Capacitive Patents (Class 73/718)
  • Patent number: 10896032
    Abstract: A method for certifying and deploying instruction code includes communicating, from a developer system, a first record to a decentralized database that indicates an availability of the instruction code. A second record is received by the developer system from the decentralized database and indicates a request to certify the instruction code, the second request having been communicated by a certification system. In response to receipt of the second record the developer system communicates a third record to the decentralized database that authorizes the certification system to retrieve the instruction code from the developer system. The developer system subsequently communicates the instruction code to the certification system. Communication of the instruction code facilitates execution of the instruction code on the certification system to thereby certify functionality of the instruction code.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: January 19, 2021
    Assignee: ACCENTURE GLOBAL SOLUTIONS, LIMITED
    Inventors: Michael Thomas Giba, Teresa Sheausan Tung, Jean-Luc Chatelain, Ishmeet Singh Grewal
  • Patent number: 10876910
    Abstract: A sealed force-sensitive resistor is provided. The sealed force-sensitive resistor includes: a bottom layer; a first conductive element attached to the bottom layer and a top layer. The top layer is sealed to the bottom layer in an airtight manner. The force-sensitive resistor further comprises a spacer ring surrounding the first conductive element and a flexible top sensor layer. The top sensor layer is attached across the spacer ring and comprises a second conductive element facing the first conductive element. The flexible top sensor layer is moveable in use in relation to the flexible bottom layer to vary the resistance of the force sensitive resistor. The force-sensitive resistor further comprises an air permeable spacer material between the top and bottom layer.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: December 29, 2020
    Assignee: NURVV LIMITED
    Inventors: Kemal Dervish, Haim Geva, Jason Lloyd Roberts, Giles Tongue, Grant Trewartha
  • Patent number: 10854580
    Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Patent number: 10816422
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 27, 2020
    Assignee: InvenSense, Inc.
    Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Patent number: 10752498
    Abstract: A method for manufacturing a micromechanical component including a substrate and a cap which is joined to the substrate, and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. In a first step, an access opening connecting the first cavity to surroundings of the micromechanical component being formed in the substrate or in the cap. In a second step, the first pressure and/or the first chemical composition in the first cavity being set. In a third step, the access opening being sealed by introducing energy or heat into an absorbing portion of the substrate or the cap with the aid of a laser, a reversible getter for further setting the first pressure and/or the first chemical composition being introduced into the first cavity chronologically prior to the third step.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: August 25, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Achim Breitling, Eckhard Graf, Jens Frey, Jochen Reinmuth, Mawuli Ametowobla
  • Patent number: 10689251
    Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: June 23, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Enri Duqi, Lorenzo Baldo, Roberto Carminati
  • Patent number: 10676216
    Abstract: A station for compliance testing of unmanned vehicles comprises a dedicated area for acceptance of an unmanned vehicle. The dedicated area is configured for permitting the unmanned vehicle to be in a first inspection position. The station further comprises a transmitter. The transmitter is directed towards the dedicated area. The transmitter is configured to instruct the unmanned vehicle to perform a behavior. The station further comprises a sensor. The sensor is directed towards the dedicated area. The sensor is configured to detect a non-compliance of the unmanned vehicle. The detected non-compliance is in response to the instructed performed behavior of the unmanned vehicle.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Yuk L. Chan, Eileen P. Tedesco, Kyle Gilbertson, Daniel F. Hogerty, Lawrence A. Clevenger, Benjamin D. Briggs
  • Patent number: 10661308
    Abstract: In some examples, a method of fabricating a transducer includes disposing a plurality of anchors on a substrate and disposing a sealing material and a device layer over the anchors and the substrate to form a cavity, the sealing material sealing the cavity. The method may further include forming, in the device layer, a plate and at least one spring member. The at least one spring member may be supported by at least one anchor of the plurality of anchors, and the at least one spring member may support the plate to allow relative movement between the plate and the substrate.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: May 26, 2020
    Assignee: KOLO MEDICAL, LTD.
    Inventors: Xuefeng Zhuang, Yongli Huang, Dave Hong, Lei Chen
  • Patent number: 10647568
    Abstract: A micromechanical component including a mounting including a spanned diaphragm, which is warpable via a pressure difference between a first diaphragm side and a second diaphragm side against a diaphragm counter force according to a diaphragm spring constant of the diaphragm, and at least one actuator electrode, which is connected to the diaphragm and adjustable against a spring force according to at least one spring constant of at least one spring with the aid of a warping of the diaphragm, an overall system spring constant being definable as the sum of a diaphragm spring constant of the diaphragm and the spring constant of the single spring, or an overall spring constant of all springs, via which the at least one actuator electrode is connected to the mounting, and the spring constant of the single spring or of all springs being at least 5% of the overall system spring constant.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: May 12, 2020
    Assignee: ROBERT BOSCH GMBH
    Inventors: Helmut Grutzeck, Jochen Reinmuth
  • Patent number: 10533912
    Abstract: A flange-set for a pressure difference measuring transducer with two flanges mountable on external sides of a measuring mechanism of the pressure difference measuring transducer lying opposite one another and containing membranes to be loaded with pressures, as well as a pressure difference measuring transducer equipped with the flange-set. Each of the flanges comprises: a wall, which in the mounted state covers one of the two membranes of the measuring mechanism and encloses a pressure chamber bordering on such membrane. Arranged on a first side of the wall is a first process connection, which includes a pressure duct connection region, in which opens a pressure duct extending through the flange to the pressure chamber.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: January 14, 2020
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Michael Hugel, Thomas Uehlin, Benjamin Lemke
  • Patent number: 10466126
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to pressure sensors and methods of manufacture. The structure includes: a top membrane of semiconductor material having edges defined by epitaxial material and a liner material; a back gate under the top membrane; and a cavity defined between the top membrane and the back gate.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: November 5, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Juergen Faul, Frank Jakubowski
  • Patent number: 10444087
    Abstract: The present disclosure relates to a capacitive force sensor. The capacitive force sensor includes a planar base body, a supported membrane body, two spacers disposed spaced apart to each other, where the membrane body abuts the planar base body via the spacers, and wherein a cavity is formed between the membrane body and the planar base body to allow displacement or deflection of the membrane body under a force onto the membrane body in the area between the spacers. The membrane body forms a first electrode and, a second electrode is provided on the planar base body, wherein the first and second electrode define a first precision capacitor with changing measuring capacity depending on the force. An electrical bracket extends from each of the spacers for electrically contacting the first electrode and forms a bend between each of the associated spacer and a bottom of the base body.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: October 15, 2019
    Assignee: PREH GMBH
    Inventors: Benedikt Schmidt, Thomas Zirkelbach, Harald Ment, Jürgen Nauth, Thilo Schultheis, Sara Hofmann, Matthias Müller
  • Patent number: 10352806
    Abstract: A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: July 16, 2019
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Xiaoyi Ding, James Norwicki
  • Patent number: 10349188
    Abstract: A Microelectromechanical system (MEMS) microphone comprises a base unit and a driving system disposed on the base unit. The driving system comprises a first diaphragm, a second diaphragm spaced apart from the first diaphragm, and a comb finger counter electrode assembly comprising a moving electrode member, the counter electrode assembly is mechanically coupled to the first and second diaphragms. The driving system further comprises a side wall mechanically coupled the first diaphragm to the second diaphragm defining a sealed electrode region and the sealed electrode region having an encapsulated gas pressure and the comb finger counter electrode assembly is disposed within the sealed electrode region.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 9, 2019
    Assignees: Akustica, Inc., Robert Bosch GmbH
    Inventors: Daniel C. Meisel, Bernhard Gehl, Yujie Zhang, Andrew Doller, Gokhan Hatipoglu
  • Patent number: 10337849
    Abstract: A capacitive sensor includes a sensor sheet having a central electrode layer and a measuring instrument. A first dielectric layer is laminated on the upper surface of the central electrode layer. A second dielectric layer is laminated on the lower surface of the central electrode layer. A first outer electrode layer is formed on the surface of the first dielectric layer. A second outer electrode layer is formed on the surface of the second dielectric layer. The central electrode layer and the first outer electrode layer face each other at a first detection portion. The central electrode layer and the second outer electrode layer face each other at a second detection portion. Capacitances of the detection portions change with deformation. The state of deformation of the sensor sheet is measured on the basis of the total capacitance by adding the capacitances of the first detection portion and the second detection portion.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: July 2, 2019
    Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
    Inventors: Hideo Otaka, Masaya Yonezawa, Yusuke Bessho
  • Patent number: 10246318
    Abstract: A micromechanical component having a substrate, a membrane that covers an opening structured into the substrate from a first side of the substrate and that can be warped by a pressure difference between the first side of the substrate and a second side, oriented away from the first side, of the substrate, and having at least one actuator electrode that is connected at least to the membrane in such a way that the at least one actuator electrode can be displaced relative to the substrate by a warping of the membrane, the at least one actuator electrode being capable of being displaced relative to the substrate by the warping of the membrane, in each case along a displacement axis oriented parallel to the second side of the substrate. A production method for a micromechanical component is also described.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: April 2, 2019
    Assignee: ROBERT BOSCH GMBH
    Inventors: Helmut Grutzeck, Jochen Reinmuth
  • Patent number: 10234351
    Abstract: Embodiments of the present invention provide a display substrate, a display device, a pressure detection system and a detection method thereof, which relate to the field of display technologies and is able to integrate the ambient pressure testing function in the display substrate for the convenience of being carried by people when going out, wherein the display substrate comprises a base substrate and a pressure sensing structure located on the base substrate configured to test the ambient pressure. The pressure sensing structure comprises a first pressure sensitive electrode and a second pressure sensitive electrode arranged opposite to each other, and a plurality of insulating pillars arranged at intervals between the first pressure sensitive electrode and the second pressure sensitive electrode, wherein the first pressure sensitive electrode is in contact with the base substrate.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: March 19, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jiuxia Yang, Yun Qiu, Zhidong Wang
  • Patent number: 10222284
    Abstract: A pressure sensor is disclosed. The pressure sensor has a sensor module having a strain gauge measuring a pressure of a gas flowing into a passage of the sensor module, a substrate electrically connected to the strain gauge, a frame covering a portion of the sensor module and supporting the substrate, a terminal electrically connected to the substrate and contacting a contact point of an external device, a terminal holder supporting the terminal, and a housing having an end connected to the sensor module and covering a portion of the terminal holder.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: March 5, 2019
    Assignee: Tyco Electronics AMP Korea Co. Ltd.
    Inventors: Young Deok Kim, Eul Chul Byeon, Kyung Hwan Oh, Won Jong Choi
  • Patent number: 10161820
    Abstract: A capacitance-detection pressure switch and pressure sensor that, in the connection between a diaphragm used as one electrode and a signal line for detecting a signal from the diaphragm, can ensure stable conduction without exerting an influence on operating characteristics of the diaphragm. A capacitance-detection type pressure switch of the present invention includes a metallic diaphragm that is displaced in response to a change in pressure of an operating medium supplied from a conduit, a movable electrode connected electrically to the diaphragm, a fixed electrode provided at an atmospheric pressure side of the diaphragm opposing the conduit, and an insulating film ensuring insulation between the fixed electrode and the diaphragm, wherein an electrode contact portion for connection to the movable electrode is formed as at least one projection extending toward an exterior on a part of the outer periphery of the diaphragm.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: December 25, 2018
    Assignee: SAGINOMIYA SEISAKUSHO, INC.
    Inventors: Yoshihiro Hamabe, Kenichi Matsuyama, Gen Katsuki
  • Patent number: 10126190
    Abstract: A capacitive force sensor 101 of the present invention includes a plurality of cells each including a lower electrode 104, a movable member that includes an upper electrode 107 and has flexibility, and a support 105b arranged to movably support the movable member and to form a gap 106 between the upper and the lower electrodes. The plural cells are grouped into elements each including one or more of the cells, and the one or more cells in a same element are electrically connected to each other.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: November 13, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yasuhiro Soeda, Yasuhiro Shimada
  • Patent number: 10113926
    Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: October 30, 2018
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
  • Patent number: 10067024
    Abstract: A differential pressure sensor comprises a measuring diaphragm made of an electrically conductive material, two electrically insulating mating bodies, and at least one capacitive transducer. The measuring diaphragm is connected to the mating bodies in a pressure-tight manner with the formation of a measuring chamber in each case along a circumferential edge. The mating bodies each have a diaphragm bed which is concave in the center, wherein the mating bodies each have a pressure channel which extends through the mating body into the measuring chamber. The capacitive transducer has at least one mating body electrode which is formed by a metallic coating of the surface of the mating body in the region of the diaphragm bed and with which contact can be made by a metallic coating of the wall of the pressure channel.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: September 4, 2018
    Assignee: ENDRESS + HAUSER GMBH + CO. KG
    Inventors: Bernhard Jochem, Timo Kober, Benjamin Lemke, Darina Riemer Woyczehowski, Rafael Teipen, Anh Tuan Tham, Roland Werthschutzky
  • Patent number: 10048156
    Abstract: A method for operating a pressure transducer which transducer includes a pressure sensor having a measurement membrane and a base body, between which a cavity is enclosed with a reference pressure, wherein utilizing a control and calculation unit in a pressure measuring mode, the capacitance of a measuring capacitor and a reference capacitor are determined, and a measured value of the media pressure is calculated as a function thereof, where during a diagnostics mode, the capacitance is determined and evaluated for a diagnostics capacitor formed by one measuring capacitor electrode and one reference capacitor electrode arranged on the same surface such that changes in the relative humidity in the cavity and/or process medium penetrating through a tear can be detected with via the diagnostic capacitor, and a warning signal regarding an impending malfunction can thus be generated and output to a service device in a timely manner.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: August 14, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Christoph Paulitsch, Stefan Von Dosky
  • Patent number: 10018489
    Abstract: A fluid flow velocity sensor using a differential pressure measurement includes a stack having a tip pointing in a first direction, the stack including first and second plates arranged in parallel one another along the first direction; and a pressure-sensitive diaphragm arranged between the first and second plates along the first direction, the pressure-sensitive diaphragm being spaced apart from the first plate by a first cavity and from the second plate by a second cavity. The first cavity is entirely sealed, except at the tip of the stack, so as to be under a stagnation pressure during operation of the fluid flow velocity sensor. The second cavity is opened so as to be under a reference pressure during operation of the fluid flow velocity sensor. The fluid flow velocity sensor includes a detector to measure a parameter representative of the differential pressure between the first and the second cavities.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: July 10, 2018
    Assignee: COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
    Inventors: Iouri Moukharski, Alan Braslau
  • Patent number: 9994439
    Abstract: A pressure sensor has a substrate having a diaphragm, a cavity portion that is positioned on one side of the diaphragm, and a ceiling portion that is disposed opposite to the diaphragm via the cavity portion, and unevenness is formed on a surface of the substrate facing the cavity portion. In addition, the unevenness has a plurality of recessed portions.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: June 12, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Yusuke Matsuzawa, Takuya Kinugawa
  • Patent number: 9862597
    Abstract: A method for manufacturing a micromechanical component having a substrate and having a cap connected to the substrate and enclosing with the substrate a first cavity is provided, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, in a first method step an access opening that connects the first cavity to an environment of the micromechanical component being constituted in the substrate or in the cap, in a second method step the first pressure and/or the first chemical composition being established in the first cavity, in a third method step the access opening being sealed with the aid of a laser by the introduction of energy or heat into an absorbing portion of the substrate or of the cap, the introduction of energy or heat being controlled by spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of the substrate or of the cap.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: January 9, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Mawuli Ametowobla, Philip Kappe
  • Patent number: 9829405
    Abstract: A microelectromechanical pressure sensor structure that comprises a planar base, a side wall layer and a diaphragm plate. The side wall layer forms side walls that extend away from the planar base into contact with the diaphragm plate. The side wall layer is formed of at least three layers, a first layer and a second layer of insulating material and a third layer of conductive material, wherein the third layer is between the first layer and the second layer. The conducting layer provides a shield electrode within the isolating side wall layer. This shield electrode is adapted to reduce undesired effects to the capacitive measurement results.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Heikki Kuisma, Koichi Yoshida
  • Patent number: 9778127
    Abstract: A differential pressure sensor includes: a sensor module including: a sensor case including a port through which a target fluid is to be introduced and a base attached with the port; a sensor configured to detect a physical quantity of the target fluid; a sensor substrate attached with the sensor, the sensor substrate having an outer circumferential surface facing an inner circumferential surface of the base; and a cover configured to press the sensor substrate against the base; and a case body including an electric circuit that is housed therein and electrically connectable to the sensor module, the case body having an open end to which the sensor module is externally attached, in which a sensor module clearance is defined between the outer circumferential surface of the sensor substrate and an inner circumferential surface of the sensor case.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: October 3, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Takayuki Ite, Daiki Aruga, Hideki Muramatsu
  • Patent number: 9752945
    Abstract: A coplanar process fluid pressure sensor module is provided. The module includes a coplanar base and a housing body. The coplanar base has a pair of process fluid pressure inlets, each having an isolator diaphragm. The housing body is coupled to the coplanar base at an interface between the coplanar base and the housing body. A differential pressure sensor is operably coupled to the pair of process fluid pressure inlets, and is disposed proximate the coplanar base within the housing body.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: September 5, 2017
    Assignee: Rosemount Inc.
    Inventors: Robert C. Hedtke, David A. Broden
  • Patent number: 9738513
    Abstract: Provided are a MEMS pressure sensor and a method for forming the MEMS pressure sensor. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface, the second substrate includes a pressure sensing region; bonding the first surface of the first substrate and the third surface of the second substrate with each other; forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: August 22, 2017
    Assignee: MEMSEN ELECTRONICS INC
    Inventor: Manhing Chau
  • Patent number: 9738508
    Abstract: A MEMS capacitive pressure sensor is provided. The MEMS capacitive pressure sensor includes a substrate having a first region and a second region, and a first dielectric layer formed on the substrate. The capacitive pressure sensor also includes a second dielectric layer having a step surface profile formed on the first dielectric layer, and a first electrode layer having a step surface profile formed on the second dielectric layer. Further, the MEMS capacitive pressure sensor includes an insulation layer formed on the first electrode layer, and a second electrode layer having a step surface profile with a portion formed on the insulation layer in the peripheral region and the rest suspended over the first electrode layer in the device region. Further, the MEMS capacitive pressure sensor also includes a chamber having a step surface profile formed between the first electrode layer and the second electrode layer.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: August 22, 2017
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Zhongshan Hong
  • Patent number: 9739678
    Abstract: The invention describes a pressure transducer having a pressure measuring cell, a position sensor, and an analysis device which has at least one signal processing device and a position correction device for the purpose of determining a position error, wherein the at least one position sensor is arranged in a stationary position relative to the pressure measuring cell, and the position sensor is electrically connected to the position correction device, wherein a first signal is provided by the signal processing device, said signal being determined from a signal provided by the pressure measuring cell, wherein a second signal is provided by the position sensor, and wherein an output signal is provided by the position correction device, determined from the first and the second signals.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: August 22, 2017
    Assignee: VEGA GRIESHABER KG
    Inventor: Joern Jacob
  • Patent number: 9726561
    Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: August 8, 2017
    Assignee: ams International AG
    Inventors: Willem Frederik Adrianus Besling, Iris Bominaar-Silkens, Remco Henricus Wilhelmus Pijnenburg, Marten Oldsen
  • Patent number: 9725309
    Abstract: A micromechanical sensor device includes: an ASIC substrate having a first front side and a first rear side; a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers; a MEMS substrate having a second front side and a second rear side; a first micromechanical functional layer formed on top of the second front side; and a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element. In the second micromechanical functional layer, a movable sensor structure is anchored on one side via a first anchoring area, and an electrical connecting element formed in a second anchoring area is anchored on one side on the ASIC, and the first and second anchoring areas are elastically connected to one another via a spring element.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: August 8, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Julian Gonska, Jochen Reinmuth
  • Patent number: 9689768
    Abstract: A pressure difference sensor includes a pressure difference measuring cell, which has a measuring cell platform with pressure contactable measuring chambers in its interior, a first mounting surface and a second mounting surface. The mounting surfaces have a variable separation under pressure loading of the measuring chambers. A first reinforcement element with a first planar reinforcement area and a second reinforcement element with a second planar reinforcement area.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: June 27, 2017
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventors: Benjamin Lemke, Rafael Teipen, Anh Tuan Tham
  • Patent number: 9670059
    Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: June 6, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Roland Helm
  • Patent number: 9664579
    Abstract: A pressure sensor module is described for determining the pressure of a measurement medium, and includes a sensor chip, a housing having a pressure connector, and a plug part for the electrical connection of the pressure sensor module. In addition, plug contacts that are electrically connected to the sensor chip are provided in the plug part. In addition, in the provided pressure sensor module it is provided that the sensor chip is capable of being loaded with the measurement medium through the pressure connector, and the pressure connector is made at least partly of a light metal.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: May 30, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventor: Masoud Habibi
  • Patent number: 9651440
    Abstract: A pressure sensor for sensing pressure of a fluid includes a diaphragm separator having a protrusion. The pressure sensor further includes a resonator, where the protrusion is in contact with the resonator on a first side of the resonator. The protrusion is positioned to exert an imparted force onto the resonator. The pressure sensor also includes a backing diaphragm positioned on a second side of the resonator. The backing diaphragm exerts a counter force onto the resonator in response to the imparted force.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: May 16, 2017
    Assignee: CHEVRON U.S.A. INC.
    Inventor: James Daniel Montoya
  • Patent number: 9638559
    Abstract: Featured are systems and methods for measuring differential and absolute pressure of a flowing fluid/gas in a fluid system. In such a method the fluid system is configured with first and second pressure taps that are spaced from each so the second pressure tap is downstream of the first pressure tap in a direction of flow. An absolute pressure sense element and a differential pressure sense element are provided, where the absolute pressure sense element is first fluidly coupled to one of the first or second pressure tap to measure an absolute pressure representative of the flowing fluid/gas. The differential pressure sense element is second fluidly coupled to each of the first and second pressure taps so as to measure a differential pressure of the flowing fluid/gas between the first and second pressure taps.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: May 2, 2017
    Assignee: Sensata Technologies Inc.
    Inventors: Peter Zummo, Victor Bender
  • Patent number: 9621975
    Abstract: A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves. The MEMS device also includes a second substrate coupled to and facing the diaphragm, and including circuitry, wherein the second substrate includes a recess region forming an integrated back cavity in the MEMS device. The MEMS device also includes an electrical connection electrically coupling the first substrate and the second substrate and configured to transmit an electrical signal indicative of the deflection of the diaphragm.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: April 11, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Fang Liu, Martin Lim
  • Patent number: 9593011
    Abstract: A method is described for producing a micromechanical component. The method includes providing a first substrate, providing a second substrate, developing a projecting patterned element on the second substrate, and connecting the first and the second substrate via the projecting patterned element. The method provides that the connecting of the first and the second substrate includes eutectic bonding. Also described is a micromechanical component, in which a first and a second substrate are connected to each other.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: March 14, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Julian Gonska, Heribert Weber
  • Patent number: 9581513
    Abstract: A diaphragm-type pressure gauge which is attached to a vessel to be measured and measures a pressure by introducing a gas inside the vessel includes a housing into which the gas is introduced, and a sensor unit which is arranged in the housing, and includes a diaphragm electrode, a measurement surface of which is arranged parallel to an introduction direction of the gas. When the housing is attached to the vessel, the measurement surface of the diaphragm electrode is arranged parallel to a direction of gravitational force.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: February 28, 2017
    Assignee: CANON ANELVA CORPORATION
    Inventor: Haruzo Miyashita
  • Patent number: 9574961
    Abstract: A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: February 21, 2017
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Xiaoyi Ding, James Nowicki
  • Patent number: 9562796
    Abstract: The disclosed embodiments include a combination absolute pressure and differential pressure transducer that includes at least a first cavity and a second cavity, at least a first pressure port and a second pressure port, a first isolation membrane exposing the first cavity to a first fluid pressure applied to the first pressure port, a second isolation membrane exposing the second cavity to a second fluid pressure applied to the second pressure port, at least one absolute pressure sense element exposed to absolute pressure in one of the first cavity and the second cavity, and at least one differential pressure sense element exposed to differential pressure between two of the first cavity and the second cavity.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: February 7, 2017
    Assignee: Illinois Tool Works Inc.
    Inventor: John M. Lull
  • Patent number: 9541462
    Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: January 10, 2017
    Assignee: Kionix, Inc.
    Inventors: Scott G. Adams, Charles W. Blackmer, Kristin J. Lynch
  • Patent number: 9488549
    Abstract: A sensor element with air pressure measurement includes a layer stack from a plurality of layers arranged one on top of the other. At least one first layer contains a measurement sensor device for measuring a measurement parameter different from an ambient pressure of the sensor. The first or at least one second layer contains a pressure measurement device for measuring the air pressure in an environment on one side of the sensor element, or a channel for coupling a pressure measurement device to an environment on one side of the sensor element.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: November 8, 2016
    Assignee: Continental Automotive GmbH
    Inventor: Willibald Reitmeier
  • Patent number: 9464922
    Abstract: A capacitive sensor for detecting relative movement of adjacent bodies includes a first electrode on a first electrode supporting body, and a second electrode opposite the first electrode on a second electrode supporting body. The second electrode supporting body is a resilient film element supported on the first electrode supporting body by spaced-apart support sections. A pressure body includes two pressure projections that rest, in the region between the support sections, against the side of the second electrode supporting body facing away from the second electrode and that press against the second electrode supporting body while bending it when there is a relative movement between the first electrode supporting body and the second pressure body. The second electrode is secured to the second electrode supporting body only in a securing section substantially in the center between pressure regions at which the pressure projections rest against the second electrode supporting body.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: October 11, 2016
    Assignee: Behr-Hella Thermocontrol GmbH
    Inventor: Karsten Marquas
  • Patent number: 9464950
    Abstract: A capacitive pressure sensor includes a substrate wafer and a diaphragm wafer. The substrate wafer defines a substrate recess with a first recess. The diaphragm wafer defines a diaphragm recess with a second recess. The diaphragm wafer is bonded to the substrate wafer such that the substrate and diaphragm recesses form a height differentiated pressure chamber.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: October 11, 2016
    Assignee: Rosemount Aerospace Inc.
    Inventors: Weibin Zhang, Anita Fink, Saeed Fahimi, Kimiko J. Childress
  • Patent number: 9447501
    Abstract: A non-aqueous photocurable composition contains dispersed carbon-coated metal particles in an organic diluent in an amount of at least 10 weight %. The dispersed carbon-coated metal particles have a median diameter equal to or less than 0.6 ?m, and are dispersed using a particle dispersing agent that has a weight average molecular weight (Mw) of at least 2,000 and up to and including 100,000 and comprises nitrogen-containing units. The median diameter of the dispersed particles is determined using a dynamic light scattering method. Moreover, when the non-aqueous composition contains up to and including 25 weight % of the dispersed carbon-coated metal particles, it exhibits no visual settling when subjected to a settling test of at least 24 hours at 20° C. Such non-aqueous photocurable compositions include photocurable components and are useful to prepare photocurable and photocured electrically-conductive patterns and layers in various articles, including touch screen devices having touch screen displays.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: September 20, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Karen M. Kosydar, Christine Joanne Landry-Coltrain, Gary L. Slater, Mary Christine Brick
  • Patent number: 9437331
    Abstract: Generally, the present disclosure is directed to gas monitoring systems that use inductive power transfer to safely power an electrically passive device included within a nuclear material storage container. In particular, the electrically passive device can include an inductive power receiver for receiving inductive power transfer through a wall of the nuclear material storage container. The power received by the inductive power receiver can be used to power one or more sensors included in the device. Thus, the device is not required to include active power generation components such as, for example, a battery, that increase the risk of a spark igniting flammable gases within the container.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: September 6, 2016
    Assignee: Savannah River Nuclear Solutions, LLC
    Inventors: Joseph V. Cordaro, John Stephen Bellamy, James M. Shuler, Davis J. Shull, Daniel R. Leduc