Abstract: In the present invention, a plurality of suction ports are provided in a heating plate of a heat processing apparatus. The suction ports are provided at a central portion, an intermediate portion, and a peripheral portion of a substrate mounting surface of the heating plate, respectively. The warped state of the substrate before heat-processed is measured, so that when the substrate warps protruding downward, the suction start timing via a suction port corresponding to the outer peripheral portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports, and when the substrate warps protruding upward, the suction start timing via the suction port corresponding to the central portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports.

Abstract: A printing system is disclosed. The printing system includes a first print engine to print content on a web of paper and a vacuum unit to provide stabilization and cooling of the web. The vacuum unit operates in a first mode upon receiving an activation signal from the first print engine and operates in a second mode upon de-assertion of the activation signal.

Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Abstract: This invention relates to a tooling system comprising a plurality of elements (22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64) having tessellating sides arranged in an array. The elements of the array being movable between a closed position in which the elements contact one another, and an open position in which the elements of the array are spaced apart. In the open position the elements are capable of vertical movement relative to one another. Drive means for opening and closing the array are provided and the elements are mounted on supporting rails (2, 4, 6, 8, 10, 12, 14) and are driven by the drive means between the open position and the closed position along a drive axis which is at angle to the longitudinal axis of the supporting rails.

Abstract: A controller is provided for machining devices of the type having a workpiece support table with a plurality of vacuum support devices mounted thereon for heightwise movement between an active raised position and an inactive lowered position. The controller includes at least one hydropneumatic actuator operably connected with the vacuum support devices, and shifting the same between the raised and lowered positions. A synchronization bar has at least one lock member that selectively engages and displaces heightwise in unison and at the same time each of the vacuum support devices operated by the hydropneumatic actuator.

Abstract: A nacelle lifting tool and method for lifting the nacelle of a wind generator in relation to the rotating ring. The inventive tool is formed by first and second fixing devices which replace brake callipers that are disposed on front and rear lifting devices. The aforementioned lifting devices are supported by supports which are fixed in the form of braces to the vertices of a regular polygon formed by beams. The inventive method consists in removing the brake callipers in order to install the fixing devices in an alternating manner and fixing said devices vertically. The first and second fixing devices include rear and front callipers and the lifting devices include hydraulic jacks.

Abstract: The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. According to the invention, at least one of the holding instruments (1, 7), preferably both holding instruments (1, 7) respectively, comprises at least one gel film (2, 8) for holding the associated wafer (5, 9). The invention furthermore relates to the use of a gel film for holding integral wafers.

Abstract: The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Abstract: The present invention pertains to methods, apparatuses, and systems for fabricating three-dimensional integrated circuits. One or more embodiments of systems, apparatuses, and/or methods according to the present invention are presented.

Abstract: In one embodiment, an apparatus for constraining an object includes a first clamping surface configured to apply a first holding force to a first surface of the object; a second clamping surface configured to apply a second holding force to a second surface of the object; and an actuator configured to selectively move the second clamping surface relative to the first clamping surface.

Abstract: Remotely engageable and releasable suction cups include a pliable body and an active material in operative communication with the pliable body and configured to create and/or eliminate a partial vacuum through the activation of stiffness or geometry changes in the active material. Suitable active materials include shape memory materials such as shape memory alloys, ferromagnetic shape memory alloys, and shape memory polymers (SMP). A second class of active materials include materials that exhibit a change in at least one attribute when subjected to an applied field but revert back to their original state upon removal of the applied field. Active materials in this category include piezoelectric materials, electroactive polymers (EAP), magnetorheological polymers, and the like.

Abstract: An alignment apparatus and method for aligning work pieces. The alignment apparatus includes a base member and at least on adjustable leg that extends from the base member. The alignment apparatus additionally includes a vacuum plate mounted to the adjustable leg. The alignment apparatus also has a an actuator mounted to the base member wherein the actuator includes a shaft extending therefrom. The alignment apparatus includes an attachment member connected to the shaft.

Abstract: A universal holding fixture assembly includes a plurality of linear actuators supported by the fixture and adapted to engage and support a workpiece relative to the fixture. A linear displacement member is supported by a housing and adapted to move between retracted and extended positions. An end effector assembly is operatively supported by the linear actuator and adapted to engage the workpiece when the linear displacement member is in its extended position. A sensor is operatively supported by the end effector assembly and is responsive to contact with the workpiece to establish a datum of the position of the linear actuator relative to the workpiece.

Abstract: A medium suction support device includes a medium support table, a suction unit, a plurality of flexible tube members and a sliding member. Through-holes are formed in the medium support table to pass through the medium support table. The suction unit is disposed on a side of the back surface to suction the recording medium disposed on the medium support surface via the through-holes. One opening end of each of the flexible tube members surrounds a corresponding one of the through-holes on the back surface. The sliding member is configured to move in parallel along the back surface. The sliding member has openings formed in an opposing surface facing the back surface with each of the openings being configured to respectively accommodate the other opening end of a corresponding one of the flexible tube members. The openings have different lengths in a parallel movement direction of the sliding member.

Abstract: A back-up table for a chip mounter. The back-up table for a chip mounter includes a base plate, a back-up plate spaced a predetermined distance from the base plate to support a back-up pin that supports a printed circuit board, and at least one set of link units installed between the base plate and the back-up plate and facing opposite to each other. The back-up table further comprises a first driving part installed between the opposite facing link units and operating the link units to raise and lower the back-up plate, and a second driving part serially connected to the first driving part.

Abstract: The invention relates to a device for supporting sheet-like materials for at least one separating process in the sheet-like materials, with at least one jet cutter device which may be displaced in the Y-direction during a separation process, with a first and second support surface together forming a support table for supporting the sheet-like material and with a jet trapping device, arranged between the first and second support surfaces and provided to be able to be displaced in the X-direction. The first and the second support surfaces are made from a flexible material forming part of at least one enclosed chamber, filled with a gas under pressure.

Abstract: A wafer holding apparatus for holding a wafer in a semiconductor fabrication apparatus includes a stage having a wafer receiving area with a large number of apertures. A gas, supply source supplies gas to the apertures to levitate the wafer by gas pressure. The levitated wafer is held in contact with a retainer disposed above a peripheral part of the wafer receiving area by the gas pressure, which the retainer resists. The wafer is thereby held securely even when the stage is moved, and the surface configuration of the wafer is not affected by the presence of foreign matter between the wafer and stage.

Abstract: A configurable end-of-arm tool attachable to an articulable robotic arm is described. The end-of-arm tool comprises a rail element, a machine-adjustable swing arm, a machine-adjustable extendable shaft attached to the swing arm. A machine-adjustable rotator set is attached to the extendable shaft, and a workpiece interface tool is attached to the extendable shaft. The swing arm, the extendable shaft, and the rotator set are machine-adjustable to place the workpiece interface tool at a predetermined position.

Abstract: A structure of a vacuum chuck for absorbing a substrate and usable in the fabrication of a liquid crystal display device is provided. This structure includes an absorbing plate absorbing a surface of the substrate, and a plurality of vacuum lines in an oblique line shape on the absorbing plate.

Abstract: A thin film forming apparatus such that a substrate can be easily fixed/removed to/from the outer circumferential surface of a drum type substrate holder through a simple arrangement. The drum type substrate holder (5) is supported in a horizontal posture rotatably about a horizontal rotational shaft in a film deposition chamber A jig (13) holding a substrate (12) fixedly is transferred by an arm horizontally onto the outer circumferential surface of the drum type substrate holder (5), and an end part (13b) of the substrate fixing jig (13) can be secured by a securing device (14) provided at the corner part (5a) of the outer circumferential surface of the drum type substrate holder (5).

Abstract: An exemplary reconfigurable workpiece support fixture according to an embodiment of the present invention includes a base, and a plurality of spaced-apart plates are removably attachable to the base. Each plate defines a plurality of notches along an angular profile. A plurality of spaced-apart manifolds are receivable in the plurality of notches, and each manifold spans across the plurality of plates. A plurality of attachment devices are removably attachable to the plurality of manifolds.

Abstract: A chuck for releasably retaining a substrate, where the chuck has a body with a substrate receiving surface disposed in an X-Y coordinate plane and adapted to receive the substrate. The body has gas pressure delivery channels and gas vacuum drawing channels, where the gas pressure delivery channels and gas vacuum drawing channels are mutually exclusive within the body. The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery channels, for delivering a gas pressure against the substrate while the substrate is retained by the chuck, and thereby keeping the substrate from contacting the substrate receiving surface. The substrate receiving surface also has gas vacuum drawing portions in communication with the gas vacuum drawing channels, for drawing a gas vacuum against the substrate while the substrate is retained by the chuck, and thereby retaining the substrate proximate the substrate receiving surface.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.

Abstract: A vacuum hold-down system for use with workpieces of various shapes and/or sizes is disclosed. The system comprising a vacuum hold-down table defining a mask support plane and an apertured vacuum table mask which is selectably positionable on said mask support plane, wherein said vacuum hold-down table and said vacuum table mask is configured to define a plurality of selectable different contiguous arrays of vacuum apertures, by suitable relative positioning of said vacuum table mask and said vacuum hold-down table in said mask support plane.

Abstract: The invention relates to a negative pressure clamp that includes a bearing plate including a plurality of chambers into each of which gives a suction duct, said working plate being covered with a flexible and formable working plate having suction openings formed therein for drawing a part to be maintained and perforations in which are inserted the lugs of the bearing plate arranged about the chambers.

Abstract: A method for the operation of a panel placement system for punching presses wherein a feed slide is moved between the punching die of the punching press and a transfer position located in front of the punching press. A first connection mechanism of the feed slide, in the transfer position, seizes a panel in the rear area to advance it stepwise through the punching press in response to the cycle of said punching press, wherein the panel is gripped exclusively from above in a rear edge area which is located between the rear edge and the surfaces to be punched out.

Abstract: Provided is a scan stage for a semiconductor wafer pollutant measurement apparatus, which includes: a stage main body which comprises: a circular fixed housing; an adsorption plate which is rotatably installed in the inside of the fixed housing, at the center of which an adsorption path is formed, at the bottom of which a vacuum port is connected, and which is rotated by an external rotating force; and a step motor which is placed at the bottom of the fixed housing and connected with the adsorption plate; a base plate that is supported by pillars to form a lower space between the fixed housing of the stage main body and the base plate; a cylinder at the bottom of which a cylinder load is connected so that the base plate moves up and down; and support jigs that hold up a wafer in the outer side of the stage main body, in which three support jigs are disposed in proximity with the outer circumference of the stage main body.

Abstract: A platform for supporting a sheet material having a workpiece portion to be cut is disclosed. The platform comprises one or more movable supports arranged to support the workpiece portion in a support position. The or each support is movable to a cutting position in which a cutting agent may cut the workpiece adjacent the support position without damaging the support.

Abstract: A non-contact holder holds the workpiece on the holding surface without contact between the workpiece and the holding surface by generating a negative pressure at the opening using a circular flow of gas introduced into the inside of the column body and generating a positive pressure between the holding surface and the workpiece using the gas flowing from the opening provided on the holding surface, and the holding surface has (2n+1) (n: a positive integer) guide grooves which have spiral shapes extending in spiral directions in correspondence with the circulation direction of the circular flow and have starting ends communicating with the opening to guide the gas introduced through the starting ends in the spiral directions, the final ends of the guide grooves being disposed at equal intervals on the circumference of the holding surface around the opening.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: A device for structuring a solar module. A retainer device arranged above the solar modules to be machined comprises retainer means which retain the solar modules. The retention is achieved in a non-contact manner. In a region beneath the solar module a structuring tool is arranged mounted to be mobile in a longitudinal and a transverse direction. The structuring tool can thus machine the complete surface of the solar module.

Abstract: An apparatus for drilling holes in a glass plate has a supporting member for sucking and supporting a glass plate which is used for an automobile window or the like, as described later, and the supporting member is comprised of a suction pad for sucking the glass plate and a pair of supports for supporting the glass plate on an outer side of the suction pad. The supports are detachably mounted on the outer side of the suction pad, and the supporting member is adapted to rotate about the suction pad in an R direction. The apparatus for drilling holes in a glass plate further includes a hole forming means for forming in the glass plate holes shown in FIG. 7; a supporting means having the supporting member and for supporting the glass plate in which the holes are to be formed by the hole forming means; and a transporting means for transporting onto the supporting means the glass plate in which the holes are to be formed.

Abstract: A solar cell production system utilizes self-contained vacuum chucks that hold and cool solar cell wafers during transport on a conveyor between processing stations during a fabrication process. Each self-contained vacuum chuck includes its own local vacuum pump and a closed-loop cooling system. After each wafer is processed, it is removed from its vacuum chuck, and the vacuum chuck is returned to the start of the production line by a second conveyor belt. In one embodiment, each vacuum chuck includes an inductive power supply that is inductively coupled to an external source to drive that vacuum chuck's vacuum pump and cooling system. An optional battery is recharged by the inductive power supply, and is used to power the vacuum pump and cooling system during hand-off between adjacent processing stations.

Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.

Abstract: A method and an apparatus which can be used for separating a dummy disc from a substrate in a process for manufacturing multi-layer optical storage discs are provided.

Abstract: A pin locking apparatus (1) includes a housing, at least one pin (40) and at least one locking piston (11). The housing includes at least one locking bore (12) and at least one pin bore (14). The at least one pin is slidably contained within the pin bore and is positioned by application of pressure in the pin bore. The at least one locking piston is slidably contained within the locking bore and is actuated by pressure in the locking bore to apply a locking force on the pin.

Abstract: An applicator head for a device with an air suction source for applying individual flat materials elements to objects. The applicator head has an applicator surface in air communication with the air suction source and has perforatable, weak locations. The weak locations can be selectively perforated and, when perforated, a weak location can function as a suction intake opening.

Abstract: A lens holding tool (1) includes a cylindrical jig main body (10) having an opening (19), a vent hole (13), and a hollow portion (18), and a ring-like lens holding body (20) formed of an elastic body. The lens holding body (20) includes a holding portion (21) and a fitting portion (22). The fitting portion (22) is fitted on the outer surface of the jig main body (10). When the hollow portion (18) is evacuated, the holding portion (21) sucks and holds the outer peripheral edge (24) of a lens (100).

Abstract: A vacuum suction system comprises a work conveyor table 2 having work receiving openings 5, and a table base 3 having vacuum suction channels 7 which communicate with the work receiving openings 5 of the conveyor table 2. The work receiving openings 5 and the vacuum suction channels 7 communicate with a vacuum generation source 17 via a vacuum pipe 9. A negative pressure sensor 10 is disposed on the vacuum pipe 9. Based on a signal from the negative pressure sensor 10, a compressed air generation source 20 supplies a compressed air to the vacuum pipe 9 and thereby stabilizes the vacuum level in the vacuum pipe 9.

Abstract: Workpieces of large dimensions, typically body pressings or fuselage panels, are supported and secured for machining by a device capable of movement in a vertical direction and adaptable thus to the particular geometry of the workpiece. The vertical movement is produced by a rod of which the top end carries a head incorporating a pivotable fixture mechanism, equipped with a suction cup connected to a source of negative pressure by way of a suction duct and activated to clamp the work once the head is in position.

Abstract: A support section (28) for supporting a wafer (1) is convexly formed in the center of a receiving section (26) of a support groove (25) of a boat 21. At the time of boat loading of the boat (21), in which wafers (1) respectively received by the supporting sections (28) are aligned, from a standby chamber (33) to a processing chamber (14), the pressure in the standby chamber (33) and processing chamber (14) is set to 200 pascals or more, and 3000 pascals or less. By supporting the wafer upwards from the receiving section with use of the support section, even if peeling of the film on the wafer occurs from a large frictional force between the supported surface of the wafer and the support section under a reduced pressure, the particles from the peeling are caught by the receiving section and therefore particles are prevented from adhering to the IC fabrication surface of the wafer directly below the receiving section.

Abstract: There is provided an inexpensive stage which is equipped with an alignment function and is capable of easily performing high-accuracy alignment especially in a ? direction even in case an object to be processed is large in weight. The stage equipped with an alignment function has a stage main body for holding a substrate while leaving a processing surface thereof open to access. The stage is provided with: a suction means capable of sucking that surface of the substrate which lies opposite to the processing surface; a gas supply means for supplying a gas to such a region of the substrate as is other than a portion sucked by the suction means; and a drive means to give a rotating force to the suction means so that the substrate can be rotated on the same plane by causing the suction means to serve as the center of rotation.

Abstract: Recesses (72), surface contours, contact tip modifications (52, 56), and/or other methods of ensuring pressure between a bottom surface (50) of a test plate (5) and top surfaces (52) of electrical contacts (18) are employed to enhance cleaning of the top surfaces (52) of the electrical contacts (18) to promote reliable measurements of DUTs (14).

Abstract: A plurality of air levitation units that jet air to the lower surface of a substrate are placed below the substrate, and the substrate is supported in a noncontact manner so as to be substantially horizontal. Further, a portion subject to exposure of the substrate is held from below in a noncontact manner by a chuck main body that a fixed-point stage has, and a surface position of the portion subject to exposure is adjusted in a pinpoint manner. Consequently, exposure can be performed on the substrate with high precision. Since the chuck main body moves in a scanning direction according to the position of the substrate, the chuck main body can surely hold the substrate even when the substrate proceeds into an exposure area.

Abstract: A labeling machine, a vacuum drum for use in a labeling machine, and a method of using a labeling machine having a vacuum drum. The abstract of the disclosure is submitted herewith as required by 37 C.F.R. §1.72(b). As stated in 37 C.F.R. §1.72(b): A brief abstract of the technical disclosure in the specification must commence on a separate sheet, preferably following the claims, under the heading “Abstract of the Disclosure.” The purpose of the abstract is to enable the Patent and Trademark Office and the public generally to determine quickly from a cursory inspection the nature and gist of the technical disclosure. The abstract shall not be used for interpreting the scope of the claims. Therefore, any statements made relating to the abstract are not intended to limit the claims in any manner and should not be interpreted as limiting the claims in any manner.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).

Abstract: The invention relates to a vacuum chuck capable of reducing cost and weight by making its structure simple and shortening the clamping time.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: An energy-saving vacuum adsorption apparatus to adsorb at least one article on a workstation includes an air compressor connecting to the workstation through a duct, a vacuum generator which is connected to the air compressor through the duct to suck air from the workstation into the duct and has a second control valve, a sealed vacuum tank to store the sucked air and provide pressure detection, a sensor connecting to the vacuum tank through a detection circuit to detect and control vacuum condition of the workstation, and a first control valve connecting to the detection circuit to control ON and OFF of the air compressor. The air compressor does not need operation for a long duration, thus can save electric power and has a longer life span.