Sawing Patents (Class 125/12)
  • Patent number: 6678959
    Abstract: A grout removal tool includes an adapter having a replaceable cutting blade mounted thereon. The adapter is configured to be installed within a common reciprocating saw. The adapter has a proximal attachment end for attachment to the saw, an elongated proximal leg extending from the proximal attachment end, and an elongated distal leg extending from the proximal leg at an angle to terminate in a distal end whereupon the cutting blade is attached. When the proximal attachment end of the adapter is installed within the reciprocating saw, the cutting blade reciprocates in a parallel plane beneath the plane in which the proximal leg reciprocates. When the cutting blade is reciprocated across a grouted work surface, it results in a high rate of grout removal with low dust dispersion.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: January 20, 2004
    Assignee: Midwest Trade Tool, Inc.
    Inventors: William Phillip, Lonnie E. Middleton
  • Patent number: 6679243
    Abstract: The present invention provides a superabrasive tools and methods for making the same. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy that contains Cr, Mn, Si, or Al or mixtures thereof.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: January 20, 2004
    Inventor: Chien-Min Sung
  • Publication number: 20040007225
    Abstract: A movable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials in which in the closed cell foam. Metallic inserts may be used to bond to either or both of the foam and the composite skin to accept working components. A saw is also described which uses gears sharing the same support element.
    Type: Application
    Filed: March 18, 2003
    Publication date: January 15, 2004
    Inventor: Anthony Baratta
  • Patent number: 6669537
    Abstract: A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t1, and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t2 greater than the thickness t1. The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 &mgr;m or less, and the relation between the thicknesses t1 and t2 is set to t1+0.01 mm≦t2≦t1+0.05 mm.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: December 30, 2003
    Assignee: Fujitsu Limited
    Inventors: Akio Maeda, Takashi Shiotani
  • Publication number: 20030230297
    Abstract: In a method for producing wall panels, bricks (9) are partly cut at a cutting station, conveyed to a line-up path (5) and then masoned into wall panels. Bricks (9) to be cut are gripped by a transport and holding device (12; 12a; 34; 49; 66), transported to the cutting station (19, 20; 24a; 50) and cut at the cutting station (19, 20; 24a; 50) in the required cutting planes in the state as clamped in the transport and holding device.
    Type: Application
    Filed: June 17, 2002
    Publication date: December 18, 2003
    Inventors: Dieter Ainedter, Christoph Ainedter
  • Patent number: 6662799
    Abstract: A vertical wafer sawing apparatus for separating semiconductor devices formed on a semiconductor wafer includes a chuck table disposed vertically to a supporting surface of the chuck table and a scribing member moving perpendicular to the wafer surface to dice the wafer. The chuck table or a scribing member moves in one specific direction at least among the directions of the x, y and z-axis. The direction of the x-axis runs perpendicular to a wafer stage, on which a wafer is loaded, and parallel to the ground or the support surface for the chuck table. As a result, the set-up dimensions of the apparatus can be decreased even as wafer size increases. Further, contaminants such as silicon scraps and dust on the wafer can be efficiently removed during the wafer sawing process.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: December 16, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Kuk Kim, Seung-Chul Ahn
  • Patent number: 6659097
    Abstract: A decorative tile set of nonuniformly-shaped tiles (tiles with non-parallel sides and/or non-perpendicular comers) is manufactured for interlocking installation adjacent uniformly-shaped tiles, i.e., adjacent to tiles having parallel sides and/or perpendicular corners, as in standard flooring tiles such as laminate flooring planks. A sacrificial bed having a planar upper bed surface is provided, and trenches are cut in the sacrificial bed to define areas on the upper bed surface which at least substantially correspond to tile boundaries. At least one workpiece from which the tiles are to be cut is then provided atop the sacrificial bed with its finished face closely held against the sacrificial bed. The workpiece is then cut to produce tile blanks bounded by tile blank boundaries, with the tile blank boundaries being outwardly spaced from the desired tile boundaries by an offset distance.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: December 9, 2003
    Inventor: Daniel J. Houston
  • Patent number: 6659843
    Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: December 9, 2003
    Inventors: John N. Boucher, David E. Bajune
  • Patent number: 6660384
    Abstract: Compound tile with natural stone visible side, preferably marble, of the type comprising a plate of natural stone having a reduced thickness and firmly fixed by adhesive means to a rigidification supporting sheet, said support having a particular composition which is adapted to the physical characteristics of the natural stone plate.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: December 9, 2003
    Assignee: Uralita de Productos Y Servicios, S.A.
    Inventors: Juan J. Pastor Segura, Kepa Ceara Apraiz, Jose Maria Martinez Tejera
  • Patent number: 6651644
    Abstract: A rotating blade for a cutting machine having a new arbor mounting hole. The arbor mounting hole has five sides arranged in a cut gem configuration. The arbor mounting hole is symmetrical on either side of a mid-line. However, the mid-line of the arbor mounting hole need not pass through the geometric center of the blade. Inserts are provided. The inserts fit into the arbor mounting hole. Each of the inserts defines an aperture for receiving a drive arbor of a different configuration. The apertures are off-set in the inserts, to compensate for the off-set arbor mounting hole, so that the apertures are disposed at the geometric center of the blade when any insert is placed in the arbor mounting hole.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: November 25, 2003
    Inventor: Edward Zuzelo
  • Publication number: 20030213482
    Abstract: For a power cut-off saw, a debris-collection device pivotably mountable to the cut-off saw. The device has a collection chamber with a top slot and a front slot in communication with the top slot. Both slots are adapted to receive the cut-off saw blade; the front slot is adapted to capture dust from the cut. A debris-control component may, but need not, cover the top slot and permits entry of the saw blade but prevents dust from escaping. A discharge arm on the top of the collection chamber has a hollow channel which communicates with the collection chamber and facilitates the discharge of dust from the collection chamber by an externally connected vacuum source which suctions out the collected dust.
    Type: Application
    Filed: May 15, 2002
    Publication date: November 20, 2003
    Inventors: John P. Buser, Terry R. Alley
  • Patent number: 6640796
    Abstract: A method for separating slices from a hard brittle workpiece involves subjecting the workpiece to an advancing movement and pressing it onto wires of a wire web of a wire saw, the wires being under a defined wire tension and making contact with the workpiece over a cutting depth along a cutting contour. The wires are lifted off the cutting contour an number of times while the wire tension is kept substantially unchanged, with the aid of rolls of a roll system. The roll system comprises at least one roll that is moved onto the wire web and back, the roll system comprising at least two moveable rolls which flank the workpiece. A wire saw is suitable for carrying out the method.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: November 4, 2003
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Karl Egglhuber, Jörg Lukschandel
  • Patent number: 6638153
    Abstract: The invention relates to a diamond saw blade which is made by attaching improved undercut preventing tips, produced by diffusing and joining cobalt-based powder onto ultra hard tips at a high temperature, to respective shank slot walls formed on the circumference of a diamond saw blade by means of laser welding in order to remove drawbacks of high cost or insecurity with the conventional art.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: October 28, 2003
    Assignee: Ehwa Diamond Ind. Co. Ltd.
    Inventors: Chang Hyun Lee, Youn Chul Kim
  • Patent number: 6626166
    Abstract: Abrading and cutting devices such as saws include waste containment systems and methods to improve removal of slurry or other contaminants from a work area during operations, and separation of slurry from a carrying medium such as air. A vacuum bar includes high and low vacuum openings to help focus flow and to conserve vacuum pressure. One opening faces the saw blade. A slurry containment and separation container includes walls and configurations for the inlets and outlets that enhance cleaner separation of the air and the slurry. Coolant is applied to the saw blade to make operation and cleanup more efficient. The vacuum generator can operate off of the power generated by the machine.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: September 30, 2003
    Assignee: Electrolux Professional Outdoor Products, Inc.
    Inventor: Anthony Baratta
  • Patent number: 6612300
    Abstract: The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed. The present invention is characterized by being a method for completely cutting through a hard, brittle material 1 using a disk-shaped rotary grindstone 2, wherein the cross-sectional shape of the outer peripheral edge 20 of rotary grindstone 2 has a V-shaped pointed shape.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: September 2, 2003
    Assignee: Denso Corporation
    Inventors: Shinji Mukota, Satoshi Ishikawa, Satoru Yamaguchi, Hiromi Katou
  • Publication number: 20030150442
    Abstract: A cutting tool for cutting hard rock, said cutting tool including one or more cutting elements (10) each comprising a pointed or chisel-shaped body (12) including a diamond composite material including diamond crystals bonded together by a silicon carbide matrix, the each cutting element being mounted into a supporting matrix comprising a metal matrix composite material, such that the point or chisel edge of the each element protrudes from said matrix.
    Type: Application
    Filed: November 18, 2002
    Publication date: August 14, 2003
    Inventors: James Norman Boland, Kit Bunker, Paul Edwin Willis
  • Publication number: 20030131838
    Abstract: The invention is based on a cutting tool, in particular a tile cutting tool, with a base body (10), which can be clamped into a tool-holding device of a machine tool and driven to rotate, and with a cutting head (12) that is set with cutting particles (14).
    Type: Application
    Filed: September 11, 2002
    Publication date: July 17, 2003
    Inventors: Guenther Berger, Marianne Berger, Frank Berger, Stephane Chomienne
  • Patent number: 6591826
    Abstract: The invention relates to a device on a handheld cutting or sawing machine with a rotatable cutting or sawing blade; a driving machinery for rotating the blade; means for supplying cooling or flushing water on the blade and/or a workpiece; a rear handle with controls for the driving machinery; a front handle bow with a front part (5) which is the normal gripping part of the handle bow; a right hand side part (6) and a left hand side part; and a water valve (8) for control of the flow of cooling or flushing water, said valve comprising a valve housing (27) with a valve house chamber (33); a valve body (36) which is turnable about an axis of rotation (23) by means of a lever (22); an inlet nipple (15) for the connection of a water hose (16) for incoming water to the valve; and an outlet nipple (17) for the connection of a water hose (10) for outgoing water from the valve; and securing means (35, 43) for mounting the water valve on the handle blow.
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: July 15, 2003
    Assignee: Aktiebolaget Electrolux (publ)
    Inventor: Ove Donnerdal
  • Publication number: 20030116152
    Abstract: The invention provides a chuck for holding a workpiece, such as a chip-array semiconductor Chip Scale Packages (CSP) substrate, having a plurality of components such as CSPs to be singulated, and chaff areas of the components. The chuck comprises means to hold the chaff areas when the components are being singulated, that may include a first pressure means to hold the components and a second pressure means to hold the chaff areas.
    Type: Application
    Filed: December 26, 2001
    Publication date: June 26, 2003
    Applicant: ASM Automation Assembly Ltd
    Inventors: Yiu Ming Cheung, Ka Wing Wong
  • Publication number: 20030104765
    Abstract: A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t1, and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t2 greater than the thickness t1. The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 &mgr;m or less, and the relation between the thicknesses t1 and t2 is set to t1+0.01 mm≦t2≦t1+0.05 mm.
    Type: Application
    Filed: March 22, 2002
    Publication date: June 5, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Akio Maeda, Takashi Shiotani
  • Publication number: 20030084894
    Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.
    Type: Application
    Filed: September 27, 2002
    Publication date: May 8, 2003
    Inventor: Chien-Min Sung
  • Patent number: 6543434
    Abstract: A device for simultaneously separating a multiplicity of wafers from a hard brittle workpiece having a longitudinal axis, with a wire web made from saw wire and with an advancing device which brings about a translational relative movement, which is perpendicular to the longitudinal axis of the workpiece, between the workpiece and the wire web of the wire saw, in the course of which movement the workpiece is passed through the wire web, wherein the wire web is formed from a multiplicity of individual wires, and wherein there is a device for holding and rotating the workpiece about the longitudinal axis.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: April 8, 2003
    Assignee: Wacker-Chemie GmbH
    Inventors: Bernhard Holzmuller, Ulrich Wiese, Jochen Greim
  • Patent number: 6543433
    Abstract: A dressing center with a roller unit wherein a saw blade is smoothed. The saw blade is led centrically to an ideal plane between corresponding roller pairs. Each roller pair has a roller with a convex running surface and a roller with a concave running surface. The upper rollers are mounted in corresponding bearing blocks. The bearing blocks have threaded sleeves into which the threaded spindles engage. The threaded spindles are driven by stepper motors. The stepper motors are activated as a function of measured unevennesses. Movement of the upper rollers is achieved as a distance proportionally to the measured unevennesses. With a distance-proportional correction, the smoothing is practically achieved in one operating cycle, directly to a desired final measure. The continuously bearing roller pairs result in a method that functions with an extremely low noise level.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: April 8, 2003
    Assignee: Iseli & Co. AG Maschinenfabrik
    Inventor: Benno Iseli
  • Patent number: 6540501
    Abstract: A method for creating decorative patterns on surfaces of cured concrete blocks includes a plurality of texturing elements secured to one or more rotatable shaft via a plurality of flexible support cables. Upon rotation of the shaft, centrifugal force causes the secured texturing elements to radially extend from the shaft. The blocks are preferably positioned such that the rotating texturing elements repeatedly come into contact with particular surfaces of the blocks, thereby forming a textured or antiqued pattern on such block surfaces. In a particular embodiment, the rotatable shaft is reciprocally moved in a direction parallel to the block surfaces to be patterned, whereby an entire block surface is exposed to the rotating texturing elements.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: April 1, 2003
    Assignee: Allan Block Corporation
    Inventor: Timothy Allen Bott
  • Publication number: 20030051720
    Abstract: A tile cutter (10) comprises a cutting wheel, a motor which drives the wheel in use, and a main housing body (MB) and a worktop (WT) mounted on the main housing body (MB) to define a cutting surface (14) upon which tiles may be supported when being cut. The main housing body (MB) comprises a first compartment (12) for housing the motor and a second compartment (13) for housing the cutting wheel. The second compartment (13) defines an open topped water compartment. The worktop (WT) has a main body (BM) fixedly secured to the main housing body (MB) and has an access opening closed by a movable access lid (24) overlying the second compartment (13) to close the open top of the water compartment. The access lid (24) provides access to the water compartment. The worktop (WT) further includes one or more open topped drainage channels (15) communicating with the cutting surface (14) and the water compartment to permit, in use, water to drain from the cutting surface (14) to the water compartment.
    Type: Application
    Filed: August 8, 2002
    Publication date: March 20, 2003
    Applicant: Turner Intellectual Property Limited
    Inventor: Iain Bradfield
  • Publication number: 20030047176
    Abstract: The present invention provides for an apparatus for forming a V groove in a sheet of natural, synthetic or engineered stone material. The apparatus comprises a table for supporting a work piece of natural, synthetic or engineered stone material to be cut, two or more cutting heads aligned to cut along the same line of the work piece of natural, synthetic or engineered stone material and a means of moving the work piece or the cutting heads relative to one another to cut the V groove in the natural, synthetic or engineered stone work piece. Each of the cutting heads removes material from the natural, synthetic or engineered stone work piece with the final cutting head forming the shape of the desired V groove. Each of the cutting heads is provided with a means for air cooling the cutting surfaces.
    Type: Application
    Filed: September 6, 2002
    Publication date: March 13, 2003
    Inventor: Ted Benyovits
  • Patent number: 6526958
    Abstract: In order to enable the cutting of a soft ceramic green block by a dicing saw with excellent cutting accuracy and at high speed, heat treatment is performed on the ceramic green block to dissociate a plasticizer, thereby improving the hardness of the ceramic green block. Thereafter the ceramic green block is cut by the dicing saw.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: March 4, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noriyuki Kubodera, Yasuto Inagaki
  • Patent number: 6526959
    Abstract: An adhesive sheet for noise and shock absorption and a saw blade making use of it and manufacturing methods therefor for use in joining components of a cutting or grinding apparatus to generate vibrations and noises such as a cutting saw machine for a grinding or cutting material such as brick, concrete, granite, marble, etc. The adhesive sheet according to the present invention is composed of a resin adhesive such as denaturalized epoxy resin, phenol resin, rubber, or compound composition thereof etc., and a noise and shock absorption material infiltrated with the resin adhesive, and fabricated by infiltrating the noise and shock absorption material such as non-woven fabric, paper, or textiles with the resin adhesive such as denaturalized epoxy resin, phenol resin, rubber, or compound composition thereof etc., and drying the infiltrated noise and shock absorption material at a predetermined temperature for several minutes and hardening it by half.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: March 4, 2003
    Assignee: Ehwa Diamond Ind. Co., Ltd.
    Inventors: Chang Hyun Lee, Hyun Seok Choi
  • Patent number: 6508244
    Abstract: A tile cutting guide arrangement includes a cutting table, slidably supported on the supporting frame, having a main cutting channel wherein a saw blade of a power saw machine is arranged to overhanging travel along the main cutting channel, and a tile guider slidably mounted on the cutting table. The tile guider includes a plurality of rip guides spacedly formed thereon wherein each rip guide has a guiding edge, which is 45 degrees with respect to the main cutting channel, adapted for guiding an edge of a tile on the cutting table, so as to align a diagonal of the tile with the main cutting channel of the cutting table.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: January 21, 2003
    Inventor: Wy Peron Lee
  • Patent number: 6494197
    Abstract: Disclosed is a dicing machine for cutting a CSP plate into pellets and for transferring and putting them in a transport tray. The pick-up-and-transport means picks a selected pellet from a diced CSP plate to carry and put the so selected pellet in an allotted cell in a transport tray. On the way to the transport tray storage area, there is cleaning means for wiping and removing minute pieces of debris if any from the rear side of each pellet. The cleaning means includes a wiper in the form of rotary sponge roll, which is wet with washing liquid, and is rotated to expose its clean surface to each pellet all the time.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: December 17, 2002
    Assignee: Disco Corporation
    Inventors: Eiichi Yoshimura, Ken Togashi, Shinichi Namioka
  • Publication number: 20020162548
    Abstract: A tile cutting guide arrangement includes a cutting table, slidably supported on the supporting frame, having a main cutting channel wherein a saw blade of a power saw machine is arranged to overhanging travel along the main cutting channel, and a tile guider slidably mounted on the cutting table. The tile guider includes a plurality of rip guides spacedly formed thereon wherein each rip guide has a guiding edge, which is 45 degrees with respect to the main cutting channel, adapted for guiding an edge of a tile on the cutting table, so as to align a diagonal of the tile with the main cutting channel of the cutting table.
    Type: Application
    Filed: May 1, 2001
    Publication date: November 7, 2002
    Inventor: Wy Peron Lee
  • Patent number: 6470874
    Abstract: A concrete saw (10) includes a cutting assembly having a high compression diesel motor (38) mounted on a carriage (40) in turn slideably mounted in a frame (22) in turn pivotally mounted to parallel rails (14) of a chassis (12) moveably supported on the concrete surface by wheels (18, 20). Concrete slurry hardened on two pairs of UHMW slides (30, 44) provided between the sliding surfaces of the carriage (40) and the frame (22) will break away and fall from the slides (30, 44) when the belt tension is adjusted. A guard (58) prevents entry of concrete slurry to the belt drive and includes a housing (66) having a U-shaped wall (68) which closely conforms to the bottom periphery of the sheave (36) of the belt drive.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: October 29, 2002
    Assignee: Cimline, Inc.
    Inventor: Anthony J. Mertes
  • Patent number: 6457468
    Abstract: The vertical blade saw assembly for ceramic and masonry materials is designed to provide an assembly that allows the user to make cuts of any shape to ceramic tiles and masonry materials in order to permit the installation of precision cuts for a particular setting. The assembly has an electric drive motor that is protected from the coolant used to keep the blade from overheating. The assembly has a plurality of parallel arms that are connected and permit the oscillating motion of the arms. The vertical blade is connected to the arms which place the blade in motion. The assembly has a base unit to provide support for the assembly. A coolant tray is positioned around the base unit. A water pump and accompanying tubing is used to circulate the coolant to the blade. Several cutting blades are also disclosed.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: October 1, 2002
    Inventor: Nicolas Goldberg
  • Publication number: 20020129807
    Abstract: A tubular carrier and method of making such on which is to be mounted a plurality of spaced apart cutting segments which then comprises a core drill for cutting into a hard material, such as cement. The main section of the wall surface of the tubular carrier is relieved which forms a decreased diameter relative to the fore end of the tubular carrier on which are mounted the cutting segments. This relieving of the wall of the tubular carrier provides extra distance when operating of the core drill relative to the wall of the hole that is being produced thereby reducing side slap which thereby extends the useful life of the core drill by diminishing the wearing out of the tubular carrier.
    Type: Application
    Filed: March 16, 2001
    Publication date: September 19, 2002
    Inventor: Adolfo Cervantes
  • Patent number: 6443813
    Abstract: A process of dicing a bar to form a plurality of sliders having air bearing surfaces commences with defining a dice lane having a nominal surface between adjacent slider portions on the bar, opposite edges of the dice lane defining respective edge surfaces of adjacent slider portions. The dice lane is cut away with a blade to form an edge surface of the slider. A barrier trench is formed in the nominal surface along each edge of the dice lane. The barrier trench has a width that extends a predetermined distance into the slider portion of the bar from the edge of the dice lane and a predetermined depth to eliminate ridges in the air bearing surface of the slider. The barrier trench is formed either before or after the dicing of the slider. The slider thus formed is characterized by an absence of ridges in the air bearing surface.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: September 3, 2002
    Assignee: Seagate Technology LLC
    Inventors: Richard A. Strom, Gordon M. Jones
  • Publication number: 20020112715
    Abstract: This invention is an improved structure for saw clip. On the working desk, there is a lead trough. On the pivot of this working desk, there is a block section for items to wait to be sawed. A top pusher block, when moved onwards, can be used to fix the items so that the sawing process can go smoothly. Among the parts of this invention, there is a sliding trough on top of the block and the sliding trough and the lead trough go across each other. Moreover, a lead screw goes through both the sliding trough and lead trough. The lead screw can be adjusted to be at any position in the lead trough to change how the block is placed. Then, the block can be screwed tightly so that it will not turn upon receiving the pushing force from clipping.
    Type: Application
    Filed: February 22, 2001
    Publication date: August 22, 2002
    Inventor: Chiu-Chiang Huang
  • Publication number: 20020096165
    Abstract: A cutting machine has a blade mounted for reciprocating movement. A workpiece is rotated while the blade is reciprocated, and then the workpiece is rotated through smaller angles to complete the cut. A holder is attached to partially cut slices of the workpiece.
    Type: Application
    Filed: January 24, 2001
    Publication date: July 25, 2002
    Inventors: Frederick Schmid, Maynard B. Smith, Chandra P. Khattak
  • Publication number: 20020096166
    Abstract: A saw extension for supporting a hand-held portable rotary saw has a base, a plurality of wheels positioned to support the base above a surface, and an upwardly extending arm extending from the base to a control grip. The hand-held portable rotary saw is removably attached to the base with at least one locking pin positioned through a guide plate of the hand-held portable rotary saw and into at least one locking aperture of the base. The saw extension includes a power control mechanism mounted on the saw extension. The power control mechanism includes a power socket into which a saw power cord of the hand-held portable rotary saw can be plugged, a master power cord for electronically connecting the power socket with an external power source.
    Type: Application
    Filed: February 25, 2002
    Publication date: July 25, 2002
    Inventor: David Halstead
  • Patent number: 6422228
    Abstract: A portable concrete saw apparatus includes a motor having a rotatable shaft and a saw blade coupled to the shaft for rotation by the motor. A plate is coupled to the motor for supporting the motor. A housing surrounds the plate, motor and blade, the housing having a pair of tracks receiving opposite ends of the plate for sliding vertical movement relative to the housing. The housing includes a perimeter defining an opening in a lower side of the enclosure plane. A powered actuator is coupled between the housing and the plate for displacing the plate along the tracks between a fully retracted position wherein the blade is fully enclosed within the housing and an extended position wherein the blade projects from the housing through the opening defined by the perimeter to cut material from a work area within the perimeter and contiguous to the housing, the housing retaining the material cut by the blade from the work area.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: July 23, 2002
    Assignee: Keystone Engineering & Manufacturing Corporation
    Inventor: Winchester E. Latham
  • Patent number: 6418922
    Abstract: A method of cutting a wafer of a semiconductor material, including breaking the wafer along cutting paths using a knife hitting a sheet supporting the wafer in a frame. The method includes using knives of different lengths according to the wafer region in which the cutting path is located using a tool block including apparatus for receiving at least two knives of different lengths and for rotating step-by-step around an axis to change the knife that is active in the wafer cutting.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: July 16, 2002
    Assignee: STMicroelectronics S.A.
    Inventors: André Dubois, Jean-Pierre Levivier
  • Publication number: 20020083938
    Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.
    Type: Application
    Filed: September 18, 2001
    Publication date: July 4, 2002
    Inventor: Alois Tieber
  • Publication number: 20020078941
    Abstract: The present invention relates to a cutting block for a sawing machine for sawing stone blocks into slabs which has a pair of opposed yokes for tensioning a plurality of blades by means of tie-bars with spurs, wherein the tie-bars which hold the blades have a single spur between two blades placed side by side.
    Type: Application
    Filed: November 13, 2001
    Publication date: June 27, 2002
    Inventors: Alessandro Pozzi, Emilio Brusadelli
  • Patent number: 6398623
    Abstract: A working method capable of implementing various types of devices such as a slider available with high reliability without causing malfunction or the like due to contamination during an actual use is provided by solving a problem of deterioration in profile precision and a problem of contamination resulting from roughness of a cut surface or chipping. A wire saw comprising a wire having a diameter greater than a width of a portion cut by a first cutting step, namely, a width of a cut groove is brought into contact with the cut groove of a bar. While the wire saw is slid in a longitudinal direction, the bar is sliced across the overall thickness of the bar along the thickness of the bar. Thus, while the bar is cut, a final cut surface formed by cutting is smoothed.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: June 4, 2002
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Ryuji Fujii
  • Patent number: 6390896
    Abstract: A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed by a sawing wire which moves in a reciprocating manner and is covered with bonded abrasive grain. A cooling liquid is provided beneath the wire web, in which cooling liquid the sawing wire of the wire web is immersed when cutting off the disks. Also provided is a wire saw which is suitable for carrying out the method.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: May 21, 2002
    Assignee: Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Anton Huber, Joachim Junge, Jörg Moser
  • Patent number: 6360737
    Abstract: There is an annular or internal-diameter saw and a method of protecting the clamping edge and of cleaning the saw blade of this annular or internal-diameter saw. The annular or internal-diameter saw has an element which partly screens the clamping edge and is arranged in the vicinity of the clamping edge and the saw blade, and has an outer material layer on the clamping edge. The outer material layer faces the element and is substantially harder than a clamping edge material lying behind it. The method is distinguished by the fact that workpiece residues thrown against the clamping edge are shattered when striking the clamping edge. This is due to the fact that an element partly screening the clamping edge is provided in the vicinity of the clamping edge and the saw blade.
    Type: Grant
    Filed: February 8, 2000
    Date of Patent: March 26, 2002
    Assignee: Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Wolf-Rüdiger Kurtze, Leopold Neussl, Peter Lehfeld
  • Patent number: 6357432
    Abstract: A method of fabricating support members for wafer processing fixtures and the produce are disclosed. In the first step of the method, an elongate support member basic form is provided. The basic form has a substantially wedge-shaped cross-section and angular comers. A plurality of wafer-retaining slots are cut along one side of the support member basic form. The support member basic form can include a front surface and a rear surface, with at least one angular comer occurring on each of the surfaces. The comers have a larger radius on the rear than in the front. Attachment structures on terminal ends can be fixed to bases. The elongate support member basic form can be fabricated from an inert crystalline material, such as polycrystalline silicon or monocrystalline silicon.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: March 19, 2002
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Zehavi, Robert Davis
  • Patent number: 6354909
    Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: March 12, 2002
    Inventors: John N. Boucher, David E. Bajune
  • Patent number: 6349712
    Abstract: A saw extension for supporting a hand-held portable rotary saw has a base, a plurality of wheels positioned to support the base above a surface, and an upwardly extending arm extending from the base to a control grip. The hand-held portable rotary saw is removably attached to the base with at least one locking pin positioned through a guide plate of the hand-held portable rotary saw and into at least one locking aperture of the base. The saw extension includes a power control mechanism mounted adjacent the control grip. The power control mechanism includes a power socket into which a saw power cord of the hand-held portable rotary saw can be plugged, a master power cord for electronically connecting the power socket with an external power source, and a trigger switch for operably controlling the flow of power to the hand-held portable rotary saw.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: February 26, 2002
    Inventor: David Halstead
  • Patent number: 6345615
    Abstract: The wafer handling and support system disclosed herein does not use tape and is adapted for use in conjunction with a number of work stations. The wafer handling and support system includes a chuck plate comprised of a non-porous section surrounding a porous section and a robotic arm for transporting a chuck plate/wafer combination under vacuum. The chuck plate is sized to be carried by a wafer chuck and the porous section of the chuck plate is configured to support a wafer. The wafer may be held in place on the chuck plate by the application of a vacuum.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: February 12, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Warren M. Farnworth
  • Publication number: 20020014232
    Abstract: Cutting tools and machining tools are provided having PCBN tips and/or coatings bonded to their cutting or machining surfaces for cutting or machining cement and/or mineral based hard building materials such as Hardiplank®.
    Type: Application
    Filed: March 6, 2001
    Publication date: February 7, 2002
    Applicant: SMITH INTERNATIONAL, INC.
    Inventors: Michael J. Garcia, Denis G. Pearce