Abstract: A method and apparatus for the processing of tissue and cellular material during cryopreservation and/or processing for microscopy. The method and apparatus maximizes heat transfer coefficients by using liquid-free cryopreservation protocols and maximizing glass transition characteristics through increasing pressure during cryopreservation. Cooling rates combined with megapascal pressures reduced the required concentration of cryoprotective agents (CPAs) needed for ice-free cell and tissue cryopreservation.

Abstract: A substrate table supports a substrate holder to which a substrate is clamped for exposure. The substrate table has a plurality of e-pins spaced apart from and distributed around the center of the substrate holder to receive, and lower, a substrate onto the substrate holder prior to exposure, and to raise a substrate off the substrate holder after exposure. Tip portions of the e-pins and the corresponding apertures in the substrate holder have a shape in plan including at least one re-entrant, e.g. a cross shape.

Abstract: Provided is an apparatus for testing a semiconductor. The apparatus includes a chuck on which a wafer is disposed, a probe card disposed on the chuck to provide a test signal to the wafer, a sensor disposed in the probe card, a base unit connected to the probe card to transmit the test signal to the probe card, and a pressure device connecting the base unit to the probe card, the pressure device correcting deformation of the probe card.

Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

Abstract: The invention relates to an apparatus and method for cutting a material web in a papermaking machine. The apparatus includes a cutting device, an upper holding device and an upper positioning device. The cutting device is fixed above the upper positioning device on the upper holding device such that it can be moved in the cross-machine direction. The apparatus additionally has an air guide box and the air guide box is fixed above the material web, likewise on the upper holding device. Furthermore, the apparatus has a cutting table fixed to a lower holding device via a first and/or a second lower positioning device. The cutting table is movable substantially vertically with respect to the material web via the first lower positioning device and/or movable in the cross-machine direction via the second lower positioning device.

Abstract: A battery electrode manufacturing apparatus including: a front end die which cuts a strip-shaped electrode material into an electrode shape; a hand which grasps the electrode material and conveys the electrode material to the cutting position of the front end die; and a first suction conveyor which is disposed upstream of the front end die in a conveying direction and has a supporting surface for supporting the electrode material during the cutting by the front end die. The hand includes a first grasper and a second grasper, and the first suction conveyor is disposed between the first grasper and the second grasper. The hand carries the electrode material to the cutting position, at such a position that the electrode material does not contact the front end die and the first suction conveyor.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

Abstract: A suction-type hand according to the present invention includes a base part, a plurality of linear drive devices successively arranged in the base part, a plurality of link parts, which are each connected to the corresponding one of movable parts of the linear drive devices and which are moved closer to or moved away from the base part in response to the movement of the movable parts, a plurality of joint parts for connecting the plurality of link parts in series, and rotatably supporting the link parts, and a plurality of suction parts for drawing and holding a workpiece, which are each supported by the corresponding one of the plurality of link parts.

Abstract: A method of mounting a roof panel assembly to a vehicle having a roof opening in its fixed roof includes: mounting a frame of the roof panel assembly to the fixed roof from below with an operating mechanism and a ring frame in a position corresponding to a closed position of the movable panel, providing an amount of paste-like adhering material onto the ring frame distributed around the circumference thereof, positioning the movable panel onto the ring frame from above with the adhering material interpositioned and compressing the adhering material until a correct position with respect to the vehicle roof is reached, and keeping the movable panel in this position until the adhering material is sufficiently hardened to maintain the panel in its position.

Abstract: A tool configured to install and torque multiple fasteners, such as nuts and/or bolts, positioned in confined and/or hard to reach areas. The tool includes a body portion, a plurality of fastener retainers, and a structure which permits both the remote tightening and torquing of such fasteners. The tool also provides an actuator for the remote release of torque loads which may build up in the fastener retainers during such torquing of the fasteners. The actuator includes a lever arm pivotally connected to the body portion and a cam that is rotatable between a first position and a second position. A linkage is engaged by the cam and urges the lever arm to a torquing position upon the cam being in the first position and to a torque release position upon the cam being in the second position.

Abstract: A reconfigurable fixturing assembly including an elongate member defining a longitudinal axis, a support assembly slideably connected to the elongate member, the support assembly including a support member extending therefrom, a plurality of pivot assemblies slideably connected to the elongate member, each pivot assembly defining a pivot axis, and a plurality of transverse guide rails, wherein each transverse guide rail defines a guide rail axis that is transverse to the longitudinal axis of the elongate member, and wherein each transverse guide rail is slideably connected to an associated pivot assembly.

Abstract: A mount flange for mounting a cutting blade on a spindle is provided. The cutting blade has a central engaging hole and a peripheral cutting edge. The mount flange includes a cylindrical boss portion having a front portion adapted to be inserted into the engaging hole of the cutting blade and a rear portion whose inner circumferential surface is adapted to be engaged with the spindle, and a flange portion projecting radially outward from the rear portion of the boss portion and having a front surface functioning as a mounting surface adapted to come into abutment against one side surface of the cutting blade. An annular space is formed in the mount flange so as to surround the spindle and open to the inner circumferential surface of the boss portion, thereby suppressing rearward warpage of the outer circumference of the flange portion due to the rotation of the spindle.

Abstract: A system that may include a apertured structure that is configured to support a substrate and a vacuum supply unit that is configured to (i) prevent a supply of vacuum to a first area of the substrate during a first processing period during which the first area is processed and a second area of the substrate is not processed; (ii) provide vacuum to the second area during the first processing period; (iii) prevent the supply of vacuum to the second area during a second processing period during which the second area is processed and the first area is not processed; and (iv) provide vacuum to the first area during the second processing period.

Abstract: Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes.

Abstract: A feeding mechanism configured to feed a plurality of work pieces to a mold includes a feeding assembly and a fetching assembly. The feeding assembly includes a first adjusting portion and a second adjusting portion. The first adjusting portion includes a first movable plate, a second movable plate, and a guiding member. An end of the guiding member passes through the second adjusting portion and is elastically received in the first movable plate. Another end of the guiding member is extended through the second movable plate and exposed out from the second movable plate for being sleeved around the work pieces. The fetching assembly fetches the work pieces from the feeding assembly and carries the work pieces to the mold.

Abstract: The workpiece fastening device of the present invention comprises a table on which a workpiece is placed, an arm which can move so as to press a workpiece on the table against the table, and a drive part which drives the arm. The arm of the workpiece fastening device comprises a connection member which is connected to the drive part, and a rotary member which is attached to the connection member to be able to rotate about a rotation axis which extends in a direction intersecting with a movement direction of the arm. The rotary member of the arm has first and second pressing parts which are arranged at the opposite sides of the rotation axis and presses a workpiece on the table against the table by the first and second pressing parts.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.

Abstract: A device for clamping a workpiece (P) to a workbench (T) includes a body (1) containing a vacuum-generating element. The body (1) has a lower cavity (2) open at the bottom and positioned in the vicinity of a face for securing to the workbench (T). The lower cavity (2) forms a vacuum reserve, this vacuum reserve being connected by a substantially straight duct (6) to an upper face for securing a workpiece (P).

Abstract: An evaporation device includes a carrier stage, a base and a light source. The carrier stage is placed on the base; the base provides with a vacuum pin; the vacuum pin can move with respect to the base; the carrier stage provides with a pin hole; the vacuum pin can pass through the pin hole to absorb a substrate. A side of the carrier stage away from the base is coated with a photosensitive adhesive, the light source is used to irradiate the photosensitive adhesive between carrier stage and the substrate in order to decrease the adhesiveness of the photosensitive adhesive so that the substrate and the carrier stage can be separated smoothly in order to achieve a small deformation and improve the product yield rate. The evaporation method can achieve a small deformation and improve the product yield rate when separating the substrate and the spacing pad.

Abstract: A picktip is provided and includes a picktip member configured to extend along a longitudinal axis defined in parallel with emissions from an ultraviolet (UV) light source. The picktip member partially includes UV transparent material through which the emissions are directed and has an end face from which the emissions are exited. The picktip member defines vacuum pathways terminating at the end face, and the end face has a non-planar topography.

Abstract: Provided is a device of bonding substrates together, which includes a first holding unit configured to vacuum-draw a first substrate and to adsorptively hold the first substrate on a lower surface thereof and a second holding unit installed below the first holding unit and configured to vacuum-draw a second substrate and to adsorptively hold the second substrate on an upper surface thereof. The second holding unit includes: a body portion configured to vacuum-draw the entire surface of the second substrate; a plurality of pins installed on the body portion and configured to make contact with a rear surface of the second substrate; and a support portion installed on the body portion at the outer side of the pins, the support portion having a reduced contact area over which the support portion makes contact with an outer peripheral portion of the second substrate.

Abstract: A processing apparatus that performs processing to a wafer is provided, the processing apparatus comprising a wafer chuck disposed on a stage and that holds the wafer; three pins that attract the wafer and move the wafer from the wafer chuck; and a control unit that is configured to stop or decrease the attraction of the three pins based on information about a through hole of the wafer when the wafer is moved from the wafer chuck by the three pins.

Abstract: There is disclosed a container processing machine comprising a material handling surface for handling a sheet-like material through suction and a vacuum source in fluid connection with said material handling surface, the machine including means for detecting and transmitting a value of pressure of the gas being suctioned; a controllably operable flow valve; a control unit operatively connected with said detection and transmission means and with said flow valve; said detection and transmission means and said flow valve being arranged between said vacuum source and said material handling surface; said control unit being programmed to adjust the degree of opening of said flow valve in response to a signal which is a function of at least said value of pressure.

Abstract: A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.

Abstract: An apparatus and method for automatically modulating vacuum applied to a vacuum cup are described herein. More particularly an automated labeling apparatus and method for applying labels onto containers using a vacuum based transport mechanism is described herein.

Abstract: A vacuum based apparatus that will, when activated, inhibit relocation of a computing device. The apparatus includes a first surface of a main body. A suction cup is attached to the main body. The suction cup faces outward from and protrudes from the first surface. The suction cup is connected to a vacuum pump and activation of the vacuum pump generates adhesion between the suction cup and another surface that is in contact with the suction cup. A spacer is attached to and protrudes outward from the first surface. The spacer surrounds at least a part of the suction cup that is protruding from the first surface. A control logic that controls the activation of the vacuum pump.

Abstract: A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.

Abstract: A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.

Abstract: A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an electrically conductive cover plate comprising an open center surrounded by a support, the cover plate comprising an electrical conductor surrounding the open center and with at least one of the overlapping cavities of the wafer plating jig base.

Abstract: A surface area vacuum gripper for sucking and handling workpieces, comprising a housing, in which a negative pressure vacuum chamber is provided that can be subjected to negative pressure and wherein the housing includes suction openings on the suction side, facing the workpiece. An insertion element is provided in the housing, which reduces the free inner space of the housing and includes vacuum channels fed by a vacuum generator. The insertion element can be equipped with a plurality of optional functions.

Abstract: A laser processing apparatus is provided in which its XY table is composed of plural divided blocks vertically movable, at least one divided block is stopped while it is moving down, and a through hole is formed by irradiating a workpiece in an area corresponding to a position directly above the divided block with a laser beam.

Abstract: A substrate treatment method includes the steps of: supporting a substrate with a support member; arranging an extension surface such that the extension surface laterally surrounds one major surface of the substrate supported by the support member and extends continuously to the major surface of the substrate supported by the support member; rotating the substrate supported by the support member; and etching the substrate by supplying an etching liquid onto the major surface of the substrate supported by the support member, wherein the extension surface has higher affinity for the etching liquid than the major surface of the substrate supported by the support member.

Abstract: Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate having an outer perimeter, an opening inside of the outer perimeter, and a gap extending between the opening and the outer perimeter. The lift plate includes annular rims of different inner diameters and that are configured to respectively support the first and second workpieces.

Abstract: An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.

Abstract: A tool for machining a curved profile along an axis of rotation X, said curved profile comprising at least one first section along a plane perpendicular to the axis of rotation X and at least one second section parallel to the axis of rotation X. The tool includes blocks, each having a clamping surface against which the profile can take support. The blocks include positioning elements against which the first section and the second section of the profile can take support, and an apparatus arranged to immobilize the profile which is adapted to occupy a first activated state, wherein it immobilizes the profile, and a second deactivated state, wherein it does not immobilize the profile. The tool includes manual presses for maintaining the profile flattened against the positioning elements until the profile immobilizing apparatus is in the activated state.

Abstract: A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.

Abstract: A two way roundness device can be configured as a device in which a tool, such as an indicator rotates or as a device in which the part to be measured or cut rotates. This ability to alternate between these two configurations is enabled by a combination of a rotating spindle assembly and a two-axis stage that can be oriented, in use, with the two-axis stage under the spindle assembly or with the two-axis stage on top of the spindle assembly.

Abstract: A partial spherical shape of each measurement area of a sphere to be measured, which is established so as to have an area overlapping with another measurement area adjacent to each other, is measured at each rotation position, and the surface shape is measured by joining the partial spherical shapes of the measurement areas by a stitching operation based on the shape of the overlapping area. The position at which the sphere is measured is changed and re-held. A positional displacement between half parts of the sphere before and after re-holding, which is caused by an effect of an error owing to the re-holding, is separated into three rotational components. Magnitudes of the three rotational components are quantified by image correlation and the positional displacement corrected. Then, the stitching operation is performed to measure the entire part of the sphere surface.

Abstract: Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.

Abstract: Tool for transporting and shaping flexible laminar parts, which comprises a chamber 1 having a flexible and impermeable wall, with a bottom 3 provided with though holes 6. The chamber 1 houses a flexible and impermeable plate, a rigid plate 4, which reproduces the final three-dimensional shape that the flexible laminar part 5 has to adopt, and a suction tube 8.

Abstract: The present invention relates an aligning voltage applying device and a method for applying an aligning voltage. The aligning voltage applying device includes a base, probe pins, and a pressing plate module. The pressing plate module includes a pressing plate and a driving unit. The aligning voltage applying device and the method for applying the aligning voltage of the present invention can make the probe pins contact pads effectively without damage to the probe pins and an LCD substrate.

Abstract: Embodiments relates to a refrigerator that makes it possible to improve water supply performance by disposing an air exhaust unit in a water supply channel connected to the output side of a pump supplying water from a water tank to an ice maker or a dispenser, and effectively return water remaining when the use of dispenser is finished, by using an opening/closing member in the water supply channel, and a water tank for a refrigerator.

Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.

Abstract: A new and useful improvement in starting blocks and starting block anchoring devices for use at the line of start of a track either indoors or outdoors. The inventive starting block anchor is comprised of a vacuum suction device operatively and releasably attaches to an interface that also operatively and releasably attaches to a track and field starting block of various configurations.

Abstract: Hard-material, flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached with vacuum to the flexible elastomeric membrane of a wafer carrier that allows one surface of the workpiece to be in conformal abrading contact with a moving flat-surfaced abrasive. The elastomeric membrane external wafer attachment surface has a pattern of recessed vacuum grooves and vacuum is supplied to the grooves to firmly attach the rigid-material silicon wafer in flat-surfaced contact with the membrane. The attached wafer seals the vacuum grooves and also provides lateral stiffness to the center portion of the membrane. An outer annular extension of the flexible elastomer membrane maintains the wafer at its original membrane-centered location when abrading forces are applied to the rotating wafer. The rotating wafer peripheral edge does not contact a rigid retaining ring during a wafer polishing procedure.

Abstract: A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.

Abstract: The invention relates to a device for securing solar cells to glass surfaces, the securing device comprising a film of encapsulation material containing a plurality of holes and troughs in the film surface. Solar cells disposed on the film can be secured to a glass surface as a result of a vacuum being generated in the troughs and holes. The invention also relates to a method for securing solar cells in solar module production.

Abstract: An adjustable fixture structure for a 3D X-ray CT device is disclosed. Only the detected article is fixed on the fixture element of the adjustable fixture structure, may the adjustable connecting element slide with respect to the adjustable sliding trough and the fixture element slide with respect to the fixture sliding trough, so that the detected article is adjusted into within the detection range of the 3D X-ray CT device by using the adjustable connecting element and the fixture element. As such, the issues which a detected article is difficult to be oriented and positioned, a detection efficacy and result is poor, and the detected article might thus be damaged, may be well overcome.

Abstract: A method and system for a preheating step of a wave soldering process. A bottom side preheater is positioned underneath a PCB and a thermal carrier is positioned adjacent the PCB. A top side heater may also be used. The PCB includes one or more through holes, and an electronic component having one or more pins is mounted on the PCB so that each pin is positioned in a corresponding through hole. The bottom side preheater directs heat to the bottom surface of the PCB, thereby heating the bottom surface via heat convection. The thermal carrier directs heated air laterally across the top surface of the PCB to increase a heat transfer at the top surface without increasing the temperature of the electronic component, thereby reducing a temperature differential between the top and bottom surfaces.