Abstract: Provided is a battery grid pellet adhesion/cohesion strength tester that can accurately determine the push-out strength of a battery grid pellet by measuring the binding of the active material to the battery grid during the pasting and curing process. A programmable test stand and force gage are used with a selectable active material punching tool fixture and a set of selectable set of grid location pins. Active material from a lead-acid battery is forced out of the battery grid at a programmed feed rate with the force gage reporting precise force measurements for each battery grid pellets adhesion/cohesion strength. The inventive device can be utilized as a quality control measure following the battery pasting and curing process, which will ensure that consistent and uniform adhesion/cohesion has occurred during battery manufacture, thereby avoiding battery premature performance failure.

Abstract: The present invention relates to transmission elements (1, 1a, 1b; 12, 12a, 12b) for testing/determining the tensile or shear strength of a bonding between two elongated shaped specimen elements by transmitting a tensile or shear force (10, 22) to a specimen element (5a, 5b; 12a, 12b).

Abstract: A testing arrangement and method of using in performing an in-situ adhesion test of a cold spray deposit on a surface of a structure. The testing arrangement includes a specimen member having a number of apertures defined therein and a loading arrangement coupled to the specimen member. The loading arrangement is configured to provide a mechanical force of a known magnitude to the specimen member. In performing an in-situ test of a cold spray deposit on a structure, the method includes positioning the testing arrangement with respect to a surface of the structure, depositing the cold spray deposit on the surface of the structure, and testing the adhesion of the cold spray deposit to the surface.

Abstract: Techniques are described for a materials test controller that includes a Field-Programmable Gate Array (FPGA). The FPGA is configured for acquiring sensor data from sensor device(s) that measure the current state of sample material(s) on which the materials testing is performed. For controlling the actuator device, the FPGA generates a waveform of setpoints; each setpoint represents a desired state of the materials testing. Based on the sensor data, the FPGA calculates process variable(s) for input to a control logic of the FPGA. Using multiple iterations to generate output signals for the actuator device, the control logic receives the process variable(s) and a setpoint of, and based at least on these received inputs, generates an output signal. The output signal of the FPGA causes the actuator device to transition from the current state to a new state that is closer to the desired state as measured by the sensor devices.

Abstract: The invention relates to uplift testing apparatus and method used to provide a quality control test to confirm adequate bonding by the mortar or adhesive to the tile and underlayment or mechanically attached tile roof systems, and, more particularly it is a direct tensile load that is applied by pulling up on the edge of the tile by using a tile testing scale.

Abstract: A bonding apparatus according to the present disclosure includes a bonding tool that bonds a wire to a terminal, a guide member that guides the wire, a clamp made of a conductive material and capable of fixing the wire, and an electrical property measurement unit electrically connected to the clamp. The clamp is configured to be electrically connected to the wire when the wire is fixed. After the wire is bonded to the terminal using the bonding tool, the bonding apparatus carries out a tensile test for fixing the wire using the clamp and pulling the wire bonded to the terminal with a predetermined load and an electrical property test for measuring an electrical resistance of a junction between the wire and the terminal using the electrical property measurement unit.

Abstract: A bond test apparatus comprises a test tool assembly 200 comprising a test tool 40 configured to contact a bond during a bond test, a flexure 80 coupled to the test tool assembly, and a sensor. The sensor is configured to provide a measurement of a displacement of a first end of the flexure 80 relative to a second end of the flexure on application of a force to the flexure, and a processor is configured to receive a displacement signal from the sensor and, based on the displacement signal and optionally a known stiffness of the flexure, to determine the force on the flexure. A cartridge for a bond test apparatus, a method of measuring a force in a bond test apparatus, and a method of measuring the closing force on the jaws of a bond test tool are also provided.

Abstract: This specification discloses a method and implementations improving the field of holding or mounting Scanning Probe Microscopy probe tips for use and alignment. Specifically, the invention allows probes to be mounted replaceably to a very small SPM actuator and aligned in 5 axis permitting alignment of cantilever to beam and reflected beam to detector. The invention allows for great simplification of SPM design while allowing reduction in sizes and masses of tip mounting apparatus thereby improving performance.

Abstract: An electronic device comprises a semiconductor chip, an accommodating part that accommodates the semiconductor chip, a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, and a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface.

Abstract: A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.

Abstract: A method for forming a carbon nanotube array is disclosed. More than one carbon nanotube array is transferred onto an accepting surface of one substitute substrate by sandwiching a liquid medium between the substitute substrate and the plurality of carbon nanotube arrays and solidifying the liquid medium into a solid medium. The solid medium is melt to form the liquid medium again. The carbon nanotube arrays are slid on the accepting surface of the substitute substrate to contact side surfaces with each other to form the carbon nanotube assembling array. A method for forming a carbon nanotube structure, such as a film, is also disclosed.

Abstract: A shearing force test device comprises a substrate mounted with an elastomer having a free end capable of moving toward or away from the substrate; the free end is connected with a test head; the elastomer is installed with two U-shaped elastic arms arranged at a distance and capable of mutually neutralizing horizontal position offsets; the free ends of the two U-shaped elastic arms are connected together; the test head is fixedly installed on the free end; the two U-shaped elastic arms are provided with the fixed end of the elastomer there between; the fixed ends of the two U-shaped elastic arms are connected together, and are fixedly connected with the substrate; and the other ends of the two U-shaped elastic arms away from the free ends are fixedly connected together via a connecting plate.

Abstract: A device for testing adhesive tape including a sample holder located in a first plane and a movable platen having a major surface located in a plane perpendicular to the plane in which the sample holder is located. The platen and the sample holder each have an edge adjacent to the edge of the other, where the platen and the sample holder are moveable with respect to each other such that the movement of the platen with respect to the sample holder separates the adjacent edges and thereby applies a load to a length of tape that is secured to the surface of a sample in the holder and secured to the surface of the platen during testing.

Abstract: A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state.

Abstract: An exemplary embodiment of a testing device for testing a pulling force includes a shell having a test platform, a load sensor mechanism, a control system, a drive and transmission mechanism and a material clamping mechanism. Two portions of a test object are clasped by the load sensor mechanism and the clamp. When the load sensor mechanism is driven to move further away from the clamp via the drive and transmission mechanism, a pulling force perpendicular to the test platform is generated between the two portions of the test object. The load sensor mechanism detects the pulling force and feeds back the detection to the control system.

Abstract: In one embodiment, an apparatus, includes: a mandrel; an expansion cylinder, comprising: opposite first and second ends; an inner circumferential surface extending between the ends and characterized by an inner diameter, the inner circumferential surface defining a hollow cavity; an outer circumferential surface extending between the ends and characterized by an outer diameter that is greater than the inner diameter; and a plurality of slots extending from the inner circumferential surface to the outer circumferential surface and latitudinally oriented between the ends; and one or more base plates configured to engage one of the ends of the expansion cylinder. In another embodiment, a method includes: arranging an expansion cylinder inside a test cylinder; arranging a mandrel inside the expansion cylinder; applying a force to the mandrel for exerting a radial force on the expansion cylinder; and detecting one or more indicia of structural failure of the test cylinder.

Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

Abstract: A technique for testing the compatibility of an encapsulation material and a wire bond included at an unencapsulated assembly. The technique includes immersing the assembly in an encapsulating compound extract. The assembly includes a semiconductor die and a bonding wire affixed to a metalized pad of the semiconductor die by the wire bond. After the immersing, a mechanical strength of the wire bond is determined.

Abstract: A method of testing one of bond or fatigue strength of an elastomeric seal lip to a metal substrate and apparatus therefor is provided. The method and apparatus avoid causing inadvertent damage to the seal lip during testing. Further, the method and apparatus allow a tensile force to be applied along an axis of the seal lip along which the seal lip extends regardless of the angle of inclination of the seal lip relative to a central axis of a metal substrate to which the seal lip is attached. Accordingly, accurate and repeatable test results indicating one of bond strength of the seal lip to the metal substrate or fatigue strength of the seal lip are obtained via the method and apparatus.

Abstract: Adhesion testing systems, methods of fabrication, and methods of testing are disclosed. Test systems include test coupons with non-metallic test adherends. Test coupons are configured to test bonds to the non-metallic test adherends under peeling stress and/or shearing stress. Test methods are simplified and rapid as compared to standard adhesion tests and include methods of accelerated environmental testing. Test methods also are adapted for qualitative and quantitative measurement of bond performance.

Abstract: An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe including a straight, thermally conductive pin; a heater for heating a tip of the probe; a holder for supporting the probe and including a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.

Abstract: A device for a peel test. The device includes: a gripping member to grip an end of a test film to be peeled off a test object; a movable member linearly moving in a direction to or away from the gripping member; a holding member for the movable member capable of linearly moving in a direction along a peel surface of the test object while holding the test object; a moving mechanism configured to move the movable member linearly; a load measuring unit configured to measure a load applied to the gripping member; a first conversion mechanism to convert the linear motion of the movable member to rotational power, and output the rotational power; and a second conversion mechanism to convert the rotational power output from the first conversion mechanism to the linear motion of the holding member relative to the movable member.

Abstract: A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state.

Abstract: A tape test removal device has an elongated housing having a first end and a second end; a shuttle which slides along a longitudinal axis of the housing and is disposed within the housing; a biasing member adjacent the first end of the housing and positioned adjacent the shuttle member; the biasing member is secured in a first, compressed conformation; and a clip extending from the shuttle to hold a portion of a tape to be tested.

Abstract: A method and apparatus for generating a tension wave. A beam of coherent light is directed to an absorber surface of a transducer structure. A compression wave is generated within the transducer structure. The compression wave is reflected on a reflecting surface of the transducer structure to form the tension wave. The tension wave is directed through a test object in a desired direction using a configuration of the reflecting surface relative to the test object.

Abstract: An optical fiber, which is less likely to increase its transmission loss even when it is exposed to a high-humidity environment or immersed in water, is provided. The optical fiber comprises a glass fiber and at least two coating layers (a soft layer and a hard layer) coated at the circumference of the glass fiber, wherein the limit-adhesion strength between the glass fiber and the coating layer under a hot and humid environment is 0.5N/10 nm or more. Preferably, the glass-transition temperature of the hard layer is less than 90° C.

Abstract: A device for laser-optical generation of mechanical waves for processing and/or examining a body includes a laser light source for generation of laser light and a modulator, on which a generated laser light falls and with which, from an incident laser light, a predetermined laser light intensity distribution can be generated on or in the body, in such a way that mechanical waves are excited on or in the body, with which the body is processed and/or with which, via detection of said waves, the body can be examined. According to certain aspects of the invention, the modulator is formed as a diffractive optical element wherein a height profile structure is formed on the surface of the diffractive optical element, with which the phase of the incident laser light is varied, thus generating a predetermined laser light intensity distribution.

Abstract: Maximum allowable load values of a welded portion in respective fracture modes of a load fracture, a moment fracture, and a nugget interior fracture are found based on at least one of a sheet thickness t, a tensile strength TS, an elongation El, and a chemical composition of a nugget portion in each of spot-welded steel sheets, a nugget diameter d of a welded portion, an effective width B of the welded portion determined by a distance between adjacent welded portions, edges or ridge lines, and a sectional height H. Then, according to these fracture modes, an allowable load value at every moment after the maximum allowable load value of the welded portion is reached is found, and a displacement or a time at which the allowable load value becomes 0, that is, at which a complete fracture occurs is found, thereby finding a fracture limit.

Abstract: A positioning device for positioning a number of two-sided adhesive pieces includes a base, a number of pulling blocks, and a pressing block. The base includes a positioning block defining a number of positioning holes. Each pulling block includes a connecting plate, and a supporting plate protruding out from a top end of the connecting plate. A first surface of each adhesive piece is adhered on a top surface of one of the supporting plate. The connecting plate is received in a corresponding one of the positioning hole. The pressing block is attached to the positioning block. A second surface of each adhesive piece to be adhered to a bottom surface of the pressing block.

Abstract: Presented is a system and method for testing the adhesion of coatings to substrates using an ultrasonic scalar. The system comprises a body, a flexible scalpel extending from said body, and a source of ultrasonic waves. The flexible scalpel applies pressure and ultrasonic waves to a coating that is removed when the adhesion of the coating to the substrate is substandard. The method comprises applying an flexible scalpel extending from an ultrasonic adhesion test device to a coating, applying ultrasonic waves through the flexible scalpel to the coating while moving across the coating, removing the coating if there is less than an acceptable adhesion of the coating to the substrate, and inspecting the coating to determine if coating was removed from the substrate.

Abstract: A tensile testing machine has a jaw which includes a unitary ‘H’ section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on the test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the uprights via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.

Abstract: A technique for testing the compatibility of an encapsulation material and a wire bond included at an unencapsulated assembly. The technique includes immersing the assembly in an encapsulating compound extract. The assembly includes a semiconductor die and a bonding wire affixed to a metalized pad of the semiconductor die by the wire bond. After the immersing, a mechanical strength of the wire bond is determined.

Abstract: A method for detecting the integrity of a bond of a multi-piece work piece includes capturing a first image of the work piece, stressing the work piece, capturing a stressed image of the work piece, and comparing the first image of the work piece with the stressed image of the work piece to determine the integrity of the bond.

Abstract: The present invention is a device for measuring the surface energy of a material. The device includes a pulling mechanism and a clamp. A film, including an adhesive side, is attached to a surface to be measured. The film is clamped to surface energy measuring device. The device is placed flush on the surface. A pulling mechanism is pulled until a triangular piece of film tears and is removed from the surface. The device is then lifted off of the surface and a measurement is made at the pre-calibrated marking nearest the tip of the triangle torn into film.

Abstract: A product, generally in sheet form, and suitable for use as an underlay for a floor covering intended for permanent installation, comprises a layer comprising crumb-rubber material and having a first side and a second side. Scrim material is bonded to at least one of the first and second sides. A coating of a high-grab pressure sensitive adhesive is applied to at least part of the exposed surface of the scrim material. The adhesive is determined to be a high-grab adhesive if after 24 hours adhesive binding dwell-time, it has a 90° peel adhesion at 300 mm/minute, as measured by the FINAT Test Method No: 2, of between 4.35 and 21.76 Newtons/25 mm width at room temperature (23° C.±1° C.) and at a relative humidity of 50%±5%.

Abstract: The invention relates to a structure and a process for measuring an energy of adhesion between two substrates bonded in a transverse direction. The method involves providing for at least one of the two substrates to have a plurality of elementary test cells within a test layer each being capable of locally applying, in the transverse direction, a preset mechanical stress (?), dependent on the temperature (T), to a bond interface between the substrates in a direction tending to separate them, applying a test temperature to the substrates and identifying debonded regions of the bond interface so that the local adhesion energy at the test temperature in the regions may be deduced therefrom, the local adhesion energy in a region of the bond interface being deduced from the stress applied by the test cells that caused debonding in the region.

Abstract: The disclosed embodiments concerns a traction pad to be bonded for coating adhesion or surface cohesion tests by tearing including a counterbore designed to control the thickness of the adhesive film. Support elements such as wedges or a border maintain the base of the counterbore at the required distance from the tested surface and openings are provided for evacuating the adhesive prior to its controlled hardening when the traction pad is applied on the tested surface.

Abstract: A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.

Abstract: Maximum allowable load values of a welded portion in respective fracture modes of a load fracture, a moment fracture, and a nugget interior fracture are found based on at least one of a sheet thickness t, a tensile strength TS, an elongation El, and a chemical composition of a nugget portion in each of spot-welded steel sheets, a nugget diameter d of a welded portion, an effective width B of the welded portion determined by a distance between adjacent welded portions, edges or ridge lines, and a sectional height H. Then, according to these fracture modes, an allowable load value at every moment after the maximum allowable load value of the welded portion is reached is found, and a displacement or a time at which the allowable load value becomes 0, that is, at which a complete fracture occurs is found, thereby finding a fracture limit.

Abstract: An apparatus and method for determining the tensile strength of dental materials utilizing a mold. The dental material is placed in the mold and is adhered to a surface. The mold containing the dental material is then engaged with a pulling device which subjects the mold to a measured force to disengage the dental material from the surface. This provides a measure of the tensile strength of the dental material.

Abstract: A tension testing device for use in a tension test for evaluating the strength of bond between a body and a pin of an electronic device includes a base, a tensiometer, a hanger, and a clamp. The base includes a supporting member and a carrying member, wherein the tensiometer is carried by the carrying member and includes a pulling portion. The hanger is coupled to the pulling portion for underpinning the body and project the pin in the direction of the base. The clamp is disposed on the base, positioned beside the hanger, for clamping the pin. The tension testing device protects the electronic device against test-induced deformation, dispenses with an intricate step of the welding and unwelding of the pin and a test lead, precludes a tension test-induced component of force, manifests ease of use, ensures test stability, and enhances test efficiency and reliability.

Abstract: A tension testing device for use in a tension test for evaluating the strength of bond between a body and a pin of an electronic device includes a base, a tensiometer, a hanger, and a clamp. The base includes a supporting member and a carrying member, wherein the tensiometer is carried by the carrying member and includes a pulling portion. The hanger is coupled to the pulling portion for underpinning the body and project the pin in the direction of the base. The clamp is disposed on the base, positioned beside the hanger, for clamping the pin. The tension testing device protects the electronic device against test-induced deformation, dispenses with an intricate step of the welding and unwelding of the pin and a test lead, precludes a tension test-induced component of force, manifests ease of use, ensures test stability, and enhances test efficiency and reliability.

Abstract: Exemplary embodiments are disclosed for the use of Lamb waves in laser bond inspection.

Abstract: The present invention provides a test specimen configured for mechanical load life characterization testing of a dual wall bonded airfoil for use in a turbomachinery device. The dual wall bonded airfoil has a spar and a skin bonded to the spar. The test specimen includes a main stress body, which includes a test spar component configured to represent the spar of the dual wall bonded airfoil; a test skin component configured to represent the skin of the dual wall bonded airfoil; and a test bond joint bonding the skin component to the spar component. The test bond joint is configured to represent the actual bond joint between the spar and the skin of the dual wall bonded airfoil. The test specimen is structured to simulate the dual wall bonded airfoil for testing in a mechanical testing machine.

Abstract: A tensile testing machine has a jaw which includes a unitary ‘H’ section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on said test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the jaw via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.

Abstract: In order to conduct tests designed to determine the adherence properties of a coating on a substrate, a pull plate of a hardenable material is molded directly to the surface of a coating applied to a substrate. The pull plate geometry is determined by the mold cavity and is made of a material that adheres to the coating surface during the molding process. The pull plate therefore, is only used once, while the mold may be reused.

Abstract: An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe having a longitudinal axis; a heater for heating a tip of the probe; a holder for supporting the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder along the longitudinal axis of the probe. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.

Abstract: An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe including a straight, thermally conductive pin; a heater for heating a tip of the probe; a holder for supporting the probe and including a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.

Abstract: An apparatus for adhering coupons together for adhesive shear testing may include a first member, a second member, at least one alignment device, and at least one separation device. The first member may have at least one first member cavity for holding at least one first member coupon. The second member may have at least one second member cavity for holding an overlapping area of at least one second member coupon adjacent to and separate from the at least one first member coupon. The overlapping area of the at least one second member coupon may be adhered to the at least one first member coupon. The at least one alignment device may control a size of the overlapping area. The at least one separation device may control a separation distance between the overlapping area of the at least one second member coupon and the at least one first member coupon.