Resistive Sensor Patents (Class 73/514.33)
  • Patent number: 10859405
    Abstract: A sensor system according to an embodiment of the disclosure includes a physical quantity distribution generation source configured to generate a distribution of a physical quantity, and a plurality of sensor packages including respective sensor chips configured to detect the physical quantity. In a plane including the sensor packages, central positions of the respective sensor chips are shifted in directions from central positions of the respective sensor packages toward a central position of the distribution of the physical quantity, and distances from the central position of the distribution of the physical quantity to the central positions of the respective sensor chips of the respective sensor packages are substantially equal to each other.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: December 8, 2020
    Assignee: TDK CORPORATION
    Inventors: Naoki Ohta, Yoshiyuki Mizoguchi
  • Patent number: 10823759
    Abstract: A test system for testing a wafer for integrated circuit devices is described. The test system comprises a first plurality of test probes adapted to make electrical contacts to first corresponding contacts of a wafer tested by the test system; a second plurality of test probes adapted to make electrical contacts to second corresponding contacts on a perimeter region of a portion of the wafer tested by the test system; and a control circuit coupled to the first plurality of test probes and the second plurality of test probes; wherein the control circuit determines whether the second plurality of test probes has a proper contact with the wafer based upon signals received by the second plurality of test probes. A method of testing a wafer for an integrated circuit is also described.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: November 3, 2020
    Assignee: XILINX, INC.
    Inventors: Lik Huay Lim, Andy Widjaja, King Yon Lew, Mohsen H. Mardi, Xuejing Che
  • Patent number: 10649002
    Abstract: Techniques for self-adjusting calibration of offset and sensitivity of a MEMS accelerometer are provided. In one example, a system comprises a first microelectromechanical (MEMS) sensor. The first MEMS sensor comprises: a proof mass coupled to an anchor connected to a reference plane, wherein the proof mass is coupled to the anchor via a first spring and a second spring; a plurality of reference paddles coupled to the anchor; and a plurality of acceleration sensing electrodes disposed on the reference plane, wherein a first area of each of the acceleration sensing electrodes is larger than a second area of each of a plurality of reference electrodes associated with the plurality of reference paddles.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: May 12, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Matthew Julian Thompson, Joseph Seeger, Sarah Nitzan
  • Patent number: 10099699
    Abstract: A road surface condition estimation device includes a tire side device and a vehicle side device. The tire side device includes a vibration detection unit attached to a back surface of a tire tread and outputting a detection signal indicating a tire vibration magnitude, a signal processing unit, and a transmitter. The signal processing unit extracts a ground contact duration during which a portion of the tread corresponding to an arrangement position of the vibration detection unit is in contact with a ground, and calculates a high frequency component level of the detection signal detected during the ground contact duration as road surface condition data. When the ground contact duration is ended, a transmission trigger is transmitted to the transmitter and the transmitter transmits the road surface condition data. The vehicle side device estimates a road surface condition of the travelling road based on the road surface condition data.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: October 16, 2018
    Assignee: DENSO CORPORATION
    Inventors: Youichirou Suzuki, Akira Takaoka, Takashi Saitou, Nobuya Watabe, Masashi Mori, Takatoshi Sekizawa
  • Patent number: 9989554
    Abstract: The invention relates to an acceleration sensor, especially a duplex acceleration sensor, an arrangement and a method for detecting a loss of road grip of a vehicle wheel (3). The acceleration sensor comprises a tube (5) having a longitudinal axis forming a circular arc segment, and two closed ends. A mass (15; 315) is arranged inside the tube (5) such that is able to move inside the tube (5) in the longitudinal direction thereof. A magnet arrangement (17; 203; 205; 317) is designed to counteract, by way of a magnetic force exerted on the mass (15; 315), a movement of said mass (15; 315) from an idle position (25), and a read-out unit (608) is designed to detect a movement of said mass (15) from the idle position (25).
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: June 5, 2018
    Assignee: Bert Grundmann
    Inventor: Bert Grundmann
  • Patent number: 9851266
    Abstract: A stress-detecting element includes a support body, a support film, a first piezoelectric element, first and second elastic parts. The support body has an opening part with first and second rectilinear sections extending parallel to each other. The support film blocks off the opening part. The first piezoelectric element straddles the first rectilinear section from an interior area to an exterior area of the opening part as seen in plan view. The first elastic part straddles the first rectilinear section from the interior area to the exterior area of the opening part. The second elastic part straddles the second rectilinear section from the interior area to the exterior area of the opening part. The first and second elastic parts respectively have first and second elastic end sections disposed in the interior area of the opening part and spaced apart from each other.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: December 26, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Tsutomu Nishiwaki
  • Patent number: 9817021
    Abstract: A sensor system is described as including at least two micromechanical inertial sensors, which are movably connected to a substrate, each inertial sensor including a functional layer, the functional layers of the two inertial sensors varying in thickness, and the two inertial sensors being situated next to one another on the substrate.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: November 14, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Daniel Christoph Meisel, Thomas Kathmann
  • Patent number: 9671248
    Abstract: A method of calibrating an inertial unit having an inertial core with vibratory axisymmetric gyros, the method includes the steps of starting from a first position, causing the inertial core to pivot towards a second position about a pivot axis that is different from the sensing axes of the gyros and from a trisector thereof, while taking measurements of an angular orientation of the vibration of each gyro, the angular orientation being left free during pivoting; returning the inertial core to the first position; adjusting the angular orientation of the vibration of each gyro to a value corresponding to the second position; causing the inertial core to pivot towards the second position while once more taking measurements of the angular orientation of each gyro; and calibrating the inertial core as a function of the measurements taken.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: June 6, 2017
    Assignee: Sagem Defense Securite
    Inventor: Erwan Salaun
  • Patent number: 9625486
    Abstract: A MEMS acceleration sensor comprising: a frame, a plurality of proofmasses; a plurality of flexures; a plurality of hinges and a plurality of gauges. The frame, proofmasses, flexures, hinges and gauges designed to measure acceleration in a direction perpendicular to the device plane while being generally resistant to motions parallel to the device plane. The measurement of the acceleration is accomplished through the piezoresistive effect of the strain in the gauges.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: April 18, 2017
    Assignee: MEGGITT (ORANGE COUNTY), INC.
    Inventor: Tom Kwa
  • Patent number: 9341529
    Abstract: A pressure sensor 1 comprises a semiconductor substrate 10, insulating layers 21, 22, 23 formed on the semiconductor substrate 10, a semiconductor layer 30 formed on the semiconductor substrate 10 with the insulating layers 21, 23 intervening therebetween, and a cavity portion 13 provided between the semiconductor substrate 10 and the semiconductor layer 30. The portion of the semiconductor layer 30 which overlaps the cavity portion 13 as viewed in a lamination direction serves as a movable portion 31. The cavity portion 13 is surrounded by the insulating layers 22, 23. With this arrangement, the pressure sensor 1 can be manufactured easily with high precision.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: May 17, 2016
    Assignee: ROHM CO., LTD
    Inventors: Haruhiko Nishikage, Toma Fujita
  • Patent number: 9212959
    Abstract: Deflection of a free end of one plate-like member, that is caused by uniform stress, is transmitted to an other plate-like member by moving a free end of the other plate-like member. According to this configuration, the uniform stress applied to the one plate-like member is converted into stress induced by a point force in the other plate-like member, and then, the induced stress is concentrated on a fixed end side narrow portion in which a piezoresistor is provided. Thus, a novel structure for a piezoresistive surface stress sensor having high sensitivity to uniform stress applied to the surface of the sensor is provided.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: December 15, 2015
    Assignee: National Institute for Materials Science
    Inventors: Genki Yoshikawa, Heinrich Rohrer, Terunobu Akiyama, Vettiger Peter
  • Patent number: 9157807
    Abstract: A semiconductor device includes a semiconductor layer (2) and a dielectric stack (3) on the semiconductor layer. A plurality of etchant openings (24-1,2 . . . ) are formed through the dielectric stack (3) for passage of etchant for etching a plurality of overlapping sub-cavities (4-1,2 . . . ), respectively. The etchant is introduced through the etchant openings to etch a composite cavity (4) in the semiconductor layer by simultaneously etching the plurality of overlapping sub-cavities into the semiconductor layer.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: October 13, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Walter B. Meinel, Kalin V. Lazarov, Brian E. Goodlin
  • Patent number: 9110090
    Abstract: A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: August 18, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Reinhard Neul, Christian Rettig, Achim Trautmann, Daniel Christoph Meisel, Alexander Buhmann, Manuel Engesser, Ando Feyh
  • Publication number: 20150107359
    Abstract: Disclosed herein is a piezoresistance sensor module including: a piezoresistor, a depletion layer formed in a region of a portion of the piezoresistor, an insulator formed to cover the depletion layer and one surface of the piezoresistor, and a piezoelectric capacitor formed on the insulator so as to be opposite to the depletion layer.
    Type: Application
    Filed: September 28, 2014
    Publication date: April 23, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Suong YANG, Je Hong Kyoung, Ho Phil Jung, Hyung Jae Park, Dong Hyun Park
  • Patent number: 8997570
    Abstract: An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2<L/I?2.82??Expression (1) I/W?3.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: April 7, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Shinji Maekawa
  • Patent number: 8984942
    Abstract: The micro-mechanical device includes a substrate with an internal cavity, a first surface, and an opposing second surface. A first trench is formed from the first surface of the substrate into the internal cavity. The first trench at least partially defines flexures. A second trench is formed from the second surface of the substrate into the internal cavity and at least partially defines a suspended mass. The suspended mass is connected by the flexures to the substrate.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: March 24, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Brian D. Homeijer
  • Patent number: 8973438
    Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: March 10, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Sung Jun Lee, Won Kyu Jeung, Min Kyu Choi, Heung Woo Park
  • Publication number: 20150059476
    Abstract: Disclosed herein is an acceleration sensor including: a mass body part; a flexible beam having an electrode or a piezoresistor disposed thereon and having the mass body part coupled thereto; and a support part having the flexible beam connected thereto and supporting the flexible beam, wherein the mass body part, the flexible beam, and the support part are formed by coupling first and second substrates to each other, one surface of the first substrate is provided with a first masking pattern corresponding to the flexible beam, the mass body part, and the support part, and one surface of the second substrate is provided with a second masking pattern corresponding to the mass body part and the support part.
    Type: Application
    Filed: August 14, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woon Kim, Tae Yoon Kim, Seung Mo Lim
  • Publication number: 20150059477
    Abstract: Disclosed herein is an acceleration sensor including: a mass; a flexible beam on which an electrode or a piezoresistive element is disposed and the mass is coupled; and a support part connecting to and supporting the flexible beam and having therein a stress isolating slit facing the mass, wherein the mass, the flexible beam and the support part are formed by coupling first and second substrates, wherein the first substrate has a first masking pattern formed thereon corresponding to the flexible beam, the mass and the support part and the second substrate has a second masking pattern formed thereon corresponding to the mass and the support part.
    Type: Application
    Filed: August 18, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woon Kim, Sung Jun Lee, Chang Hyun Lim
  • Patent number: 8950258
    Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 10, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Reinhard Neul, Torsten Ohms, Mirko Hattass, Daniel Christoph Meisel
  • Publication number: 20150020592
    Abstract: Disclosed herein is a resistive type accelerator sensor, including: a sensor unit; and a continuous time sigma-delta ADC including an input unit which receives an analog input signal transferred from the sensor unit, an addition circuit which is coupled with the input unit to receive the analog input signal and an analog feedback signal transferred from DAC to provide a summed signal, an integrator which integrates the summed signal transferred from the addition circuit, a comparator which converts an integrated signal transferred from the integrator into a digital signal, and an output unit which transfers the digital output signal.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 22, 2015
    Inventors: Young Kil CHOI, Seung Chul PYO, Jun Kyung NA, Sung Tae KIM, Chang Hyun KIM
  • Publication number: 20150007657
    Abstract: Disclosed herein is an inertial sensor including: a flexible part; a mass body connected to the flexible part; and a support part connected to the flexible part and supporting the mass body in a floated state to displace the mass body, wherein the flexible part has an upper piezoresistor disposed on one surface thereof and a lower piezoresistor disposed on the other surface thereof to detect a displacement of the mass body.
    Type: Application
    Filed: March 10, 2014
    Publication date: January 8, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hun HAN, Jeong Suong YANG, Sung Jun LEE, Chang Hyun LIM
  • Patent number: 8887569
    Abstract: Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125. An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: November 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Won Kyu Jeung
  • Publication number: 20140305212
    Abstract: Disclosed herein is a circuit for measuring acceleration of a three-axis acceleration sensor. The circuit for measuring acceleration of a three-axis acceleration sensor includes: three-axis acceleration sensors connected to one another in parallel and sensing the respective accelerations applied to three axes directions of X, Y, and Z axes to output corresponding signals; a demultiplexer outputting three axes signals each output from the three-axis acceleration sensors through a single path; and an amplifier amplifying the output signal from the demultiplexer, and further includes, at a back-end of the amplifier, a multiplexer distributing a signal output from the amplifier to the respective axes, a sample and hold circuit unit sampling and storing an analog signal of each axis output from the multiplexer, and an analog-to-digital converter converting an analog signal output from the amplifier into a digital signal.
    Type: Application
    Filed: October 3, 2013
    Publication date: October 16, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Chang Hyun KIM
  • Publication number: 20140283606
    Abstract: An acceleration sensor includes a weight, a supporting portion arranged so as to face the weight, beams configured to be flexible and connect the weight and the supporting portion, and piezoresistive elements disposed at the beams, wherein the weight oscillates in a pendulum motion while using center portions of the beams as fulcrums.
    Type: Application
    Filed: June 11, 2014
    Publication date: September 25, 2014
    Inventor: Hiroshi HAMAMURA
  • Publication number: 20140224018
    Abstract: MEMS devices fabricated using inexpensive substrate materials such as paper or fabric, are provided. Using paper as a substrate, low cost, simple to prepare, lightweight, disposable piezoresistive sensors, including accelerometers are prepared. Signal-processing circuitry can also be patterned on the substrate material. The sensors can be utilized as two-dimensional sensors, or the paper substrate material can be folded to arrange the sensors in a three dimensional conformation. For example, three sensors can be patterned on a paper substrate and folded into a cube such that the three sensors are orthogonally positioned on the faces of a cube, permitting simultaneous measurement of accelerations along three orthogonal directions (x-y-z). These paper-based sensors can be mass produced by incorporating highly developed technologies for automatic paper cutting, folding, and screen-printing. Also provided are methods of modifying paper for use as a substrate material in MEMS devices.
    Type: Application
    Filed: July 25, 2012
    Publication date: August 14, 2014
    Inventors: George Whitesides, Xinyu Liu, XiuJun Li, Martin M. Thuo, Michael O'Brien, Yu Sun
  • Patent number: 8776602
    Abstract: The acceleration sensor according to the present invention includes a circuit chip having a prescribed circuit built into a front surface thereof; a sensor chip bonded to the front surface of the circuit chip; and a resin package for sealing the circuit chip and the sensor chip, while the sensor chip includes: a membrane arranged to oppose to the front surface of the circuit chip and having a plurality of openings; a piezoresistor formed on a surface of the membrane opposed to the circuit chip; a support section provided on a side opposite to the circuit chip with respect to the membrane and supporting a peripheral edge portion of the membrane; and a weight section provided on the side opposite to the circuit chip with respect to the membrane and integrally held on a central portion of the membrane.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: July 15, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Goro Nakatani, Yasuhiro Fuwa, Mizuho Okada
  • Publication number: 20140165725
    Abstract: An analysis circuit for a field effect transistor having a displaceable gate structure, includes a measurement circuit coupled between a supply voltage connection of the analysis circuit and a drain connection of the field effect transistor and configured to output a measurement signal that is dependent on the current strength of a current flowing through the field effect transistor to a measurement connection.
    Type: Application
    Filed: March 12, 2012
    Publication date: June 19, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Alexander Buhmann, Fabian Henrici
  • Publication number: 20140144236
    Abstract: Disclosed herein is an accelerator sensor, including: a mass body; a flexible beam that is provided with a piezoresistive element configured of an X-axis resistive element, a Y-axis resistive element, and a Z-axis resistive element having both ends connected with contact pads and is connected with the mass body; and a support portion that is connected with the flexible beam and supports the flexible beam so as to float the mass body, wherein the flexible beam has a slit provided between one-axis resistive element and the other axis resistive element adjacent to each other and the slit is extendedly formed from the contact pads connected with ends of the one axis resistive element and the other axis resistive element to the contact pads connected with the other ends thereof.
    Type: Application
    Filed: March 18, 2013
    Publication date: May 29, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun Lim, Seung Hun Han, Jung Won Lee, Sung Jun Lee, Jeong Suong Yang
  • Publication number: 20140060187
    Abstract: An acceleration sensor includes an outer frame body, a heating element, a first temperature sensing element for temperature measurement and a second temperature sensing element for temperature measurement, and an operational amplifier. In the outer frame body, a fluid chamber capable of sealing a fluid inside thereof is formed. The heating element is formed on a circuit mounting surface which is a specific inner wall surface of a plurality of inner wall surfaces defining the fluid chamber. The first temperature sensing element and the second temperature sensing element are formed on the circuit mounting surface. The distance from the first temperature sensing element to the heating element is shorter than the distance from the second temperature sensing element to the heating element. The operational amplifier calculates a difference between a measurement result by the first temperature sensing element and a measurement result by the second temperature sensing element.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 6, 2014
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: Akira TANABE
  • Publication number: 20140000368
    Abstract: A dynamic sensor includes a weight having an H shape in a plan view. The weight includes a first weight portion and a second weight portion which have substantially rectangular parallelepiped shapes and are aligned in a short side direction at an interval and a bridge portion which connects the first and second weight portions and extends in the aligned direction. The bridge portion connects the first and second weight portions at an approximate center thereof in a long side direction. Supports are located in a region between the first and second weight portions where the bridge portion is not provided. The first weight portion is connected to a first support via a first beam and to a second support via a second beam. The second weight portion is connected to the first support via a third beam and to the second support via a fourth beam.
    Type: Application
    Filed: December 14, 2012
    Publication date: January 2, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130340527
    Abstract: An acceleration sensor with improved impact resistance includes a beam portion connected to a supporting portion at a base side and connected to a weight portion at a top side. The beam portion has a T-shaped cross-section, and piezoresistors are located on an upper surface of the beam portion. The weight portion connects to a top of the beam portion and is arranged inside the supporting portion. A C-shaped slit is provided between the weight portion and the supporting portion so as to surround the weight portion. The weight portion includes an extended portion in which an end of a top surface layer on a side facing the beam portion extends out toward the beam portion beyond an end of the supporting substrate layer on a side facing the beam portion.
    Type: Application
    Filed: December 4, 2012
    Publication date: December 26, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Murata Manufacturing Co., Ltd.
  • Patent number: 8604574
    Abstract: The transparent photodetector includes a substrate; a waveguide on the substrate; a displaceable structure that can be displaced with respect to the substrate, the displaceable structure in proximity to the waveguide; and a silicon nanowire array suspended with respect to the substrate and mechanically linked to the displaceable structure, the silicon nanowire array comprising a plurality of silicon nanowires having piezoresistance. In operation, a light source propagating through the waveguide results in an optical force on the displaceable structure which further results in a strain on the nanowires to cause a change in electrical resistance of the nanowires. The substrate may be a semiconductor on insulator substrate.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: December 10, 2013
    Assignee: International Business Machines Corporation
    Inventor: Tymon Barwicz
  • Publication number: 20130312522
    Abstract: Methods and apparatuses are disclosed that assist in sensing underwater signals in connection with geophysical surveys. One embodiment relates to a transducer including a cantilever coupled to a base. The cantilever may include a beam and a first coupling surface angularly oriented from the beam, and the base may include a second coupling surface angularly oriented from the beam and substantially parallel to the first coupling surface of the cantilever. The transducer may further include a sensing material coupled between the first coupling surface of the cantilever and the second coupling surface of the base.
    Type: Application
    Filed: February 7, 2012
    Publication date: November 28, 2013
    Applicant: ION Geophysical Corporation
    Inventor: Ken Kan Deng
  • Patent number: 8569934
    Abstract: A piezo-resistive MEMS resonator comprising an anchor, a resonator mounted on the anchor, an actuator mounted to apply an electrostatic force on the resonator and a piezo-resistive read-out means comprising a nanowire coupled to the resonator.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: October 29, 2013
    Assignee: NXP B.V.
    Inventors: Gerhard Koops, Jozef Thomas Martinus van Beek
  • Patent number: 8522613
    Abstract: There is provided an acceleration sensor including: a weight portion; plural fixed portions formed above a bottom plate around a periphery of the weight portion; a beam portion coupling the fixed portions and the weight portion, and holding the weight portion at a position separated from the bottom plate; a detection portion provided at the beam portion and detecting deformation of the beam portion; a frame portion provided so as to project out from the bottom plate and surround the fixed portions at a position separated from the fixed portions; and a lid portion of plate shape that seals an opening of the frame portion.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: September 3, 2013
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Takeharu Suzuki
  • Publication number: 20130205901
    Abstract: The micro-mechanical device includes a substrate with an internal cavity, a first surface, and an opposing second surface. A first trench is formed from the first surface of the substrate into the internal cavity. The first trench at least partially defines flexures. A second trench is formed from the second surface of the substrate into the internal cavity and at least partially defines a suspended mass. The suspended mass is connected by the flexures to the substrate.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Inventor: Brian D. Homeijer
  • Patent number: 8474318
    Abstract: An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: July 2, 2013
    Assignee: Hitachi Metals, Ltd.
    Inventors: Atsushi Kazama, Masakatsu Saitoh, Ryoji Okada, Takanori Aono
  • Patent number: 8468888
    Abstract: A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: June 25, 2013
    Assignees: Domintech Co., Ltd.
    Inventors: Ming-Ching Wu, Chih-Kung Huang, Jeff Biar, Kazuhiro Okada
  • Publication number: 20130133426
    Abstract: Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element.
    Type: Application
    Filed: August 22, 2012
    Publication date: May 30, 2013
    Applicant: SAMSUNG ELECTRON-MECHANICS CO., LTD.
    Inventors: Jung Tae PARK, Seung Heon HAN, Jong Woon KIM, Heung Woo PARK, Jung Won LEE, Jung Eun NOH, Won Kyu JEUNG, Sung Jun LEE
  • Patent number: 8418558
    Abstract: A covered acceleration sensor element includes a support frame portion surrounding a weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion, and piezoresistance elements provided on the beam portions. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. The support frame portion is separated by separation grooves into an inner frame and an outer frame. The plurality of inner frame support portions has flexibility. The beam portions are connected to both sides of the weight portion along the second axis and the third axis. The inner frame support portions are connected to both sides of the inner frame in a direction in which they are rotated nearly 45 degrees from the second axis and the third axis.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: April 16, 2013
    Assignee: Torex Semiconductor Ltd.
    Inventors: Atsushi Kazama, Masakatsu Saitoh, Ryoji Okada, Yasuhiro Hamaguchi
  • Publication number: 20130061675
    Abstract: Disclosed herein are an acceleration measuring apparatus and an acceleration measuring method. The acceleration measuring apparatus includes: an acceleration sensor including a first output terminal and a second output terminal; a first switch of which an end is connected to the first output terminal; a second switch of which an end is connected to the second output terminal; a first resistor of which an end is connected to the other end of the first switch; a second resistor of which an end is connected to the other end of the second switch; a logic element connected to the end of the first resistor and the end of the second resistor; and a Time-to-Digital Convertor (TDC) converting a signal output from the logic element into a digital value.
    Type: Application
    Filed: August 27, 2012
    Publication date: March 14, 2013
    Inventors: Sung Tae Kim, Chang Hyun Kim
  • Patent number: 8387459
    Abstract: The MEMS sensor according to the present invention includes: a substrate; a supporting portion provided on one surface of the substrate; a beam, supported by the supporting portion, having a movable portion opposed to the surface of the substrate through a space; a resistor formed on at least the movable portion of the beam; a weight arranged on a side of the beam opposite to the substrate; and a coupling portion, made of a metallic material, coupling the beam and the weight with each other.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: March 5, 2013
    Assignee: Rohm Co., Ltd.
    Inventor: Goro Nakatani
  • Patent number: 8387458
    Abstract: The invention provides a sensor comprising a frame, a plurality of beams extending inwardly from said frame, a weight portion supported by the beams, a piezoelectric-resistor formed on each beam and an insulating layer that covers the piezoelectric-resistor. The piezoelectric-resistor has at least one bend, and a metal wiring is located on the insulting layer positioned at the bend. The metal wiring is connected to the bend via at least two contact holes formed in the insulating layer. Contact holes are formed in the insulating layer positioned at both ends of the piezoelectric-resistor, and a bridge circuit wiring is connected to the piezoelectric-resistor via the contact holes.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: March 5, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhiko Aida, Katsumi Hashimoto, Toshiaki Mori
  • Publication number: 20130042687
    Abstract: A piezoresistive transducer is disclosed having a framework including a support element attached to a bending element that undergoes a deformation relative to the support element when a force acts on the bending element including a neutral fiber whose length does not change during the deformation. At least one piezoresistive expansion body is attached to the support element that exhibits a piezoresistive material and converts the deformation of the bending element into an electrically detectable change in resistance.
    Type: Application
    Filed: February 28, 2011
    Publication date: February 21, 2013
    Inventors: Robert K├╝lls, Siegfried Nau
  • Patent number: 8302285
    Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: November 6, 2012
    Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.
    Inventors: Yoshitaka Sasaki, Tatsushi Shimizu, Takehiro Horinaka, Kazuo Ishizaki, Shigeki Tanemura
  • Publication number: 20120255358
    Abstract: An acceleration sensor includes a frame, a weight portion, an arm portion for connecting the frame and the weight portion, and a sensing portion for detecting a bend of the arm portion. The sensing portion includes a first electrode portion, a second electrode portion, and a strain resistor portion. The first electrode portion and the second electrode portion are provided on the weight portion. A first end of the strain resistor portion is connected to the first electrode portion, and a second end of the strain resistor portion is connected to the second electrode portion. The strain resistor portion is formed of a strain resistor film comprising a metal oxide. The strain resistor portion is formed in meander shape in the part which is nearer to the weight portion than the frame in the arm portion.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 11, 2012
    Applicant: Panasonic Corporation
    Inventor: Takashi IMANAKA
  • Patent number: 8276449
    Abstract: The acceleration sensor according to the present invention includes a sensor chip having a movable portion operating in response to a change in a physical quantity and a silicon chip arranged to be opposed to a first side of the sensor chip and bonded to the sensor chip, while the sensor chip is provided with a penetrating portion penetrating the sensor chip in the thickness direction so that the first side is visually recognizable from a second side of the sensor chip, and the silicon chip is provided with an alignment mark on a portion opposed to the penetrating portion.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: October 2, 2012
    Assignee: Rohm Co., Ltd.
    Inventor: Goro Nakatani
  • Patent number: 8230577
    Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: July 31, 2012
    Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.
    Inventors: Yoshitaka Sasaki, Tatsushi Shimizu, Takehiro Horinaka, Kazuo Ishizaki, Shigeki Tanemura
  • Publication number: 20120152020
    Abstract: Disclosed herein is an inertial sensor. There is provided an inertial sensor 100, including: a plate-like substrate layer 110, a mass body 130, a post 140, a support part 150 extending in the central direction of the mass body 130 from the post 140, and a detection unit 170 detecting the displacement of the displacement part 113. The inertial sensor adopts the support part 150 limiting the downward displacement of the mass body 130 to prevent the support portion of the mass body 130 from being damaged.
    Type: Application
    Filed: June 21, 2011
    Publication date: June 21, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woon Kim, Liwei Lin, Minyao Mao, Heung Woo Park