Bond Test Patents (Class 73/827)
  • Publication number: 20110079088
    Abstract: A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface.
    Type: Application
    Filed: December 7, 2010
    Publication date: April 7, 2011
    Applicant: DAGE PRECISION INDUSTRIES LTD.
    Inventors: Benjamin Kingsley Stuart Peecock, Robert John Sykes, Alan Norman Wiltshire
  • Patent number: 7913553
    Abstract: A strength testing device for testing a connection strength between two articles when a connection interface therebetween located vertically and includes a blade member, a suspending member, and a handle. The suspending member includes a relay portion, a first connection portion and a second portion disposed at two opposite ends of the relay portion. The blade member includes a blade seating on one of the articles. A holder is formed on the second connection portion to hold a critical weight to break the two articles along the connection interface. A gravity line of the weight crosses with the blade.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: March 29, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Bing-Jun Zhang
  • Publication number: 20110067500
    Abstract: A method and template enable the testing of fusion joints of plastic pipes to be conducted by a single operator in the field at the welding site by the efficient and precise extraction from the joints to be tested of a number of high quality tensile coupons. The coupons are tested to failure in a field-suitable, well controlled, self contained, tensile testing apparatus. A narrowing bow-tie-like pattern of the coupon ensures that the failure of the coupon in the tensile test will occur at the narrowest section of the coupon. The template can be visually aligned with the joint to ensure that it is the joint that will be tested.
    Type: Application
    Filed: April 23, 2010
    Publication date: March 24, 2011
    Inventors: Jason A. Lawrence, James R. Perrault, Brian O'Connell
  • Publication number: 20110067499
    Abstract: A method and template enable the testing of fusion joints of plastic pipes to be conducted by a single operator in the field at the welding site by the efficient and precise extraction from the joints to be tested of a number of high quality tensile coupons. The coupons are tested to failure in a field-suitable, well controlled, self contained, tensile testing apparatus. A narrowing bow-tie-like pattern of the coupon ensures that the failure of the coupon in the tensile test will occur at the narrowest section of the coupon. The template can be visually aligned with the joint to ensure that it is the joint that will be tested.
    Type: Application
    Filed: September 22, 2009
    Publication date: March 24, 2011
    Inventors: Jason A. Lawrence, James R. Perrault, Brian O'Connell
  • Patent number: 7856889
    Abstract: A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.
    Type: Grant
    Filed: March 17, 2005
    Date of Patent: December 28, 2010
    Assignee: Nordson Corporation
    Inventors: Benjamin Kingsley Stuart Peecock, Alan Norman Wiltshire
  • Publication number: 20100307259
    Abstract: An apparatus and method for determining the tensile strength of dental materials utilizing a mould. The dental material is placed in the mould and is adhered to a surface. The mould containing the dental material is then engaged with a pulling device which subjects the mould to a measured force to disengage the dental material from the surface. This provides a measure of the tensile strength of the dental material.
    Type: Application
    Filed: June 1, 2010
    Publication date: December 9, 2010
    Inventor: JOSHUA JAMES CHEETHAM
  • Patent number: 7810397
    Abstract: A test method for measuring yarn and tuft or loop gripping strength characteristics and capability of tufted nonwoven primary backing mats for making tufted carpets, the tufted primary backing mat having no additional binder or adhesive on the backside of the mat prior to making tufted carpet is disclosed. The test apparatus and test method can be used for quality control purposes and for evaluation of experimental or new candidates for primary backing mats for making interim tufted products for carpets that are more resistant to tuft or loop defects. Revealed is a new and critical Quality Knee characteristic of primary backing mats that is crucial for minimizing tuft or loop defects during the tufting process and also the force magnitude on the yarn necessary to pop the tuft completely out of the primary backing mat sample.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: October 12, 2010
    Assignee: Johns Manville
    Inventor: Lester Mickel Aseere
  • Publication number: 20100218615
    Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, in the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.
    Type: Application
    Filed: May 12, 2010
    Publication date: September 2, 2010
    Applicant: NORDSON CORPORATION
    Inventor: Robert John Sykes
  • Patent number: 7775122
    Abstract: Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: August 17, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David W. Sokol, Craig T. Walters
  • Patent number: 7748278
    Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: July 6, 2010
    Assignee: Nordson Corporation
    Inventor: Robert John Sykes
  • Patent number: 7739918
    Abstract: The present invention provides a testing apparatus and method for testing the adhesion of a coating to a surface. The invention also includes an improved testing button or dolly for use with the testing apparatus and a self aligning button hook or dolly interface on the testing apparatus. According to preferred forms, the apparatus and method of the present invention are simple, portable, battery operated rugged, and inexpensive to manufacture and use, are readily adaptable to a wide variety of uses, and provide effective and accurate testing results. The device includes a linear actuator driven by an electric motor coupled to the actuator through a gearbox and a rotatable shaft. The electronics for the device are contained in the head section of the device. At the contact end of the device, is positioned a self aligning button hook, attached below the load cell located on the actuator shaft.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: June 22, 2010
    Assignee: Lockheed Martin Corporation
    Inventors: Glenn M. LaPeyronnie, Charles M. Huff
  • Patent number: 7735377
    Abstract: Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: June 15, 2010
    Assignees: LSP Technologies, Inc., The Boeing Company
    Inventors: David W. Sokol, Craig T. Walters, Steven M. Toller, Richard H. Bossi, Kevin R. Housen
  • Publication number: 20100131211
    Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property.
    Type: Application
    Filed: December 4, 2009
    Publication date: May 27, 2010
    Applicant: ALLIANT TECHSYSTEMS INC.
    Inventors: John L. Shipley, Jerry W. Jenson, Mark R. Eggett, Sorin V. Teles, Don W. Wallentine
  • Patent number: 7707895
    Abstract: The invention relates to a method for examining the resistance of a connection between two bodies, whereby one of the bodies only has a small mass. A correspondingly directed force is exerted upon the connection until disconnection thereof. The force used is the centrifugal force which acts at a distance from a rotational axis in a concentric manner about said rotated connection. Said method is particularly advantageous if the body having a small mass is a coating which is applied to the other body. In order to obtain a sufficiently high centrifugal force, an examining stamp is applied to the body having the small mass and/or the coating on the side oriented away from the connection. The adhesion between the body and/or the coating and the examining stamp is greater than between both of the bodies and/or the coating and the other body.
    Type: Grant
    Filed: November 11, 2005
    Date of Patent: May 4, 2010
    Assignee: BAM Bundesanstalt fur Material-Forschung und-Prufung
    Inventors: Uwe Beck, Georg Reiners, Christian Berndt, Sylke Grune, RĂ¼diger Uhlendorf
  • Publication number: 20100050780
    Abstract: A test method for measuring yarn and tuft or loop gripping strength characteristics and capability of tufted nonwoven primary backing mats for making tufted carpets, the tufted primary backing mat having no additional binder or adhesive on the backside of the mat prior to making tufted carpet is disclosed. The test apparatus and test method can be used for quality control purposes and for evaluation of experimental or new candidates for primary backing mats for making interim tufted products for carpets that are more resistant to tuft or loop defects. Revealed is a new and critical Quality Knee characteristic of primary backing mats that is crucial for minimizing tuft or loop defects during the tufting process and also the force magnitude on the yarn necessary to pop the tuft completely out of the primary backing mat sample.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 4, 2010
    Inventor: Lester Mickel Aseere
  • Publication number: 20100044348
    Abstract: A method and apparatus for installing an insulation material to a surface by inserting a nozzle and a neck of a welding gun through a channel in an insulation material, positioning the insulation material on the surface to be insulated using the welding gun, firmly pushing the welding gun into the channel of the insulation material until the nozzle of the welding gun, an anchor embedded in the insulation material and the surface are in contact, welding the anchor of the insulation material to the surface with the welding gun, and removing the nozzle and the neck of the welding gun from the channel in the insulation material. A method and apparatus for testing the integrity of a weld between an anchored insulation material, a surface and a nozzle of a welding gun. A special tool for testing the integrity of the weld between the anchored insulation material and a surface.
    Type: Application
    Filed: August 22, 2008
    Publication date: February 25, 2010
    Applicant: REFRACTORY ANCHORS, INC.
    Inventor: Randall Loren Buchmann
  • Patent number: 7628066
    Abstract: An apparatus for evaluating the peel adhesion of a test specimen to a substrate. The apparatus includes a base plate having a surface for receiving the substrate; a substrate clamping plate for securing the substrate to the substrate receiving surface of the base plate; a test specimen clamping mechanism, the test specimen clamping mechanism having a first end for securing a first end of the test specimen thereto and a second end; and a pivotable linkage, the pivotable linkage having a first end for connecting to the second end of the test specimen clamping mechanism and a second end pivotably mounted to an adaptor, the adaptor in communication with a source of tensile force, wherein the source of tensile force is applied through or via the adaptor to draw the pivotable linkage and test specimen clamping mechanism away from the base plate and peel the test specimen away from the substrate. Also disclosed is a method for evaluating the peel adhesion of a test specimen to a substrate.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: December 8, 2009
    Assignee: Ethicon, Inc.
    Inventors: Meng Deng, Robert Nering
  • Patent number: 7607357
    Abstract: The testing systems can incorporate one or more of: (a) side-insertion peel clamps for faster operator loading of film specimens; (b) integral calibration platforms in the peel grip assemblies for convenient calibration of the peel force transducers; and (c) a positioning assembly to hold in place aged specimens in preparation for peeling tests.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: October 27, 2009
    Assignee: Enepay Corporation
    Inventors: Gary Stewart, William Arthur Schlieper, II
  • Patent number: 7597006
    Abstract: An adhesiveness evaluation method that can be used to accurately evaluate the adhesiveness of a selected specific micro-spot of a specimen 1 of a small size. A part to be measured 5 is produced by isolating it from a surrounding part 4 and fixing it to a ?-probe 6, which is a support member. Then, the pulling force is applied to the part to be measured 5 using the ?-probe 6, which is the support member and which is fixed to it, to evaluate the adhesiveness of the part to be measured 5.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: October 6, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventor: Toshiaki Aiba
  • Publication number: 20090229372
    Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 17, 2009
    Applicant: ALLIANT TECHSYSTEMS INC.
    Inventors: John L. Shipley, Jerry W. Jenson, Mark R. Eggett
  • Patent number: 7574916
    Abstract: A system for applying a controlled stress on a joint in a structure includes means for applying a plurality of thermal bursts in a designated timing sequence and trajectory pattern to produce a combined shock wavefront directed toward the joint. This system can provide increased accuracy in measuring the strength and quality of composite bonds and laminations.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: August 18, 2009
    Assignee: The Boeing Company
    Inventor: Brian J. Tillotson
  • Patent number: 7562562
    Abstract: A method and device is provided for detecting a predetermined material. The device includes a first inner layer having first and second surfaces and a volume responsive to a first predetermined stimuli. A second inner layer has first and second surfaces. An adhesive bonds at least a portion of the first surface of the first inner layer to the first surface of the second inner layer with a bonding force. A change in the volume of the first layer generates an elastic force on the adhesive material. As a result, the first inner layer delaminates from the second inner layer in response to the elastic force overcoming the bonding force.
    Type: Grant
    Filed: May 8, 2007
    Date of Patent: July 21, 2009
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: David J. Beebe, Dongshin Kim
  • Patent number: 7559261
    Abstract: A device for measuring a molecule, wherein a gel substrate material (200) comprises a gel (220) containing a solvent in the network structure thereof and a molecular chain (210), and a cantilever (100) is bound with the molecular chain (210) by a covalent bonding or a physical bonding and pulls up the molecular chain (210) through the above bonding, and wherein the force loaded when the cantilever (100) pull up the molecular chain (210) is measured and the interaction between polymer chains acting between the gel (200) and the molecular chain (210) is detected. The above device can be used for measuring the interaction between molecules, and in particular, can construct an experiment system for measuring the non-covalent bonding interaction between polymer chains at a molecular level.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: July 14, 2009
    Assignee: National University Corporation Hakkaido University
    Inventors: Takaharu Okajima, Hiroshi Tokumoto
  • Patent number: 7559253
    Abstract: A method for measuring a bonding force between a substrate (50) and a carbon nanotube array (40) formed thereon, wherein the carbon nanotube array includes a plurality of carbon nanotubes. A force gauge (1) including a cantilever (10), a flat-surface probe (20), a movement mechanism (60), and a force sensor (70) is provided. The probe is secured at one end of the cantilever. An adhesive layer (30) is formed on the flat surface of the probe. The probe is moved toward the substrate and is brought into bonding contact with the carbon nanotube array by the movement mechanism. The probe is pulled away from the substrate by the movement mechanism, causing the carbon nanotubes adhered thereto to separate from the substrate. The force at separation is detected by the force sensor, and that force can be converted into an average nanotube/substrate bonding force/strength.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: July 14, 2009
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai Liu, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 7549337
    Abstract: A method is disclosed wherein a portion of a sensor part of an optical fiber sensor is embedded in an adhesive between two joined members, and peeling in an adhesive joint of the two members is detected on the basis of measuring optical characteristics from the optical fiber sensor when the optical fiber sensor is irradiated with light from a light source while one member is vibrated by vibration means. The method comprises the steps of determining the temperature of the two members during measurement on the basis of the optical characteristics from the sensor part exposed outside of the adhesive; determining, on the basis of the temperature determined during the measurement, the measurement range in which the optical characteristics from the optical fiber sensor are measured; and measuring the variation in the optical characteristics from the optical fiber sensor within the determined measurement range while the member is being vibrated by the vibration means.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: June 23, 2009
    Assignee: Honda Motor Co., Ltd.
    Inventors: Keiichi Sato, Hideaki Murayama, Kazuro Kageyama
  • Patent number: 7509876
    Abstract: Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: March 31, 2009
    Assignees: LSP Technologies, Inc., The Boeing Company
    Inventors: David W. Sokol, Craig T. Walters, Kevin R. Houson, Richard H. Bossi, Steven M. Toller
  • Patent number: 7509875
    Abstract: The invention relates to a method and arrangement for carrying out the nondestructive determination of the connection quality of bonded wafers (1, 8) in order to verify the connection strength. The fact that an unbonded region (9) forms around a raised or recessed structure (3) on at least one of the connecting surfaces is made use of. The extension of the unbonded region is a measure of the strength of the wafer connection and is electrically determined by staggered contacts (5, 4) that, with the formation of the bond connection, close, only in part, via a contact strip (10).
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: March 31, 2009
    Assignee: X-Fab Semiconductor Foundries AG
    Inventor: Roy Knechtel
  • Publication number: 20090056469
    Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.
    Type: Application
    Filed: March 8, 2007
    Publication date: March 5, 2009
    Applicant: NORDSON CORPORATION
    Inventor: Robert John Sykes
  • Patent number: 7497115
    Abstract: The invention relates to a quality control process for an adhesive joint of two sub-components of a structure comprising the following steps: a) Providing the structure of composite material to be controlled; b) Providing at least one premanufactured testing device (1) representative of one of the sub-components of the structure; c) Bonding the at least one premanufactured testing device (1) to the other sub-component (7) of the structure in conditions similar to those of the real adhesive joint of the sub-components; d) Carrying out at least one mechanical test on the at least one premanufactured testing device (1) which allows assessing the quality of the adhesive joint.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: March 3, 2009
    Assignee: Airbus Espana, S.L.
    Inventors: JosĂ© Manuel Menendez Martin, JuliĂ¡n SĂ¡nchez FernĂ¡ndez
  • Patent number: 7475601
    Abstract: A test method for measuring tuft gripping strength characteristics of a tufted nonwoven primary backing mat for making tufted carpets, the tufted backing mat having no additional binder on the backside of the mat for tufted carpet is disclosed. The test is used in a method of developing primary backing mats for making tufted carpets that are competitive or superior in TGS.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: January 13, 2009
    Assignee: Johns Manville
    Inventors: Cari Ann Dreiling, Lester M. Aseere
  • Publication number: 20080313879
    Abstract: A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Virendra R. Jadhav, Vijayeshwar D. Khanna, David C. Long, David L. Questad
  • Publication number: 20080302190
    Abstract: The invention relates to a method for examining the resistance of a connection between two bodies, whereby one of the bodies only has a small mass. A correspondingly directed force is exerted upon the connection until disconnection thereof. The force used is the centrifugal force which acts at a distance from a rotational axis in a concentric manner about said rotated connection. Said method is particularly advantageous if the body having a small mass is a coating which is applied to the other body. In order to obtain a sufficiently high centrifugal force, an examining stamp is applied to the body having the small mass and/or the coating on the side oriented away from the connection. The adhesion between the body and/or the coating and the examining stamp is greater than between both of the bodies and/or the coating and the other body.
    Type: Application
    Filed: November 11, 2005
    Publication date: December 11, 2008
    Applicant: Bam Bundesanstalt Fur Material-Forschung Und-Prufung
    Inventors: Uwe Beck, Georg Reiners, Christian Bernt, Sylke Grune, Rudiger Uhlendorf
  • Publication number: 20080276718
    Abstract: A method and device is provided for detecting a predetermined material. The device includes a first inner layer having first and second surfaces and a volume responsive to a first predetermined stimuli. A second inner layer has first and second surfaces. An adhesive bonds at least a portion of the first surface of the first inner layer to the first surface of the second inner layer with a bonding force. A change in the volume of the first layer generates an elastic force on the adhesive material. As a result, the first inner layer delaminates from the second inner layer in response to the elastic force overcoming the bonding force.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 13, 2008
    Inventors: David J. Beebe, Dongshin Kim
  • Patent number: 7448279
    Abstract: A device for testing material properties with regard to combined tensile and shear loads, in particular for testing adhesives, includes a device for applying the force, a measuring device, a test piece receptacle, and a test piece having a bonding surface. The test piece is dimensionally stable within the intended limits of the force to be applied. This measure ensures that the shear forces acting on the joint act approximately at a right angle to the bonding surface over the entire test period, so that realistic conclusions may be drawn with regard to the material properties of the tested adhesive.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: November 11, 2008
    Assignee: Robert Bosch GmbH
    Inventors: Thomas Brinz, Jane Lewis, Thomas Geiger
  • Publication number: 20080257059
    Abstract: A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. Breaking force is measured by conventional means. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.
    Type: Application
    Filed: March 17, 2005
    Publication date: October 23, 2008
    Inventors: Benjamin Kingsley Stuart Peecock, Alan Norman Wiltshire
  • Patent number: 7426856
    Abstract: A device for measuring adhesion strength between a first optical element and a second optical element includes a force gauge, a first magnet, and a second magnet. The second magnet is fixed to the force gauge. The first magnet and the second magnet are configured for magnetically attaching to opposite sides of the first optical element. An attractive force between the first magnet and the second magnet is greater than the adhesion strength between the first optical element and the second optical element.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: September 23, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Bor-Yuan Hsiao, Mong-Tung Lin
  • Publication number: 20080202254
    Abstract: An apparatus for evaluating the peel adhesion of a test specimen to a substrate. The apparatus includes a base plate having a surface for receiving the substrate; a substrate clamping plate for securing the substrate to the substrate receiving surface of the base plate; a test specimen clamping mechanism, the test specimen clamping mechanism having a first end for securing a first end of the test specimen thereto and a second end; and a pivotable linkage, the pivotable linkage having a first end for connecting to the second end of the test specimen clamping mechanism and a second end pivotably mounted to an adaptor, the adaptor in communication with a source of tensile force, wherein the source of tensile force is applied through or via the adaptor to draw the pivotable linkage and test specimen clamping mechanism away from the base plate and peel the test specimen away from the substrate. Also disclosed is a method for evaluating the peel adhesion of a test specimen to a substrate.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 28, 2008
    Applicant: ETHICON, INC.
    Inventors: Meng DENG, Robert NERING
  • Publication number: 20080173098
    Abstract: A method for measuring a bonding force between a substrate (50) and a carbon nanotube array (40) formed thereon, wherein the carbon nanotube array includes a plurality of carbon nanotubes. A force gauge (1) including a cantilever (10), a flat-surface probe (20), a movement mechanism (60), and a force sensor (70) is provided. The probe is secured at one end of the cantilever. An adhesive layer (30) is formed on the flat surface of the probe. The probe is moved toward the substrate and is brought into bonding contact with the carbon nanotube array by the movement mechanism. The probe is pulled away from the substrate by the movement mechanism, causing the carbon nanotubes adhered thereto to separate from the substrate. The force at separation is detected by the force sensor, and that force can be converted into an average nanotube/substrate bonding force/strength.
    Type: Application
    Filed: August 30, 2007
    Publication date: July 24, 2008
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: KAI LIU, KAI-LI JIANG, SHOU-SHAN FAN
  • Patent number: 7392708
    Abstract: A method an apparatus for testing shear strain response of a test specimen having a thick adhesive bond line is disclosed. Method and apparatus permit the use of readily available clip-on extensometers. The apparatus and method may include the use of knife edges secured to each of two adherend components on a standard ASTM D 5656 thick adherent test specimen.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: July 1, 2008
    Assignee: The Boeing Company
    Inventors: Raymond E. Bohlmann, Milton D. Hurd, Jeff Wollschlager
  • Patent number: 7389698
    Abstract: A bond strength tester unit is provided for testing adhesive bond strength of a nutplate or the like attached to a substrate, such as by adhesive bonded attachment to a blind side of the substrate in substantial alignment with a substrate opening. The nutplate may be constructed according to U.S. Pat. No. 5,013,391, and carries a fastener element such as a threaded nut or the like for subsequent connection with a mating fastener element such as a threaded bolt or the like passed through the substrate opening. The tester unit includes a tool tip having a reaction head for engaging the substrate, in combination with an actuator pin for applying a test force of selected magnitude against the adhesively bonded nutplate. In the event of inadequate bond strength, the actuator pin will separate the nutplate from the substrate.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: June 24, 2008
    Assignee: Physical Systems, Inc.
    Inventor: Charles G. Hutter, III
  • Patent number: 7380467
    Abstract: The present invention is directed to a bond integrity tool, which includes a shoulder housing, a collar shaft, and an end cap. The collar shaft has a neck portion and a mouth portion. The neck portion is disposed within the shoulder housing, and the mouth portion is able to grip a test piece. The end cap communicates with the neck portion, such that when the end cap is initiated the end cap applies force on the shoulder housing, which in turn applies force on the collar shaft, which grips the test piece such that the bond integrity between the test piece and a surface may be tested.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: June 3, 2008
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Chong T. Oh, William E. Farrell, William T. Jacoby, Bernard W. Baird
  • Publication number: 20070204701
    Abstract: The testing systems can incorporate one or more of: (a) side-insertion peel clamps for faster operator loading of film specimens; (b) integral calibration platforms in the peel grip assemblies for convenient calibration of the peel force transducers; and (c) a positioning assembly to hold in place aged specimens in preparation for peeling tests.
    Type: Application
    Filed: February 15, 2007
    Publication date: September 6, 2007
    Inventors: Gary Stewart, William Arthur Schlieper
  • Patent number: 7240564
    Abstract: A method and apparatus for detecting and determining event characteristics such as, for example, the material failure of a component, in a manner which significantly reduces the amount of data collected. A sensor array, including a plurality of individual sensor elements, is coupled to a programmable logic device (PLD) configured to operate in a passive state and an active state. A triggering event is established such that the PLD records information only upon detection of the occurrence of the triggering event which causes a change in state within one or more of the plurality of sensor elements. Upon the occurrence of the triggering event, the change in state of the one or more sensor elements causes the PLD to record in memory which sensor element detected the event and at what time the event was detected. The PLD may be coupled with a computer for subsequent downloading and analysis of the acquired data.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: July 10, 2007
    Assignee: Alliant Techsystems Inc.
    Inventors: Peter D. Totman, Randy L. Everton, Mark R. Egget, David J. Macon
  • Patent number: 7219556
    Abstract: A process for measuring snarling properties of a yarn is provided. Firstly a first and a second point of the yarn are held in close proximity, and a portion of the yarn between the two points is of a predetermined length. A predetermined tension force is temporarily exerted to the portion of the yarn, and simultaneously the portion of the yarn is temporarily restricted from twisting when the tension force is exerted. Then the portion of the yarn is released from the tension force such that the portion of the yarn is able to twist freely so as to form snarls thereon. Thereafter, the snarling properties of the yarn are measured by detecting an amount of the snarls thereby formed.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: May 22, 2007
    Assignee: The Hong Kong Polytechnic University
    Inventors: Charlotte Murrells, Ka-Kee Wong, Xiaoming Tao, Bingang Xu
  • Patent number: 7202796
    Abstract: In order to provide a triggering signal for a cable stripping device that is also capable of dealing with very thin wires, it is suggested to use a piezoelectric sensor, the output signal from which is forwarded to an electronic evaluation unit. The electronic evaluation unit then outputs a digital signal that enables the stripping process to be started safely. Various mechanical mechanisms are suggested to ensure that the digital signal is not triggered when not being touched. This problem is proposed to be solved by a low pass filter discriminating between sensor inputs by touching and vibration shock events, etc.
    Type: Grant
    Filed: October 1, 2004
    Date of Patent: April 10, 2007
    Assignee: Komax Holding AG
    Inventor: Nicolas Ruchti
  • Patent number: 7162929
    Abstract: Methods and systems are disclosed for evaluating an adhesive layer such as a tack coat. In one embodiment, a portable apparatus is provided to test a tack coat layer prior to applying an overlay. The portable apparatus includes a tripod configuration placed on a surface, a plate conformed to the surface by a load and a torque wrench-applying a pull-off force to test the strength of the surface. In other embodiments, a portable apparatus is provided to test a tack coat layer prior to applying an overlay, where the portable apparatus does not include support members.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: January 16, 2007
    Assignee: Board of Regents, The University of Texas System
    Inventor: Vivek Tandon
  • Patent number: 7134591
    Abstract: A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection transversely to the bond wire through an ultrasonic welding tool.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: November 14, 2006
    Assignee: Hesse & Knipps GmbH
    Inventor: Frank Walther
  • Patent number: 7041960
    Abstract: A bond separation inspection method using an optical fiber sensor. The method includes a step of embedding a sensor part of an optical fiber sensor in an adhesive joining a plurality of members together. The sensor part is embedded in the adhesive in such a way that the sensor part undergoes a compressive strain. Separation of the bond is detected on the basis of an optical characteristic of the sensor part when light from a light source is directed into the optical fiber sensor.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: May 9, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventor: Keiichi Sato
  • Patent number: 7028555
    Abstract: Apparatus and method for measuring adhesion capability in a tire liner, the apparatus including a film strip attaching to the tire liner and having a through opening and an attachment interface distanced from the opening; an adhesive backed cover member attaching to the film strip in covering relationship to the strip opening and a cover member surface portion establishing an adhesive bond with the tire liner through the film strip opening; means attached to the strip attachment interface for exerting a directional peeling force upon the strip sufficient to unitarily peel the film strip and the cover member from the tire liner; and means for measuring the directional peeling force.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: April 18, 2006
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Brian Matthew Logan, Bruce Raymond Hahn, Martin Lamar Sentmanat, Gary Edwin Tubb, Joseph Carmine Lettieri
  • Patent number: 7017422
    Abstract: A bond strength tester and method for determining certain bond strength parameters of a bonded component, including a phaselocker, a transducer, a loading device that is capable of applying stress-loads to the bond, a controller for controlling the loading device, a data recording device to acquire data, and a computer device to analyze data calculating certain bond strength parameters.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: March 28, 2006
    Assignee: Luna Innovations Incorporated
    Inventors: Joseph S. Heyman, John E. Lynch