Vacuum-type Holding Means Patents (Class 269/21)
  • Patent number: 6913524
    Abstract: The invention comprises a suction housing connected to a negative pressure forming means to suck in fluids, a suction opening member mounted on the suction housing, a part of which is caused to contact the surface of an object, and which defines a pressure-reduced area together with the suction housing and the surface of an object, and a means for maintaining the distance between the suction housing and the surface of an object at a predetermined distance, wherein the suction opening member and the surface of an object where in contact with each other are caused to be detached from each other partially or entirely due to the increase in the fluid pressure difference between the inside and the outside of the pressure-reduced area, resulting in the communication between the inside and the outside of the pressure-reduced area, allowing the outside fluid to flow into the pressure-reduced area.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: July 5, 2005
    Inventor: Fukashi Urakami
  • Patent number: 6898838
    Abstract: An inflatable bladder comprising at least one aperture and/or at least one baffle within the bladder for supporting a printed circuit board during component placement on a semiconductor substrate such as a printed circuit board is provided. The inflatable bladder is positioned to provide support for the substrate while apertures within the inflatable bladder communicate a suction force to the substrate to inhibit the substrate from bending, bowing, or flexing away from contact with the inflatable bladder during component placement. The inflatable bladder provides support for the substrate while attempting to prevent injury to components by pliably conforming to component irregularities on the back side of the substrate. The inflatable bladder can be selectively inflated or deflated for contacting the substrate and thereafter supporting the back side of the substrate during assembly operations.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: May 31, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Brian F. Gordon
  • Patent number: 6889967
    Abstract: A vacuum hold down table includes a surface sheet having perforations arranged so as to reduce surface cracking when the surface sheet is subject to forces during use of the table; the perforations may also be arranged to that a greater hold down force is produced in that portion of the table where the workpiece will be located, this may be accompanied by varying the hole diameter and/or hole spacing.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: May 10, 2005
    Assignee: Gerber Technology, Inc.
    Inventor: Eric Brown
  • Patent number: 6883791
    Abstract: A suction device includes a substrate having a plurality of aperture, in each of which an inner ring, a plug and an outer ring are mounted. The plug is moved between the inner ring and the outer ring. The inner ring and the plug are made of a magnet and a magnetic material to attach the plug on the inner ring to seal an axial hole of the inner ring. The plug will move to the outer ring by an external force, such as airflow, to seal an axial hole of the outer ring. An air guide plate is attached on the substrate and has a plurality of channels to be communicated to the axial holes of the outer rings respectively and to extract air therefrom.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: April 26, 2005
    Inventors: Chi-Wang Liang, Chung-Heng Yang
  • Patent number: 6877650
    Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: April 12, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Jeffrey W. Marsh, R. Tracy White, David L. Hamilton
  • Patent number: 6871571
    Abstract: Web processing apparatus (30, 300) is provided for high speed, extremely accurate die cutting or lamination operations. Processing station (32, 300) includes a Vacuum hold down plate (32, 308) which receives and holds an image bearing incremental segment of the web. In feed and out feed tension on the web is released while a segment of the web is held by the hold down plate. The hold down plate with a segment of the web thereon is selectively shifted about X, Y and ? axis as required to bring the image on the web segment into alignment with a web processing component at the processing station.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: March 29, 2005
    Assignee: Preco Industries, Inc.
    Inventors: Charles C. Raney, Hongli Du, John T. Pierson, Jr.
  • Patent number: 6871846
    Abstract: A body has a support surface for temporarily supporting a siding, trim, or other construction piece that is to be installed on a building wall. A suction cup is controllable to temporarily adhere by suction the support device to the building wall. An extendible spacer is used to accurately position the support device on the building wall. Notches in the body receive the ends of a tape measure or chalk line for accurately sizing and positioning the construction pieces. The support device can be used with existing compressors, vacuum pumps, or other suction-inducing devices. A venturi tube in the body generates the suction when an air compressor is used. A method of installing the siding, trim, or other construction pieces is also provided.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: March 29, 2005
    Inventor: Keith R. Antill
  • Patent number: 6857627
    Abstract: An inflatable bladder comprising at least one aperture and/or at least one baffle within the bladder for supporting a printed circuit board during component placement on a semiconductor substrate such as a printed circuit board is provided. The inflatable bladder is positioned to provide support for the substrate while apertures within the inflatable bladder communicate a suction force to the substrate to inhibit the substrate from bending, bowing, or flexing away from contact with the inflatable bladder during component placement. The inflatable bladder provides support for the substrate while attempting to prevent injury to components by pliably conforming to component irregularities on the back side of the substrate. The inflatable bladder can be selectively inflated or deflated for contacting the substrate and thereafter supporting the back side of the substrate during assembly operations.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: February 22, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Brian F. Gordon
  • Patent number: 6844274
    Abstract: A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: January 18, 2005
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo
  • Patent number: 6841049
    Abstract: In an optical disk substrate film-formation apparatus which prepared an optical disk by forming a thin film on a substrate, the optical disk substrate is held by a holder section. A contact support surface is provided to the holder section which closely contacts at least a portion of the surface of the optical disk substrate rear to the surface where the think film is formed.
    Type: Grant
    Filed: February 4, 2000
    Date of Patent: January 11, 2005
    Assignee: Ricoh Company, Ltd.
    Inventors: Kazunori Ito, Katsunari Hanaoka, Hiroshi Deguchi, Nobuaki Onagi, Hiroko Tashiro, Kiyoto Shibata, Yasutomo Aman, Hiroshi Miura, Wataru Ohtani, Hajime Yuzurihara, Masaru Shinkai
  • Patent number: 6841034
    Abstract: A device for welding a plurality of thermoplastic plastic parts (parts to be joined) forming a hollow body with an opening by a laser, comprising a vacuum holder having a vacuum chamber which communicates with a vacuum pump, is open on one side and, together with the hollow body, forms a closed chamber that can be evacuated. When a vacuum is applied, the vacuum holder holds the hollow body stationary, holds the joined parts together and enables testing of the tightness of the weld.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: January 11, 2005
    Assignee: JENOPTIK Automatisierungstechnik GmbH
    Inventors: Hans-Ulrich Zuehlke, Gabriele Eberhardt, Norbert Preuss, Martin Griebel, Juergen Weisser
  • Patent number: 6830416
    Abstract: A system and method for operating a machine whereby a workpiece is held on a worktable of the machine with a suction force. When the work piece has a surface area insufficient to receive a full cut from a tool mounted in a tool head of the machine, the machine automatically adjusts the depth and the cutting speed of the tool to lesson the cut so the workpiece is not moved or ejected from the worktable. The depth and speed of the tool may be adjusted in a single cut pass of the tool or they may be adjusted in successive cut passes.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: December 14, 2004
    Assignee: Thermwood Corporation
    Inventors: Kenneth J. Susnjara, Michael P. Hardesty, David Hildenbrand
  • Patent number: 6827344
    Abstract: The invention relates to a low-pressure holding device (1) with a low-pressure chamber (5) and a valve (9) for the permanent hold on gas-impermeable surfaces (14). The low-pressure holding device is fixed to a supporting surface by means of a piston suction pipe (13) which is detachably connected to the inventive device. The low-pressure holding device can be provided with a receptacle for holding appliances (2).
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: December 7, 2004
    Inventor: Harald Ristau
  • Patent number: 6823763
    Abstract: A fabric cutting system for cutting a pre-selected pattern from a fabric stock and transferring the cut fabric piece to a workstation. The system includes a cutter assembly for cutting the preselected pattern from the fabric stock. A configurable pickup assembly is located between the cutter assembly and the workstation and adapted to pick-up and transfer the cut fabric piece to the workstation. A hold down table adjacent to the cutter assembly maintains the position of the fabric stock in a determinable relationship to the position of the cutter assembly and the configurable pickup assembly. In the preferred embodiment, the hold down table is vacuum operated and includes a moving mesh belt on which and the fabric stock is moved downstream towards the pickup assembly as the fabric piece is being cut by the cutter assembly. This arrangement results in substantially higher throughput through the fabric cutting system.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: November 30, 2004
    Assignee: Sara Lee Corporation
    Inventors: Wayne G. Foster, Ken J. Thompson, John R Everhart, Erik D. Moore, Joel C. Rosenquist, Michael D. Hines
  • Patent number: 6821195
    Abstract: An invention is provided for a carrier head for use in a CMP process. The carrier head includes a metal plate that is capable of transferring a downforce to a wafer during a CMP operation. A plurality of vacuum holes is disposed within the metal plate, wherein each vacuum hole is positioned such that the vacuum hole is within five millimeters of an edge of the wafer during the CMP operation. In this manner, each vacuum hole can be positioned such that the vacuum hole is within an edge exclusion zone of the wafer during the CMP operation. In some embodiments, each vacuum hole is positioned such that the vacuum hole is within three millimeters of the edge of the wafer during the CMP operation, such as 2.7 millimeters from the edge of the wafer.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: November 23, 2004
    Assignee: Lam Research Corporation
    Inventors: Xuyen Pham, Ren Zhou, Raisa Khavinson
  • Patent number: 6817601
    Abstract: A block suction apparatus for fixing plate-shaped work pieces on a fixing beam or fixing table using under-pressure has at least one support surface provided with a sealing plate having a sealing lip about its periphery. The sealing lip delimits a suction chamber and least one supporting element is provided within the suction chamber. At least one additional supporting element is also provided and is located in the direct vicinity of the sealing lip. Sagging of sections of a plate being lifted by the apparatus which project past the block suction apparatus is thereby reduced and the edge of the plate can therefore be processed with greater accuracy.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: November 16, 2004
    Assignee: J. Schmalz GmbH
    Inventors: Kurt Schmalz, Ralf Stockburger
  • Patent number: 6817933
    Abstract: A plurality of spaced apart supports are designed to closely support a work piece immediately adjacent the edge being worked, ground or polished. Adjacent shear forced are also eliminated by the use of a polymeric interconnections used to both generally contribute to the spacing and to transmit the vacuum in a distributed manner among the individual support units. The top and bottom surfaces of the supports are dressably machineable in place on the working table to insure that all are brought to exactly the same height to insure even support, and utilize a hardened rubber, or any other suitable machinable material which will not enable the work piece to displace significantly downwardly upon the application of vacuum. The tops and bottoms, as a group, are selectively operable. The ability to periodically dress both ends of the interconnected supports gives the user the power to continually insure that each interconnected support set is within a more exacting vertical tolerance.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: November 16, 2004
    Inventor: John Blick
  • Patent number: 6805338
    Abstract: A wafer chuck assembly for a semiconductor wafer processing device has axially movable wafer support pins associated with a wafer chuck body of the wafer chuck assembly. The wafer support pins are biased to contact and support the backside of a semiconductor wafer when the semiconductor wafer is placed and/or maintained (typically via air suction) on the wafer chuck assembly. Each support pin axially moves independent of one another such that any area of contamination on the backside of the semiconductor wafer that registers with a support pin, moves the affected support pin axially downwardly.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: October 19, 2004
    Assignee: LSI Logic Corporation
    Inventor: Masakazu Okuda
  • Patent number: 6799756
    Abstract: A suction-cup device has a cup-shaped support body having a cup opening and a hole. A suction diaphragm is positioned in the cup opening of the cup-shaped support body. A rod extends through the hole and is connected to the suction diaphragm. A clamp has first and second arms pivotally connected together at an articulation pin, the first and second arms each having a clamping jaw at one end and an actuating section at another end. The clamping jaws are biased toward each other. The clamp has a clamping member pivotally connected to the rod by a pivot pin which extends in a direction transverse to a direction of the articulation pin. The clamping member operatively contacts the cup-shaped support body and moves the rod and actuates the suction diaphragm when the clamping member is pivoted to a suction position. The clamping member moves the rod and releases the suction diaphragm when the clamping member is pivoted to a release suction position.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: October 5, 2004
    Assignee: Wolfcraft GmbH
    Inventor: Klemens Degen
  • Patent number: 6796879
    Abstract: A dual semiconductor wafer slippage, or loss, and water-resistant sensor holder for chemical mechanical polishing (CMP) semiconductor fabrication equipment is disclosed. The holder has a body and a cover. The body is designed to hold two wafer slippage sensors at an angle to a vertical plane, such as substantially fifteen degrees, and has a window to allow the sensors to detect wafer slippage. The cover is situated over the window of the body to prevent slurry from spraying and drying onto the sensors during high-pressure rinse cleaning of a platen of the CMP semiconductor fabrication equipment.
    Type: Grant
    Filed: January 12, 2002
    Date of Patent: September 28, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Rico Cheng, Kang-Yung Peng, Kevin Lai
  • Patent number: 6798970
    Abstract: An apparatus for placing a fiber on a substrate, the apparatus including a base, a supporting member attached to the base, a first placement head attached to the support member, the first placement head having an extendable plunger slidably coupled to the first placement head, the first placement head having an airflow channel formed proximate to a tip of the plunger, a substrate carrier attached to the base, wherein, during operation of the apparatus, the substrate carrier holds a substrate beneath the plunger mechanism, and wherein, during operation of the apparatus, a vacuum source is connected to the placement head to draw a flow of air through the airflow channel, and wherein, during operation of the apparatus, the placement head picks up and holds a fiber against the plunger tip using forces associated with the flow of air.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: September 28, 2004
    Assignee: Zygo Corporation
    Inventors: Robert Brown, Jeffrey E. Leclaire, Huizong Lu, John L. Sullivan
  • Patent number: 6796014
    Abstract: An apparatus that includes a frame structure, a plurality of suction cups and a clamp assembly. The plurality of suction cups are coupled to the frame structure and are operable in an energized mode for securing the apparatus to a first structure. The clamp assembly is coupled to the frame structure and exerts a clamping force onto a second structure when the suction cups have secured the apparatus to the first structure. The clamping force is of sufficient magnitude to retain the second structure in a predetermined position relative to the first structure. An optional tool may be included to perform a desired operation and an optional conveyance mechanism may be employed to selectively position the tool relative the frame structure. A method for coupling a first structure to a second structure is also provided.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: September 28, 2004
    Assignee: The Boeing Company
    Inventor: Branko Sarh
  • Patent number: 6792852
    Abstract: A vacuum print system comprising: an outer shell to define an airtight inner space and having a closure door at a ceiling thereof; a printer provided in the airtight inner space; a worktable to supply a work to the printer provided in the airtight inner space operable to move; and an air exhaust system connected to the airtight inner space is disclosed. The worktable is operable to move between a sealing position and a work supplying position. The worktable at the sealing position divides the airtight inner space into two airtight compartments, a first compartment having the closure door, and a second compartment having the printer provided therein and the air exhaust system connected thereto. The worktable at the work supplying position supplies the work to the printer. Further, the closure door is operable to open to take the work in and out when the worktable is at the sealing position.
    Type: Grant
    Filed: January 8, 2003
    Date of Patent: September 21, 2004
    Assignee: Noda Screen Co., Ltd.
    Inventor: Hiroshi Kawakita
  • Patent number: 6786992
    Abstract: A dunnage platform is in the general shape of a rectangular slab with legs extending form one side. The dunnage platform is made from an expanded polystyrene core. A chemical combination process is used to chemically combine portion of the core proximal to its surface with high impact polystyrene. In a first of two parts of the combination process, the core is placed in a forming mold with one of its two sides and two thirds of its thickness extending therefrom. A heated sheet of high impact polystyrene is brought into contact with the portion of the core extending from the mold. In a similar manner, the other of the two sides of the core is made to extend from the forming mold for contact with a heated sheet of high impact polystyrene.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: September 7, 2004
    Assignee: Airdex International, Inc.
    Inventor: Laurence W. Dummett
  • Patent number: 6771090
    Abstract: The arrangement of test points on an integrated circuit (IC) undergoing testing in a probe station often requires rotation of the IC or the probes when performing a series of tests. A chuck with indexed rotation promotes rapid rotation of the device under test to a new test position and increases the productivity of the probe station. The device under test is mounted on a device mounting member that is affixed to a shaft rotationally mounted in a base. A resilient seal supports the device mounting member and forms a sealed chamber over a substantial part of the area of the device mounting member. Applying vacuum or pressure to the sealed chamber urges the device mounting member and base toward contact. The support provided by the resilient seal over substantial portion of device mounting member's diameter promotes stability and consistent planarity of the device mounting member without regard to the orientation of the shaft to device mounting member.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: August 3, 2004
    Assignee: Cascade Microtech, Inc.
    Inventors: Daniel L. Harris, Peter R. McCann
  • Publication number: 20040145103
    Abstract: A vacuum suction system comprises a work conveyor table 2 having work receiving openings 5, and a table base 3 having vacuum suction channels 7 which communicate with the work receiving openings 5 of the conveyor table 2. The work receiving openings 5 and the vacuum suction channels 7 communicate with a vacuum generation source 17 via a vacuum pipe 9. A negative pressure sensor 10 is disposed on the vacuum pipe 9. Based on a signal from the negative pressure sensor 10, a compressed air generation source 20 supplies a compressed air to the vacuum pipe 9 and thereby stabilizes the vacuum level in the vacuum pipe 9.
    Type: Application
    Filed: January 16, 2004
    Publication date: July 29, 2004
    Inventors: Tomoyuki Kojima, Shigeru Matsukawa, Hiroaki Abe
  • Patent number: 6767018
    Abstract: A machinable datum for use in a vacuum fixture is disclosed.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: July 27, 2004
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Arthur S. Daniels, James Pham, Ernest L. Baker
  • Patent number: 6764258
    Abstract: A positionable vacuum clamp system including a vacuum table and one or more positionable vacuum clamps which can be of various shapes to accommodate differently shaped workpieces. The positionable vacuum clamp(s) align to the vacuum table having a recessed grid. Each positionable vacuum clamp includes a base plate and a positionable center plate and attached top plate slidingly secured by a retainer washer to the base plate. Vacuum passages within and about the positionable vacuum clamp communicate between the vacuum table and the upper vacuum mating structure of the top plate to vacuumingly secure a workpiece to the top plate for subsequent machining by external equipment.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: July 20, 2004
    Inventor: Brian Akre
  • Patent number: 6764434
    Abstract: A machining center comprising at least two workstations. A first workstation is adapted to receive a first workpiece, and a second workstation is adapted to receive a second workpiece. The first workstation may be a vacuum table, and the second workstation may be comprised of a plurality of hold-down bars. A carriage is adapted to travel between the two workstations in one machine cycle. The carriage may have a single tool or a plurality of tools. During the machine cycle, the carriage is adapted to perform a machining operation (e.g., routing, drilling, sawing, and/or sanding) on the workpiece at each workstation.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: July 20, 2004
    Inventor: Wilhelm Volk
  • Patent number: 6751853
    Abstract: An apparatus which reduces the surface area with which a carrier film adheres to a die, including a plate member including laterally-spaced supports. Preferably, the apparatus also includes a vacuum source operatively connected to the plate member. Upon placement of a carrier film having an array of semiconductor dice adhered thereto onto the plate member, the dice are proximate the supports. The vacuum pulls air from the spaces between the supports, which partially releases the carrier film from the bottom surface of at least some of the dice. The apparatus may also include a die removal mechanism such as a vacuum collet type die pick-up mechanism, an extendable member die plunge-up mechanism, or a combination thereof. The present invention also includes a method for reducing the surface area with which a carrier film adheres to a die to facilitate removal thereof.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: June 22, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Rockwell Smith
  • Patent number: 6746022
    Abstract: The invention provides a chuck for holding a workpiece, such as a chip-array semiconductor Chip Scale Packages (CSP) substrate, having a plurality of components such as CSPs to be singulated, and chaff areas of the components. The chuck comprises means to hold the chaff areas when the components are being singulated, that may include a first pressure means to hold the components and a second pressure means to hold the chaff areas.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: June 8, 2004
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Yiu Ming Cheung, Ka Wing Wong
  • Patent number: 6736408
    Abstract: In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: May 18, 2004
    Assignee: Applied Materials Inc.
    Inventors: Donald J. K. Olgado, Bernardo Donoso, Alexander Lerner
  • Patent number: 6732624
    Abstract: The invention pertains to a cutting device, particularly for the cutting of predetermined breaking points in plastic membranes, foils or the like, with an air-permeable supporting surface for the plastic membrane or the like and with an aspirating device, with which the plastic membrane or the like is applied onto the supporting surface. The supporting surface is formed by a sintered metal plate.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: May 11, 2004
    Inventor: Heinz Gaubatz
  • Patent number: 6725557
    Abstract: A measuring system including a linear gauge 8 is placed on a vibration isolation table 7, and this system assembly is placed in a temperature controllable, constant-temperature chamber. A specimen table 16, which has a centrally-disposed circular protrusion 16C of a diameter sufficiently smaller than a specimen under measurement, is mounted on a surface plate 2 of a linear gauge 8. The position of a measuring element 1 is measured when it is brought into contact with the centrally-disposed circular protrusion 16C, and the position of the measuring element 1 is measured when it is brought into contact with the specimen placed on the specimen table. The measured values are used to determine the thickness of the specimen.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: April 27, 2004
    Inventors: Jun-ichi Kushibiki, Mototaka Arakawa, Ryoichi Okabe
  • Patent number: 6722642
    Abstract: A vacuum chuck for holding a semiconductor wafer during high pressure processing comprises a wafer platen, first through third lift pins, and an actuator mechanism. The wafer platen comprises a smooth surface, first through third lift pin holes, and a vacuum opening. In use, the vacuum opening applies vacuum to a surface of a semiconductor wafer, which chucks the semiconductor wafer to the wafer platen. The first through third lift pins mount within the first through third lift pin holes, respectively. The actuator mechanism couples the first through third lifting pins to the wafer platen. The actuator mechanism operates to extend the first through third lift pins in unison above the smooth surface of the wafer platen. The actuator mechanism operates to retract the first through third lift pins in unison to at least flush with the smooth surface of the wafer platen.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: April 20, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Thomas R. Sutton, Maximilan A. Biberger
  • Patent number: 6719877
    Abstract: The bonding system for auxiliary door seals contains a receiving means for detachably holding a mounting template whose peripheral edge at the narrow side is provided with a plurality of spaced-apart trough-like suction members which are connectable via a joint line and a connection valve to a source of vacuum to suck in the auxiliary door seal placed on the peripheral edge. The receiving means is guided together with the mounting template by a slide means below and past two plasma irradiation means and below two metering devices which apply a predetermined amount of a viscous adhesive to the auxiliary door seal. Each of the metering devices has a double seat valve which releases either the connection between a cartridge and a displacement-type metering means or the connection between the displacement-type metering means and the outlet opening of the valve means.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: April 13, 2004
    Inventor: Hartmut Böhle
  • Publication number: 20040061267
    Abstract: A vacuum hold down table includes a surface sheet having perforations arranged so as to reduce surface cracking when the surface sheet is subject to forces during use of the table; the perforations may also be arranged to that a greater hold down force is produced in that portion of the table where the workpiece will be located, this may be accompanied by varying the hole diameter and/or hole spacing.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Inventor: Eric Brown
  • Patent number: 6712132
    Abstract: A piezoelectric wafer clamping system for securing semiconductor wafers during the integrated circuit manufacturing processes. The piezoelectric wafer clamping system includes a plurality of piezoelectric stack assemblies designed for providing a real time adjustable vertical clamping force to a semiconductor wafer, an annular wafer clamp member coupled to each one of the plurality of piezoelectric stack assemblies and positionable to abut a top surface of a semiconductor wafer, a wafer support assembly designed for supporting the semiconductor wafer during processing, and a control assembly to monitor and compare actual cooling gas process parameters with preset process chamber parameters and electronically regulate a vertical clamping force applied by the plurality of the piezoelectric stack assemblies.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: March 30, 2004
    Inventor: Revvie A. Green
  • Patent number: 6708393
    Abstract: A fixture and method for aligning a vehicle fender and door, particularly a fixture for an assembly line point that attaches to a vehicle door and moves a front edge of the door to a spacing element, attaches to a vehicle fender, moves the fender to the spacing element and to a pre-defined 3-dimensional relationship with the door, and holds the fender in the pre-defined relationship while the fender is secured in place on the vehicle.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: March 23, 2004
    Assignee: DaimlerChrysler Corporation
    Inventors: Michael Roy, Anthony J Osborne, John LeBlanc, Ronald R Moore, Larry Weatherall, Lawrence J Guc
  • Patent number: 6701596
    Abstract: In order to improve a clamping and spreading device for the relative movement of two workpieces which have surfaces lying essentially parallel to a common plane, comprising a first holder, to which the first workpiece can be fixed, and a second holder, to which the second workpiece can be fixed, wherein the two holders are movable relative to one another, in such a manner that this can be used in a simple manner comfortable for the operator it is provided for the first holder and the second holder to be connected to one another via a guiding device so as to be displaceable and for the guiding device to comprise an actuating element which is mounted not only on the first holder so as to be movable but is also mounted on the second holder so as to be movable and via which a relative movement of the two holders can be actuated.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: March 9, 2004
    Assignee: Bessey & Sohn GmbH & Co.
    Inventors: Gerhard Kloepfer, Karl Philipp
  • Patent number: 6702268
    Abstract: Apparatus and method for the fixing of panels to be worked by vacuum suction with suction holes using at least one plane with selectively liftable and lowerable small pistons as a support for the panel to be worked. The same small pistons are lifted and lowered by the pressure differential clearance, respectively the lifting ones with respect to the lowering ones and vice versa, along orthogonal lines.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: March 9, 2004
    Assignee: Heian Europe S.R.L.
    Inventor: Marco Nascimben
  • Publication number: 20040041321
    Abstract: The present invention relates to a suction device with telescopic evacuating pipes which includes a cantilever, a plurality of glide pieces, a pipe-collecting piece and a plurality of telescopic evacuating pipes. The cantilever is provided with a glide groove at both sides thereof. The glide pieces are movable along the glide groove of the cantilever and are positioned by fastening knobs. Each of the glide pieces has a vacuum sucker 132 at the bottom thereof. A first connector is arranged at one side of the glide pieces and used to connect through the internal piping with the vacuum sucker. The pipe-collecting piece is installed at the inner end of the cantilever and is used to join second connectors in connection with a vacuum generator through hosepipes. One end of the telescopic evacuating pipe is fastened at the outer end of the pipe-collecting piece while the other end is connected to the first connector.
    Type: Application
    Filed: August 27, 2002
    Publication date: March 4, 2004
    Inventor: Tsung-Chang Hsieh
  • Patent number: 6698735
    Abstract: Fluid bearings, vacuum chucks and methods for producing these devices. One example of a method for forming a fluid bearing includes forming a plate having a face surface and a bonding surface, coupling a first side of a body to the bonding surface, placing the face surface of the plate against a predetermined surface, and generating a pressure difference to conform the face surface to the predetermined surface. One example of a fluid bearing of the invention includes a plate support and a flexible bearing plate having a bonding surface which is attached to the plate support with an adhesive which is flexible before hardening. The flexible bearing plate conforms to a predetermined surface during a portion of the time that the adhesive hardens. Examples of vacuum chucks, and methods for forming vacuum chucks, and other aspects of the invention are described.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: March 2, 2004
    Inventor: Marek Zywno
  • Patent number: 6699353
    Abstract: The invention concerns an air permeable paper sheet as support element for a layer of fabrics (mat) on a production line in particular during the cutting phase. The invention is characterized in that said sheet has in its thickness pores or fine perforations distributed over the whole surface thereof, said sheet having a bulkiness or hand more than 2.5 cm3/g, enabling it to allow air to pass through by the suction effect produced from beneath its lower surface.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: March 2, 2004
    Assignee: Ahlstrom Lystil SA
    Inventors: Christophe Guillaumot, Didier Bigot
  • Patent number: 6688300
    Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: February 10, 2004
    Assignee: Intercon Technologies, Inc.
    Inventor: Alois Tieber
  • Patent number: 6685179
    Abstract: A positioning device for determining the position of an object includes an anchoring surface, a first movable carriage on which the object is loaded and which has a means for suctioning onto the anchoring surface, a second movable carriage which has a drive assembly and which is connected with the first movable carriage as needed, and a connecting means which controls the connection of the first and second movable carriages. The first and second movable carriages are connected by the drive assembly and the first movable carriage is conveyed to a predetermined position on the anchoring surface and is suctioned and anchored on the anchoring surface at this position by a means for breaking the connection between the first and second movable carriages and for performing the suctioning to position the object.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: February 3, 2004
    Assignee: Agilent Technologies, Inc.
    Inventor: Toshiki Kita
  • Patent number: 6676787
    Abstract: A false drum servers used in the manufacture of tires having a hollow cylindrical drum with a perforated surface on the drum through which air is drawn. The drawn air creating a suction surface for holding flat or sheet materials that are to be cut before transferring onto a tire building drum. When smaller pieces of flat materials are being held on the drum, the perforations that are not covered allow air to flow freely into the drum, thereby reducing the suction adhering effect of the perforated surface. The present invention provides methods and apparatus for varying the amount of perforated area through which air can be drawn into the drum, thereby changing the amount of suction adhering surface area of the perforated drum.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: January 13, 2004
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Marie-Laure Bénédicte Josette Cavalotti, John Kolbjoern Roedseth
  • Patent number: 6672318
    Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: January 6, 2004
    Assignee: Mimasu Semiconductor Industry Co., Ltd.
    Inventors: Masato Tsuchiya, Shunichi Ogasawara, Hideyuki Murooka
  • Patent number: 6672576
    Abstract: An apparatus for and method of utilizing vacuum in machine tool operations utilizes vacuum, rather than clamps and fixtures, to secure the work piece to the table of the machine tool. The apparatus employs a plurality of vacuum buttons arranged on a vacuum plate or a configurable vacuum plate. This system minimizes the downtime for machine tools by permitting the set up for a particular machining operation or series of operations to be conducted off line. That is, the set up for one operation is primarily made while the machine tool is performing another operation or series of operations on another work piece. The machine tool continues to operate producing one machined, useful product while the set up for a second product is being performed. The use of a plurality of vacuum buttons arranged on a vacuum plate allows the flexibility to accommodate a variety of different work pieces.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: January 6, 2004
    Assignee: United Defense LP
    Inventor: Charles M. Walker
  • Patent number: 6666122
    Abstract: High speed, extremely accurate web or sheet-fed segment die cutting or lamination apparatus (30, 300) has a processing station (32, 300), which receives a sheet or web segment, and is provided with a vacuum hold-down plate (142, 306) for holding initially fed segments (38). The plate is shiftable as necessary along orthogonal X-Y axes in the plane of the segment (38), and/or is rotatable about a &thgr; axis transverse to the segment plane. Plate movement is effected by a series of aligned, translatable eccentric drive units (178-182, 346-350). Segments (38) carry positioning fiducials (44) that are compared with fixed reference indicia (250, 252) in the station (32, 300). The comparison data is used by a controller (254) to generate the plate movement information used in simultaneous operation of the associated plate drive units (178-182, 346-350).
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: December 23, 2003
    Assignee: Preco Industries, Inc.
    Inventors: Charles C. Raney, Hongli Du, John T. Pierson, Jr.