Abstract: An apparatus and method for real-time in-situ simultaneous measurement of temperature and mechanical parameters can include a charge type vibration sensing module having a temperature compensation function and a temperature/vibration coplanarly-integrated wireless surface acoustic wave (SAW) sensing module are controlled by a processing module in which a full-range temperature-vibration composite parameter compensation decoupling method is implanted, which can detect a vibration signal in a variable temperature environment. Moreover, temperature and vibration multi-parameter testing of static components in a high-temperature, narrow and closed environment can be implemented by arranging the charge type vibration sensing module having a temperature compensation function, and the temperature/vibration coplanarly-integrated wireless SAW sensing module implements health monitoring of moving components in a high-temperature and high-rotation environment.

Abstract: A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Disclosed are a substrate treating apparatus and a substrate transporting method. The substrate treating apparatus includes a first transport mechanism. The first transport mechanism includes a hand. A hand includes a base, a suction portion, a first receiver, a second receiver, and a receiver driving unit. The suction portion is attached to the base. The suction portion flows gas along a top face of a substrate, and sucks the substrate upward without contacting the substrate. The first receiver and the second receiver are supported on the base. The first receiver and the second receiver are disposed below the substrate sucked by the suction portion. The first receiver and the second receiver can receive a back face of the substrate. The receiver driving unit moves the second receiver with respect to the base. The receiver driving unit causes the second receiver to access the first receiver and to move away from the first receiver.

Abstract: A piezoelectric actuator includes: a diaphragm plate; a first electrode provided on or over the diaphragm plate; a piezoelectric substance layer provided on or over the first electrode; and a second electrode provided on or over the piezoelectric substance layer; wherein the piezoelectric substance layer includes a plurality of active portions sandwiched between the first electrode and the second electrode, either one of the first electrode and the second electrode is an individual electrode provided individually for each of the plurality of active portions, the other of the first electrode and the second electrode is a common electrode that is common to the plurality of active portions, and lead-out wiring is multiple-connected to the individual electrode.

Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.

Abstract: In a road surface condition determining device, when determining a road surface condition, a vibration detection unit, a waveform processing unit and a data transmission unit for implementing a sensing function and a data transmission function are not set continuously to an active state for all tire side device, but at least only one tire side device is set to an active state. Remaining one or more is set to a sleep state. A reduction in power consumption of the tire side devices set to the sleep state can thus be achieved. Further, with regard to the at least one tire side device, since the sensing function and the data transmission function remain in the active state, the road surface condition can be reliably determined based on the road surface data of the tire side device.

Abstract: A sensor unit includes a substrate, an inertial sensor module mounted at the substrate, a container including a storage space for storing the substrate and the inertial sensor module, and a coupling member that couples the container and the substrate in a state in which the substrate and the container are in non-contact with each other. The coupling member has elasticity, and an elastic modulus of the coupling member is smaller than an elastic modulus of the container.

Abstract: According to one embodiment, a vibration detecting device includes a housing, a vibration sensor in the housing, a circuit board in the housing, a flexible wiring component, a first face, and a second face. The vibration sensor is housed in the housing. An electric component that processes a detection signal of the vibration sensor is provided on the circuit board. The wiring component electrically connects the vibration sensor and the circuit board. The first face is provided on the housing and is configured to be attached to an object. The second face is provided inside the housing and is inclined with respect to the first face, the vibration sensor being attached thereto.

Abstract: The invention related to a microelectromechanical systems gyroscope, which comprises a plurality of sensing modules sensing angular velocities on tri-axes, a plurality of outer frames set at outside of the sensing modules, and a plurality of driving shafts set between the frames respectively. The driving shafts are connected with two adjacent frames by first and second flexible connecting elements, respectively, and the frames are connected with the sensing modules by a plurality of transporting units. Thus, tri-axes sensing is provided.

Abstract: A strain body according to an embodiment includes a central portion, an outer peripheral portion, connecting portions, strain sensors provided on main surfaces of the connecting portions, reference resistors provided on a main surface of the central portion, and constructing a bridge circuit with the strain sensors, an electrode for taking a detection signal of the bridge circuit, a lead wire making electric connection between the electrode and the outside, and an anisotropic conductive film provided between the electrode and the lead wire to make electric connection between a terminal of the electrode and a terminal of the lead wire.

Abstract: A sensor system according to an embodiment of the disclosure includes a physical quantity distribution generation source configured to generate a distribution of a physical quantity, and a plurality of sensor packages including respective sensor chips configured to detect the physical quantity. In a plane including the sensor packages, central positions of the respective sensor chips are shifted in directions from central positions of the respective sensor packages toward a central position of the distribution of the physical quantity, and distances from the central position of the distribution of the physical quantity to the central positions of the respective sensor chips of the respective sensor packages are substantially equal to each other.

Abstract: A test system for testing a wafer for integrated circuit devices is described. The test system comprises a first plurality of test probes adapted to make electrical contacts to first corresponding contacts of a wafer tested by the test system; a second plurality of test probes adapted to make electrical contacts to second corresponding contacts on a perimeter region of a portion of the wafer tested by the test system; and a control circuit coupled to the first plurality of test probes and the second plurality of test probes; wherein the control circuit determines whether the second plurality of test probes has a proper contact with the wafer based upon signals received by the second plurality of test probes. A method of testing a wafer for an integrated circuit is also described.

Abstract: Techniques for self-adjusting calibration of offset and sensitivity of a MEMS accelerometer are provided. In one example, a system comprises a first microelectromechanical (MEMS) sensor. The first MEMS sensor comprises: a proof mass coupled to an anchor connected to a reference plane, wherein the proof mass is coupled to the anchor via a first spring and a second spring; a plurality of reference paddles coupled to the anchor; and a plurality of acceleration sensing electrodes disposed on the reference plane, wherein a first area of each of the acceleration sensing electrodes is larger than a second area of each of a plurality of reference electrodes associated with the plurality of reference paddles.

Abstract: A road surface condition estimation device includes a tire side device and a vehicle side device. The tire side device includes a vibration detection unit attached to a back surface of a tire tread and outputting a detection signal indicating a tire vibration magnitude, a signal processing unit, and a transmitter. The signal processing unit extracts a ground contact duration during which a portion of the tread corresponding to an arrangement position of the vibration detection unit is in contact with a ground, and calculates a high frequency component level of the detection signal detected during the ground contact duration as road surface condition data. When the ground contact duration is ended, a transmission trigger is transmitted to the transmitter and the transmitter transmits the road surface condition data. The vehicle side device estimates a road surface condition of the travelling road based on the road surface condition data.

Abstract: The invention relates to an acceleration sensor, especially a duplex acceleration sensor, an arrangement and a method for detecting a loss of road grip of a vehicle wheel (3). The acceleration sensor comprises a tube (5) having a longitudinal axis forming a circular arc segment, and two closed ends. A mass (15; 315) is arranged inside the tube (5) such that is able to move inside the tube (5) in the longitudinal direction thereof. A magnet arrangement (17; 203; 205; 317) is designed to counteract, by way of a magnetic force exerted on the mass (15; 315), a movement of said mass (15; 315) from an idle position (25), and a read-out unit (608) is designed to detect a movement of said mass (15) from the idle position (25).

Abstract: A stress-detecting element includes a support body, a support film, a first piezoelectric element, first and second elastic parts. The support body has an opening part with first and second rectilinear sections extending parallel to each other. The support film blocks off the opening part. The first piezoelectric element straddles the first rectilinear section from an interior area to an exterior area of the opening part as seen in plan view. The first elastic part straddles the first rectilinear section from the interior area to the exterior area of the opening part. The second elastic part straddles the second rectilinear section from the interior area to the exterior area of the opening part. The first and second elastic parts respectively have first and second elastic end sections disposed in the interior area of the opening part and spaced apart from each other.

Abstract: A sensor system is described as including at least two micromechanical inertial sensors, which are movably connected to a substrate, each inertial sensor including a functional layer, the functional layers of the two inertial sensors varying in thickness, and the two inertial sensors being situated next to one another on the substrate.

Abstract: A method of calibrating an inertial unit having an inertial core with vibratory axisymmetric gyros, the method includes the steps of starting from a first position, causing the inertial core to pivot towards a second position about a pivot axis that is different from the sensing axes of the gyros and from a trisector thereof, while taking measurements of an angular orientation of the vibration of each gyro, the angular orientation being left free during pivoting; returning the inertial core to the first position; adjusting the angular orientation of the vibration of each gyro to a value corresponding to the second position; causing the inertial core to pivot towards the second position while once more taking measurements of the angular orientation of each gyro; and calibrating the inertial core as a function of the measurements taken.

Abstract: A MEMS acceleration sensor comprising: a frame, a plurality of proofmasses; a plurality of flexures; a plurality of hinges and a plurality of gauges. The frame, proofmasses, flexures, hinges and gauges designed to measure acceleration in a direction perpendicular to the device plane while being generally resistant to motions parallel to the device plane. The measurement of the acceleration is accomplished through the piezoresistive effect of the strain in the gauges.

Abstract: A pressure sensor 1 comprises a semiconductor substrate 10, insulating layers 21, 22, 23 formed on the semiconductor substrate 10, a semiconductor layer 30 formed on the semiconductor substrate 10 with the insulating layers 21, 23 intervening therebetween, and a cavity portion 13 provided between the semiconductor substrate 10 and the semiconductor layer 30. The portion of the semiconductor layer 30 which overlaps the cavity portion 13 as viewed in a lamination direction serves as a movable portion 31. The cavity portion 13 is surrounded by the insulating layers 22, 23. With this arrangement, the pressure sensor 1 can be manufactured easily with high precision.

Abstract: Deflection of a free end of one plate-like member, that is caused by uniform stress, is transmitted to an other plate-like member by moving a free end of the other plate-like member. According to this configuration, the uniform stress applied to the one plate-like member is converted into stress induced by a point force in the other plate-like member, and then, the induced stress is concentrated on a fixed end side narrow portion in which a piezoresistor is provided. Thus, a novel structure for a piezoresistive surface stress sensor having high sensitivity to uniform stress applied to the surface of the sensor is provided.

Abstract: A semiconductor device includes a semiconductor layer (2) and a dielectric stack (3) on the semiconductor layer. A plurality of etchant openings (24-1,2 . . . ) are formed through the dielectric stack (3) for passage of etchant for etching a plurality of overlapping sub-cavities (4-1,2 . . . ), respectively. The etchant is introduced through the etchant openings to etch a composite cavity (4) in the semiconductor layer by simultaneously etching the plurality of overlapping sub-cavities into the semiconductor layer.

Abstract: A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

Abstract: Disclosed herein is a piezoresistance sensor module including: a piezoresistor, a depletion layer formed in a region of a portion of the piezoresistor, an insulator formed to cover the depletion layer and one surface of the piezoresistor, and a piezoelectric capacitor formed on the insulator so as to be opposite to the depletion layer.

Abstract: An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2<L/I?2.82??Expression (1) I/W?3.

Abstract: The micro-mechanical device includes a substrate with an internal cavity, a first surface, and an opposing second surface. A first trench is formed from the first surface of the substrate into the internal cavity. The first trench at least partially defines flexures. A second trench is formed from the second surface of the substrate into the internal cavity and at least partially defines a suspended mass. The suspended mass is connected by the flexures to the substrate.

Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

Abstract: Disclosed herein is an acceleration sensor including: a mass; a flexible beam on which an electrode or a piezoresistive element is disposed and the mass is coupled; and a support part connecting to and supporting the flexible beam and having therein a stress isolating slit facing the mass, wherein the mass, the flexible beam and the support part are formed by coupling first and second substrates, wherein the first substrate has a first masking pattern formed thereon corresponding to the flexible beam, the mass and the support part and the second substrate has a second masking pattern formed thereon corresponding to the mass and the support part.

Abstract: Disclosed herein is an acceleration sensor including: a mass body part; a flexible beam having an electrode or a piezoresistor disposed thereon and having the mass body part coupled thereto; and a support part having the flexible beam connected thereto and supporting the flexible beam, wherein the mass body part, the flexible beam, and the support part are formed by coupling first and second substrates to each other, one surface of the first substrate is provided with a first masking pattern corresponding to the flexible beam, the mass body part, and the support part, and one surface of the second substrate is provided with a second masking pattern corresponding to the mass body part and the support part.

Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.

Abstract: Disclosed herein is a resistive type accelerator sensor, including: a sensor unit; and a continuous time sigma-delta ADC including an input unit which receives an analog input signal transferred from the sensor unit, an addition circuit which is coupled with the input unit to receive the analog input signal and an analog feedback signal transferred from DAC to provide a summed signal, an integrator which integrates the summed signal transferred from the addition circuit, a comparator which converts an integrated signal transferred from the integrator into a digital signal, and an output unit which transfers the digital output signal.

Abstract: Disclosed herein is an inertial sensor including: a flexible part; a mass body connected to the flexible part; and a support part connected to the flexible part and supporting the mass body in a floated state to displace the mass body, wherein the flexible part has an upper piezoresistor disposed on one surface thereof and a lower piezoresistor disposed on the other surface thereof to detect a displacement of the mass body.

Abstract: Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125. An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.

Abstract: Disclosed herein is a circuit for measuring acceleration of a three-axis acceleration sensor. The circuit for measuring acceleration of a three-axis acceleration sensor includes: three-axis acceleration sensors connected to one another in parallel and sensing the respective accelerations applied to three axes directions of X, Y, and Z axes to output corresponding signals; a demultiplexer outputting three axes signals each output from the three-axis acceleration sensors through a single path; and an amplifier amplifying the output signal from the demultiplexer, and further includes, at a back-end of the amplifier, a multiplexer distributing a signal output from the amplifier to the respective axes, a sample and hold circuit unit sampling and storing an analog signal of each axis output from the multiplexer, and an analog-to-digital converter converting an analog signal output from the amplifier into a digital signal.

Abstract: An acceleration sensor includes a weight, a supporting portion arranged so as to face the weight, beams configured to be flexible and connect the weight and the supporting portion, and piezoresistive elements disposed at the beams, wherein the weight oscillates in a pendulum motion while using center portions of the beams as fulcrums.

Abstract: MEMS devices fabricated using inexpensive substrate materials such as paper or fabric, are provided. Using paper as a substrate, low cost, simple to prepare, lightweight, disposable piezoresistive sensors, including accelerometers are prepared. Signal-processing circuitry can also be patterned on the substrate material. The sensors can be utilized as two-dimensional sensors, or the paper substrate material can be folded to arrange the sensors in a three dimensional conformation. For example, three sensors can be patterned on a paper substrate and folded into a cube such that the three sensors are orthogonally positioned on the faces of a cube, permitting simultaneous measurement of accelerations along three orthogonal directions (x-y-z). These paper-based sensors can be mass produced by incorporating highly developed technologies for automatic paper cutting, folding, and screen-printing. Also provided are methods of modifying paper for use as a substrate material in MEMS devices.

Abstract: The acceleration sensor according to the present invention includes a circuit chip having a prescribed circuit built into a front surface thereof; a sensor chip bonded to the front surface of the circuit chip; and a resin package for sealing the circuit chip and the sensor chip, while the sensor chip includes: a membrane arranged to oppose to the front surface of the circuit chip and having a plurality of openings; a piezoresistor formed on a surface of the membrane opposed to the circuit chip; a support section provided on a side opposite to the circuit chip with respect to the membrane and supporting a peripheral edge portion of the membrane; and a weight section provided on the side opposite to the circuit chip with respect to the membrane and integrally held on a central portion of the membrane.

Abstract: An analysis circuit for a field effect transistor having a displaceable gate structure, includes a measurement circuit coupled between a supply voltage connection of the analysis circuit and a drain connection of the field effect transistor and configured to output a measurement signal that is dependent on the current strength of a current flowing through the field effect transistor to a measurement connection.

Abstract: Disclosed herein is an accelerator sensor, including: a mass body; a flexible beam that is provided with a piezoresistive element configured of an X-axis resistive element, a Y-axis resistive element, and a Z-axis resistive element having both ends connected with contact pads and is connected with the mass body; and a support portion that is connected with the flexible beam and supports the flexible beam so as to float the mass body, wherein the flexible beam has a slit provided between one-axis resistive element and the other axis resistive element adjacent to each other and the slit is extendedly formed from the contact pads connected with ends of the one axis resistive element and the other axis resistive element to the contact pads connected with the other ends thereof.

Abstract: An acceleration sensor includes an outer frame body, a heating element, a first temperature sensing element for temperature measurement and a second temperature sensing element for temperature measurement, and an operational amplifier. In the outer frame body, a fluid chamber capable of sealing a fluid inside thereof is formed. The heating element is formed on a circuit mounting surface which is a specific inner wall surface of a plurality of inner wall surfaces defining the fluid chamber. The first temperature sensing element and the second temperature sensing element are formed on the circuit mounting surface. The distance from the first temperature sensing element to the heating element is shorter than the distance from the second temperature sensing element to the heating element. The operational amplifier calculates a difference between a measurement result by the first temperature sensing element and a measurement result by the second temperature sensing element.

Abstract: A dynamic sensor includes a weight having an H shape in a plan view. The weight includes a first weight portion and a second weight portion which have substantially rectangular parallelepiped shapes and are aligned in a short side direction at an interval and a bridge portion which connects the first and second weight portions and extends in the aligned direction. The bridge portion connects the first and second weight portions at an approximate center thereof in a long side direction. Supports are located in a region between the first and second weight portions where the bridge portion is not provided. The first weight portion is connected to a first support via a first beam and to a second support via a second beam. The second weight portion is connected to the first support via a third beam and to the second support via a fourth beam.

Abstract: An acceleration sensor with improved impact resistance includes a beam portion connected to a supporting portion at a base side and connected to a weight portion at a top side. The beam portion has a T-shaped cross-section, and piezoresistors are located on an upper surface of the beam portion. The weight portion connects to a top of the beam portion and is arranged inside the supporting portion. A C-shaped slit is provided between the weight portion and the supporting portion so as to surround the weight portion. The weight portion includes an extended portion in which an end of a top surface layer on a side facing the beam portion extends out toward the beam portion beyond an end of the supporting substrate layer on a side facing the beam portion.

Abstract: The transparent photodetector includes a substrate; a waveguide on the substrate; a displaceable structure that can be displaced with respect to the substrate, the displaceable structure in proximity to the waveguide; and a silicon nanowire array suspended with respect to the substrate and mechanically linked to the displaceable structure, the silicon nanowire array comprising a plurality of silicon nanowires having piezoresistance. In operation, a light source propagating through the waveguide results in an optical force on the displaceable structure which further results in a strain on the nanowires to cause a change in electrical resistance of the nanowires. The substrate may be a semiconductor on insulator substrate.

Abstract: Methods and apparatuses are disclosed that assist in sensing underwater signals in connection with geophysical surveys. One embodiment relates to a transducer including a cantilever coupled to a base. The cantilever may include a beam and a first coupling surface angularly oriented from the beam, and the base may include a second coupling surface angularly oriented from the beam and substantially parallel to the first coupling surface of the cantilever. The transducer may further include a sensing material coupled between the first coupling surface of the cantilever and the second coupling surface of the base.

Abstract: A piezo-resistive MEMS resonator comprising an anchor, a resonator mounted on the anchor, an actuator mounted to apply an electrostatic force on the resonator and a piezo-resistive read-out means comprising a nanowire coupled to the resonator.

Abstract: There is provided an acceleration sensor including: a weight portion; plural fixed portions formed above a bottom plate around a periphery of the weight portion; a beam portion coupling the fixed portions and the weight portion, and holding the weight portion at a position separated from the bottom plate; a detection portion provided at the beam portion and detecting deformation of the beam portion; a frame portion provided so as to project out from the bottom plate and surround the fixed portions at a position separated from the fixed portions; and a lid portion of plate shape that seals an opening of the frame portion.

Abstract: The micro-mechanical device includes a substrate with an internal cavity, a first surface, and an opposing second surface. A first trench is formed from the first surface of the substrate into the internal cavity. The first trench at least partially defines flexures. A second trench is formed from the second surface of the substrate into the internal cavity and at least partially defines a suspended mass. The suspended mass is connected by the flexures to the substrate.

Abstract: An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.

Abstract: A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element.