output digital signals to obtain a system with a system error function that is significantly reduced from the original converter error function.

Abstract: A testing apparatus including a plurality of testing module slots to which different types of testing modules for testing a device under test are optionally mounted, includes a first and a second testing modules, and a synchronization controlling unit. The synchronization controlling unit includes an operation order holding unit for holding information indicating that a test operation by a first testing module should be performed before a test operation by a second testing module, a trigger return signal receiving unit for receiving a trigger return signal from the first testing module, and a trigger signal supplying unit for supplying a trigger signal to the second testing module, the trigger signal indicating that the second testing module should start the test operation thereof, when the trigger return signal receiving unit receives the trigger return signal.

Abstract: An apparatus for testing an integrated circuit that includes analog nodes is disclosed. In one aspect, an integrated circuit comprises testing circuitry and core logic circuitry. A memory in the testing circuitry stores data identifying analog nodes in the core logic circuitry and tolerance values associated with the analog nodes. A condition checker compares actual test values with the associated tolerance values. A main control unit controls the testing circuitry and synchronizes testing of the core logic circuitry. In another aspect, the testing circuitry includes a host computer interface useful for communicating with a host computer. A data memory in the testing circuitry is used for storing diagnostic data. The contents of the data memory may then be uploaded to a host computer. Test stimuli may be transmitted to the integrated circuit from a location outside the integrated circuit to perform testing.