Abstract: Isothermal work piece holding system uses vibration-damping, low thermal conductivity, low TCE polymer-composite holding body(ies) to damp machine tool vibration and chatter while accurately, rigidly maintaining the work piece in position by vacuum and/or mechanical clamps during machining. Cooling fluid channels having high thermal conductivity plates in contact with the work piece transfer thermal energy to/from it to maintain it isothermal during machining, inspection and assembly, eliminating dimensional changes and increasing process repeatability. Minimizing chatter reduces cycle time and improves surface finish which eliminates manual re-work. The system employs vacuum and coolant fluid pumps, heater/cooler(s), temperature sensor(s) and controller(s) to achieve highly accurate dimensional tolerances machining of parts which reduces error stack-up and assembly costs. Isothermal fixtures are disclosed for assembling parts and automated rivet settings in precise locations with reduced use of shims.

Abstract: A spindle device to mount and rotate an object, including: a housing; a main shaft supported by the housing rotatably to the housing wherein the main shaft includes a through hole which goes through from an end to the other end thereof, and an opening of the through hole forms a mounting section to mount the object at the end, and an opening of the through hole forms a suction section at the other end; a connecter member disposed to cover-the outside of the other end and connected with the external negative-pressure source; and a bearing disposed between the circumference of the main shaft at other end and the connecter member covering the outside; wherein the object is suctioned onto the mounting section at the end with the external negative-pressure source through the through hole.

Abstract: An apparatus and method for engaging and transferring a discrete part having a varying thickness to a substrate web. The apparatus includes one or more transfer assemblies and a web conveyor supporting the substrate web. Each transfer assembly includes a carrier member adapted to engage and transport the discrete part. One of the carrier member and the web conveyor includes a recessed portion for receiving portions of the discrete part that are relatively thicker than other portions of the discrete part, thereby ensuring more uniform contact between the discrete part and the web substrate.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A coating apparatus (2) includes a work table (20) having a plurality of blowing holes (201) for suspending a substrate (200) thereabove, a coating unit (22) having a photoresist coating nozzle (222) and a supplying device (224) for photoresist material. The photoresist coating nozzle is disposed above the work table, and the supplying device connects to the coating nozzle for supplying photoresist thereto. In operation, the substrate to be coated is continuously suspended in the gas just above but not in contact with the work table. Therefore, accumulation of static electricity and/or foreign particles on the substrate can be avoided. Gas emitting from the blowing holes can remove foreign particles from the surface of the work table and the backside of the work table.

Abstract: In a method of the present invention for holding a substrate in a vacuum, a glass substrate (5) is held by an adhesive pad (20) or an adhesive sheet, both of which are made from a material containing a diene based resin, whereby an adhesive agent is prevented from remaining on the substrate, and the adhesive sheet can be detached with ease from the substrate after assembling the substrates.

Abstract: A system for structuring solar modules includes a transportation system for transporting a solar module in one transport plane in a first axial direction and a first transverse axis with a structuring tool, wherein the transportation system is configured as an air cushion system.

Abstract: A vacuum cup is made from rubber to resist damage and providing a vacuum seal without a separate gasket or O-ring. The vacuum cup may be one of several configurations suitable for different CNC machines and includes a rubber body comprising a bottom surface for mounting, a top surface including a vacuum area for holding a work piece, and a raised edge around the perimeter of the top surface for sealing against the work piece. The bottom surface may have any one of a variety of machine interfaces to cooperate with various machines. A vacuum passage connects the bottom surface with the vacuum area and a check valve may reside in the vacuum passage. The rubber body is sufficiently strong to resist flexing due to vacuum or work piece weight and the vacuum area includes work piece supports for contacting a work piece held on the vacuum cup.

Abstract: A substrate bonding apparatus for use in fabricating LCD devices substantially prevents substrates held to upper stages from sagging. The substrate bonding apparatus may, for example, include upper and lower stages having a plurality of passages for holding respective substrates; suction force applying means having one end mounted within each passage for transmitting a suction force to operably proximate portions of a substrate, wherein the one end of the suction force applying means is projectable from within each passage to a predetermined distance from the stage; and a vacuum pump for providing a suction force to the suction force applying means.

Abstract: A gap setting tool for setting a gap between a pair of panels includes a first body portion, a second body portion, and a pin having a predetermined diameter. The first body portion, the second body portion, and the pin are movable relative to one another. One of the panels is fixed and the other panel is movably mounted adjacent thereto. The body portions are operable to be attached to respective ones of the pair of panels, such as by vacuum cups or the like, and drawn toward one another with the pin in the gap until the panels contact the pin.

Abstract: An improved substrate support system for clamping spring loaded pins that support substrates, such as printed circuit boards, which have even profiles, and uneven profiles due to components being installed on one side during manufacturing operations to the opposite side of the substrate. The substrate support system can utilize a cam lever, a knob, or a draw latch to move a clamping plate between an aligned position and a clamping position.

Abstract: The present method and system features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the support system includes a chuck having a plurality of piezo pins and reference pins, with the piezo pins being coupled to piezo actuators to undergo relative movement with respect to said reference pins. These and other embodiments are discussed more fully below.

Abstract: A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving holes extends from the principal face through the first surface of the chamber, and a plurality of vacuum ducts extend from ports in the second surface of the chamber to a vacuum source to evacuate the internal chamber. The ports in the second face of the chamber are laterally offset from the receiving holes in the first face of the chamber to allow seating of the interior ends of the columns on coplanar portions of the rear surface. The ports are preferably centered, equidistant from the closest adjacent receiving holes, thereby providing centering of the columns by means of a vacuum driven air flow around the latter.

Abstract: A press includes an arm mechanism to input force transferred to upper and lower rollers by a worm unit. The worm unit occupies less space so that even if the size of the press is increased, the worm unit can be used without too much change. The handle is located on a top of the casing of the press and is formed together with the casing of the press. A suction mechanism is located on an underside of the base part of the casing and is controlled by a lever. A platform is independently connected to the casing.

Abstract: The invention relates to an arrangement comprising a support body with a substrate holder, mounted thereon on a gas bearing with rotating drive. The gas bearing and the rotating drive are formed by gas flowing in through nozzles arranged in the separating gaps between support body and substrate. The support body and the substrate holder are embodied as rings, whereby the rings lie on each other in a self-centering manner and the one ring comprises a ring bead extending into a ring recess on the other ring.

Abstract: A substrate supporting apparatus for supporting a substrate or wafer in a non-contact state by Bernoulli theorem is disclosed. The substrate supporting apparatus 1 comprises a housing 2, a rotatable chuck 3 which is disposed in the housing 2, which is provided at its central portion with a hollow 12 and which supports a substrate 6, and a cylindrical nozzle member 4 which is disposed in the housing 2, which has a nozzle hole 7 and which can vertically move in the hollow 12. A nozzle hole 7 is formed in a central portion of the nozzle member 4. Gas is discharged from a gas source 8 through the nozzle hole 7, thereby holding the substrate 6 by an upper surface of the chuck 3 in a non-contact state. When the substrate 6 is to be detached, the nozzle member 4 is moved upward while discharging gas from the nozzle hole 7, thereby floating the substrate 6.

Abstract: A heat treatment apparatus includes a support sheet placed on an upper surface of a heat-treating plate. The support sheet has, formed on an upper surface thereof, projections for contacting and supporting a substrate, and a lip for contacting edge regions of the substrate. The support sheet is formed by an etching process, and therefore areas of the sheet around the projections are recessed, rather than being perforated as in the case of laser processing. These heat-treating plate and support sheet constitute a substrate support structure capable of supporting the substrate properly.

Abstract: A system and method are described for holding and releasing a workpiece for electrochemical machining. In one embodiment, a workpiece holder has a workpiece surface that couples to the workpiece when negative pressure is applied to provide a seal between the workpiece and the workpiece surface. A plenum located within the workpiece holder has a proximal end capable of being removably coupled to the workpiece. A piston is configured to move upward in the plenum and to lift the workpiece off of the workpiece surface in response to positive pressure being applied.

Abstract: A chuck adapted to test electrical and/or optical components on a device-under-test (DUT).

Abstract: A depaneling system is disclosed for cutting a panel. The depaneling system comprises a tooling apparatus and a cutting apparatus. The tooling apparatus helps hold the panel in place with suction during cutting of said panel and collects dust particles generated by the cutting of the panel. The cutting apparatus is comprised of a housing, a drive motor, a cutting unit, and a drive connector. The housing separates the drive motor from the cutting unit. The housing comprises a first section and a second section separated by a dividing member. The drive connector, such as a belt, passes through the first section of the housing. The second section of the housing forms a path for the dust particles.

Abstract: A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity is coated to the compound material. The compound material has been used in printed circuit boards. The carrying device includes a plurality of tiny holes and a vacuum system located beneath the circular board. The thin wafer is attracted on the carrying device by the method of vacuum and is convenient to be tested, processed and transported.

Abstract: A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.

Abstract: A die holding tray useful for testing a plurality of individual dies placed into the holding tray together with a method of making the same. The holding tray has machined lateral and longitudinal sets of grooves with one set of grooves filled with strips in order to form pockets from the unfilled grooves. Vacuum channels are formed into the bottom of the pockets, and dies are held in place during testing by the flatness of the pocket bottoms and a drawn vacuum. Several embodiments are disclosed, including machining grooves in a compliant layer.

Abstract: A clamp including a vacuum base having a seal adapted to engage a first object. A cavity is defined between the first object and the seal. The clamp includes a vacuum generator connected to the cavity for reducing pressure in the cavity and a clamping member mounted on the vacuum base for engaging a second object. The clamp further includes a valve connected between the cavity and the vacuum generator. The valve is selectably positionable between an open position allowing fluid communication between the vacuum generator and the cavity for generating a pressure inside the cavity that is lower than a pressure outside the cavity, and a closed position at least partially restricting fluid communication between the vacuum generator and the cavity for at least partially preventing air from entering the cavity when pressure inside the cavity reaches a predetermined maximum.

Abstract: A mechanical suction device has a housing, multiple pneumatic cylinder assemblies, multiple air piston assemblies and a base. The housing has a side, multiple top recesses, multiple bottom recesses, multiple longitudinal air passages and multiple transverse ports. The pneumatic cylinder assemblies are mounted on the side of the housing, and each has a cylinder and a shaft valve. The air piston assemblies are mounted on the housing, and each has an air piston mounted on one of the top recesses. The shaft valves are mounted slidably and respectively inside the transverse ports. At least one of the air pistons is raised to suck one or multiple workpieces by providing air compressed into at least one of the longitudinal air passages and providing air compressed into at least one of the cylinders to move the corresponding shaft valve.

Abstract: An apparatus and method for machining of thin panels, in particular, panels having a complex shape, specifically non-deformable panels, in which the panel to be machined is placed beforehand in an isostatic position, characterized by: one defines one or more areas of a predetermined extent for purposes of machining, named machining windows, in the area of the panel to be machined; and perpendicular to each machining window; one of surfaces of panel is held in position without introducing positioning hyperstatism; the actual shape of the aforementioned surface is measured; the desired machining operation is performed on the opposite surface by taking the aforementioned measured surface as a reference; and the aforementioned surface is released.

Abstract: A table configured to support a substrate has one or more projections which support the substrate. In an embodiment, the table also has a raised perimeter defining a space which is configured to be filled with a liquid. A pump is configured to remove liquid from the space via outlet passages to an optional inlet. The removal of liquid can create a pressure differential across the substrate which then clamps it in place. Liquid circulated to the inlet may be filtered by a filter to remove contaminants.

Abstract: A conformal vacuum cup provides a machine tool attachment fitting usable in a flexible-track drill system. Using multiple, independently articulated stiffeners, the conformal vacuum cup conforms to the contour of complex aerostructure surface shapes. The individual stiffeners are decoupled from each other to some extent by grooves and slots molded into resilient overmolding material to support long-axis curving. Spacing pins employ a domed shape consonant with the elastic deformation of the workpiece surface under load. The pins employ a hard material to prevent particle embedment in use and to control position tolerance for drill heads and other tools traveling on the flexible track. Partial holes in each vacuum cup are blocked by diaphragms. Interconnection from a vacuum system manifold to the vacuum cups can be realized by penetrating the diaphragms and inserting barbed fittings connected by vacuum tubing.

Abstract: A transfer apparatus is provided for the transport of transfer objects such as glass substrates or semiconductor devices in which cleanliness and secure transport are of major concern. A plurality of air nozzles inject air through the plurality of air nozzles to hold a transfer object in place above or below the plurality of air nozzles without the plurality of air nozzles making contact with the transfer object. The plurality of air nozzles are positioned perpendicular to the transfer object to stop and/or engage the transfer object in a rest position. The plurality of air nozzles are inclined to a specified angle to move the transferred object in a desired direction. Advantageously, because the transfer object is moved without physical contact between the structure of the air nozzles and the transfer object, the transfer is secure, clean, and efficient.

Abstract: A work piece holding arrangement (10) includes an array of engagement elements (12) for engaging a work piece. The arrangement (10) also includes an actuator (34) for moving a plurality of the engagement elements (12) into engagement with the work piece, and a deformable clamping member (26) to clamp the engagement elements (12). The clamping member (26) is deformable between a clamping condition in which at least some of the engagement elements (12) are engaged by the clamping member (26) and clamped in respective positions, and a non-clamping condition in which the engagement elements (12) can move.

Abstract: A lithographic projection apparatus including a radiation system for providing a projection beam of radiation; a support structure for supporting a patterning device, the patterning device serving to pattern the projection beam according to a desired pattern; a substrate holder having a plurality of protrusions, the extremities thereof defining a substantially flat plane of support for supporting a substantially flat substrate, the substrate holder provided with the ability to provide a pressing force for pressing the substrate against the extremities of the protrusions, the protrusions in an edge zone of the substrate holder arranged to provide a substantially flat overhanging of the substrate in relation to the pressing force of the pressing means; and a projection system for projecting the patterned beam onto a target portion of the substrate.

Abstract: A pneumatic handling and recoating apparatus for handling workpieces, such as glass, is provided. The apparatus utilizes a holding device operatively connected to a vacuum assembly. The holding device engages workpieces by vacuum and subsequently releases them by a burst of gas. The burst of gas also facilitates the application of a coating material, such as a stain-retardant agent, to a workpiece upon release from the holding device.

Abstract: The invention concerns a method and a device (10) for closing wedge simulation to set gap dimensions between a movable flap (5; 5a, 5b) of a vehicle and the surrounding body (1) of the vehicle. The flap (5; 5a, 5b) is initially fitted and held in a roughly adjusted installation position in alignment with the body (1). The flap (5; 5a, 5b) is then finely adjusted such that predeterminable gap dimensions can be met with optimum precision. Finally, the flap (5; 5a, 5b) is movably fixed in the finely adjusted installation position on the body (1). To simplify the closing wedge simulation without losing accuracy for fine adjustment of the flap (5; 5a, 5b), the invention proposes to suction the flap (5; 5a, 5b) against a mechanical stop (15) for fine adjustment using a pneumatic suctioning device (16), wherein the mechanical stop (15) is fixed relative to the surrounding body (1) and is freely pivotable about a substantially vertical axis of rotation (13).

Abstract: Holding arrangement for a chip which includes a support having a first end for supporting the chip. A vacuum chamber is arranged in the support. An annular seal is arranged at the first end. A vacuum source evacuates the chamber. A method of holding a chip in the holding arrangement includes placing the chip into the holding arrangement, pad printing the chip, and removing the chip from the holding arrangement.

Abstract: A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.

Abstract: A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

Abstract: A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

Abstract: Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.

Abstract: A portable apparatus for removing and installing windshields on a vehicle disassembles in to several light weight pieces. The small pieces are easily transported and assembled at a job site where a windshield is to be replaced. An adjustable height post is mounted on a base that includes a ramp to be placed under a vehicle wheel by driving the vehicle upon the base. A horizontal arm is mounted on the post. The horizontal arm is raised or lowered by a jack type device mounted on the post. The horizontal arm is moved horizontally to place a windshield, held to the arm by suction cups, in position over the vehicle. The horizontal arm both pivots and rotates to correctly position the windshield. The windshield to be replaced is first removed by the apparatus.

Abstract: A false drum servers used in the manufacture of tires having a hollow cylindrical drum with a perforated surface on the drum through which air is drawn. The drawn air creating a suction surface for holding flat or sheet materials that are to be cut before transferring onto a tire building drum. When smaller pieces of flat materials are being held on the drum, the perforations that are not covered allow air to flow freely into the drum, thereby reducing the suction adhering effect of the perforated surface. The present invention provides methods and apparatus for varying the amount of perforated area through which air can be drawn into the drum, thereby changing the amount of suction adhering surface area of the perforated drum.

Abstract: A system and method for operating a machine whereby a workpiece is held on a worktable of the machine with a suction force. When the work piece has a surface area insufficient to receive a full cut from a tool mounted in a tool head of the machine, the machine automatically adjusts the depth and the cutting speed of the tool to lesson the cut so the workpiece is not moved or ejected from the worktable. The depth and speed of the tool may be adjusted in a single cut pass of the tool or they may be adjusted in successive cut passes.

Abstract: A precision optical element is described, such as is used in thermal imaging systems in the infra-red, manufactured by means of single point machining, with both of its surfaces having an aspheric form, with or without the addition of a diffractive optics pattern. The element is produced while held in a novel vacuum chuck, whose support surface has a width in the radial direction significantly less than the size of the element, and which is aspherically machined to match the aspheric first surface of the element. A method whereby such an element can be produced by means of single point machining, such as diamond turning or fly cutting, is also described. Also described are new optical system designs and applications using such double-sided aspheric elements, thereby providing significant improvement over currently available optical systems.

Abstract: A vacuum chuck for holding a semiconductor wafer during high pressure, preferably supercritical, processing comprising: a wafer holding region for holding the wafer; a vacuum region for applying vacuum to a surface of the wafer, the vacuum region within the wafer holding region; and a material, preferably sintered material, applied within the vacuum region, the material configurable to provide a uniform surface between the surface of the wafer and the wafer holding region, wherein the material is configured to allow vacuum to flow therethrough. The vacuum region preferably comprises at least one vacuum groove. Alternatively, the vacuum region includes at least two vacuum grooves that are concentrically configured on the wafer holding region. The vacuum groove alternatively comprises a tapered configuration. Alternatively, a coating material is applied between the wafer surface and the substantially smooth holding region surface, whereby the coating provides a seal between the wafer and the holding region.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: A photosensitive tabular member suction mechanism that can reliably suck with a simple configuration, on a stage, photosensitive tabular members of different sizes by effectively using the suction force resulting from negative pressure, and an image recording device disposed with this photosensitive tabular member suction mechanism. Cylinder members are attached inside the stage in correspondence to respective suction holes, and the piston members accommodated in the suction holes are urged upward by springs. In a state where a substrate is not placed on a placement surface of the stage, the piston members are in a closed position due to the urging force of the springs and block off the suction holes. When the substrate is placed on the placement surface, the piston members move to an open position counter to the urging force of the springs and the suction holes are opened, whereby the substrate is sucked by a suction force resulting from negative pressure.

Abstract: A conveying device for a plate-like workpiece, comprising a suction-holding device for suction-holding the plate-like workpiece and a moving device for moving the suction-holding device between a first predetermined position and a second predetermined position, wherein the suction-holding device comprises a plate-like workpiece holding member, non-contact suction-holders disposed on the under surface of the center area of the plate-like workpiece holding member, a restricting device which is mounted on the under surface of the peripheral area of the plate-like workpiece holding member and restricts the movement in the horizontal direction of the plate-like workpiece, and a plurality of falling prevention devices which are mounted in the peripheral area of the plate-like workpiece holding member at predetermined intervals in the circumferential direction and prevent the falling of the plate-like workpiece adsorbed by the non-contact suction-holders.

Abstract: An apparatus for vacuum bonding a liquid crystal display device includes a unitary vacuum processing chamber, upper and lower stages provided at upper and lower spaces within the vacuum processing chamber for receiving first and second substrates, and at least one first substrate receiving system provided within the vacuum chamber to contact dummy areas between cell areas of one of the first and second substrates.

Abstract: A media holddown device a plastics vacuum guide attached to a sheet metal vacuum beam, the guide includes vacuum chambers in communication with the beam through openings to control the negative pressures applied to media of varying widths by a fan. Dividing walls are provided between the chambers to maintain the value of the negative pressure larger than a predetermined value, especially for media with conventional widths. An intermediate wall divides the guide into front and rear chambers to increase the control of media leading edges. The number, size and pattern of arrangement of openings are selected to produce desired air flow characteristics.

Abstract: The invention proceeds from a vacuum process apparatus for an article which is processed or treated, resp. at two stations, whereby each station has a charging and/or removing opening for the article. A transporting device is supported for rotation and includes a supporting portion which is successively moved onto the openings of the stations. The process plant is designed in such a manner that the surface normals determined by the surfaces of the openings and the space axis defined by the axis of rotation of the transport device do not run parallel and rather enclose together an angle of 90° or 45°. By such an arrangement it is possible to design extremely compact vacuum vapor deposition apparatuses having a plurality of individual stations, whereby additionally short transporting distances are obtainable and the volumes to be conditioned can be minimized.

Abstract: The invention proceeds from a vacuum process apparatus for an article which is processed or treated, resp. at two stations, whereby each station has a charging and/or removing opening for the article. A transporting device is supported for rotation and includes a supporting portion which is successively moved onto the openings of the stations. The process plant is designed in such a manner that the surface normals determined by the surfaces of the openings and the space axis defined by the axis of rotation of the transport device do not run parallel and rather enclose together an angle of 90° or 45°. By such an arrangement it is possible to design extremely compact vacuum vapor deposition apparatuses having a plurality of individual stations, whereby additionally short transporting distances are obtainable and the volumes to be conditioned can be minimized.