Abstract: A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.

Abstract: This invention relates to a printed wiring board (10) for IC cards to be built in or fitted to a contact type IC card, that is, an IC card having external contact terminals. The present invention is to provide a printed wiring board (10) for IC cards wherein bumps (20) are formed in a part of a conductor circuit (13) of this printed wiring board (10) for IC cards and are made external contact terminals, futhermore wherein only the contact surfaces of the external contact terminals are exposed on the surface of the IC card (30) and the surfaces of the external contact terminals and the surface of an over sheet (14) are made to be on the same plane level, so that, in case the IC card (30) is bent, an IC module (12) may be perfectly prevented from springing out and further the electric contact reliability of the external contact terminal may be also high.

Abstract: A method and apparatus for fixing a connector having pins onto a printed circuit board wherein the apparatus is movable between a position rear the pins and a position retracted from the pins. The apparatus includes heating means and pressure heads which act in a complimentary manner. After the pins are heated and are cooling, the pressure heads upset the pins thereby strengthening the connection.

Abstract: The appearance of stresses when remelting printed circuit boards should be avoided. The remelting process of the tin-lead layers ensues in a pressure vessel at elevated ambient gas pressure. The quantity of heat required for the remaining can be supplied on the basis of known methods (infrared irradiation, oil, etc.) or by heating the compressed gas itself. As needed, the compressed gas can be designed as a protective atmosphere. Printed circuit boards of any and all types can be remelted by this process.

Abstract: A fingertip soldering tool has been designed which is made up of a small fingertip soldering body that is secured above the human finger (preferably the index finger) via a finger strap. Within the fingertip soldering body is a soldering tip for electrical and electronic soldering. The present fingertip soldering tool has essential advantages: a) The same hand which the soldering tool is attached to is freed up for other use; and (b) the small soldering tip provides electrical efficiency, allows wide access into small areas and gives rise to structural lightness which enhances its maneuverability further. A protective shield around the soldering tip provides safety from the surrounding environment and human flesh.

Abstract: To effect disassembly of components relative to an integrated circuit board, the circuit board and its typical construction, including the soldering of the various components projected through the circuit board, is effected by an anvil, including a plurality of anvil bores, wherein the anvil is heated and each anvil bore is accordingly heated effecting the elimination of the associated soldering joints of each projecting tip of an associated electrical component directed through the circuit board. The apparatus further includes a metallic brush member arranged for securement to an associated heating member or gun to effect the cleaning and removal of solder residue remaining on the circuit board. Further, various anvil sizes are provided to accommodate various circuit board patterns and may be provided in a kit form in a single unitary container.

Abstract: A specialized desoldering iron utilizes a blade which takes the form of a quadrilateral enclosure having a pair of heating elements mounted to two opposite walls of the enclosure. The enclosure is shaped and dimensioned to fit over a quad flat pack integrated circuit such that the lower edges of the walls of the enclosure come down onto the soldered leads of the integrated circuit. The two heating elements provide enough heat to simultaneously desolder all of the leads of a large quad flat pack, and the enclosure is open-topped so that the large heat sinks which are mounted atop IC's that consume a high level of power do not interfere with the desoldering process.

Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.

Abstract: The present invention provides a method and apparatus for making joists. The chord members of the joists consist of two pairs of spaced apart angle irons, and the web portion of the joists consist of a plurality of linear metal bar lengths. Under a computerized control, the pairs of angle irons are spaced from one another by a predetermined distance depending on the design characteristics of the joist to be made, and the metal bar lengths are individually selected and cut to provide a metal bar having a specified diameter and a specified length, after which each of the metal bars is selectively positioned, in sequence, between the two pairs of angle irons, and then each end of each metal bar is automatically welded to the angle irons in a predetermined sequence.

Abstract: A temperature controlled soldering iron includes an elongated heater assembly with a hollow soldering tip at one end, containing a heating element and a temperature sensing element, which is responsive to the temperature of the tip. The heater assembly includes an outer conductive sheath concentrically disposed around an inner conductive sheath, both of which are attached to a steel bushing. A constantan rod is disposed within the inner sheath and connected to the bushing to form a thermocouple junction therewith. The heating element is connected at one end to the bushing and at the other end to a tubular conductor disposed around and insulated from the constantan wire. A temperature controller surveys the temperature sensed at the thermocouple junction by connection to the constantan wire and the outer sheath. The voltage applied between the tubular conductor and the inner sheath is automatically varied to control the temperature of the heater assembly.

Abstract: A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion.

Abstract: A soldering gun is provided including an elongated tubular body of quartz having first and second ends. The first end of the body is telescoped into an outwardly opening recess provided therefore in a soldering iron tip mounted from the first end and a second shorter and smaller diameter quartz tubular member is telescoped into the end of the larger diameter tubular member from which the tip is supported. A coil of 6 to 12 turns of Ni Chrome wire is disposed about the second quartz tubular member within the first quartz tubular member and the end of the coil adjacent the tip is reversely turned and directed back through the second quartz tubular member to a point adjacent the other end thereof.

Abstract: An anti-pollutant soldering iron protects workers against pollutant residual vapors resulting from soldering by operating an air moving fan, or the like, to create a suction air stream in a housing which guides pollutant residues trapped therein to and through a retaining filter and then directs the filtered air to the atmosphere. The air moving fan, or the like, may also be reversed to force the residual vapors away from the soldering iron.

Abstract: A tool for shaping wax and wax-like substances has a handpiece containing an electrical connector for connection to a source of electrical power and an opening in which an electrically heated tool tip is removably mounted for the convenient interchange of tips. The tool tip is held in a fixed predetermined position in the opening by ridges in the opening interlocked with complementary notches on the tip and is removably mounted within the opening in electrical connection with the connector. A cooling air gap is formed between the outer surface of said tip and the inner surface of said opening by the interlocked ridges and notches to prevent overheating of the handpiece. The tip comprises two spaced apart electrically conductive parallel wires which are connected at one end to form a continuous tip which defines a confined air gap of a defined configuration which is suitable for holding and shaping wax.

Abstract: A metallic soldering tip is disclosed having a forward, outer retaining rim and a rear inwardly tapered skirted end of the character to be fitted loosely over a ceramic rod heating element. The tip is axially slotted from its rear edge to a point forward of the retaining rim. An inner sheath over the rear portion of the ceramic rod has a flared forward end which engages the tapered skirted end of the soldering tip while the reduced diameter forward end of an outer retaining sheath engages the retaining rim of the soldering tip and is drawn forcefully rearwardly by a retaining nut threaded onto the handle or body of the soldering implement. The rearward displacement of the outer sheath forces the slotted skirted portion of the soldering tip to press inwardly against the ceramic heating element by virtue of the tapered relation between the inner sheath, the rear of the soldering tip, retaining rim and the forward end of the outer retaining sheath.

Abstract: Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.

Abstract: A tool for desoldering quadrilateral surface-mount components such as integrated circuits which have a row of leads on each of the four sides, the tool comprising a metallic hood with a depending skirt which contacts the rows of leads when the hood is snapped over the component. The hood is heated with a hot air gun or a heating element, and conducts the heat to the leads, melting the solder connecting the leads to the pads of the circuit board, permitting the component to be lifted off of the circuit board.

Abstract: An improved tape automated bonding is disclosed. A heater head employs a heat conducting member and a bonding tip member. The heat conducting member formed of a material, such as molybdenum or tungsten, has a U-shaped contour which comprises a pair of halves and an interconnection for generating bonding heat by undergoing high frequency electric current. The bonding tip member is bonded to the interconnection of the conducting member. The tip member is formed of material, such as diamond or cubic boron nitride, which is higher in resistivity and thermal conductivity than the conducting member.

Abstract: A modular soldering station is disclosed which includes a base unit containing a soldering instrument power supply and having a plurality of holding fixtures to which may be attached novel modular desoldering tools, component pick up tools, vacuum fume removal apparatus, and cradling means for each. Different combinations of such implements may be used to make up a particularly desired soldering station for a given soldering/desoldering task or set of tasks.

Abstract: An apparatus for producing semiconductor devices includes: a wafer splitting device for splitting a semiconductor wafer into individual dice; an automatic warehouse for lead frames for storing a plurality of kinds of lead frame; an assembly device for assembling a die and a lead frame into a semiconductor device; an automatic die/lead frame transport device for transporting the dice split by the splitting device and lead frames stored in the automatic warehouse to the assembly device; and a computer for controlling the automatic die/lead frame transport device to transport the lead frames of the type and quantity corresponding to the dice split by the splitting device, from the automatic warehouse to the assembly devices. The computer compares the number of non-defective dice with a predetermined production quantity and ensures that a sufficient quantity of non-defective dice to satisfy the production quantity are split and transported to the assembly device.

Abstract: An apparatus for connecting strips, in which a rear end portion of a preceding strip and a front end portion of a succeeding strip are cut and brought into contact to each other so that a butt welding of the contacted portions may be carried out to connect both the strips. A carriage is provided for carrying a cutting device for cutting the end portions of both the strips. A finish-machining device is provided for finish-machining the cut end faces of both the strips and a welding device for butt welding both the strips along a contacting line of both the strips is installed so as to be movable in a line substantially parallel with the contacting line of both the strips. Die wears and burrs incidental to cut faces can be prevented from forming and the highly accurate contacted state of strips can be achieved, thereby improving the quality of the welded portion.

Abstract: A temperature controlled soldering iron with a heating element having a positive temperature coefficient arranged as one leg of a Wheatstone resistance bridge such that the voltage across the heating element signals the temperature of the soldering iron. A comparator is connected across opposite nodes of the bridge and turns off a switching element to cut current flow through the bridge when the heating element is above the desired temperature. A pulse generator continuously supplies pulses to briefly restart current flow through the bridge and allow the temperature to be sensed. The pulses are short duration and occur regardless of whether the comparator has previously turned off current flow, and independent of the temperature of the heating element. After each pulse the comparator controls current flow by leaving the flow on or turning it off according to the temperature of the heating element as measured by comparison of the voltages on the opposite nodes of the bridge.

Abstract: A method of fabricating an electrical contact formed at least in part of a precious metal which defines a contact surface on the electrical contact. In this method, an initial discrete deformation of the precious metal extends a projection of the precious metal to a first preselected height beyond the contact surface. Thereafter a further discrete deformation of at least the precious metal projection forms it into a preselected configuration and also alters the extension of the precious metal projection to another preselected height beyond the contact surface different than the first preselected height.

Abstract: A method and arrangement for the positioning and bonding of a solid body (2) in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

Abstract: The soldering apparatus using at least one resistance heated stirrup electrode that is place onto soldering locations on a printed circuit board includes a pivotable suspension of the stirrup electrode. The pivotable suspension is such that a dislocated rotational axis of pivotable suspension lies in a plane of the working surface and extends perpendicular to a long side of the rectangular working surface of electrode and at the center thereof. The working surface of the stirrup electrode thus achieves reliable contact with parts to be soldered. Embodiments having two or four soldering stirrups, each individually pivotly suspended, are also possible.

Abstract: An electrical soldering gun for pipe soldering has a plastic case with a pistol grip handle and a single elongated electric heating element extending longitudinally of the case. A first soldering jaw with recesses is disposed on and extends axially of the heating element and has directly hingedly connected in heat exchange relationship therewith with a second jaw provided with complementary recesses for cooperating with the first jaw recesses to receive and grip a pipe to be soldered. The second jaw is connected to a slidable trigger on the casing by a pull rod for manually pivotally moving the second jaw away from the first jaw against the force of a spring associated with the trigger normally biasing the push rod and second jaw toward the first jaw.

Abstract: A miniature light-weight electric soldering iron includes a hollow handle terminating in a conical air deflecting arrangement through which a cone-shaped curtain of relatively high velocity air is applied to the work area in a circular or elliptical region surrounding the point at which molten solder is being applied by the hot soldering iron tip thereby entraining and dissipating noxious fumes which may be generated from the soldering flux by the hot soldering iron tip. In one embodiment, the soldering iron handle is provided with a plurality of wall air inlet openings and a tiny motor and fan are incorporated to draw air into the handle through these openings and then direct it out through a truncated cone-shaped deflector to develop the air curtain. In another arrangement, the motor and fan are dispensed with and the cone-shaped deflector is coupled to a convenient pressure source, such as an air line. The flow of air further serves to maintain the handle at a comfortably cool temperature.

Abstract: A soldering iron comprises a tube and a soldering tip slipped onto the front or outer end of the tube with a close sliding fit. The soldering tip is fastened axially by means of a spring element which is fastened to an inner end of the tube. In order to secure the soldering tip from rotating, the diameter of the front or outer section of the tube is made smaller than the diameter of the far or inner end section of the tube and the soldering tip is connected form-fittingly with the tube by a web formed in the inner tube which engages in a slot of the outer tube.

Abstract: The apparatus, for manufacturing building panels for construction walls with antiseismic and thermoacoustic insulation characteristics, includes a horizontal table for assembling a panel formed by at least one layer of insulating material and by a pair of metal grids associated with the opposite faces of said insulating layer, means for advancing said panel step by step to a station for inserting, cutting and welding connecting elements of said metal grids. The inserting and welding station includes means adapted to insert the connecting elements transversely to the insulating layer, lower welding means adapted to weld the connecting elements, which pass through the insulating layer, to the lower metal grid of the panel, means for cutting the connecting elements at the upper metal grid of the panel, and upper welding means adapted to weld the cut connecting elements to the upper metal grid of the panel.

Abstract: A plastic welder that can be held and operated with only one hand. The supply rod or filler rod can be advanced into and through the heating tip of the welder by a trigger that can be actuated by the user with the same hand in which the grip of the plastic welder is held. No air assist is required, as a device is provided for reliably avoiding overheating of the plastic welder by intermittently interrupting the electrical current feeding the heating element at times automatically determined by a temperature setting selected by the user. The heating tip is formed of a major portion of steel infiltrated with a minor portion of copper. The temperature of the heating element with the welder in inoperative condition is maintained at a predetermined level above the temperature of the heating tip when the welder is operative and in use.

Abstract: Soldering apparatus of the kind having a replaceable tip element including a soldering face and having a frame portion and a tip retaining portion adapted to retain the tip element in heat conducting relationship with the frame portion. The soldering apparatus is characterized in that the frame portion incorporates a contact assisting formation adapted to embed itself at least partly into the tip element remote from the soldering face to thereby reduce electrical resistance between the tip element and frame.

Abstract: Metals to be bonded are drawn from pay-off reels and passed around holding rollers which are grounded cathodes, each roller being partially exposed in an etching chamber having an anode area at least three times the exposed area of the cathode. Each chamber has an inert gas at from 10.sup.-4 to 10.sup.-1 Torr and is subjected to RF power with a frequency from 1 to 50 MHz, which by a magnetic field produced by fixed magnets in the holding roller produces a glow discharge plasma which etches the metal in the chamber. Etched surfaces of the strips are then rolled together in a vacuum of from 10.sup.-6 to 10.sup.-3 Torr and a temperature to 300.degree. C. at a rolling pressure sufficient to effect a thickness reduction from 0.1 to 30%.

Abstract: A electrically heated soldering iron for applying heat to a wide variety of miniaturized integrated circuit solder pin row arrangements includes an elongated handle carrying at one end a heating block provided with a pair of tangs between which is seated an elongated soldering blade having a sharp, knife-like operative edge. One of the tangs is removably bolted to the heating block and has a sloped shoulder mating with a cooperating surface on block to permit the tang to move relative to the other tang to accommodate blades of slightly different dimensions while still allowing the removable tang to exert compressive force on the blade as the bolt is tightened. The operative edge of the blade is disposed in the same plane as the handle at an angle of about 135.degree. with the longitudinal handle axis.

Abstract: An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch.

Abstract: A heating apparatus for heating components to be connected to each other which are supported on a thin substrate comprises a U-shaped heating tool which is brought down on the components and a U-shaped support which engages a lower surface of the substrate. Both the tool and the support are heated to reduce a temperature gradient or thermal losses through the substrate. The support also absorbs the forces of the tool when the tool is pressed against the parts to be connected to each other.

Abstract: Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the electronic component has its leads simultaneously excised from the tape and formed in a predetermined configuration, in a self aligning zero clearance punch and die set, the device so excised being then transferred to a presentation area for pickup for subsequent assembly operations.

Abstract: A solder tip includes a transfer slot having a shoulder portion for containing a connector pin during heating and soldering. The shape of the slot increases the surface area between the soldering iron and the body of the connector pin to speed heating and shoulder portion permits pressure to be applied to the end of the connector pin during soldering. The slot is further configured to facilitate a roll-off soldering method whereby the solder tip is rotated to lift the connector pin out of the slot after the solder has been applied.

Abstract: An apparatus for connecting one part to another by heating the parts comprises a heated tool with a heating bar, having a heated surface for being brought into contact with the one part and for being moved toward the other part, and a stop mechanism in the form of a mechanical stop bar, or sensing arrangement for stopping the movement of the heated tool toward the other part when a selected spacing between the heated tool and the other part is reached.

Abstract: An electrically heated thermode mounts to a support movable to position the thermode for multiple lead reflow soldering and includes a flat resistance element folded on its flat side in a U-shape structure in which the bight portion forms the pressing portion and the legs the terminal portions of the thermode. To overcome a problem arising where a group of joints to be soldered have varying height tops, the way in which the thermode is mounted to the movable support provides freedom of rotational movement of the thermode relative to the support while providing a low resistance electrical connection between support and the thermode terminal portions. To overcome a problem arising because opposite end joints sink more heat than interior joints, terminal plates are shaped and connected to the terminal portions so as to distribute a sheet of current in a way that more of the current flows along side edges than along the interior portion of the U-shaped structure.

Abstract: A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edges of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board.

Abstract: Apparatus for facilitating the assembly of a structural panel and for preventing the sag thereof comprises an upstanding support structure in the form of laterally spaced rows of longitudinally spaced columns (C) which extend upwardly from a floor support surface (F). Longitudinally extending support beams (B') interconnect the upper ends of the support columns (C), and the structural panel (2) comprising an outer plate (6) and an underlying skelton framework (7) is supported upon the support beams (B'). A radiation heating element truck (4), movable upon laterally spaced rails (8) by means of casters (11), include radiation heating elements (12) mounted upon a support panel (5) whereby the truck (4) is movable between first and second operative positions or stages (A, B).

Abstract: This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer.

Abstract: Apparatus for gripping and removing integrated circuits, including four heatable jaws movable into gripping relation with soldered integrated circuit leads. The heatable jaws are mounted to respective leveler plates, each of which is suspended from a base member by a pivotable gripper arm and three flexure arms. Individual air cylinders are selectively actuable to pivot the gripper arms and thereby achieve inward motion and gripping action of the jaws. A second embodiment employs a cam follower mechanism rather than air cylinders to actuate similarly-mounted jaw elements.

Abstract: A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bonding stage at horizontal locations thereof which are situated below the lead supporting portion of the tape carrier. Alternatively, the lead supporting means may take the form of a pair of horizontally extending rectangular columns which are retractably inserted into the above specified horizontal locations of the upper surface of the bonding stage. Thus, leads can be formed simultaneously with the outer lead bonding. The bonding stage may be divided into upper and lower stages, and the projections may be formed on the upper surface of the lower stage to extend through holes formed in the upper stage. This structure makes the projections retractable.

Abstract: A temperature controlled soldering iron wherein the same pair of dissimilar conductors, joined together, unitarily provides a soldering tip, a heating element for heating the soldering tip and a thermocouple for sensing the temperature of the soldering tip. When current is supplied to the conductors, a temperature effect is produced which is in addition to the normal heating of the conductors and results in a corresponding voltage which varies directly with the temperature of the conductors. The voltage is applied to a control circuit where it is amplified, compared against a reference voltage, corresponding to a pre-selected soldering temperature, and the voltage derived from said comparison is applied to regulating the current used for heating the dissimilar conductors. The dissimilar conductors are formed from wires of dissimilar metals and mounted in a generally cylindrical handle by a means which minimizes handle temperatures.

Abstract: A method and apparatus for manufacture and repair of thermally durable surface mounted device printed wiring assemblies which includes a printed wiring assembly having surface mounted devices thereon, which are attached to said wiring assembly by a quenched or rapidly soldified soldier joint. A method for manufacture and repair of such printed wiring assemblies is to heat the TWAs with SMDs thereon, above the solder melting temperature, and then expose the solder to a fluid below the solder melting temperature which is capable of absorbing heat rapidly from the solder. The intermediate solder joint is thereby rapidly solidified to achieve the advantages of the investive method.

Abstract: A method and device for automatic soldering multiple intermittently arranged terminals a bridging phenomenon from occurring between the soldered terminals by sliding, virtually horizontally, the iron tip of the soldering iron, which is held upon the arrayed terminals after the application of the solder to those terminals, in a direction which is at right angles to the direction of the arrayed terminals, thus separating it from the arrayed terminals.

Abstract: A collet holder which provides heated gas directly to and around the collet head, and prevents oxygen entrainment. The collet holder is characterized by three concentric sections. The first section receives the cartridge heater and holds the collet, providing it with a vacuum. The second section surrounds the forward portion of the first section and creates the gas turbulent flow heat exchanger. The collet extends through a discharge orifice by which the heated gas is applied to the collet head. Finally, a third shield section encases the collet holder and minimizes heat loss.

Abstract: A hand-held electrically heated tool for applying heat to an object includes an elongated metallic tubular handle open at its forward and rear ends and having a plurality of raised relatively-spaced longitudinally extending vanes formed on its the inner surface and extending between the forward and rear ends thereof. An exposed metal electrical resistance heating element forming a wire tip is mounted in an insulator disposed in the forward end of the handle in engagement with the vanes with the tip extending forwardly of the handle. A spherically concave portion of the insulator reflects heat away from the handle.

Abstract: The invention is directed to a method and apparatus for handling a component having a body and one or more members protruding therefrom, such that the protruding members are put in proper, mating registration with corresponding holes of a substrate or the like. The components are handled during transport and insertion by gripping of the bodies thereof, and the method and apparatus of the invention compensates for any offset in X, Y, and .theta. between the profile of the body and a particular pattern or location of the protruding members relative to the profile of the body.