Abstract: This invention relates to a method for selecting a substrate intended for use in a cutting operation. The method is particularly suitable for selecting facestock materials intended for use in making pressure-sensitive adhesive (PSA) constructions such as PSA labels. The method includes the following steps (A)-(D). Step (A) involves cutting the substrate during a first cutting step to form at least two shapes in the substrate. The shapes are positioned in spaced relationship to each other. A matrix is formed during this cutting step. The matrix is the waste substrate material around the shapes. Step (B) involves cutting the substrate with a second cutting step to form a test sample. The test sample is comprised of part of one shape, part of the next adjacent shape, and the matrix around the shape parts. Step (C) involves separating the matrix from the shape parts while measuring the force required to separate the matrix from the shape parts and measuring the displacement of the separating force.

Abstract: Methods and procedures for varying parameters at a work station where different size and/or type needles are automatically sutured to different size and/or type sutures, such as: a method and system for applying a predetermined, given tension to different size and/or type sutures; a system and method for inserting a suture into different size and/or type needles to a predetermined, given depth; and a method and system to cool different size and/or type sutures for a predetermined, given length of time. Values for these parameters may be stored in a supervisor computer and then transmitted to controllers to operate the work station with these parameter values for each of a plurality of different size and/or type sutures and/or needles.

Abstract: A semi-automated machine for singulating individual surgical needles from an bulk supply and attaching a suture to the surgical needle is described. Each of the surgical needles has a suture receiving opening formed therein for receiving a suture. The machine includes a needle singulation station, a precise positioning station, a suture feeding station, a swage station, a pull-test station and an off-load station. A universal gripper mounted on a rotary indexing device automatically receives each individual needle in a predetermined orientation and conveys the needle for sequential processing from station to station to form the needle-suture assembly. A swage station is provided for swaging the needle to close the suture receiving opening about the suture to secure said suture thereto and form therefrom a needle and suture assembly. The suture pull-test station tests each needle suture bond with a pre-determined pull for quality control. This pull is adjustable via a precision spring tension device.

Abstract: An improved method and device for measuring the mechanical properties of fibrin clots. A mixture of fibrinogen and thrombin is formed between two synthetic polymeric substrate materials and allowed to form a fibrin clot. The force required to separate the substrate materials is then measured and indicates the strength of the clot.

Abstract: Thermoplastic welding is an emerging technology targeted at significantly reducing the manufacturing cost of aerospace structure by eliminating fasteners and the touch labor associated with fasteners to prepare, install, and inspect the assemblies. Quality welds are highly dependent upon achieving appropriate temperatures everywhere along the bond line. The present invention is a system that evaluates the quality of the welds involving inputting an EM pulse to the embedded susceptor and listening to the acoustic response that the pulse generates to determine weld quality from the sound.

Abstract: A feed assembly for a pack seal tester includes a vertically extending housing having a top opening for receipt of packages therein and a bottom opening for discharge of packages therefrom. The housing includes a feed hopper comprised of two parallel movable opposed spaced C-shaped sidewalls. A piston plate is aligned to remove packages from the bottom opening and into a package test chamber, the package test chamber being in alignment with the bottom opening. The package test chamber includes means to align said packages at a preselected position for testing by a pack seal tester.

Abstract: An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.

Abstract: A fixture for use with a wire pull tester that tests the strength of a bond between an electrical contact of a semiconductor device and a wire affixed to the electrical contact. The fixture comprises a device support, a mounting surface provided on the device support, and a port provided at the mounting surface. The device support may include a height adjustment mechanism. The mounting surface may be configured to engage a surface of the semiconductor device and includes a port with which an air pressure differential is produced to maintain engagement between the mounting surface and the semiconductor device surface.

Abstract: A bonding defect detecting apparatus is provided for operation in conjunction with an ultrasonic wire bonder using an ultrasonic oscillator driven by a signal. The apparatus has A/D converters for digitally converting a signal waveform of the signal by real-time sampling during a bonding operation. A digital signal processing device is provided for calculating at least one signal characteristic of each of the signal waveforms for each of a plurality of the bonding operation. A data accumulating devices accumulates the at least one signal characteristic for n number of bonding operations of the plurality of the bonding operation. A calculating device calculates an average signal characteristic of the signal characteristics of the n number of bonding operations.

Abstract: A procedure and apparatus for testing the hot tack properties of heat sealable flexible packaging materials. A portion of a test strip of heat sealable material is lapped and a segment of this portion heat sealed together. Upon completion of the heat seal the unsealed ends of the test strip are pulled apart at a prescribed constant rate to gradually delaminate the heat seal while the heat seal is cooled at a prescribed rate. Force required to delaminate the seal is continuously recorded as a function of time as the heat seal cools, thus providing data on seal strength for a full range of temperatures of the heat seal as it cools over time. In the apparatus a threading bar intercepts the strip intermediate its ends and pulls a portion through the opening between opposed dies of a heat sealer and in doing so laps the portion of the strip pulled through the opening.

Abstract: A semi-automated machine for singulating individual surgical needles from an bulk supply and attaching a suture to the surgical needle is described. Each of the surgical needles has a suture receiving opening formed therein for receiving a suture. The machine includes a needle singulation station, a precise positioning station, a suture feeding station, a swage station, a pull-test station and an off-load station. A universal gripper mounted on a rotary indexing device automatically receives each individual needle in a predetermined orientation and conveys the needle for sequential processing from station to station to form the needle-suture assembly. A swage station is provided for swaging the needle to close the suture receiving opening about the suture to secure said suture thereto and form therefrom a needle and suture assembly. The suture pull-test station tests each needle suture bond with a pre-determined pull for quality control. This pull is adjustable via a precision spring tension device.

Abstract: The present invention relates to a method of testing and/or monitoring structural adhesively bonded joints by the introduction of transducers into the stress or strain field effected by the movement of said adhesively bonded joints under load, such that the load transfer characteristics between the bonded materials and the adhesive can be recorded thus allowing the quantification of the integrity of the adhesive bond lines in such joints. The method assesses the integrity of the bond by comparing the difference in maximum and minimum ratios and curve perameters relating to stress and strain with those of the "at assembly" values.

Abstract: A back-to-back, single lap-joint test fixture and method provides for uniform shear strength determination in a lap-joint area at an adhesive bond plane between a low-modulus rubber-like elastic material substrate and a stiff panel both defining a single lap-joint specimen, two of which are disposed back-to-back with the rubber substrates being constrained from lateral deformation by respective aluminum housings each having a load-transferring lip pushing upon a substrate also being pulled by load transferring dowel pins pulling upon the rubber substrate while with a restraining clamp that restrains transverse movement of the housing and rubber substrate all so as to produce only shear-type failures based on the near-incompressible nature of the rubber materials in the two back-to-back single lap-joint specimens.

Abstract: A tester for measuring a durability of a knitted yarn portion in which at least two sets of yarns, including a set of first yarns and a set of second yarns, are intersected, the tester includes: a first holding unit holding ends of the two sets of yarns at first positions that are relative to the knitted yarn portion; a second holding unit holding opposite ends of the two sets of yarns at second positions that are relative to the knitted yarn portion; and a position adjusting unit, connected to the first holding unit and the second holding unit, allowing at least one of the first positions and the second positions, relative to the knitted yarn portion, to be moved to other positions, thus varying an intersecting angle of the yarns of the knitted yarn portion.

Abstract: A back-to-back, single lap-joint test fixture and method provides for uniform shear strength determination in a lap-joint area at an adhesive bond plane between a low-modulus rubber-like elastic material substrate and a stiff panel both defining a single lap-joint specimen, two of which are disposed back-to-back with the rubber substrates being constrained from lateral deformation by respective aluminum housings each having a load-transferring lip pushing upon a substrate also being pulled by load transferring dowel pins pulling upon the rubber substrate while with a restraining clamp that restrains transverse movement of the housing and rubber substrate all so as to produce only shear-type failures based on the near-incompressible nature of the rubber materials in the two back-to-back single lap-joint specimens.

Abstract: A device for testing the holding force of fastening elements secured in a base material includes an axially extending load application member (5) engageable within an axially extending impact member so that the impact member can be displaceable axially relative to the load application member. The load application member (1) has a coupling region (3) at a front end and a stop surface (4) spaced axially from the coupling region and facing towards the first end of the load application member. The impact member (2) has a central passageway in which at least part of the load application member is displaceable. The impact member (2) has a first stop surface (6) facing a second end of the impact member (2). The coupling region is substantially cylindrically shaped and has projections (14) which extend radially outwardly from the outside surface of the coupling region. The projections (14) can be deflected elastically.

Abstract: An apparatus for testing adhesive shear strength having a cylindrical adhve bond between test specimens which is subjected to pure shear. The test specimens are two cylindrical rods. One rod has a bore and counterbore reamed into one end along its longitudinal axis. The other rod has a diameter essentially equal to the diameter of the bore. The adhesive to be tested is placed within the bore and counterbore and the smaller diameter rod is inserted into and seated at the base of the bore. The adhesive fills the space between the smaller rod and the counterbore, creating a uniform, cylindrical layer of adhesive between the exterior surface of the smaller rod and the inner surface of the counterbore. When the adhesive cures, the assembly is subjected to a tensile load along its longitudinal axis, tending to pull the inserted rod from the bore and subjecting the cylindrical adhesive bond to a pure shear load.

Abstract: A fixture for use with a wire pull tester that tests the strength of a bond between an electrical contact of a semiconductor device and a wire affixed to the electrical contact. The fixture comprises a device support, a mounting surface provided on the device support, and a port provided at the mounting surface. The device support includes a height adjustment mechanism. The mounting surface is configured to engage a surface of the semiconductor device and includes a port with which an air pressure differential is produced to maintain engagement between the mounting surface and the semiconductor device surface when a pull force provided by a wire pulling member of the tester is imparted to the wire affixed to the electrical contact of the semiconductor device.

Abstract: A fusion joint test system for a saddle fusion joint on a pipe includes a test plug having a rotatable swivel base with a hard robber foot for accommodating the curvature of the pipe, and for preventing the base from rotating once it comes in contact with the pipe. The base is connected to a threaded shank that engages the internal threads of a cylindrical bore of a connector that forms the saddle. The shank has a top end for receiving an electronic torque wrench. The torque wrench applies a predetermined torque on the plug, which exerts an upward force on the saddle joint. The shank may also have an air channel for also allowing fluid pressure to be applied to the fusion joint.

Abstract: A method and system are provided for testing the adhesive strength of a bond between an adhesive, a coating such as paint, or some other material, and an underlying substrate to which the test substance is bonded. The test may be performed at room temperature or in an environmental chamber at extreme conditions. An aperture is formed through the substrate and a thin film is employed to cover the aperture. The film extends beyond the perimeter of the aperture in contact with a first surface of the substrate. A coating of adhesive, paint, adhesive tape, or any other substance to be tested is then applied atop the film and the surrounding surface of the substrate in a smooth, continuous layer. A membrane which maintains its elastic property with only minor yielding during the test is bonded to the test substance, either directly or by means of a layer of high-strength adhesive interposed therebetween.

Abstract: An apparatus for testing the adhesion quality of a coating on the interior surface of a hollow cylindrical substrate, and a method for its use, the apparatus comprising an element joined to the coating, the element having a joining face at one end, a neck at the other end for pulling in a direction perpendicular to the joining face, and a channel through the element aligned with the direction of pulling; a non-adhering plug present in the channel of the element effective to be maintained in contact with the coated surface while extending through and out of said element; a die cut adhesive disc gluing the face of the element to the coated surface as a result of pressure and heat, said disc having a die cut circumference and inner opening commensurate with the size of the plug extending therethrough; a piston and piston housing assembly in which the piston housing is slidable on the piston in response to pressure and has an extension circumferentially overlapping the neck of the element to place a substantially

Abstract: A method of predicting the adhesion of a metal surface for painting or bonding comprising pressing an elastomer pad against the surface with a known force for a certain minimum time, measuring the force required to pull the pad away from the surface, and comparing that force with an empirically derived standard.

Abstract: A tensile strength or pull strength testing of a semiconductor bump electrode is measured without mounting a semiconductor chip on a substrate or the like. A probe to be inserted into a semiconductor bump electrode is heated up to a temperature at which a metal of the bump electrode 21 is fused, and then the probe having been heated up to the temperature to fuse the metal of the bump electrode is inserted into the bump electrode so that the metal of the bump electrode is fused. Further, the fused metal of the bump electrode is cooled down together with the probe to solidify the same. Thereafter, the probe fixed within the bump electrode is pulled vertically relative to the bump electrode until the bump electrode breaks. At the time of breakage of the semiconductor bump electrode, the pull force is detected as the pull strength of the bump electrode.

Abstract: A device for measuring the bonding load of the bonding arm of a bonding machine including a frame body, a screw shaft rotatably installed in the frame body, a turning member for turning the screw shaft by hand, a screw assembly screw-engaged on the screw shaft so as to be movable on the screw shaft when the screw shaft is rotated, a slider connected to the screw assembly, a gauge holder provided on the slider for installing a tension gauge, a lifting member attached to the tension gauge so that the engagement part of the lifting member can engage with the bonding arm, and a mounting assembly for mounting the frame body to the wire bonding machine.

Abstract: To determine the tensile breaking force of a selected rod/wrap member weld joint in a metal screen of a tubular sand screen assembly used in downhole oil and gas recovery operations a test specimen, including a single rod segment and arcuate segments of the wrap member welded thereto, is removed from the screen. The removed test specimen is supported between base and cover portions of a specially designed test fixture, and a compressive force is exerted on the fixture to forcibly move the base and cover portions thereof toward one another. Representatively, the fixture is operatively positioned in a conventional spring test machine that exerts such compressive force on the fixture. The base and cover portions of the test fixture are configured such that the compressive force is converted to a tensile force exerted on a selected single rod/wrap weld joints in the specimen, with the spring test machine recording the tensile force exerted on the weld joint at its breakage.

Abstract: A removable tab process whereby tabs (7) are affixed to the pads (3) by initially having the bonding surface as flat as possible so that bonding pressures from pad to pad are relatively uniform. Bonding is performed with the pressure applied to the pads being such that the tabs can later be easily removed without damage to the die pads, yet sufficiently strong so that the tabs do not come loose during burn in and testing. A bond strength pull between about 5 and about 40 grams per pad is appropriate for this purpose. The tabs are removed by placing the tested die (1) and attached tabs in a fixture (11) and providing a tool (31) dimensioned and moved along a path (13, 15, 17, 19) whereby each of the tabs is serially removed with the pressure applied to each tab to provide removal being preferably no greater than 40 grams.

Abstract: A novel pull strength tester is incorporated into an automatic wire bonder for performing pull strength tests during production bonding operation. The pull strength tester is provided with a control for automatically applying increments of pull force on a fine wire after making a bond. The control senses the elongation of the fine wire as a result of the force applied and is capable of terminating the pull test at a predetermined threshold value or continuing to increase the force until a break occurs. After each increase in force, a continuity circuit determines if the wire has broken at the bond or the bond has lifted off the bonding target. The system employs the information to determine if a proper bond was made and/or if a short tail was made which could affect the subsequent attempt to form a proper ball for a subsequent first bond.

Abstract: An automatic pull-testing apparatus for testing the strength of an armed surgical needle comprises a supporting blade for supporting a suture receiving end of the armed needle and having at least one suture receiving guide therein. A first gripping device is provided for releasably retaining the armed needle in an oriented position, and for positioning the armed needle at the supporting blade to enable the suture strand depending therefrom to be threaded at the suture receiving guide. A second suture gripping device grips the suture at a position below the suture receiving guide of the supporting blade. A slide block counterweighted to a predetermined weight is connected to the second suture gripping device for applying a controlled positive downward force upon the suture strand.

Abstract: The present invention comprises a test system for non-destructively testing the attachment strength of a plurality of electric wires each connected to a corresponding input/output (I/O) port in an integrated circuit (IC) dice. The test system comprises a test bench for placing said integrated circuit dice thereon. The test system further comprises a force asserting means including a testing pin for asserting a controlled amount of pressing force along a predefined direction to each of the electric wires near said corresponding I/O ports on said IC dice. The test system also includes a control means including a testing arm connecting to the testing pin for controlling and positioning the testing pin to apply the controlled amount of force to each of the electric wires. The control means further includes a force measurement means for measuring the amount of force applied to each of the electric wires.

Abstract: This invention relates to an apparatus and method for measuring the peel strength of a paper joint which is adhesively bonded. Such structures of this type, generally, allow the peel strength of the adhesively bonded joint to be accurately and repeatably measured in an inexpensive manner.

Abstract: An induction heating device includes an induction heating gun which includes a housing, a U-shaped pole piece having two spaced apart opposite ends defining a gap therebetween, the U-shaped pole piece being mounted in one end of the housing, and a tank circuit including an induction coil wrapped around the pole piece and a capacitor connected to the induction coil. A power source is connected to the tank circuit. A pull test machine is provided having a stationary chuck and a movable chuck, the two chucks holding two test pieces bonded together at a bond region. The heating gun is mounted on the pull test machine in close proximity to the bond region of the two test pieces, whereby when the tank circuit is energized, the two test pieces are heated by induction heating while a tension load is applied to the two test pieces by the pull test machine to determine separation strength of the bond region.

Abstract: A hydraulically driven, dynamic tensile testing device wherein a test sample attached to an underlying surface can be secured to the device and subjected to tensile forces in that the device is raised from the underlying surface, where the device rests against the underlying surface on three or more legs connected to interacting pistons (6). The interacting pistons are preferably hydraulic pistons that are pressurized by means of a hydraulic fluid which is distributed through interconnected ducts in such a way that the legs have a constant, even pressure. The device thus ensures that the tensile forces are evenly distributed on the cross-section of the test sample.

Abstract: A static load tester is shown that provides tensile testing of plated test specimens to detect hydrogen embrittlement damage from plating processes. The functional components of the device are centrally aligned within a channel of an I-beam frame. A load cell and electronic readout provide the user with a measure of the tensile force applied to up to eight test specimens mounted end to end in a tester. Tension is applied to the specimens through use of a simple threaded rod and nut load application system at the base of the device. A static load tester may be incorporated into each channel of the I-beam frame, thereby providing a double testing unit. Additionally, a series of I-beam frame tester configurations may be incorporated into one multiple testing unit. Each multiple testing unit has a number of static load testers equal to double the number of I-beam frames mounted into the unit.

Abstract: A method and an apparatus for determining the operability of a semiconductor chip including at least one bond between the semiconductor chip and at least one electrical lead, the at least one electrical lead having a first surface, the at least one bond connecting the first surface to the semiconductor chip. The apparatus has a handling carrier rigidly supporting the semiconductor chip, a test socket containing the handling carrier for providing an electrical path from the test socket to the at least one electrical lead and through the at least one bond to the semiconductor chip and back, and a computer for applying an electrical signal to the electrical path for generating an output signal. A gas nozzle is provided, positionable near the first surface, for directing a gas flow at the first surface while an electrical signal is applied. The gas flow generates a force on the electrical lead in a direction away from the semiconductor chip.

Abstract: A compound sheet with a welded seam is arranged on a table (2) of the device (1). By lowering a cutting and bending punch (4), a cutout is cut from the compound sheet and bent downwards. A pulling device is arranged inside the device (1) underneath the table (2) to seize the downwardly bent cutout and tear it off the compound sheet. The quality of the weld can be evaluated by visual inspection of the appearance of the rupture point, in a known manner. In this way, tear test specimens of consistent quality and informativeness can be prepared very quickly and easily.

Abstract: A reliable, repeatable, well-characterized, safe technique for testing the mounting integrity of heat sinks adhered to semiconductor packages is disclosed. Generally, a semiconductor package is secured in a tensiometer, the heat sink is clamped and secured to the spindle of the tensiometer, and a stud-pull type test is conducted.

Abstract: A procedure and apparatus for testing the hot tack properties of heat sealable flexible packaging materials. A portion of a test strip of heat sealable material is lapped and a segment of this portion heat sealed together. Upon completion of the heat seal the unsealed ends of the test strip are pulled apart at a prescribed constant rate to gradually delaminate the heat seal while the heat seal is cooled at a prescribed rate. Force required to delaminate the seal is continuously recorded as a function of time as the heat seal cools, thus providing data on seal strength for a full range of temperatures of the heat seal as it cools over time. In the apparatus a threading bar intercepts the strip intermediate its ends and pulls a portion through the opening between opposed dies of a heat sealer and in doing so laps the portion of the strip pulled through the opening.

Abstract: A connector assembly for connecting to a chip and a substrate for testing the bond between a chip and a substrate in a testing apparatus, the connector assembly comprises a pair of connector blocks, each block having a generally square planar connecting face for bonding to oppositely directed faces of a chip and substrate, and a coupling end for mounting in a tensile testing machine, and a swivel connector assembly for connecting to the coupling and mounting in a tensile testing machine for the application of aligned tension to the chip and substrate.

Abstract: Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample having first and second bond foots affixed to respective first and second support pads. The method and apparatus monitors the voltage levels of first and second electrically conductive probes. The first probe has a primary lead in electrical contact with the first support pad and a secondary lead in electrical contact with the first bond foot. Similarly, the second electrically conductive probe has a primary lead in electrical contact with the second support pad and a secondary lead in electrical contact with the second bond foot. Voltage detection circuitry is provided in electrical contact with the first and second probes for detecting the voltage level at each of the respective primary and secondary leads to generate the respective corresponding output signals.

Abstract: The procedure heretofore of transporting industrial slings annually to and from the industrial site where the sling is used and a test facility for stress testing the sling, and the concomitant withdrawal of the sling from industrial use for a day or more, are avoided by mounting the stress testing equipment on a motorized vehicle to enable such testing at the industrial site.

Abstract: A process for nondestructive testing of beam lead bonds in disclosed. A high pressure liquid jet is applied to the beam leads adjacent the bond pad such that a force is applied to the lead in the opposite direction of the bonding step. If the bond does not have sufficient strength, the lead is bent away from the bonding pad and can be detected either visually or electrically. If the bond does have sufficient strength to withstand the force, no degradation of the bond occurs.

Abstract: With relation to a first test piece with an adhesive applied thereto, a second test piece is swiftly moved close to the contact bonding position by a movable actuator, and then the second test piece is pressed by a pressing actuator on the first test piece for contact bonding. When the both test pieces joined together are peeled from one another, a peel load is detected by a load cell via a table which is supported by the load cell and on which the test pieces are fixed. If a corrugated board is used as a test piece, it is held by a holding member consisting of a plurality of parallel needles which have been inserted from the side into the intermediate portion between one surface and another of the test piece and common frame members for securing the ends of the needles.

Abstract: A method and apparatus are provided for determining the strain developed in a coated surface. A beam with a coating on a surface thereof is mounted as a cantilever and a force is applied to the free end of the beam to cause deflection of the beam until the coating on the beam fails. The strain in the beam, and hence in the coating at the point of failure, is determined based on the dimensions of the beam, the point along the beam where failure of the coating occurs and the amount of deflection of the beam, and this determination is made independently of the temperature of the beam and the material from which the beam is made. The determination is made based on the equation E=1.5.sub.x /1.sup.3, where E is strain, h is the beam thickness, d is the beam deflection, x is the distance from the free end of the beam to the point where failure of the coating occurred, and l is the length of the beam.

Abstract: An adhesive testing device includes a movable carriage (2) carrying a substrate (4) to which adhesive is applied by an applicator wheel (32). The carriage is brought to rest opposite the anvil (46) carrying another substrate. The substrates are pressed together and the force required subsequently to separate them measured. In a preferred arrangement the anvil is carried by a beam (48) bearing a strain gauge (60). The carriage is preferably inverted during its movement to the applicator wheel: this allows it to have its operative surface uppermost initially for ease of application of the substrate. Various parameters (e.g. periods between operations, speed of the carriage, temperature of adhesive and/or anvil) may be varied to simulate conditions in a packing machine.

Abstract: A device for testing the strength of a glue bond of a paperboard container corner section, which section includes one wall panel adhesively secured in face-to-face relationship to a glue flap which is foldably joined to and extends at right angles from another wall panel, by determining the force required to separate the one wall panel from the glue flap.The device has a pair of platforms mounted for pivotal movement about a common axis, each carrying clamping elements for gripping one portion of a container corner section, and a load cell associated with one platform and operable to measure the force required to separate the one wall panel from the glue flap, based on the relative movement of the platforms.

Abstract: A system for testing the properties of a material used in sealing gaps between aircraft panels. The system includes a first device having a pair of interior plates positionable on opposite sides of a first specimen, a pair of intermediate plates located on the sides of the interior plates remote from the first specimen, a pair of exterior plates located on the sides of the intermediate plates remote from the specimen, drive shafts coupled to the exterior plates, a first mechanism connected to the drive shafts for imparting motion thereto, and a first electrical device connected to the interior plates for testing the properties of the first specimen during the operation of the first mechanism.

Abstract: A method includes applying a fluid force to a lead and determining if a lead separates at its bond in response to fluid force. The fluid can be applied to all the leads simultaneously or to given groups of leads. The determination of how many and which leads are separated is produced by positioning a sensor adjacent the leads and an indicator.

Abstract: The test method employed uses a cylindrical solid aluminum pin having a first stem portion and a threaded second portion separated by a middle necked down portion. The test pin threaded portion is inserted into a flowable adhesive such as an epoxy inside a joining pin located in a hole through abutting honeycomb panels and the epoxy is allowed to cure. A force is exerted on the first portion of the test pin until either the test pin separates at the necked down portion or the test pin is dislodged from the joining pin. In the latter case, the test indicates an improper mixture or a poor curing of the adhesive.

Abstract: In a method for examining the quality of adhesion in a vulcanized rubber-adhesively bonded metal part made by adhesively bonding a rubber member to a metal with an adhesive for rubber applied thereon in a vulcanization-forming or molding, a small rubber test piece is previously vulcanization-formed or molded together with the rubber member onto a portion of the metal surface other than the bonded joint of the rubber member, and the small rubber test piece is teared off from the metal surface, thereby discriminating the part whether the adhesion is good or bad.

Abstract: A cover tape is adhered to a receiving tape which is provided with a plurality of cavities distributed for receiving components, to close the openings of the cavities. In order to measure the force required for stripping the cover tape from the receiving tape, the cover tape is bent to be at a prescribed stripping angle from a longitudinal end thereof to be stripped from the receiving tape, and the cover tape and the receiving tape are moved to be separated at the same speed from each other along loci of linear movement respectively while retaining the stripping angle. Tensile force acting on the cover tape is measured during such movement, thereby determining the force required for stripping the cover tape.