Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for nonadhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: The invention relates to a holding device (1), especially for fixing a glass substrate during a cutting process. Said holding device comprises a housing (2) and a plunger (3) which can be axially displaced in relation to the housing (2). The plunger has a first and a second end section (4, 5), the first end section (4) projecting from the housing (2) and having a suction element (6). The aim of the invention is inter alia to improve a known holding device in such a manner that the substrate can be approached and fixed almost without the application of force. The holding device (1) according to the invention is characterized in that the plunger (3) is received in the housing (2) by a pneumatic spring. A holding system (20) comprising a plurality of holding devices (1) is protected in a support plate (24), said support plate (24) having a vacuum channel collector (21) which is connected to vacuum channels (13) and which is connected to a common vacuum pump (14).

Abstract: An exemplary reconfigurable workpiece support fixture according to an embodiment of the present invention includes a base, and a plurality of spaced-apart plates are removably attachable to the base. Each plate defines a plurality of notches along an angular profile. A plurality of spaced-apart manifolds are receivable in the plurality of notches, and each manifold spans across the plurality of plates. A plurality of attachment devices are removably attachable to the plurality of manifolds.

Abstract: A sheet handling device containing a sheet support element having a surface provided with suction holes which are connected to at least one suction chamber, the suction chamber being connected to a suction device adapted to create a subatmospheric pressure in the suction chamber, and a flow obstructing material arranged to obstruct an air flow from at least a subset of the suction holes into the suction chamber.

Abstract: An apparatus having a single, elongated flexible rail with a plurality of attachment devices connected to the rail and spaced at intervals therealong for releasably affixing the rail to a surface of a work piece by vacuum. The rail bends and twists as needed to substantially follow the surface of the work piece. An X-axis carriage is coupled to the rail and adapted to traverse the rail along an X-axis, wherein the X-axis is parallel to a length of the rail. A Y-axis carriage is coupled to the X-axis and adapted to traverse the X-axis carriage along a Y-axis, wherein the Y-axis is perpendicular to the X-axis. A fastening device clamps the X-axis carriage to the Y-axis carriage. A laser associated with the X-axis carriage facilitates precise locating of a drill carried by the apparatus relative to a spot where a hole is to be drilled.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: A method for assembling a multiwell plate assembly, and a multiwell plate assembly prepared thereby, are provided. The method includes providing a lid for a multiwell plate body having at least one channel being formed therethrough; positioning the lid in proximity to a gasket member; applying sufficient negative pressure to the channel to draw the gasket member towards the lid; positioning the lid above a multiwell plate body, while continuing to apply negative pressure to the channel; emplacing the lid on the multiwell plate body; and, releasing the negative pressure from the channel. Advantageously, as will be recognized by those skilled in the art, various gasket members can be used in conjunction with the subject method, without altering the method. In this manner, gaskets can be selected based on their suitability for use with various biological and/or chemical samples which may be used in the bioassays.

Abstract: The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: Isothermal work piece holding system uses vibration-damping, low thermal conductivity, low TCE polymer-composite holding body(ies) to damp machine tool vibration and chatter while accurately, rigidly maintaining the work piece in position by vacuum and/or mechanical clamps during machining. Cooling fluid channels having high thermal conductivity plates in contact with the work piece transfer thermal energy to/from it to maintain it isothermal during machining, inspection and assembly, eliminating dimensional changes and increasing process repeatability. Minimizing chatter reduces cycle time and improves surface finish which eliminates manual re-work. The system employs vacuum and coolant fluid pumps, heater/cooler(s), temperature sensor(s) and controller(s) to achieve highly accurate dimensional tolerances machining of parts which reduces error stack-up and assembly costs. Isothermal fixtures are disclosed for assembling parts and automated rivet settings in precise locations with reduced use of shims.

Abstract: An apparatus for supporting a substrate during semiconductor processing includes a substrate support structure having a first surface, a second surface opposing the first surface, and a groove recessed into the first surface and defining a peripheral portion of the substrate support structure. The substrate support structure is substantially free of guide pins. The apparatus also includes an annular sealing member coupled to the groove and a plurality of proximity pins projecting to a first height above the first surface. The apparatus further includes a plurality of purge ports passing from the second surface to the first surface, a plurality of vacuum ports passing from the second surface to the first surface, and a heating mechanism coupled to the substrate support structure.

Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

Abstract: The present invention restrains, during a transfer of a substrate, a central portion of the substrate from being warped by its own weight, which might be caused by a super-enlargement of a diameter of the substrate. A substrate transfer apparatus 18 includes: a support part 17 which is moved above a substrate w of a large diameter; and an upside grip mechanism 28 disposed on the support part 17, the upside grip mechanism 28 capable of supporting a peripheral portion of the substrate w from above. The support part 17 is provided with a non-contact sucking and holding part 30 having a suction hole 31 and a blow hole 32. The non-contact sucking and holding part 30 sucks and holds the substrate w in a non-contact manner, by blowing a gas onto the central portion of the upper surface of the substrate w and sucking the central portion to form an air layer 50 such that the central portion of the wafer w is not warped.

Abstract: There is provided a method for unloading an object vacuum-chucked on a mounting table having one or more gas flow paths opened at one or more locations on the mounting table, including the steps of (a) turning off a vacuum-chucking of the object vacuum-chucked via the gas flow paths; (b) lifting the object from the mounting table by using an object lifting unit; and (C) supplying a gas between the mounting table and the object during the step (b) via at least one of the gas flow paths. Further, there is also provided a program storage medium storing therein a computer executable program for executing the unloading method.

Abstract: A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.

Abstract: A dunnage platform is in the general shape of a rectangular slab with legs extending form one side. The dunnage platform is made from an expanded polystyrene core. A chemical combination process is used to chemically combine portion of the core proximal to its surface with high impact polystyrene. In a first of two parts of the combination process, the core is placed in a forming mold with one of its two sides and two thirds of its thickness extending therefrom. A heated sheet of high impact polystyrene is brought into contact with the portion of the core extending from the mold. In a similar manner, the other of the two sides of the core is made to extend from the forming mold for contact with a heated sheet of high impact polystyrene.

Abstract: A holding device for workpieces, is provided. The holding device includes a holder and a suction device. The holder has a chamber, a top panel and a plurality of through holes defined in the top panel. The through holes are in communication with the chamber. The top panel is configured for supporting the workpieces over the respective through holes. The suction device is coupled to the chamber and is configured for pumping out air in the chamber, such that an atmospheric pressure of the chamber is lower than that of an exterior of the chamber, thereby holding the workpieces. A vacuum deposition apparatus using the holding device is also provided.

Abstract: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.

Abstract: A method for adhering a protecting tape to a protection surface of a wafer is disclosed. The method comprises: cutting the protecting tape of which one surface is processed to be an adhering surface into predetermined size and shape; storing the protecting tape so as to release tensile force therein; holding the protecting tape by a protecting tape holding device; holding the wafer by a wafer holding device; locating the protecting tape and the wafer in a vacuum chamber in such a way that the adhering surface and the protection surface are facing each other; evacuating an interior of the vacuum chamber; and bringing the protecting tape holding device and/or the wafer holding device close to each other, thereby adhering the adhering surface of the protecting tape and the protection surface of the wafer.

Abstract: A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.

Abstract: The glazing panel handling tool has an elongate grab handle bridge connecting spaced suction pad devices. The grab handle bridge is rotatable about a longitudinal axis in order to cause the separation distance between the suction devices to be varied. The adjustability aids in the utility of the tool in glazing panel handling situations.

Abstract: In the course of a method for handling a workpiece having at least one through-opening, at least one suction element and the workpiece are placed against each other to form a suction chamber. A vacuum is generated in the suction chamber in order to fix the workpiece and the suction element to each other with a holding force for subsequent manipulation of the workpiece. The workpiece and the suction element are fixed to each other with a holding force by at least partially providing at least one through-opening of the workpiece opening into the suction chamber with a covering in order to reduce the flow of air through the through-opening to the suction chamber after the vacuum has been generated. A workpiece handling system is used to carry out the above-mentioned method.

Abstract: A universal holding fixture assembly includes a plurality of linear actuators supported by the fixture and adapted to engage and support a workpiece relative to the fixture. A linear displacement member is supported by a housing and adapted to move between retracted and extended positions. An end effector assembly is operatively supported by the linear actuator and adapted to engage the workpiece when the linear displacement member is in its extended position. A sensor is operatively supported by the end effector assembly and is responsive to contact with the workpiece to establish a datum of the position of the linear actuator relative to the workpiece.

Abstract: A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.

Abstract: An apparatus and method for securing a plurality of stringers to a mandrel during lay-up is provided, the plurality of stringers and mandrel forming a lay-up surface. The apparatus includes a vacuum source and a first vacuum attachment assembly in communication with said vacuum source to tightly secure the first vacuum attachment assembly down against the lay-up surface. A second vacuum attachment assembly is provided in communication with the vacuum source to force it tightly down against the lay-up. A flexible spacer is in rigid communication with the second vacuum attachment assembly and includes an extended end in communication with the first vacuum attachment assembly such that the flexible spacer presses one of the stringers against the mandrel.

Abstract: A covering is provided for exterior or interior application on solid surfaces such as garage floors, patios, and walkways. The covering is formed as tiles formed of a top layer of fibrous material, such as carpet, and a bottom layer of adhesive applied in spaced bands, lines, strips or rows that allow the tile to be removed from the surface after installation if desired. A release sheet, preferably formed of plural pieces, is secured over the adhesive for removal during installation. A portion of the release sheet can function as a positioning strip to assist in accurately placing the tiles. The covering is manufactured by coating the bottom surface of a strip of material in beads of adhesive, smoothing the beads into bands, lines, strips or rows, and then cutting the strip into tiles using a non-mechanical cutter such as a laser.

Abstract: [Problem] A non-contact type suction holding apparatus capable of reliably holding a plate-shaped member without damaging its surface by suction-holding the plate-shaped member with a portion except for its peripheral portion (main portion) in a non-contact state in which it is floated off the suction table is provided. [Means for Solving Problems] In a non-contact type suction holding apparatus 1 according to the present invention, Bernoulli suction means 10 generating negative pressure by blowout of air (gas) is disposed in a suction table 2, the wafer W is held by the Bernoulli suction means 10 in a state in which a portion except for a peripheral portion of the wafer (plate-shaped member) W of which under-surface peripheral edge portion is supported on the suction table 2 is floated off the suction table 2, and the wafer is suction-held without contact with the suction table 2.

Abstract: A vacuum type positioning apparatus (10), used in insert-molding machine for positioning an inserted workpiece (181), is provided. The vacuum type positioning apparatus includes a vacsorb unit (11) and a positioning unit (15). The positioning unit connects with the vacsorb unit. The positioning unit has an attaching wall (1912). The vacsorb unit provides a suction pressure for the positioning unit to attach the inserted workpiece with the attaching wall.

Abstract: A structure of a vacuum adsorbing working platform includes a lower body and an upper body. The lower body has a plurality of channels, and the top of the lower body has a plurality of cross grooves which extend transversely and longitudinally. The channels communicate with the grooves, and they connect to an induction pump. The upper body attached on the lower body has a plurality of ventilation holes passing through the upper body and relative to the grooves, thereby the structure of the working platform is formed which provides better suction.

Abstract: A unit for picking up ceramic products or the like comprises: a tray (2) associated with a movement unit (3); a sealing and contact element (4) located at least along the perimeter of an operating wall (5) of the tray (2) and designed to work in contact with a surface (S) of the product (M); means (6) for generating a vacuum inside at least one first chamber (C) made by the operating wall (5) of the tray (2) with the inside of the tray (2) itself and in communication with a second chamber (Ce) through the operating wall (5), which is permeable; the second chamber (Ce) is delimited perimetrically according to the surface (S) of the product (M) in such a way that the above mentioned vacuum is applied to the opposite and facing surfaces of the wall (5) and of the surface (S) of the product (M), respectively, when the element (4) comes into stable contact with the surface (S) in order to pick the product up; the contact and sealing element is composed of a body (4) having controlled porosity, associated with the

Abstract: An electrode assembly for use in a plasma processing system that includes removable rails that are adjustable for reconfiguring the electrode to accommodate substrates of different widths. The electrode assembly includes an electrode having a plurality of first connecting members. Associated with the electrode is a plurality of rails that cooperate for supporting the substrates on the electrode. Each of the rails includes a plurality of second connecting members. Each of the second connecting members is connected detachably with one of the first connecting members for removably mounting the rails with the electrode.

Abstract: A workpiece attitude change apparatus includes a first suction nozzle which includes a suction port, the suction port being able to suction a first surface of a workpiece, a second suction nozzle which has a predetermined inclination relative to the first suction nozzle, the second suction nozzle including a suction port, the suction port of the second suction nozzle being able to suction a second surface of the workpiece, and a vacuum pressure switch device for imparting a vacuum pressure to the first suction nozzle to cause the suction port of the first suction nozzle to suction the first surface of the workpiece, the vacuum pressure switch device stopping supply of the vacuum pressure to the first suction nozzle and imparting a vacuum pressure to the second suction nozzle to cause the suction port of the second suction nozzle to suction the second surface of the workpiece.

Abstract: A solar cell production system utilizes self-contained vacuum chucks that hold and cool solar cell wafers during transport on a conveyor between processing stations during a fabrication process. Each self-contained vacuum chuck includes its own local vacuum pump and a closed-loop cooling system. After each wafer is processed, it is removed from its vacuum chuck, and the vacuum chuck is returned to the start of the production line by a second conveyor belt. In one embodiment, each vacuum chuck includes an inductive power supply that is inductively coupled to an external source to drive that vacuum chuck's vacuum pump and cooling system. An optional battery is recharged by the inductive power supply, and is used to power the vacuum pump and cooling system during hand-off between adjacent processing stations.

Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Abstract: A workpiece holding jig for holding a workpiece having a plurality of first dividing lines extending in a predetermined direction and a plurality of second dividing lines formed in a direction intersecting the plurality of first dividing lines on the workpiece holding table of a processing machine for cutting the workpiece along the plurality of first dividing lines and the plurality of second dividing lines, wherein the workpiece holding jig has a plurality of through-grooves corresponding to the plurality of first dividing lines and the plurality of second dividing lines formed on the workpiece, a plurality of suction-holes which are open at the top and formed at positions corresponding to a plurality of areas sectioned by the plurality of first dividing lines and the plurality of second dividing lines of the workpiece and suction-passages that are formed at positions where they do not intersect the plurality of through-grooves and connected to the plurality of suction-holes.

Abstract: Curved and Angular Panel Arm is an arm attachment for use with vacuum lifts that has a hinged section and a pivoting vacuum head mount. To use the preferred embodiment of Curved and Angular Panel Arm, a user attaches the arm to a vacuum lift unit using an attaching mechanism. The hinged section is then adjusted and locked into place to accommodate irregularly shaped objects using the hinge pin and clip or other locking mechanism. Finally, the vacuum pads of the pivoting vacuum head mount are placed on a designated panel or object and the vacuum lift unit is turned on, enabling the vacuum pads on the vacuum head mount to attach to the irregularly shaped panel or object.

Abstract: An apparatus (1) for fixing a planar object, in particular a substrate (2), on a working area (4) by means of vacuum is provided with an at least partly transparent bearing plate (5), one side of which forms the working area and which has a rear side arranged at a distance from the working area with a radiation-reflecting structure (7). The bearing plate additionally has vacuum channels which can be connected to a vacuum line and which open into the working area. In order to illuminate the substrate as homogeneously as possible by means of transmitted light, at least one light source (10) is provided, the radiation of which can be fed into the bearing plate. In addition, the working area is preferably operatively connected to a heating apparatus (11), so that the substrate (2) can be heated.

Abstract: Disclosed is a wafer chuck, which has protrusions for supporting a substrate, for attracting and holding the substrate by negative pressure while the substrate is being supported by the protrusions. The wafer chuck includes pin-shaped protrusions dispersed on a suction side of the chuck, and circular peripheral wall portions disposed in the vicinity of the rim of the supported substrate and in the vicinity of the outer peripheral portion of a lifting hole, respectively. The suction side of the wafer chuck is provided with a first area in which the pin-shaped protrusions are arrayed in a grid-line manner, and a second area in which the pin-shaped protrusions are arrayed in circumferential form. The second area is provided in the vicinity of the peripheral wall portion and peripheral wall portion, and the first area is provided elsewhere.

Abstract: A suction plate and a cradle for an automobile having the same, the suction plate including a housing provided with a boss protruding in one direction, the boss having a through hole formed to pass through a side thereof; a suction member installed at a lower portion of the housing to be moved relative to the housing, the suction member having a central shaft inserted in the boss, the central shaft having a central hole formed thereon to pass through a side thereof; an elastic member provided in an upper portion of the central shaft to provide elastic force in a direction in which the suction member and the housing go away from each other; and an operating lever provided in the housing rotatably within a certain angular range to adjust relative movement of the housing and the suction member.

Abstract: A clamp for attaching a clip to an end of a stator bar including: an anchor adapted to fit into an open end of the clamp; a bracket having a first leg extending radially from the anchor and a second leg substantially perpendicular to the first leg, wherein the second leg has a distal end with a pivot point; at least one alignment post on an inside surface of the second leg; a lever arm pivotably attached to the pivot point on the second leg of the bracket, the lever arm further including a lip on a first end of the arm and adapted to releasably engage an edge of a cover to clip, and an adjustment screw threaded through the lever arm and having a first screw end abutting an outside surface of the second leg of the bracket, wherein turning the screw pivots the lever arm and moves the lip towards or away from the cover.

Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).

Abstract: A method for locally gripping and holding a thin, flexible panel having a complex, nondevelopable shape. The method includes placing a first surface of the panel against a three-point support system without deforming the surface; applying a plurality of suction cups which are mobile with respect to a reference support onto the surface in an area of the surface to be supported; locking each suction cup in a gripping position with respect to the support without locally deforming the surface of the panel. A device for localized gripping and holding of a thin, flexible panel having a complex, nondevelopable shape is also disclosed.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.

Abstract: A structure of a vacuum adsorbing working platform includes a lower body and an upper body. The lower body has a plurality of channels, and the top of the lower body has a plurality of cross grooves which extend transversely and longitudinally. The channels communicate with the grooves, and they connect to an induction pump. The upper body attached on the lower body has a plurality of ventilation holes passing through the upper body and relative to the grooves, thereby the structure of the working platform is formed which provides better suction.

Abstract: The present invention is a chuck having a vacuum groove that is capable of holding a wafer as the chuck rotates on a spindle. As the chuck rotates the air pressure above the center of the wafer is reduced. In order to reduce the bowing of the wafer that can result from this low pressure area above the wafer, the present invention introduces venturi holes in the chuck which reduces the air pressure in the area below the wafer. In order to prevent the air pressure in the area below the wafer from decreasing too far, the present invention uses air inlet holes to balance the affect of the venturi holes in order to substantially balance the air pressure above and below the wafer which results in significantly less bowing of the wafer when compared to conventional systems. The present invention accomplishes this without requiring sensors or other active measuring devices to help reduce the bowing of the wafer.

Abstract: A switching valve is disposed between a pressure fluid supply source and an ejector in a vacuum suction apparatus. A supply port of the switching valve is connected to the pressure fluid supply source, and an outlet port of the switching valve is connected to the ejector. In addition, when suction pads attract a workpiece under suction and a negative pressure becomes constant, a valve body is displaced by a negative pressure supplied through a vacuum port to the switching valve, whereupon communication between the supply port and the outlet port is blocked.

Abstract: A sheet handling device for wide format sheets including a sheet support plate having a top surface containing suction holes which are connected to at least one suction chamber, the at least one suction chamber being divided into compartments that are connected, though an opening, to a suction device adapted to create a subatmospheric pressure in the compartments, wherein at least one internal wall between adjacent ones of the compartments defines a flow restriction orifice, and at least one of the compartments is directly connected to the suction device, and at least another one of the compartments is indirectly connected to the suction device through the orifice.

Abstract: A modular universal holding fixture and corresponding methods, accommodating a wide range of workpiece contours, geometries, sizes, and configurations. The fixture may include a fiducial base, a registration frame, and a bridge module. Fixable to a fiducial (reference) location, the fiducial base may be attached in alignment to the registration frame. The bridge module may have a central cavity and guide tracks on top, exterior, and interior support surfaces. The bridge module transversely engages the registration frame for longitudinal movement to a registration position, and supports a tooling for transverse movement. The bridge module may repositionably constrain the tooling at an indexed position. The bridge module may be configured to engage multiple types of tooling and additional tooling headers, supports, and side actuators. A tooling may be passive linear actuators positioned by a N/C operated gantry engaged with the registration frame.

Abstract: A conformal vacuum cup provides a machine tool attachment fitting usable in a flexible-track drill system. Using multiple, independently articulated stiffeners, the conformal vacuum cup conforms to the contour of complex aerostructure surface shapes. The individual stiffeners are decoupled from each other to some extent by grooves and slots molded into resilient overmolding material to support long-axis curving. Spacing pins employ a domed shape consonant with the elastic deformation of the workpiece surface under load. The pins employ a hard material to prevent particle embedment in use and to control position tolerance for drill heads and other tools traveling on the flexible track. Partial holes in each vacuum cup are blocked by diaphragms. Interconnection from a vacuum system manifold to the vacuum cups can be realized by penetrating the diaphragms and inserting barbed fittings connected by vacuum tubing.

Abstract: A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the top of the support post and provides a transverse slide seat, a vertical slide unit, which is disposed at the transverse slide seat and provides a vertical slide seat. Further, the test device provides a clamping unit, a suction unit and a sensing element, which are moved with the vertical slide seat. The clamping unit clamps the housing and the suction unit absorbs the fan wheel. The heat dissipating fan is admitted in case of the sensing unit sensing the fan wheel being incapable of moving upward under the suction force and is carried away by the transverse slide unit in case of the sensing unit sensing the fan wheel being capable of moving upward under the suction force.