Abstract: A method is provided for repairing a turbine component with a distressed portion. The method includes machining the turbine component into a first intermediate turbine article such that the distressed portion is removed; and rebuilding the first intermediate turbine article into the turbine component with an additive manufacturing process.

Abstract: The invention relates to a positioning device (203) for a manual welding machine (300), particularly for a plastic welding machine, comprising at least one contact shield (16) associated with the manual welding machine (300) and a positioning ring (3) associated with the material to be welded. In order to perform precise welding and to prevent the subsequent slipping of the manual welding machine (300), according to the invention, the positioning ring (3) can be fixed to the material to be welded and a contact shield (16) that can be inserted in the positioning ring (3) transfers a pressure distributed evenly over the circumference to the materials to be welded, in order to allow secure welding over a large area.

Abstract: A probe apparatus includes a card clamp unit detachably supporting a probe card; and a wafer mounting table adsorbing the semiconductor wafer and bringing electrodes on the semiconductor wafer into contact with the probes. In order to mount the semiconductor wafer including an annular portion protruding from a rear surface of an outer peripheral portion and a thin portion having a thickness smaller than the annular portion, the wafer mounting table includes a planar portion on which the thin portion is mounted; and a step-shaped portion which is formed at an edge of the planar portion and mounts the annular portion thereon. Multiple circular vacuum chuck grooves are concentrically formed in the planar portion, and at least some of the vacuum chuck grooves are connected to multiple vacuum paths through which vacuum evacuation is performed at multiple positions separated from each other by 90° or more along a circumferential direction.

Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

Abstract: An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

Abstract: A ski tip hold down assembly for holding the tip end of the ski. The ski tip hold down assembly having a base attached to a work bench and an upright stand affixed to the base. The upright stand having a ski rest on a top surface thereof and a ski tip hold down bar secured to the upright stand in spaced apart relation to the ski rest defining an opening adapted to receive a ski tip, with the ski oriented in a base-up configuration, with the ski tip extending underneath the ski tip hold down bar. The apparatus further including a tail rest assembly having a base adapted to be used on the work bench in spaced apart relation to the ski tip hold down assembly and further including an upright stand affixed to the base with a ski rest provided on a top surface thereof.

Abstract: The described embodiments relate to adjustable fixtures. A number of adjustable length cylindrical pins can be utilized to form a conformal support structure in accordance with a workpiece having any number of variations. At least three fixed length pins having heights lower than the adjustable length pins, can be interspersed with the adjustable length cylindrical pins to define an orientation at which the workpiece is held. Because the adjustable length pins have an uncompressed height greater than the fixed length pins, each of the adjustable length pins can be compressed in accordance with a bottom surface of the workpiece when the workpiece is pressed against the fixed length pin. In this way a conformal support structure can be formed that supports the workpiece during a machining operation.

Abstract: In an imprint lithography system, a recessed support on a template chuck may alter a shape of a template positioned thereon providing minimization and/or elimination of premature downward deflection of outer edges of the template in a nano imprint lithography process.

Abstract: A vacuum suction device of the present invention comprises: a cover which is rotatably mounted on the upper portion so as to couple to a flat surface by means of vacuum suction; an suction plate, which is coupled to the lower portion of the cover, for vacuum suction to the flat surface; and a height adjustment member, which is arranged between the cover and the suction plate, for moving the suction plate back and forth according to the rotation of the cover; wherein a plurality of fixing pieces are formed on the upper surface of the inside of the cover, a plurality of elastic stoppers are coupled to the inside of the height adjustment member, so as to be movable by sliding when each of the fixing pieces is in contact, and for fixing the cover by each of the fixing pieces being hooked to the end portion of the cover so as to prevent reverse rotation.

Abstract: A plate configured to contact a web includes a first region having a first characteristic and a second region having a second characteristic different than the first characteristic. The plate has a substantially arcuate wall with an inner surface and an outer surface. A plurality of vacuum holes extends between the inner and outer surfaces and are configured to be in fluid communication with a vacuum source. A vacuum region is adapted to contact the first region of the web and a reduced-vacuum region is adapted to receive the second region of the web. The plurality of vacuum holes are configured such that, when attached to the vacuum source, a vacuum pressure at the vacuum region is greater than a pressure at the reduced-vacuum region so that the first region of the web is held against the plate with a greater force than the second region.

Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.

Abstract: A glass substrate-holding tool employed during the production of a reflective mask blank for EUV lithography includes an electrostatic chuck and a mechanical chuck. A caught and held portion of a glass substrate caught and held by the electrostatic chuck, and pressed portions of the glass substrate pressed by the mechanical chuck are located outside a quality-guaranteed region on each of a film deposition surface and a rear surface of the glass substrate. The sum of a catching and holding force applied to the glass substrate by the electrostatic chuck and a holding force applied to the glass substrate by the mechanical chuck is at least 200 kgf. A pressing force per unit area applied to the glass substrate by the mechanical chuck is at most 25 kgf/mm2.

Abstract: A bonding method for bonding a semiconductor chip to an underlying structure includes aligning an electrical contact of a lower surface of the semiconductor chip with an electrical connection member of an upper surface of the underlying structure, the electrical contact at least partially encased by a support material. The method further includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material encasing the deformed electrical contact. The method still further includes second heating the semiconductor chip and the underlying structure to bond the electrical contact of the semiconductor chip to the electrical connection member of the underlying structure while maintaining the support material in a cured state.

Abstract: The present invention provides a component supporting device which has: a platform, a vacuum system, a gas supply system and a discharger system. The platform has a supporting surface, a bottom surface and at least one through hole, and the through hole passes through the supporting surface and the bottom surface. The vacuum system provides a vacuum suction to the through hole. The gas supply system is used to output at least one type of gas to the through hole. The discharger system ionizes the gas into an ion fluid. Thus, the through hole can be used to provide the vacuum suction for supporting and sucking a component, or to provide the ion fluid when releasing the vacuum suction for more efficiently, uniformly and rapidly removing static electricity on a surface of the component.

Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

Abstract: A vacuum carrier can be employed to provide a partial vacuum on a back side surface of a substrate thereby holding the substrate flat against a rigid surface of the carrier throughout the duration of a bonding process. The magnitude of vacuum can be optimized to limit the warping of the substrate during and after bonding with another substrate, and to limit the mechanical stress induced in the solder balls during cooling. The vacuum carrier can include a base plate, a seal plate with at least one opening configured to accommodate at least one substrate, and vacuum seal elements configured to create a vacuum environment that pushes the substrate against the base plate when the vacuum carrier is under vacuum. The configuration of the vacuum carrier is chosen to avoid distortion of the substrate due to the vacuum seal elements, while allowing adjustment of the magnitude of the partial vacuum.

Abstract: A blade support cradle is described, which can be used to support a section of a wind turbine blade using an array of vacuum clamps. The cradle provides a secure and reliable system for the support of a blade section during and after blade manufacture, allowing for various operations to be easily carried out on the surface of the blade section. A method for receiving a blade section in the cradle is further described. In addition, the cradle may be used as part of a blade post-moulding station in a method of manufacturing a wind turbine blade.

Abstract: An electronic component manufacturing apparatus includes a first plate and a second plate such that a first surface of an electronic component chip is in contact with a first elastic layer of the first plate and a second surface of the electronic component chip is in contact with a second elastic layer of the second plate. The electronic component manufacturing apparatus further includes a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof and a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, the first and second plates in accordance with a turning path of the electronic component chip.

Abstract: A system and method for supporting a workpiece includes a plurality of support assemblies with movable heads. Positional errors are ascertained for the heads based on different positions thereof and used to properly position the heads to support the workpiece. Other inventive aspects are directed to features of the support assemblies and heads thereof.

Abstract: A buffer layer can be used in conjunction with a cutting table to reduce cutting tool wear. During use, a first surface of the buffer layer can rest on a top surface of the cutting table, and a second surface of the buffer layer can receive a material to be cut. The buffer layer can include one or more channels in its second surface, and the one or more channels can correspond to a pattern to be cut from the material. The depth of the one or more channels can be sufficient to provide a clearance depth between a tip of the cutting tool and a bottom surface of each of the one or more channels. The clearance depth can prevent the tip of the cutting tool from wearing against the bottom surface of the channels, thereby increasing life expectancy of the cutting tool and reducing process costs.

Abstract: Embodiments provide a slide assembly device having a static tooling base which is statically and solidly affixed to a base such as a table and a moveable tooling arm that is rotatable about a hinge connected to the static tooling base, so that moveable tooling arm rotates about the hinge in a manner similar to a book cover opening and closing. The embodiments further provide an upper slide chuck that is removably attachable to the moveable tooling arm and a lower slide receiver that is removably attachable to the static tooling base. The upper slide chuck is configured to hold an experimental slide via a vacuum mechanism to engagedly hold the experimental slide to the upper slide chuck while the moveable tooling arm is rotated about the hinge from an open-book position to a closed-book position.

Abstract: A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).

Abstract: A clamping apparatus for clamping a plurality of Hi-Fix boards arranged in a row, includes at least one rotational clamping unit installed to clamp facing end sides of the two or more Hi-Fix boards together, and a plurality of clamping units installed to clamp end sides of the Hi-Fix boards other than the facing sides thereof. The rotational clamping unit includes a clamper installed to rotate about a fixed rotation point to clamp or release the claming of the facing end sides of the two or more Hi-Fix boards, and a driving unit for providing a rotational force to the clamper.

Abstract: A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract: A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process.

Abstract: An improved silicon wafer transport system. More particularly, this invention relates to providing new wafer-transport apparatus having geometries configured to minimize damage to the wafer while assisting in maintaining multi-orientation positioning of the wafer during transport by the tool.

Abstract: A system and apparatus are provided for adhering steering ribs to an intermediate transfer belt (ITB). These steering ribs (one or more) are applied to the ITB by placing the rib material around a cylindrical fixture. The rib material is held in place by a vacuum that is applied to the rib material to hold it against the fixture. An ITB may be separately held in place on the fixture by another vacuum until the rib material is adhered to the inside surface of the ITB through application of compressed air to force the rib material outward against the ITB. Once the rib material is adhered to the ITB, a series of apertures directs compressed air against the rib and the ITB to release them from the fixture.

Abstract: An apparatus and method for supporting an object. In one illustrative embodiment, an apparatus may comprise a support structure, a positioning system, and a retention system. The positioning system may be associated with the support structure and configured to position the support structure with respect to a number of linear axes. The retention system may be associated with the support structure. The retention system may be configured to retain a portion of an object and move the portion of the object towards a platform such that the portion of the object substantially conforms to a shape of the platform.

Abstract: In the present invention, a ceramic vacuum chuck 2 having an upper surface for adsorbing a substrate is formed from a colored ceramic sintered body comprising 55-75% by weight alumina (Al2O3), at least 3% by weight Si in terms of oxide (SiO2), at least 0.4% by weight Ca in terms of oxide (CaO), at least 0.4% by weight Mg in terms of oxide (MgO), coloring agent, and 1% or less of impurities. A plurality of pins 4 for supporting the substrate, and a rim 6 are formed on the upper surface by shot blasting using abrasive grains, and the whole of the upper surface is shot peened using spherical particles.

Abstract: The invention is a clamping plate used to stiffen and hold a large, thin workpiece having low inherent stiffness. The clamping plate has a back layer, an intermediate layer and a contact layer. A plurality of grooves, which serve as air channels, is provided in the contact layer and the intermediate layer impart flexibility to the clamping plate. The clamping plate has sufficient flexibility to adapt to the specified contour of the workpiece. The contact layer is placed against the workpiece and vacuum apparatus provides suction through the air channels, which are in flow communication with each other between the two layers, to hold the workpiece against the clamping plate. One or more seals defines a holding area on the contact layer and prevent loss of suction.

Abstract: A suction-holding apparatus includes a suction plate made of an air-permeable material, a holding member formed with a through-hole in which the suction plate is placed, and a base to which the holding member is attached. The suction plate includes a jutting-out portion so that the outer edge of the rear face is disposed outwardly from the outer edge of the front face. The through-hole includes a first edge and a second edge spaced apart from each other in the thickness direction. The first edge is adjacent to the base. The holding member includes an eaved portion so that the second edge of the through-hole is disposed inwardly from the outer edge of the rear face.

Abstract: The invention relates to a vacuum pad for use on vacuum drums (8) of labeling machines for labeling bottles or like containers (2) with labels (3), having a plurality of vacuum openings (10) provided at least on a partial area (21, 21a) of the vacuum pad (9, 9a) and formed by channels (37, 38) that can have a vacuum applied thereto in the at least one partial area (21, 21a), characterized in that the vacuum pad (9, 9a) is manufactured of a transparent material, such as a transparent plastic, at least in the partial area (21, 21a) comprising the vacuum openings and the channels (37, 38).

Abstract: For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder 41h for guiding a vacuum for suction in an inside thereof, a shank 41s and a collet 41c, detachably attached at a tip of the holder, for adjusting the position of the collet after exchange of the collet, a reverse-side surface of that collet is photographed, before exchanging it, by a reverse-side surface photographing camera 42, which is disposed below the bonding head device, and after the exchange of the collet, the reverse-side surface of that collet exchanged, and then correction is made on positions of the collets, so that pictures photographed before/after the exchange thereof come to be coincident with.

Abstract: In one embodiment, an apparatus for constraining an object includes a first clamping surface configured to apply a first holding force to a first surface of the object; a second clamping surface configured to apply a second holding force to a second surface of the object; and an actuator configured to selectively move the second clamping surface relative to the first clamping surface.

Abstract: A drawing apparatus which performs a drawing process on a substrate includes a holding plate having a holding surface configured to be opposed a back surface of the substrate, a vacuum suction port formed in the holding surface and configured to attract the substrate to the holding surface by vacuum suction, and a plurality of Bernoulli suction ports formed in the holding surface and configured to attract the substrate to the holding surface by Bernoulli suction. The holding surface includes a circular region disposed concentrically with the center of the holding surface, and an annular region disposed concentrically with the circular region. At least one of the Bernoulli suction ports is disposed in the circular region, and at least one of the Bernoulli suction ports is disposed in the annular region.

Abstract: A clamp has a base and a first selectively compliant component carried by the base, the first selectively compliant component being selectively operable between a substantially compliant state and a substantially rigid state.

Abstract: Substrate supports are provided herein, In some embodiments, a substrate support includes a first plate; a plurality of vacuum passages disposed through the first plate; a plurality of vertical passages formed partially into the first plate; a plurality of horizontal passages disposed in the first plate, each of the plurality of horizontal passages beginning proximate a perimeter of the first plate and terminating proximate one of the plurality of vertical passages such that the horizontal passages and the vertical passages are in fluid communication; a second plate coupled to the first plate at an interface; an elongate shaft having a vacuum line and an edge purge line internal to the shaft; a vacuum channel formed at the interface fluidly coupling the vacuum line to the plurality of vacuum passages; and an edge purge channel formed at the interface fluidly coupling the edge purge line to the plurality of vertical passages.

Abstract: The invention concerns a plant for manufacturing parts made of composite material, in particular sections for an aircraft fuselage, having at least a compaction station in which, in operation, there are provided a mandrel coated of composite material to be compacted and a transport mechanism arranged to transport at least one compaction device on said composite material. The transport mechanism is associated with at least one sling having at least one strip of porous material that, in operation, is in direct contact with the compaction device, and the sling is configured to transport the compaction device onto the composite material through application of a vacuum source at least to the strip of porous material. The invention also concerns a method of and an apparatus for manufacturing parts made of composite material.

Abstract: A hand-strung jewelry construction board. A plurality of holes is drilled into the board. One or more pins are inserted into the holes. Also, one or more clamps are inserted into the holes. A jewelry string is looped around the pins and clamped in position by the clamps. In a preferred embodiment, second and third strings are wrapped around the jewelry string adjacent the pins at each end of the jewelry string. The second and third wrapped strings are glued into place. When the jewelry string is removed from the jewelry construction board, permanent loops are formed into the jewelry string.

Abstract: A processing system includes a rotary stage, at least one shaft, a rotation driver, a plurality of loading platforms, and a plurality of processing devices. The rotary stage includes two opposite end surfaces and a plurality of loading surfaces between the end surfaces. The shaft connects the end surfaces of the rotary stage. The rotation driver connects the shaft. The loading platforms are respectively disposed on the loading surfaces of the rotary stage. The processing devices are respectively disposed corresponding to the loading platforms.

Abstract: An automatic clamping device for clamping a slab (90) of rigid material onto the worktable (18) of an operating machine comprises a central body (42) terminating at both ends in a bottom cavity (72) and a top cavity (77) each having a suction cup function and being intended to engage, respectively, with the table (18) and the slab (90). The bottom cavity (72) is designed to engage with a through-hole. (30) formed in the thickness of said table (18) and communicating with an air suction duct (26, 28) in turn connected to an air suction source, so as to form a single air suction circuit, the through-hole (30) being associated with shut off valve (32) and closing member 36 for interrupting communication between the cavity (72) and the suction source.

Abstract: A method for combinatorially processing a substrate is provided. The method includes providing a substrate disposed on a substrate support. The substrate and the substrate support are raised against a plurality of sealing surfaces of corresponding sleeves of a plurality of flow cells of a combinatorial processing chamber. The combinatorial processing chamber is operable to concurrently process different regions of the substrate differently. A sealing pressure between the sealing surface of the sleeves and a surface of the substrate is monitored and the raising is terminated when a desired pressure is obtained. The different regions of the substrate are then processed differently.

Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.

Abstract: A workpiece clamping jig configured to clamp a workpiece is provided with a baseplate, a fixed abutting member, and a movable abutting member. The baseplate has a pocket, which forms an air intake passage on the reverse side of a workpiece mounting surface, and a suction through-hole internally connecting the workpiece mounting surface and the pocket. The fixed abutting member is disposed on the baseplate and has a fixed abutting surface corresponding to the shape of the workpiece, and the movable abutting member has an abutting surface movable relative to the workpiece caused to abut against the fixed abutting surface of the fixed abutting member.

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of plurality of first support elements.

Abstract: A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.