Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).

Abstract: The invention relates to a vacuum chuck capable of reducing cost and weight by making its structure simple and shortening the clamping time.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: An energy-saving vacuum adsorption apparatus to adsorb at least one article on a workstation includes an air compressor connecting to the workstation through a duct, a vacuum generator which is connected to the air compressor through the duct to suck air from the workstation into the duct and has a second control valve, a sealed vacuum tank to store the sucked air and provide pressure detection, a sensor connecting to the vacuum tank through a detection circuit to detect and control vacuum condition of the workstation, and a first control valve connecting to the detection circuit to control ON and OFF of the air compressor. The air compressor does not need operation for a long duration, thus can save electric power and has a longer life span.

Abstract: Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.

Abstract: The invention relates to a tool that comprises a body (1) in the form of a compact unit made of an appropriate material of the thermoplastic resin material type. The body (1) is adapted for placing the vacuum generator as close as possible to the suction cup (2). It comprises: on the one hand, a bore for housing the vacuum generator in the form of a cartridge (3), wherein said bore defines the vacuum chamber (44) and communicates, on the side corresponding to the inlet of said cartridge (3), with the pressurised air supply, and on the other side, i.e. the side corresponding to the outlet of said cartridge, with an expansion chamber (39) in the form of a silencer; and on the other hand, a very short inner circuit between said vacuum chamber (44) and the suction cup (2), that comprises one or more cavities and/or openings.

Abstract: A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.

Abstract: A lithographic apparatus includes an illumination system constructed and arranged to condition a radiation beam, and a support constructed and arranged to support a patterning device. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The apparatus also includes a substrate table constructed and arranged to hold a substrate, and a projection system constructed and arranged to project the patterned radiation beam onto a target portion of the substrate. The substrate table includes a chuck having a plurality of protrusions constructed and arranged to support corresponding parts of a bottom surface of a wafer. The top surface of at least one of the protrusions includes a plurality of elements that define a reduced contact area between the substrate and the top surface of the protrusion.

Abstract: Mechanism for producing vacuum pressure and air flow for drawing recording paper of various widths to the platen surface of a printer enables such pressure and air flow to be held in a suitable range without adjusting the suction. A first suction area with the same width as the minimum width of the recording paper is disposed width-wise in the middle of the platen surface that opposes the inkjet head of the printer, and second suction areas are disposed on the left and right sides of the first suction area. The first suction area is divided into a grid by intersecting ribs to form first chambers, each having a first suction hole formed in a bottom thereof that communicates with a vacuum channel. The second suction areas are also segmented to form second chambers. Second suction holes are selectively formed in some, but not all, of the second chambers and are appropriately spaced from the first suction holes.

Abstract: A vacuum release device is provided for temporarily immobilizing objects, the device comprising: a substrate; a plurality of vacuum release subunits which can be operated independent of each other, each vacuum release subunit comprising an adhesive layer over a surface of the substrate; and a spacing material positioned between the substrate and the adhesive layer so as to form a chamber within which a vacuum may be formed, application of the vacuum causing the adhesive layer to recess toward the chamber.

Abstract: Provided is a substrate suction apparatus which has a vacuum suction mechanism and an electrostatic attraction mechanism, and improves planarity of a subject to be processed by improving uniformity in vacuum suction power. A method for manufacturing such substrate suction apparatus is also provided. A substrate suction apparatus (1) is provided with a base board (2), a dielectric body (3), an electrostatic attraction mechanism (4) and a vacuum suction mechanism (5). Specifically, the dielectric body (3) is composed of a downmost dielectric layer (31), an intermediate dielectric layer (32) and a topmost dielectric layer (33). The electrostatic attraction mechanism (4) is composed of attraction electrodes (41, 42) and a direct current power supply. The vacuum suction mechanism (5) is composed of a groove (51), a suction channel (52), a porous dielectric body (3) and the porous attraction electrodes (41, 42).

Abstract: An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.

Abstract: An improved vacuum box assembly for use in printed circuit board manufacturing where the printed circuit board is supported during manufacturing operations on the second side of the board. The vacuum box uses a unique and improved side plate that securely retains commercially available substrate support devices within the vacuum box. The side plate has a retention cavity configured to receive one or more substrate support devices therein. The side plate retains the substrate support device in a desired position. Open or unoccupied regions of the retention cavity may be sealed by use of specifically configured vacuum blocking plates.

Abstract: A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

Abstract: A device capable of smoothly, easily and automatically installing a molding on a door panel for an automobile is provided and includes a molding installation jig and a dynamic sensor located between a jig body and an arm. The dynamic sensor is designed to detect a force applied from the molding installation jig to the molding. A finger is supported on a side of the jig body to contact and hold an end section of the molding. Three suction pads, which communicate with a vacuum device, are provided on a surface of the jig body at equal intervals. A pair of brackets having a C-shaped cross section are provided on a side surface of the jig body, which is perpendicular to the surface on which the suction pads are provided. A first roller, a second roller, and a third roller 19 are rotatably supported in each of the brackets.

Abstract: A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work.

Abstract: A three piece vacuum cup is made from rubber to resist damage and facilitates reconfiguring when badly damaged or for specific applications. The vacuum cup includes top, center, and bottom parts. The top is easily and inexpensively replaceable. A flexible lip seal surrounds the top edge of the top to seal against irregular surfaces and damage to the lip seal may be addressed by inserting a cord seal into slots in the top to form a second seal. Part of the top may be cut away to use with small parts and sealed using the cord seal. The center includes a family of passages which may be selectively blocked to permit use of partial tops. A bar pattern on the top has bars aligned in perpendicular directions to better hold material in all cutting directions.

Abstract: The invention concerns a process and the associated universal device for supporting a part (1) of random and/or possibly complex shape in relation to a rigid base (11) while establishing a work reference. It consists of inserting between the part to be held and the rigid base (11), at least one deformable airtight enclosure (3) of constant volume full of incompressible particles (4). Then vacuum is applied inside the deformable enclosure (3) of constant volume using a vacuum source (5) which can be connected to the deformable enclosure (3). Thus the particles (4) amalgamate to constitute a solid block which at least partially rests on the rigid base (11) and holds the part (1) matching its shapes.

Abstract: A substrate holding apparatus configured to hold a substrate by vacuum holding includes a rim which has a circumferential shape and is configured to support the substrate, a projection portion configured to support the substrate in an inner area surrounded by the rim, an exhaust unit configured to exhaust gas from an inner space within the rim to attract and support the substrate, a lift pin configured to load the substrate on the rim and the projection portion, a supply unit configured to supply gas to the space surrounded by the rim, and a control unit configured to control a flow rate of the gas supplied from the supply unit, wherein when the gas is exhausted by the exhaust unit, the control unit starts supplying the gas before the substrate contacts the rim and the projection portion, and controls the flow rate of the supplied gas in order to reduce a deformation in the substrate caused by exhaust of the gas.

Abstract: A defoaming method for removing air bubbles from a curable resin material and a contact portion of the resin material with an irregular structure of a flat metallic mold. The mold includes a fine structural region having a fine irregular structure and a flat region in the periphery of the fine structural region. The curable resin material is applied to the irregular structure of the fine structural region, filling the irregular structure with the resin material.

Abstract: An exemplary lens holding apparatus includes a pipe, a number of hollow lens holding units, and an air pump. The pipe has an airtight end and an air vent end. The lens holding units each are in communicate with the pipe and each include a number of first portions and a number of second portions. The first and second portions are alternately arranged and each have an inner space for communicating each other. The second portions each have a top wall and a bottom wall. The top wall has a first through hole defined therein and in communicate with the inner space of the second portion. The air pump is connected to the air vent end and configured for pumping air from the pipe, such that lenses received in the first through holes are releasably held in position.

Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Abstract: A supporting system, the system includes a vertically movable chuck and a stationary chuck; wherein the vertically movable chuck and the stationary chuck are concentric; wherein the vertically movable chuck vertically moves between an upper position and a lower position; wherein when the vertically movable chuck is positioned at the upper position an upper surface of the vertically movable chuck is higher than an upper surface of the stationary chuck and when the vertically movable chuck is positioned at the lower position the upper surface of the vertically movable chuck is lower than the upper surface of the stationary chuck.

Abstract: A vacuum sucker for workpiece having through holes comprises a vacuum cup and a vacuum accessory. The vacuum cup is provided with a combining section and a vacuum chamber. The vacuum accessory is provided with an assembling section and a suction head having an abutting surface. The vacuum accessory is defined with a passage, the assembling section of the vacuum accessory is screwed with the combining section of the vacuum cup, so that the suction head of the vacuum accessory is located in the vacuum chamber of the vacuum cup. Thereby, the abutting surface of the vacuum accessory can seal the through holes of the workpiece so as to prevent air from outside from entering the vacuum sucker, and the passage of the vacuum accessory is used to vacuum the vacuum chamber of the vacuum cup, thus sucking the workpiece successfully.

Abstract: A method for producing a duct from a planar board having two opposed substantially parallel edges with metal foil facings on opposed major surfaces of the board is disclosed. The method comprises making planar cuts through one of the metal foil facings and at least most of the planar board there below to produce a blank with 3 parallel “V shaped grooves which are parallel to angled edges of the blank. A duct is formed by folding the blank so that the “V” shaped grooves form three of the edges of the duct, and the angled edges form the fourth of the edges.

Abstract: An inner member having a supply port is installed at the inside of a housing, wherein the housing and the inner member are connected together by connecting bolts. Air is supplied to the supply port of the inner member and is directed and introduced through communication passages into an annular passage. Thereafter, the air is directed outwardly from a plurality of lead-out holes, which communicate with the annular passage, in a swirling direction with respect to an annular recess facing the workpiece. In addition, by having the air flow along the annular recess, which is formed with a substantially trapezoidal shape in cross section, the workpiece is maintained in a non-contact state with respect to a holding surface of the inner member.

Abstract: A lamination apparatus and a laser-induced thermal imaging method using the same are provided. The lamination apparatus comprising: a chuck for fixing first and second substrates; and having at least one vacuum hole located therein and exposed outside of the first substrate therein.

Abstract: A device for positioning a workpiece includes a socket body rotatably held on a metallic ball by an array of permanent magnets arranged into a partial socket. An air delivery system controls a flow of air passing between the magnets and the ball to alter the friction between the socket body and the ball. A positive flow of air into the socket reduces the friction, allowing the workpiece to be more easily rotated during repositioning, whereas drawing air away from the socket produces a partial vacuum which increases the friction, causing the socket body to be locked in a single position on the ball.

Abstract: A vacuum-mounted clamp for clamping a first component to a second component. The clamp includes a substantially rigid body having an application face, a back face opposite the application face, a side, and a vacuum port extending between the application face and the back face. The application face has a step adjacent the side for engaging the first component. The clamp includes a flexible seal connected to the rigid body adjacent the application face. The seal has a vacuum port in fluid communication with the vacuum port in the primary body and a periphery for contacting the second component to create a vacuum area between the clamp and the second component. The vacuum port of the body and the seal are in fluid communication with a vacuum generator for generating a vacuum in the vacuum area.

Abstract: The present invention is directed towards a chucking system to hold a substrate, said system including, inter alia, a chuck body having first and second opposed sides, said first side including an array of fluid chambers arranged in rows and columns, said fluid chambers each comprising first and second spaced-apart recesses defining first and second spaced-apart support regions, with said first support region cincturing said second support region and said first and second recesses, and said second support region cincturing said second recess, with said substrate resting against said first and second support regions, with said first recess and a portion of said substrate in superimposition therewith defining a first chamber and said second recess and a portion of said substrate in superimposition therewith defining a second chamber, with each column of said first chambers and each row of said second chambers being in fluid communication with a differing source of fluid to control a flow of fluid in said array

Abstract: The invention provides a brush mounting structure of an automatic cutting machine that can allow dismount of any desired brush from a brush mount, can allow sequential rotation of the movable brushes so that the brushes on the brush mounts can be rearranged in parallel, and can allow a clamping force for clamping engagement between the brush and the brush mount to be held against a load applied from a particular direction.

Abstract: A vacuum cup is made from rubber to resist damage and providing a vacuum seal without a separate gasket or O-ring. The vacuum cup may be one of several configurations suitable for different CNC machines and includes a rubber body comprising a bottom surface for mounting, a top surface including a vacuum area for holding a work piece, and a raised edge around the perimeter of the top surface for sealing against the work piece. The bottom surface may have any one of a variety of machine interfaces to cooperate with various machines. A vacuum passage connects the bottom surface with the vacuum area and a check valve may reside in the vacuum passage. The rubber body is sufficiently strong to resist flexing due to vacuum or work piece weight and the vacuum area includes work piece supports for contacting a work piece held on the vacuum cup.

Abstract: A vacuum hold-down device comprising a base member (1) and a separate workpiece support (8) which co-operate to define a vacuum chamber. The device further comprises a venturi (15) having an inlet port (7) for connection to a source of pressurized fluid, an outlet (9) for fluid from the venturi, and a fluid connection (19, 5) from a low pressure region of the venturi (15) to the inside of the vacuum chamber, for providing a partial vacuum therein. The partial vacuum will hold the base member (1) and the workpiece support (8) together to maintain a peripheral seal therebetween. The workpiece support (8) is provided with securing means (16) for securing a workpiece (10) thereon. The invention also provides a vacuum hold-down system comprising the base member (1) and a plurality of interchangeable workpiece supports (8).

Abstract: A pneumatically actuated area vacuum gripper for gripping and, if necessary, separating workpieces is provided by the present disclosure. In particular, the vacuum gripper is used with thin, flexible workpieces, and has a suction chamber, which has a suction wall with perforations, to be placed on the workpiece. An ejector nozzle has a connection and an outlet, the ejection nozzle being connected to the suction chamber via its connection, and the outlet of the ejector nozzle opening to the outside or into an exhaust air duct, and the suction inlet of the ejector nozzle empties into the suction chamber, whereby the direction of the air stream in the connection coming from the suction chamber corresponds to the direction of the main air conveyance in the ejector nozzle.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: A machine tool has pass-through pallet loading allowing pallets to be loaded or discharged from either side of the machine. The pallet receiver is mounted on the X-axis of the machine, and the pallet is loaded onto the pallet receiver with the pallet in a vertical orientation. Cross axis rollers on the pallet receiver support the pallet and spacing rollers maintain the pallet spaced from Z-axis locating pads as it moves to a centered position on the pallet receiver. The Z-axis pads present a relatively large surface area to the rear face of the pallet, and are configured to provide vacuum clamping to lock the pallet in all three axes once it is centered on the pallet receiver. A rotating key is provided to center and lock the pallet relative to the pallet receiver before the vacuum clamping is applied.

Abstract: A substrate support plate transfer apparatus for fabricating an organic light emitting display is disclosed. In one embodiment, the apparatus includes a quartz plate transferred into a bonding processing chamber for an organic light emitting device, a protection frame on which the quartz plate is placed in order to transfer the quartz plate into the chamber, and a frame-shaped supporting plate including a sliding transfer device for helping the transfer of the protection frame and installed in the chamber. The quartz plate has a rigidity capable of enduring pressure in the bonding process applied to a large sized substrate, and the apparatus provides for convenient replacement of the quartz plate.

Abstract: A holding/turning device for touch-sensitive flat objects, in particular wafers, with a distance positioning device which is arranged for holding the object perpendicular to the object plane at a defined distance, a lateral positioning device, arranged for positioning the object in the object plane and for rotating together with the object about a rotational axis perpendicular to the object plane, and with a rotational drive, coupled with the lateral positioning device, providing a driving force for rotating the object about the rotational axis, wherein the driving force can be applied to the object by means of the lateral positioning device. The distance positioning device has means for holding the object without involving contact, and is decoupled from the rotational drive in such a way that the distance positioning device does not rotate together with the object.

Abstract: Web processing method and apparatus (30, 300) is provided for high speed, extremely accurate die cutting or lamination operations. Processing station (32,300) includes a vacuum hold down plate (32,308) which receives and holds an image bearing incremental segment of the web. In feed and out feed tension on the web is released while a segment of the web is held by the hold down plate. The hold down plate with a segment of the web thereon is selectively shifted about X, Y, and ? axes as required to bring the image on the web segment into alignment with a web processing component at the processing station.

Abstract: A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the support surface and lower than the support surface, by supporting the electronic component with the support surface so that the electronic component does not come into contact with the inlet and so that a part of a surface of the electronic component adjacent to the support surface is exposed out of the support surface and by attracting a region of the electronic component exposed out of the support surface toward the inlet; and electrically coupling the electrode and a conductive pattern with the electronic component fixed to the supporter.

Abstract: Disclosed are a substrate support apparatus and an apparatus for examining the seal pattern of an LCD cell. The substrate support apparatus includes a movable stage provided with drawing nozzles for attaching a substrate to an upper surface and adapted to rotate by a predetermined angle; a fixed stage spaced from the movable stage and provided with floating nozzles for ejecting air upward and drawing nozzles for drawing air downward; and a driving device coupled to the movable stage to rotate the movable stage. The apparatus for examining the seal pattern of an LCD cell includes the substrate support apparatus; and a gantry unit including support platforms positioned on both sides of the substrate support apparatus, a bridge positioned above the substrate support apparatus to connect the support platforms, and a correction device coupled to the bridge to examine and repair a seal pattern of a substrate.

Abstract: The support system and method enables exact and preferably machine assisted manual location and height placement of a vacuum operated hold down with rigid pre-set support on a conventional working table. A height adjustable jack screw support with angularly flexible hold down enables a holding support engaging the bottom of a work piece even where a lower surface of the work piece has an irregular shape due to the ability of the upper cup support to passively tilt to engage the work piece.

Abstract: A support plate for supporting a wafer includes a plurality of through holes piercing the support plate in the thickness direction, and a belt-shaped or island-like flat portion on which the plurality of through holes are not formed.

Abstract: A vacuum-operated vehicle glass handling system includes a plurality of suction cups movably disposed on a frame. A powered vacuum source is fluidly connected to the plurality of suction cups for providing a vacuum at each of the plurality of suction cups. A powered vacuum source includes a pair of vacuum pumps both fluidly connected to the plurality of suction cups for redundantly providing the vacuum to the plurality of suction cups. A power source is selectively electrically connected to the powered vacuum source. A pair of vacuum actuators is on the frame for selectively electrically connecting the power source to the powered vacuum source so the powered vacuum source can provide the vacuum at the plurality of suction cups. The power source is electrically connected to the powered vacuum source upon actuation of one or both of the pair of vacuum actuators. A pair of release actuators is on the frame for selectively releasing the vacuum provided at the plurality of suction cups.

Abstract: A dunnage platform is in the general shape of a rectangular slab with legs extending form one side. The dunnage platform is made from an expanded polystyrene core. A chemical combination process is used to chemically combine portion of the core proximal to its surface with high impact polystyrene. In a first of two parts of the combination process, the core is placed in a forming mold with one of its two sides and two thirds of its thickness extending therefrom. A heated sheet of high impact polystyrene is brought into contact with the portion of the core extending from the mold. In a similar manner, the other of the two sides of the core is made to extend from the forming mold for contact with a heated sheet of high impact polystyrene.

Abstract: Substrate processing method and apparatus are disclosed. The substrate processing apparatus includes a non-contact air bearing chuck with a vacuum preload.

Abstract: A stage is provided on which is mounted a substrate that has a concavo-convex portion such as a circuit formed on the underside thereof. A channel 3 through which a coolant such as water flows is formed in a stage 1. An annular flange portion 4 is formed on the top surface of the stage 1. The inner side of the flange portion 4 forms a concave portion 5. The top surface of the flange portion 4 is provided with a smooth finish in order to mount a peripheral section of the underside of a substrate W thereon. Holes through which are passed three positioning pins 6 and lift pins 7 are provided in the flange portion 4 at regular intervals in the circumferential direction.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: Systems and methods for positioning fairing sheaths are provided. In this regard, a representative method includes using vacuum pressure to assist in moving opposing portions of a fairing sheath away from each other.