Abstract: A plurality of solder bumps are arranged in a row at regular pitch in a lead wire soldering region of a solar battery. A soldering apparatus for soldering a lead wire to the lead wire soldering region via the solder bumps comprises a lead wire feeding section for feeding out the lead wire. An end of the lead wire in the lead wire feeding section is chucked and the lead wire is laid over all length of the row of solder bumps. The soldering apparatus further comprises a soldering unit for soldering the lead wire onto the solder bump. The soldering unit has a lead wire holding member for holding the lead wire on a solder bump and a soldering iron. The soldering apparatus repeats an operation for welding the lead wire to the solder bump by means of the soldering iron, while the lead wire is held by the lead wire holding member.

Abstract: A soldering station system for transporting, utilizing, and storing the unique tools required for soldering electrical wiring assemblies, printed circuit boards, and other small electronic sub-assemblies is provided. The soldering station system includes a tool case with a bottom portion, a plurality of side portions, and a top portion, a tool pallet assembly which is coupled to an interior surface of the tool case, the tool pallet has a plurality of interior recesses, and a plurality of tools adapted for working on electronic assemblies and positioned in the interior recesses of the tool pallet assembly.

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract: A soldering iron device has a gas passage formed by enclosing a soldering iron tip 3 of an electric soldering iron with double pipes 6 and 7 to make a nozzle. By providing projections A, B and C in the spacing between said double pipes, the double pipes are prevented from any eccentricity and biasing, and the velocity of an inert gas G to be supplied is made slow to ensure that the gas is jet through the nozzle tip end. Further, engulfing of oxygen in the atmospheric air can be suppressed, whereby it is possible to prevent defective wetting of solder due to high temperature oxidation of the soldering iron tip and to suppress high temperature oxidation of workpieces and flux cored solder alloy and flux, and excellent solderability is obtained.

Abstract: For removing defective transponder units or electronic transponder equipment a web (6)is parted in a station (23) firstly in front and then at the rear of the individual unit. Thereafter the picked out unit is conveyed off transverse to a working plane (3)and the two resulting web ends are transferred into a directly juxtaposed station (24). There the web ends are fixedly interconnected by welding, glueing or the like. Therefrom a use web arises, which includes only non-defective units since the defective units were previously detected by a sensor (32)and then severed out as described with the aid of a control device (50). This fully automatically working apparatus (1)coils the processed use tape in a store (26)into a roll (40)which is suitable for further processing in a machine.

Abstract: A die set for welding fins and a base plate of a heat sink, it is used to complete fixing of the U shaped heat sinking fins and the base plate of the heat sink by welding. It has the object to increase heat-sinking efficiency and to render the welding process to finish fast. The die set comprises mainly a first die seat and a second die seat. Wherein, the first die seat is disposed beneath the base plate of the heat sink to support the latter. While the second die seat is disposed above the U shaped heat sinking fins, and is comprised of a pressing portion and a connecting portion. The pressing portion is provided in corresponding to the lower bends of the U shaped fins with pressing bars. The connecting portion having a plurality of connecting ends is provided on the bottoms of the pressing bars to supply energy to generate large heat.

Abstract: A soldering iron includes a housing for accommodating therein at least one heating element and a soldering bit which is releasably secured to the housing. The heating element includes a heat-transmitting contact surface provided on an end face thereof which faces the soldering bit. A heat reception surface of said soldering bit is located opposite the contact surface and in direct contact therewith with no intermediate layer therebetween. A temperature sensor is located adjacent the contact surface and between the contact surface and a filament winding of the heating element.

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract: Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).

Abstract: A soldering device includes an elongated hot bar and a plurality of spaced soldering tips supported along the hot bar for soldering multiple connections. A method of using the soldering device is also described.

Abstract: Method for repairing defective soldered joints, in which in a first method step a soldering material handling device is placed with a soldering material removal device at a soldering material defect point and a defective soldering material deposit is loosened from the connection with a soldering material carrier and removed, and in which in a second method step a soldering material unit from a soldering material application device of the soldering material handling device is applied to the soldering material carrier and connected to the soldering material carrier, the application device being placed at the soldering material defect point.

Abstract: A soldering apparatus with a safety device which operates automatically when a soldering iron is left in its on condition for a given period of time. A vibration sensor is attached to the soldering iron to sense vibrations of the soldering iron during soldering work. A heater control circuit is provided to be switched to a low-temperature mode when a period of time for which the vibration sensor does not sense the vibrations of the soldering iron continuously exceeding a set value, thereby maintaining the soldering iron at a predetermined low temperature in this situation.

Abstract: A pressure welding apparatus for pressure-welding an electric wire quickly and surely to a pressure welding terminal in a double-sided solderless connector according to various wire-diameters. A plurality of applicators having various wire pressure welding blades and connector support blades are arranged radially and rotatively around a rotary shaft for enabling to select the pressure welding blade and the support blade by rotary operation of the applicator. A plurality of applicators are arranged symmetrically with respect to the double-sided solderless connector. The pressure welding blade and the support blade with a mechanism movable in up and down directions are arranged opposite to each other on both sides of the solderless connector for enabling to pressure-weld an electric wire to one side of the solderless connector by the pressure welding blade, while the other side of the solderless connector is supported by the support blade.

Abstract: The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

Abstract: In a wire bonding method, particularly a method for forming a ball at an end of a bonding wire that has an intended ball size, a tail length of the bonding wire extending from the lower end of a capillary is determined according to the size of the intended ball and the internal shape of the lower end portion of the capillary, and the wire end having such a tail length is melted up to the lower end surface of the capillary by a discharge produced by an electric torch so as to form a ball on the wire end.

Abstract: The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.

Abstract: A heating tip in which an insertion cavity is formed in a tip substrate made of copper or copper alloy for insertion and containment of a heat generating portion, wherein the inner circumferential wall surface of the insertion cavity is formed by forging into a non-circular cross sectional shape which is identical with a non-circular cross sectional shape on the outer circumferential surface of the heat generating portion. The insertion cavity has the non-circular cross sectional shape and, accordingly, the area of contact with the heat generating portion is enlarged compared with a case of a circular cross sectional shape with the hole volume being assumed identical, thereby increasing the heat conductivity from the heat generating portion and enhancing the temperature rising characteristics and the thermal response of the heating tip. Since the insertion cavity is formed by forging loss of the material can be decreased, neatly and easily and, in addition, working life of the tool can be extended.

Abstract: A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

Abstract: In a method for connecting two workpieces together by welding, the workpieces are placed on clamping tables by a feed unit (F) and are joined together by a welded seam. First, the workpieces are positioned in the feed unit (F). The feed unit (F) is then traversed between the clamping tables and deposits the workpieces on them. Simultaneously with its feed movement, the unit (F) expels the workpieces welded together in the preceding cycle.

Abstract: More particularly, the invention relates to a hand soldering device including a heat insulating handle part, a soldering tip and a heating device, by means of which the soldering tip can be heated to particular soldering temperature, whereby in the handle part and/or in the region of the heating device at least two reception chambers are provided.

Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool) used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool comprises a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C.

Abstract: A soldering device for soldering lead wires from a disc head to a circuit of the disc drive includes a heat shield adapted to provide a protective barrier for a soldering tip during operation of a soldering instrument. During operation, the soldering tip is heated by a heating element for use. A heat shield is coupled with the soldering tip and designed to provide a temperature barrier along the length of the soldering tip and prevent damage to other wires in close proximity.

Abstract: A thermocouple sensor is fitted to an iron tip of an electric soldering iron provided with a temperature controller. The sensor can detect the temperature of the iron tip and supply it to the temperature controller, which then adjusts the temperature to a desired value. The thermocouple sensor is formed of a pair of non-covered sensor wires. A contact point part of the thermocouple sensor is secured to a nose of the iron tip. The wires are laid along the surface of the nose in the rearward direction and introduced into a hollow portion through a lead-in hole opened in the vicinity of the boundary between the nose and a columnar base of the iron tip. Then, the wires are inserted into and through a pair of guide holes, respectively, formed in a cylindrical insulating support of a heater. The distal ends of the wires are coupled to a socket, which is an end portion for receiving a signal representing the detected temperature of the iron tip to supply it to the temperature controller.

Abstract: There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space. A wire bonding mechanism is provided at a downstream portion of the transfer path.

Abstract: A soldering tip and heat accumulator therefor are disclosed in which the heat accumulator is essentially a hollow cylinder which is disposed over both a cylindrical heater and a major portion of the metal soldering tip. The accumulator is deeply slotted both from its rear and front ends whereby although before assembly it has radial clearance over both, when compressed during assembly by an outer retaining sleeve, the accumulator snugly engages both and provides a very high degree of thermal coupling between the heater and the soldering tip.

Abstract: An electric soldering iron is made difficult to heat up at the front end of its grip. A metal pipe is inserted in the grip so that the pipe comes into close contact at least partially with the grip, with a gap formed between the outer peripheral surface of the pipe at its front end and the inner peripheral surface of the grip. The heat produced by the accumulator conducts through the pipe to the grip and disperses throughout the grip. Thus, the front end of the grip is less likely to heat up.

Abstract: The invention provides a method of splicing rolled plates with each other, including the steps of (a) positioning a rear end portion of a leading rolled plate above a front end portion of a following rolled plate by a distance slightly greater than a diameter of a cylindrical cutter having a rotation axis extending in a width-wise direction of the leading and following rolled plates, the positioning being carried out while the leading and following rolled plates are being transferred, (b) cutting an upper surface of the front end portion of the following rolled plate with the cylindrical cutter only within a region at which the following rolled plate is to be spliced with the leading rolled plate, the cutting being carried out in a direction F in which the rolled plates are being transferred, (c) blowing a first reducing flame to the upper surface being cut from above the upper surface in the direction F while the step (b) is being carried out, (d) cutting a lower surface of the rear end portion of the leadin

Abstract: A method and apparatus for pressure-welding an electric wire to a pressure terminal in a manner that minimizes the deformation of pressure-welding cutters when the connection wire is pressed fit into the pressure terminal and provides electrical connections. An electric wire pressure-welding apparatus (1) is provided with a guide (9) constituting a vertically-extended fixed member, side pressing plates (6) constituting moving members each capable of pivoting about shafts (8) arranged in the upper portions of grooves (9a) longitudinally cut in the respective sides of the guide (9), and a sleeve (5) vertically slidable along the outer surfaces of the guide (9), and pressure-welding dies (2) each secured to the lower portion of the sleeve.

Abstract: The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool). The tool is used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool has a substrate that is composed of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and having a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree.C. at room temperature to 400.degree. C.

Abstract: This invention provides a plate assembly to be used with a soldering device for changing screens of circuit boards by soldering.

Abstract: An apparatus for removing and/or replacing a surface-mounted integrated circuit that includes electrical heating elements disposed in a planar rectangular array and a handle positioning the element array in heat-conductive contact with the legs on the side edges of a surface-mounted integrated circuit. When electrical energy is applied to the heating elements, the elements and the integrated circuit legs are heated so as to liquify the solder joints between the legs and the circuit board pads. An air pad is positioned within the heating element array for grasping and holding the integrated circuit to facilitate lifting of the circuit from the circuit board, or for holding a replacement integrated circuit on the circuit board, when all of the solder joints have been liquified.

Abstract: A slewing device having a quickly adjustable drive is available for inserting and cutting cross wires in automated equipment for the prefabrication of building panels. The device includes a bridge that may be selectively tilted to planes transverse to the line of conveyance of the panels supported by a bank of electronically-controlled electric motor drives. Each drive motor operates a corresponding device for pulling at least one metal wire so as to push and insert the wire at substantially any angle through a layer of plastic material sandwiched between sheets of wire netting to form the panel after passing through coaxial cutting devices for trimming the wire after its insertion.

Abstract: The assembly line for producing a steel coffer (2) for ceiling and/or wall structures, in particular for interior finishing and construction of ships, for transportable and movable buildings, for sheds, hotels and the like, from a sheet metal plate (1) comprises a cutting and/or stamping station (3), a bending press (4) with an associated manipulator (5) and an associated roller-ball table (6) and a welding station (7), as well as at least one trolley (8) in the form of an underfloor vehicle, an underfloor trolley, or the like, which can move back and forth under these stations (3, 5, 7). The bending press (4) is combined with a manipulator (5) designed as a semi-portal crane, which is movable with respect to this press (4) and has a gripper which is also movable, adjustable in height and rotatable around the height axis, by means of which the sheet metal plate (1) is fed in its required positions to the bending press (4).

Abstract: In a temperature regulator for soldering and unsoldering equipment having a heating device fed by a controllable electric source of heating current, the heating output of which is transmitted to a spot to be soldered by a heating output transmission device, a signal that is proportional to the temperature of the heating device is generated and compared in a comparator of a control circuit to a set value. The control circuit derives from the output signal of the comparator a control signal for controlling the source of heating current. In addition, a temperature sensor (5) is arranged in the area adjacent to the spot to be soldered of the heating output transmission device (3), the output signal of which is compared in another comparator (23) of another control circuit (23, 27, 28) to another set value (7). The second control circuit supplies another control signal for controlling the source (11) of heating current.

Abstract: A soldering iron rack including a base having an upright support, an electric soldering iron, a holder mounted on the upright support and having a heat-insulative barrel on the inside for holding the electric soldering iron, and a control circuit to detect the temperature of the electric soldering iron when the electric soldering iron is put in the holder so as to cut off power supply from the electric soldering iron when its temperature surpasses the predetermined upper limit value or to heat the electric soldering iron when its temperature drops below the predetermined lower limit value.

Abstract: A soldering iron includes a handle, a power source such as a rechargeable battery in the handle, and two electrical terminals connected to the battery through a switch; a soldering iron tip is secured to the terminals and includes a pair of electrical leads, and a wire heating element connected to the leads and encapsulated in a ceramic filled shell, wherein the tip has relatively low mass and a relatively high resistance heating element, and in battery operated irons can produce about 520 solder joints per battery charge.

Abstract: A method of joining two aluminum tubular members comprising steps of: inserting a iron ring member into a first aluminum tubular member, with part of the iron ring member extending out of the first aluminum tubular member; put a second aluminum tubular member on to the part of the iron ring member extending out of the aluminum tubular member; heating a pair of molds having a less width than the iron ring member to a temperature of 660 degrees centigrade; and applying the molds on the place where the two aluminum tubular members are joined together so as to melt the two aluminum tubular members together.

Abstract: A contact point of a thermocouple sensor is welded to the nose of an iron tip of an electric soldering iron, and sensor wires of the sensor are laid along the surface of the iron tip through a groove to a columnar base of the iron tip. The columnar base of the iron tip is covered, together with the sensor wires situated on its outer surface, with a heater cover. A heater is fitted in an axial bore in the base of the iron tip. The temperature of the iron tip is directly detected by the thermocouple sensor, and on the basis of the detection and a reference temperature, an arithmetic processing is carried out by a signal processor of the temperature controller. Such arithmetic processing is used by the temperature controller to control the electric power supplied to the heater to cause the temperature of the iron tip to coincide with the reference temperature.

Abstract: A method of assembling an integrated circuit (IC) by a TAB (Tape Automated Bonding) system, and an IC assembled thereby. Leads extending from a TAB tape and connected to an IC are each partly reduced in width. Hence, even when the end portions of the leads are deformed by some object by accident, it is not necessary to correct the shape of the leads since such end portions will be eventually cut off and discarded in the event of packaging of the IC.

Abstract: A device for manufacturing loops of steel employed in continuous-operation presses to manufacture single-layer or multiple-layer webs of material. To equalize the tension in the ends of a strip before they are welded together to form a loop and to increase the strength of the weld, the strip (10) is laid over drums (2 and 3) and its ends secured in grippers (13) that travel across the drums' axes (4 and 5). The strip is tensioned to a prescribed tension. The tension is maintained while the ends (11 and 12) of the strip are secured by transverse tensioning arms. The tension is released by moving the movable axis to an operating distance. The strip is cut with a blade, the ends of the strip are ground parallel, and are welded together to form a loop.

Abstract: A method of and apparatus for mounting hard material tips to a cutter tool such as a saw blade body (6), wherein a gripper/pick-up member/element (4) for handling the tips (8) to be mounted or other material required in the tip mounting operation is moveable about an axis (1) in order to transfer the tips or other material from a supply(ies) thereof to a location (9) at which the tips can be mounted or said other material can be utilized in the mounting of the tips.

Abstract: Self-aligning tip elements are achieved in accordance with preferred embodiments of the invention by providing a edge surface of each tip element with key and notch formations which will interfit with each other in a prescribed orientation when the tip elements are inserted into the bobbins of the a tweezer handpiece and the tip elements are brought together by squeezing-together the legs of the tweezer handpiece. By utilizing a symmetric arrangement of key and notch formations on each tip element, a pair of like tip elements can be used together instead of requiring special left and right tip elements.

Abstract: A soldering tip is provided with a protrusion extending from its operative region to permit an opening to extend therethrough. Thermocouple wires are disposed in the opening and mechanically urged into thermal contact with the operative region. One embodiment of the present invention provides a protrusion extending from the central region of the soldering tip which is deformed by compression after thermocouple wires are inserted into an opening extending through the protrusion. An alternative embodiment of the present invention incorporates two protrusions to define a gap therebetween into which the thermocouple wires can be disposed. After disposing the wires in the gap, an annular member is placed around both protrusions and a spring urges the annular member downward to press the thermocouple against the bottom of the gap and in thermal contact with the central region of the soldering tip.

Abstract: A specialized desoldering unit head is provided for the limited purpose of removing high-density solid state electronic components from circuit boards in a single step, without damaging the circuit board. In the typical case of a four-sided component with a row of leads on each side, the unit includes an electrically heated head which fits over the component with a heat-conducting blade fitting over each of the rows on the four sides of the component. The head has depth limiters stop means formed by at least one adjustable screw threaded through at least one laterally extended cross-strap on the head and positioned to engage against the top of the component to limit the lowering of the heated blades relative to the rows of leads so that the heated blades do not touch the circuit board, or even the horizontal portion of the surface-mounted leads of the lead rows, but only mounds of solder which have been applied over the leads to facilitate their heating and the removal of the component.

Abstract: The present invention relates to integrated circuits (ICs) fabrication and testing. Particularly, there is an IC pin/lead trimming and forming machine that is adapted to electrically test ICs for electrical defects. Uniquely, the IC testing can occur at any pin forming station after the IC pins or leads have been electrically isolated from each other and from other ICs on a lead frame. This arrangement will allow for testing of the individual ICs much sooner than has hereinbefore existed after undertaking the encapsulation process.

Abstract: A component installation/removal tweezer-type handpiece having two arms and a tinnable or nontinnable tip including a pair of legs respectively removably mounted with respect to the arms and a plurality of serially connected bands attached to the first and second legs such that an opening is formed within the serially connected bands so that the bands are adapted, upon closure of the tweezer-type handpiece, to clamp the terminals of an electronic component or the like and transmit heat to the terminals. In another embodiment a tweezer-type or probe-type handpiece includes a tinnable or nontinnable tip having first and second legs and one or more bands extending between the legs whereby the band(s) is adapted to transfer heat to terminals associated with an electronic component. In all embodiments of the invention the tips may be provided with a variety of sheathing or overlayer combinations to achieve a variety of application requirements.

Abstract: A thermode having a relatively long and thick blade composed of a high thermal conductivity, low thermal expansion material, e.g., molybdenum, provides an elongated contact surface for bonding a row of leads of an electronic component to a circuit board. A thermode holder is coupled to the blade by means of a plurality of struts, including a pair of outer struts, each connected at one end of the respective ends of the blade and at an acute angle facing the other outer strut, and a pair of shorter inner struts, each connected with the blade intermediate the ends of the blade and at an acute angle facing the outer strut adjacent thereof, such that in response to a force urging the blade against the circuit board, the outer struts cause a negative deflection of the blade with respect to the board and the inner struts decrease the magnitude of the deflection. The blade is heated by electric current supplied thereto from a transformer through the inner and outer struts.

Abstract: This invention concerns a machine for the automatic and continuous production of wire winding spools, and in particular metal welding wire for welding machines. The machine in question consists of three successive operating stations through which two parallel, straight metal rods are carried at intermittent speed; in the first station, upside down "U" shaped brackets are welded on the above rods; in the second station the rods are bent, repeatedly to shape a closed polygon; in the third station the interfacing ends of each open ring of the spool are welded.

Abstract: A contact heater for soldering and desoldering electronic components that is heated by hot air supplied into a cavity of the contact heater. A thermally conductive heating blade is used to contact an area to be heated, while a heat shield protects adjacent electronic components from external heat generated by the contact heater.

Abstract: A method is described for manufacturing a built-up sheet panel by forming a double flanged joint with raised flange edges between sheets arranged alongside of each other, which are then welded together by means of a driven welding carriage, the raised flange edges being shortened in accordance with the invention shortly in front of the welding.A welding carriage suitable for this purpose is provided on its lower side, in front of a welding device as seen in the direction of travel, with a parting device which is preferably developed as driven pair of cutting rollers. In this way in particular thin sheets can be assembled with excellent quality to form a sheet panel.