Abstract: A method for estimating a parameter across a region on a substrate, the region being divided into a plurality of sub-regions, the method including: obtaining values of the parameter for at least two sub-regions out of the plurality of sub-regions; and estimating the parameter for a position on the region by evaluation of a function having said values of the parameter as input values, wherein the function: a) has piecewise defined base functions, wherein a single base function is defined across a sub-region; and b) is continuous between one or more adjacent sub-regions of the at least two sub-regions within the region.

Abstract: A mask assembly for manufacturing a display device, the mask assembly includes: a mask frame including a pair of first side portions arranged in a first direction, a pair of second side portions arranged in a second direction intersecting the first direction, and an opening portion defined by the first side portions and the second side portions; a mask sheet arranged on the opening portion of the mask frame, fixed on the mask frame, and including a plurality of openings; and a support member attached to at least one of the first side portions and the second side portions of the mask frame with tensile force applied.

Abstract: A method of managing removable mechanical modifications to one or more printing devices, including receiving, by one or more computer processors, an input related to a removable mechanical modification of a printing device of the one or more printing devices, and determining, by the one or more computer processors, a location of the removable mechanical modification.

Abstract: An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.

Abstract: Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus and a plurality of support elements extend from the body and separate each of the plurality of cavities. In one embodiment, a first plurality of ports are formed in a top surface of the body and extend to a bottom surface of the body through one or more of the plurality of support elements. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body. In yet another embodiment, a first electrode assembly is disposed adjacent the top surface of the body within each of the plurality of support elements and a second electrode assembly is disposed within the body adjacent each of the plurality of cavities.

Abstract: In an example, there is provided a method including: receiving, at a processor, data specifying the shape of a blank to form a folded article; and determining, using the processor, based on the received data, a suction array layout to hold the blank against a media support, wherein the suction array layout conforms to the shape of the blank.

Abstract: Provided are a vacuum chuck member and a vacuum chuck method that are capable of suppressing misalignment of a substrate when a wafer having a significant deflection or warpage is chucked and held. In a state in which a wafer W is placed on the upper surface side of a base 1, the pressure in an inner space S1 surrounded by the upper surface of the base 1, the lower surface of the wafer W, and the inner side surface of an inner annular rib 21 is reduced through a first air passage 101. Subsequently, the pressure in an outer space S2 surrounded by the upper surface of the base 1, the lower surface of the wafer W, the outer side surface of the inner annular rib 21, and the inner side surface of an outer annular rib 22 is reduced through a second air passage 102.

Abstract: A clamp device for securing an object, the clamp device including an attachment device configured for attachment to a flat surface in a first direction; and a trigger clamp including a pair of adjustable jaws adjustable in a second direction and an actuation mechanism of the pair of adjustable jaws including both a lock function and an unlock function and an adjustment structure for adjusting a space encompassed within the pair of adjustable jaws, wherein the trigger clamp is coupled to the attachment device, the actuation mechanism is configured to be operated with only one action with only one hand of a user while the trigger clamp is coupled to the attachment device to secure the object in the space and the second direction is disposed substantially at a right angle to the first direction.

Abstract: Various burl designs for holding an object in a lithographic apparatus are described. A lithographic apparatus includes an illumination system, a first support structure, a second support structure, and a projection system. The illumination system is designed to receive radiation and to direct the radiation towards a patterning device that forms patterned radiation. The first support structure is designed to support the patterning device on the first support structure. The second support structure has a plurality of burls and is designed to support the substrate on the plurality of burls. A topography of a top surface of each of the plurality of burls is not substantially flat, such that a contact area between the substrate and each of the plurality of burls is reduced. The projection system is designed to receive the patterned radiation and to direct the patterned radiation towards the substrate.

Abstract: The present specification relates to an apparatus for manufacturing a blanket, a method for manufacturing a blanket, a blanket manufactured using the same, a reverse offset printing roll provided with the blanket, and a reverse offset printing apparatus including the same.

Abstract: The invention provides a stage apparatus comprising an object support, a plurality of support members, a gripper and a control unit. The object support comprises a surface for mounting an object on, the surface extending in a plane. The plurality of support members are for supporting the object, and are arranged to receive the object from a gripper and to arrange the object on the surface and/or vice versa. The support members are moveable in at least a first direction which is perpendicular to the plane. The control unit is arranged to receive shape information regarding an out-of-plane-shape of the object, and is arranged to control positions of the support members. The control unit is arranged to tilt the object while supported by the support members by controlling the positions so as to reduce a space consumption of the object in the first direction, based on the shape information.

Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

Abstract: A wafer testing system and a method of testing a wafer include placing a wafer on a vacuum chuck containing a plurality of vacuum zones, determining a warpage of the wafer, providing a different magnitude of vacuum suction to different vacuum zones at the same time based on the determined warpage of the wafer to reduce the warpage of the wafer, and testing the wafer.

Abstract: A device (1) for the movement of sheet-like pieces (P) in a machine tool (M), including a frame (10) moving towards or away from the machining surface (P1) of the machine, a gripping device (20) including a sheet-like element (21) with a gripping surface (21a) having openings (24) and mounted on the frame (10) rotatingly around at least one axis (x) substantially orthogonal to the direction of movement (D) of the frame (10) and element for the creation of a vacuum (25) communicating with the openings (24) and adapted to generate a vacuum pressure at the openings (24), which, when the gripping surface (21a) is substantially next to the machining surface (P1), makes it possible to detach the pieces (P) from the machining surface and keep them on the gripping surface.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A shaping apparatus is equipped with: a beam shaping system having a beam irradiation section that includes a condensing optical system which emits a beam and a material processing section which supplies a shaping material irradiated by the beam from the beam irradiation section; and a controller which, on the basis of 3D data of a three-dimensional shaped object to be formed on a target surface, controls a workpiece movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material from the material processing section while moving the beam from the beam irradiation section and the target surface on a workpiece (or a table) relative to each other. Further the intensity distribution of the beam in the shaping plane facing the emitting surface of the condensing optical system can be modified.

Abstract: A holding apparatus, in particular a chuck, for a substrate comprises a main body with a upper side, a carrier element arranged in a recess of the main body so as to be vertically movable such that it can be adjusted between a protruding loading position and a retracted clamping position, the carrier element comprising a support surface for placement of the substrate. The support surface has a smaller diameter than the main body. A lifting element lifts the carrier element to the loading position. The carrier element seals the recess such that a sealed cavity is provided between the main body and the carrier element, which cavity can have a negative pressure applied thereto which counteracts the effect of the lifting element.

Abstract: A method and apparatus for processing fuselage sections. The apparatus comprises a cradle system, a metrology system, and a controller. The cradle system holds a first fuselage section and applies forces to the first fuselage section to change a current shape of the first fuselage section. The metrology system makes measurements of the current shape of the first fuselage section. The controller receives the measurements from the metrology system, identifies the forces needed to change the current shape of the first fuselage section towards a desired shape for connecting the first fuselage section to a second fuselage section, and sends commands to the cradle system to apply the forces to change the current shape of the first fuselage section towards the desired shape.

Abstract: A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a vacuum source for producing a suction force, the workpiece being mounted on the holding surface of the holding unit, a liquid supplying step of supplying a liquid to the workpiece held on the holding surface so that the liquid flows into a gap defined between the holding surface and the workpiece to fill the gap, and a suction step of bringing the suction hole into communication with the vacuum source to suck the liquid and the workpiece and thereby hold the workpiece through the liquid on the holding surface under suction, after performing the liquid supplying step.

Abstract: A substrate can be placed on a placing table horizontally. When placing the substrate on the placing table having multiple protrusions configured to support the substrate, the substrate is attracted to the placing table while performing a suction from a suction hole configured to attract a position, different from positions located above the protrusions, of the substrate placed on the placing table, and then, a suction force of the suction hole is reduced. Accordingly, it is possible to place the substrate on the placing table while correcting the flexure. Further, the substrate can be horizontally placed on the placing table since deformation of the wafer, caused by attracting a bottom surface of the wafer strongly, is suppressed.

Abstract: The invention relates to a blank holder for a dental milling machine. The blank holder has a clamping frame with a receptacle for a blank. The clamping frame includes a first frame part and a second frame part which are pivotable relative to one another to open the receptacle. A first clamping face is formed on the first frame part and a second clamping face is formed on the second frame part. The clamping faces engage an outer periphery of the blank with the clamping frame closed. To configure a blank holder so that the blank is fixed in the clamping frame in a play-free manner, provision is made to form one of the clamping faces on an annular clamping ring. The clamping ring is held on a frame part and is displaceable counter to a force in the axial direction.

Abstract: A self-balancing line shaft of a machine tool includes a spindle device, a cutter tool holder and at least one balancing assembly. The spindle device includes a spindle extending along and rotatable about an axis, and at least one precision lock nut threadedly engaged with and rotated with the spindle. The cutter tool holder is coaxially connected and rotated with the spindle. The balancing assembly includes an annular groove formed in one of the precision lock nut and the cutter tool holder and extending along a circle path surrounding the axis, and a plurality of weight members disposed in the annular groove to be moved in a direction opposite to a rotation unbalance during rotation of the spindle such that the center of mass of the whole rotating system is close to the axis.

Abstract: An end-of-arm tool includes concentric rings of suction cup assemblies. Each suction cup assembly can be independently extended and retracted. Sensors on each suction cup assembly indicate its fully extended position such that displacement from the fully extended position upon contacting an item is indicated by the corresponding sensor.

Abstract: Disclosed is a vacuum fixture. The vacuum fixture may include a base plate assembly, a middle frame assembly, and a top plate assembly. The base plate assembly may have a first hinged edge. The middle frame assembly may be connected to the base plate proximate the first hinged edge and may define a void. The top plate assembly may have a second hinged edge connected to the first hinged edge, such that when the top plate assembly is in a closed position the middle frame assembly is located in between and contacts a first surface of the base plate assembly and a first surface of the top plate assembly, thereby forming a cavity in between the base plate assembly and the top plate assembly.

Abstract: An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.

Abstract: An object detection system utilizes a teach cycle performed with a low-pressure blow-off (i.e. positive pressure) instead of vacuum (negative pressure). During the teach operation, the positive pressure is enabled and the nozzle is lowered to the object. An air sensor detects pressure or flow at the nozzle tip. A rise in pressure or drop in flow is detected as the nozzle makes contact with the object (i.e. just before or just after actual physical contact is made). The height of the object is stored as the taught height to be used subsequently in repetitive operations by the machine. This teaching method is particularly useful for very small objects because the positive pressure does not lift the object.

Abstract: A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.

Abstract: A substrate suction stage including a substrate support unit having a top surface, a cavity formed therein, an ejection hole formed therein and extending from the cavity to the top surface, and a suction hole formed therein for connecting the ejection hole and the top surface, and a gas supply unit for supplying gas into the cavity, wherein the ejection hole surrounds the suction hole in plan view, and when gas is supplied into the cavity, gas in the suction hole is discharged to the outside via the ejection hole.

Abstract: A robotic system includes an end effector with one or more fin grippers that have one or more vacuum ports. The fin grippers are made of elastic material. The fin grippers each include contact and exterior flanges joined together with a series of crossbeams. The crossbeams each define a tube opening to form a tube guide channel between the contact and exterior flanges. In one form, the vacuum ports are located at fingertip ends of the fin grippers, and the vacuum ports include vacuum cups.

Abstract: A combined chuck table mechanism includes a chuck table, an electrostatic attraction section, and a vacuum suction section. The chuck table has a holding surface for holding a plate-shaped workpiece. The electrostatic attraction section has electrodes provided in the chuck table for charging an upper surface, a holding surface, through supply of power and electrostatically attracting the workpiece. The vacuum suction section has a porous portion that is formed to be flush with the upper surface, that communicates with a suction source, and that has fine holes, suction ports. The combined chuck table mechanism further includes a control unit adapted to achieve holding of the workpiece through a combined force by supplying power to the electrodes and a negative pressure to the suction ports.

Abstract: A splitting apparatus for an LCD panel and a splitting method thereof are described. The LCD panel has a first substrate and a second substrate. The splitting apparatus includes a first splitting device and a second splitting device disposed correspondingly to the first splitting device, and the second splitting device includes protrusion adjustment devices. The protrusion adjustment device extrudes the second substrate for forming a protrusion corresponding to a split line to separate a split plate from the first substrate by a deformation portion of the protrusion and to remove the split plate by the first splitting device. The splitting apparatus makes a rapid separation of the split plate.

Abstract: A fingerprint identification module packing method is provided. Firstly, plural fingerprint identification modules are attached on a supporting plate. Then, plural covering plates are attached on fingerprint sensing chips of the fingerprint identification modules. Then, the fingerprint identification modules are transferred to vacuum adsorption holes of a vacuum adsorption fixture. Then, the fingerprint sensing chips, the corresponding covering plates and corresponding metal terminals are welded by a laser welding process. Afterwards, the vacuum adsorption fixture is disabled. Consequently, the plural fingerprint identification modules are transferred to the packing plate.

Abstract: In one example, a media support includes a sheet of elongated suction cups. In another example, a media support includes an arrangement of elongated and/or circular suction cups in which the density of the suction cups varies between different parts of the support.

Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.

Abstract: There is provided a carrier plate removing method of removing a carrier plate from a workpiece disposed on a front surface of the carrier plate with a provisional bond layer interposed between the carrier plate and the workpiece. The carrier plate removing method includes a first holding step of holding the carrier plate and exposing the workpiece, a stepped portion forming step of forming a stepped portion in which an back surface side projects outward of a front surface side at an outer peripheral edge of the carrier plate, a second holding step of holding the workpiece and exposing the carrier plate, and a carrier plate removing step of removing the carrier plate from the workpiece by applying a force to the stepped portion and moving the carrier plate in a direction of being separated from the workpiece by a removing unit.

Abstract: A method and apparatus for smoothing a material having wrinkles. The material is positioned on a vacuum table having a group of segments. A smoothing device is moved across a surface of the material to form a substantially smooth section of the material. A vacuum is progressively applied to a portion of the group of segments in the vacuum table corresponding to the substantially smooth section of the material to pull the substantially smooth section of the material against the vacuum table.

Abstract: A specialized vacuum chuck system of the present invention is capable of securing an object to a specialized welding tool in order to ensure that the object remains in a proper positional relationship with the welding tool. The system may also use springs and load stops to ensure that a proper load in maintained so the chuck base is not pulled off the object.

Abstract: A vacuum adsorbing workbench and a vacuum adsorbing device are provided. The vacuum adsorbing workbench includes a workbench body, a first suction tube and an occluder. The workbench body is provided with multiple suction holes. Each suction hole is in communication with the first suction tube. The occluder is able to be connected with the first suction tube cooperatively to cut off communication between each suction hole and the first suction tube.

Abstract: A substrate delivery method includes receiving a substrate by protruding a plurality of pins, detecting a position of a predetermined portion of the substrate in a state where the substrate is supported by the plurality of pins, estimating a deviation amount and a deviation direction of a positional deviation between a center position of the substrate and a predetermined reference position using a detected result, tilting the substrate, and bringing the substrate into partial contact with the placing table by lowering the plurality of pins at a same speed in a state where the substrate is tilted, and disposing the substrate on the placing table while moving the center position of the substrate by the deviation amount in a direction opposite to the deviation direction by using rotation of the substrate in a vertical direction due to contact with the placing table by continuously lowering the plurality of pins.

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably coupled to one another so that the wafer support ring can be uncoupled from the wafer without causing damage to the wafer or the wafer support ring.

Abstract: A method is provided for the preparation of a semifinished product made of fiber material with an upper side and with an underside prior to a wet-pressing process. The method includes following steps: arrangement of a semifinished product made of fiber material with the underside on a preparation area with a large number of suction apertures, application of a reduced pressure to the underside of the semifinished product by way of the suction apertures, and introduction of a flowable matrix material by way of the upper side of the semifinished product.

Abstract: Tape feeder holding device includes slide section on which a tape feeder can be slid, the tape feeder supplying electronic components by feeding tape housing the electronic components in a tape feeding direction; and sliding device configured to slide the tape feeder held in the slide section in the tape feeding direction, the sliding device being capable of sliding the tape feeder to a supply position at which the electronic components can be supplied from the tape feeder. That is, with the tape feeder holding device, a tape feeder is automatically attached to the tape feeder holding device.

Abstract: A chuck according to an embodiment of the present invention includes first and second support portions 10 each of which has a repetition structure of a convex portion 11 and a concave portion 13 on a base. A substrate is held by bringing each convex portion 11 into contact with the substrate and exhausting gas in each concave portion 13 such that the concave portion 13 has a negative pressure with respect to a space between the first support portion 10 and the second support portion 10. At least one support portion of the first support portion 10 and the second support portion 10 includes at least four convex portions 11 and three concave portions 13.

Abstract: A method for supporting a structure includes coupling an index pin to the structure, moving an index head relative to the structure to receive the index pin within a bore extending through the index head, and actuating a pin lock of the index head to retain the index pin within the bore.

Abstract: A vacuum chuck for clamping workpieces, in particular wafers, and a measuring device and a method for checking workpieces by way of X-ray fluorescent radiation. The vacuum chuck has a clamping plate having a support surface, having at least one suction connection arranged on a base body for connecting to a negative-pressure device and for clamping the workpiece on the clamping plate by negative pressure received by the base body and having several suction grooves arranged in the clamping plate and are open towards the support surface. The support surface has concentric suction grooves having a suction opening to which a negative-pressure line is connected or which is connected to a work channel. Each suction groove having a separate negative pressure, which is separate to the adjacent suction groove, is selectively controlled by a control valve by a control for supplying the respective negative pressure in the respective suction groove.

Abstract: According to various embodiments, a substrate carrier may include: a substrate-supporting region for supporting a substrate; wherein a first portion of the substrate-supporting region including a pore network of at least partially interconnected pores; wherein a second portion of the substrate-supporting region surrounds the first portion and includes a sealing member for providing a contact sealing; at least one evacuation port for creating a vacuum in the pore network, such that a substrate received over the substrate-supporting region is adhered by suction; and at least one valve configured to control a connection between the pore network and the at least one evacuation port, such that a vacuum can be maintained in the pore network; wherein the pore network includes a first pore characteristic in a first region and a second pore characteristic in a second region different from the first pore characteristic.

Abstract: A remote optical control surface indication system comprising mechanisms configured to engage heads of respective fasteners that attach an alignment indexing plate to a vehicular structure having a control surface coupled thereto. The system further comprises: a camera having a field of view that encompasses a portion of an end face of the control surface when the mechanisms are engaged with the fasteners and when the control surface is in a neutral position; a source of light that is activatable to project light that illuminates the end face of the control surface; a display screen comprising an array of pixels; and a computing system configured to process image data captured by the camera to determine a current position of a centerline of the end face of the control surface relative to a baseline position and control the display screen to display symbology indicating the current position relative to the baseline position.

Abstract: A pellicle includes a frame. The frame includes a check valve, wherein the check valve is configured to permit gas flow from an interior of the pellicle to an exterior of the pellicle. The frame further includes a recess in a bottom surface of the frame. The pellicle further includes a membrane extending across the frame. The pellicle further includes a gasket configured to fit within the recess.

Abstract: An apparatus has a frame and a plurality of clamps connected to the frame. At least one of the clamps is movable to releasably clamp a sheet of material on the apparatus. The plurality of clamps are configured and located on the frame to be limited to clamp on the sheet of material at least two edges of the sheet of material.

Abstract: A substrate processing apparatus may include a substrate jig device and a transfer unit, which is configured to hold a substrate in a non-contact state and move the substrate toward the substrate jig device. The substrate jig device may include a supporter, which is configured to support an edge of the substrate and have an opening, a first suction part, which overlaps with a center region of the opening and is configured to move in a first direction, and a plurality of second suction parts, which overlap with an edge region of the opening and are configured to move toward the opening. Here, the first direction may be a direction passing through the opening.