Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

Abstract: A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.

Abstract: Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.

Abstract: An electronic component handling apparatus includes: a moving device that presses a device under test (DUT) against a socket of a test head. The moving device includes: a pusher that contacts the DUT; and a heater that heats the DUT through the pusher. The pusher includes: an internal space; and a first flow path that communicates with the internal space. Fluid from the test head is supplied to the internal space through the first flow path.

Abstract: Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.

Abstract: A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each including a heater, includes receiving temperature information of the semiconductor packages from the tester while testing the semiconductor packages, calculating an overall average temperature of the semiconductor packages from the received temperature information, and individually controlling operations of heaters of the pusher units based on difference values between the overall average temperature and individual temperatures of the semiconductor packages.

Abstract: Device including an object accommodating system having two flaps defining between one another an accommodating space and bearing against a plate of a pushbutton arranged to move between a first position corresponding to the placing of the object in the accommodating space, this causing the ends of the flaps to move away from one another, and a second position corresponding to the removal of the object, this causing the two ends to move towards one another, the plate being connected to a compression spring bearing against a bottom wall of a housing.

Abstract: A circuit board testing device able to apply tests to the front and reverse surfaces of the circuit board includes a control unit, at least one testing unit, and a chassis. The chassis includes a bottom frame, a plug member slidably mounted to the bottom frame, a side frame connected to an edge of the bottom frame and a back plate which includes at least two installation parts. The back plate is fixed to the side frame, and the testing unit is installed to the chassis. A chassis is also disclosed.

Abstract: A tooling arm includes a housing, a drive system, a lead screw and nut assembly, and a scoop assembly. The lead screw and nut assembly is operably connected to the drive system such that rotation of the nut drives the lead screw upwardly and downwardly relative to the housing. The scoop assembly is operably connected to the lead screw. The scoop assembly has an open position and a closed position and movement of the lead screw downwardly responsively moves the scoop assembly from the open position to the closed position.

Abstract: A sensor for on-chip monitoring the effects of operating conditions on a circuit, Integrated Circuit (IC) chips including the sensors, and a method of monitoring operating condition effects on-chip circuits, e.g., for the occurrence of electromigration. The sensor includes a multi-fingered driver associated with a monitored circuit, sensitive to known circuit parameter sensitivities. Sense and control logic circuit selectively driving the multi-fingered driver, and selectively monitoring for an expected multi-fingered driver response.

Abstract: An automatic SMD storage tower has a shelfless interior for variable spacing of electronic component reels on pallets or as integral reel/guide units, with a great number of affixing locations on the interior of the SMD storage tower thereby increasing the storage capacity and ease of use. The technology disclosed also includes a reel pallet with shape defined places for holding a component reel and a tape guide with the component tape threaded therethrough.

Abstract: A method of manufacturing a component using electron beam melting includes providing a powder layer; selectively melting at least a part of the powder layer so as to generate a solid layer of the component using a first electron beam; identifying any defects in the solid layer by scanning the solid layer using a second electron beam; and then repeating these steps at least once so as to build up a shape corresponding to the component. The second electron beam has a lower power than the first electron beam. The method may also include steps of removing any identified defects in the solid layer by using the first electron beam to re-melt at least a part of the solid layer, and adjusting one or more parameters of the selective melting step so as to avoid future recurring defects based on stored data relating to the scanned solid layer.

Abstract: A semiconductor test apparatus includes: a tray housing unit configured to house a customer tray loading untested semiconductor chips, secondary semiconductor chips, and non-defective semiconductor chips; a loader configured to locate the untested semiconductor chips supplied from the tray housing unit on a loading set plate and load the untested semiconductor chips onto a test tray; a tester configured to test semiconductor chips loaded on the test tray; an unloader configured to unload semiconductor chips loaded on the test tray, classify the tested semiconductor chips, and locate the classified semiconductor chips on an unloading set plate; and a retest controller configured to transfer the secondary defective semiconductor chips and the non-defective semiconductor chips to the tray housing unit and transfer the first defective semiconductor chips to the loading set plate.

Abstract: A board work device includes a housing device, a holding device, a moving device, a first lane and a second lane, a corresponding relationship acquisition device, a priority order acquisition device, and a control device. The holding device exchangeably holds a board work tool that performs a board work on a board. The corresponding relationship acquisition device acquires a corresponding relationship between the types of the board work tool and each of the multiple board works for each of the boards. The control device controls the holding device and the moving device such that, when performing the board work based on the acquired corresponding relationship, in a predetermined case, the board work that is capable of being performed in the other lane is performed without exchanging the board work tool currently being held.

Abstract: In embodiments, a PCB reflow process may be carried out by the components of an automated system working together to separate PCBs from reflow carriers and transport the reflow carriers back to a previous station of the PCB reflow system. The automated reflow carrier recycling system that is described herein may include a clip unlocking mechanism, a PCB pickup mechanism, a shifter, one or more lifters, and one or more overhead conveyors.

Abstract: Disclosed is a liquid crystal module detection apparatus for detecting image-sticking, and a detection and evaluation system and method. The apparatus comprises: a sealed thermal-insulating transparent container (1), adapted to contain a liquid crystal module (5) to be tested; a temperature-control module, adapted to adjust the temperature inside the container; a signal generator module (4), adapted to provide a drive signal to the liquid crystal module to be tested. The apparatus employs a sealed, well thermal-insulating, transparent container, and utilizes the heat emitted from the panel and the backlight of the module itself to form a desired temperature environment for detection.

Abstract: One embodiment is a transport apparatus for moving carriers of microelectronic devices along a track, the transport apparatus including: (a) a track with two rails adapted to support the carriers; (b) a trolley adapted to be transported in a direction along the track by a linear actuator; and (c) a first and a second engagement feature attached to the trolley wherein the first engagement feature is adapted to engage temporarily with a first of the carriers, and the second engagement feature is adapted to engage temporarily with a second of the carriers; wherein a predetermined movement of the trolley slidably moves the first carrier onto a test position and slidably moves the second carrier off the test position simultaneously.

Abstract: An automatic module apparatus for manufacturing a solid state drive (SSD) includes a labeling apparatus, one or more test handler apparatuses and a sorting apparatus. The labeling apparatus is for printing a label on a SSD mounted on a carrier tray. The one or more test handler apparatuses are for transporting the carrier tray on which the labeled SSD is mounted and for testing the labeled SSDs to determine whether the labeled SSDs have any defects. The SSD sorting apparatus is for transporting the carrier tray on which the tested SSDs are mounted and sorting non-defective defective SSDs tested by the test handler apparatuses. The SSD labeling apparatus, the test handler apparatuses, and the SSD sorting apparatus are in-line and automated.

Abstract: The invention relates to computer visual recognition output image-aided LED die sorting system and sorting method. The computer visual recognition output image-aided LED die sorting system comprises an optical inspection device, a scanning device, a tablet computer device and a die sucking device. The scanning device scans an inspection result of the optical inspection device and transfers the scan data to the tablet computer device, and then the tablet computer device displays a recognition signal for a user to determine rapidly. Meanwhile, the sorting method can be performed to decrease the manpower cost and enhance the quality yield and production speed.

Abstract: A semiconductor package includes a first substrate including a plurality of first connecting portions disposed thereon, a second substrate disposed on a portion of the first substrate to be adjacent to the first connecting portions and including a plurality of conductive contact rails disposed thereon, and a plurality of conductive cantilevers respectively placed in contact with surfaces of the conductive contact rails so that one end portion of each conductive cantilever is electrically coupled to one of the first connecting portions and the other end portion slides along one of the conductive contact rails.

Abstract: A blood glucose monitor includes a can, a replaceable sensor cartridge that includes a frame, an upper spring disposed between the frame and the can, a case for housing the can and sealing the frame, a lower spring disposed between the can and the case, and a meter housing for sealing an upper portion of the frame. The can is capable of accepting the replaceable sensor cartridge. The frame of the removable cartridge has at least at least two walls defining a chamber for accepting a plurality of biosensors, and a bottom portion defining an opening and at least one sealing flange. The frame can further include a desiccant material capable of reducing humidity within the frame. The frame may be dimensioned such that an interference fit constrains the plurality of biosensors prior to inserting the frame within a blood glucose monitor.

Abstract: A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.

Abstract: The present invention provides an LED chip testing device that measures characteristics of an LED chip. The LED chip testing device includes: a rotation member that supports the LED chip and rotates the LED chip to a testing position where the characteristics of the LED chip are tested; and a tester installed next to the rotation member and serving to measure the characteristics of the LED chip at the testing position.

Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.

Abstract: A component handler (100) may include: a test plate (102) including multiple circular component-seating tracks (104) each including multiple component-seating sites (500) configured to retain an electrical component (510) such that its face (522) faces away from the test plate (102); a component receiving system (114, 106, 300, 302, 306, 308, 310, 400, 402, 502, and/or 508) positioned along a rotation path of the seating tracks (104); a component test module assembly (1502) for electrically contacting each electrical component (510) seated in a component-seating site (500); one or more collection bins (124); and a collection assembly (120) for collecting some of the electrical components (510) from component-seating sites (500) and directing the electrical components (510) into the bins (124) based on one or more tests conducted at the component test module assembly (1502).

Abstract: A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.

Abstract: A method of transferring storage devices within a storage device testing system includes actuating an automated transporter to retrieve multiple storage devices presented for testing, and actuating the automated transporter to deliver each retrieved storage device to a respective test slot of the storage device testing system and insert each storage device in the respective test slot.

Abstract: A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

Abstract: A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: A method of testing objects and an apparatus for performing the same, the method including loading the objects into a testing unit through a loading unit; testing the objects in the testing unit and determining whether the objects are normal objects or abnormal objects; unloading the tested objects from the testing unit to an unloading unit; directly reversely loading the abnormal objects from the unloading unit into the testing unit when the objects are determined to be abnormal objects; and re-testing the abnormal objects in the testing unit.

Abstract: The invention provides a handler and a method for testing the same. The handler comprises a sorter and a testing module. The testing module further comprises a signal generator, a sensor, and a signal comparator. The signal generator generates and sends out a first handling signal. The sorter receives the first handling signal and correspondingly places a first electronic component on a first region according to the first handling signal. The sensor senses the first electronic component on the first region, and then correspondingly generates and sends out a second handling signal. The signal comparator is electrically connected to the sensor and the signal generator, and receives the first handling signal and the second handling signal. The signal comparator determines whether the first handling signal is equivalent to the second handling signal, and correspondingly sends out a comparing signal.

Abstract: A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

Abstract: A system of testing semiconductor devices includes a classification module configured to classify a plurality of lots into a plurality of groups; an apparatus assignment module configured to assign a plurality of testing apparatuses to each of the groups; and a test recipe creation module configured to create a test recipe to test defects in a second group other than a first group specified in the groups, the test recipe including a definition of testing positions in the second group defined by a rule different from the first group.

Abstract: sorting device for RFID tags, comprising a dispensing unit for supplying RFID tags which are applied to a transport belt to a dispensing area, in which the RFID tags are detached from the transport belt; a pick-up unit having a plurality of transport units for respectively picking up the RFID tags in a respective pick-up area onto a corresponding transport belt of the transport units and a positioning device for positioning the dispensing area and a selected pick-up area with respect to one another so that the RFID tags detached from the transport belt in the dispensing area are picked up by the pick-up area of the selected transport unit.

Abstract: A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic components and a second tray has more receptacles than the first tray for receiving tested electronic components. Electronic components comprising tested characteristics that occur with greater frequency are loaded into the receptacles of the first tray and electronic components comprising tested characteristics that occur with lower frequency are loaded into the receptacles of the second tray.

Abstract: Recesses (72), surface contours, contact tip modifications (52, 56), and/or other methods of ensuring pressure between a bottom surface (50) of a test plate (5) and top surfaces (52) of electrical contacts (18) are employed to enhance cleaning of the top surfaces (52) of the electrical contacts (18) to promote reliable measurements of DUTs (14).

Abstract: An electronic testing machine includes a plurality of test modules. Each test module has a plurality of contact pairs for testing electronic components. An apparatus and process for electrical test setup and calibration of the electronic testing machine includes a plate having at least one contact per track movable between test positions to electrically insert a test device selectively between any one contact pair, and a control program. The test device can be selected from a group consisting of a volt meter, a current meter, a precision voltage/current source, a calibration resistor, and a calibration capacitor. The control program can perform at least one test function through the plate. The test function can be selected from a group consisting of alignment verification, voltage/current source verification, insulation resistance (IR) leakage measurement verification, part-present contact check verification, capacitance and dissipation (CD) measurement verification, IR/CD compensation, and IR/CD calibration.

Abstract: A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.

Abstract: A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with their automatically read ID codes, is disclosed.

Abstract: A device handler for testing and sorting electronic devices has a testing station operative to test the electronic devices and to classify them according to different binning characteristics. A buffer assembly receives electronic devices which have been classified at the testing station, and the buffer assembly further comprises a first loading region having a plurality of receptacles and a second loading region having a plurality of receptacles. An output station is operative to unload electronic devices according to their different binning characteristics from either one of the first or second loading region of the buffer assembly for storage while electronic devices are being loaded onto the other loading region.

Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

Abstract: At least one venturi generator is provided for use with an electrical circuit component handler. The handler includes a stationary vacuum plate and a test plate. The vacuum plate includes vacuum channels, and the test plate includes test seats. The venturi generator is operative to create a vacuum pressure passed to the vacuum channels on the stationary vacuum plate and is used to draw electronic components into test seats on the test plate. The venturi generator may be the exclusive source of vacuum pressure or may supplement another vacuum source.

Abstract: The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated.

Abstract: A method for sorting devices in automated handling equipment, including placing a plurality of input trays containing a plurality of devices and a plurality of empty trays into a handler; sorting the plurality of devices in the plurality of input trays into the plurality of empty trays according to a category of each of the plurality of devices, dynamically assigning categories to each of the plurality of empty trays for each category of the plurality of devices, dynamically assigning categories to the plurality of input trays and placing the sorted plurality of devices into the plurality of input trays, removing the empty trays housing the plurality of sorted devices from the handler and determining whether the sorting is completed.

Abstract: An electronic element testing apparatus for use with a number of probes. Each probe has a lower pole and an upper pole. The apparatus includes: a first plate having a first side and a second side, the first side having an array of lower pole regions disposed thereabout, each lower pole region configured to receive a lower pole of a probe; and a plurality of signal conductor regions disposed proximate the array of lower pole regions, each signal conductor region arranged to provide a non-cable electrical path between a lower pole region and a switching circuit. The switching circuits are operable to sequentially connect each electronic element to a testing circuit via the upper and lower poles.

Abstract: A system of testing semiconductor devices includes a classification module configured to classify a plurality of lots into a plurality of groups; an apparatus assignment module configured to assign a plurality of testing apparatuses to each of the groups; and a test recipe creation module configured to create a test recipe to test defects in a second group other than a first group specified in the groups, the test recipe including a definition of testing positions in the second group defined by a rule different from the first group.

Abstract: A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The semiconductor substrate is aligned with reference to the reference semiconductor chip, so that an electrical die sorting test can be performed on the semiconductor chips on the semiconductor substrate.

Abstract: An automatic store and a method for storing plates of electronic circuits comprising a feed belt that feeds the plates of electronic circuits along a first plane (F); collection boxes positioned along at least one side of the feed belt and in which the plates of electronic circuits fed by the feed belt are grouped together according to quality classes; and one or more clearing stations disposed in cooperation with the feed belt in order to position the plates of electronic circuits in the respective collection boxes. The store comprises at least two rows of collection boxes disposed along at least one side of the feed belt, and a movement unit associated with the collection boxes to discharge the filled collection boxes and to position new collection boxes to be filled.