Abstract: A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.

Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.

Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

Abstract: A vacuum hold-down system for use with workpieces of various shapes and/or sizes is disclosed. The system comprising a vacuum hold-down table defining a mask support plane and an apertured vacuum table mask which is selectably positionable on said mask support plane, wherein said vacuum hold-down table and said vacuum table mask is configured to define a plurality of selectable different contiguous arrays of vacuum apertures, by suitable relative positioning of said vacuum table mask and said vacuum hold-down table in said mask support plane.

Abstract: A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end.

Abstract: A chemical mechanical polishing to that can provide uniform polishing across a wafer even when polishing hard wafers such as AlTiC wafers used in the formation of magnetic recording sliders. The chemical mechanical polishing to has a wafer carrier that includes a diaphragm or bladder that is configured such that an inner portion of the bladder can be pneumatically pressurized so as to bow outward, while outer portions remain unpressurized.

Abstract: Apparatus for lifting substrates from substrate supports are provided herein. In some embodiments, a substrate lift may include: a substrate support having a plurality of lift pins movably disposed through the substrate support to selectively raise and lower a substrate; an actuator coupled to the plurality of lift pins to control the position of the plurality of lift pins, wherein the actuator has a first port for receiving air at a first pressure to cause the actuator to extend the plurality of lift pins and a second port for receiving air at a second pressure to cause the actuator to retract the plurality of lift pins; and a pressure regulator coupled to the actuator to reduce the first pressure to a magnitude that is less than that of the second pressure.

Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

Abstract: An apparatus for drilling holes in a glass plate has a supporting member for sucking and supporting a glass plate which is used for an automobile window or the like, as described later, and the supporting member is comprised of a suction pad for sucking the glass plate and a pair of supports for supporting the glass plate on an outer side of the suction pad. The supports are detachably mounted on the outer side of the suction pad, and the supporting member is adapted to rotate about the suction pad in an R direction. The apparatus for drilling holes in a glass plate further includes a hole forming means for forming in the glass plate holes shown in FIG. 7; a supporting means having the supporting member and for supporting the glass plate in which the holes are to be formed by the hole forming means; and a transporting means for transporting onto the supporting means the glass plate in which the holes are to be formed.

Abstract: An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position.

Abstract: A method for producing a duct from a planar board having two opposed substantially parallel edges with metal foil facings on opposed major surfaces of the board is disclosed. The method comprises making planar cuts through one of the metal foil facings and at least most of the planar board there below to produce a blank with 3 parallel “V shaped grooves which are parallel to angled edges of the blank. A duct is formed by folding the blank so that the “V” shaped grooves form three of the edges of the duct, and the angled edges form the fourth of the edges.

Abstract: A substrate holding device including: a transfer arm body having a suction path; a pad body including a suction part having a suction surface and a suction port for holding the substrate by vacuum suction, and a cylindrical attachment part in which a suction hole communicating with the suction port is formed; a pad holding member provided with an insertion hole into which the attachment part of the pad body is loosely insertable and a communication path communicating with the suction hole and the suction path, and fixed to the transfer arm body; and an elastically deformable annular airtightness maintaining member with a circular cross-section interposed between an outer peripheral groove in an arc shape formed in the attachment part of the pad body and an inner peripheral groove in an arc shape formed at the insertion hole of the pad holding member.

Abstract: Disclosed are an absorber, in which the positions of absorption pads are automatically adjusted according to sizes of substrates, and an apparatus for fabricating a liquid crystal display panel having the same. The absorber includes an absorption plate gate attached to a robot arm having a transfer hand through a turn unit; and an absorption unit assembly mounted on the lower surface of the absorption plate, and the absorption unit assembly includes a middle absorption unit; a left absorption unit located at the left side of the middle absorption unit; a right absorption unit located at the right side of the middle absorption unit; an absorption support unit to guide moving routes of the absorption units and fix the absorption units to the absorption plate; and absorption pads respectively formed on the absorption units such that the positions of the absorption pads are adjusted according to sizes of substrates to allow the absorption pads to absorb the substrates.

Abstract: A pneumatic device may be configured and used to provide multiple movement related functions, such as in an automated assembly system. The pneumatic device may comprise a chamber; a sealing element configurable to contact a surface, to enable creating a seal around the chamber by application of pneumatic suction into the chamber; a biasing element configurable to push the sealing element away from the surface; and a pneumatic cushion configurable to expand by application of pneumatic inflow, thus urging the pneumatic device away from the surface.

Abstract: A secondary battery, a jig suitable for fabrication of the secondary battery, and a method for producing a secondary battery constructed with a case accommodating the electrode assembly. The case includes a front portion terminated along opposite edges by a first wing portion and a second wing portion, and a back portion positioned opposite to the front portion, with insulating film bent along a length of a junction between the front portion and each of the first wing portion and the second wing portion, a pair of holes in the insulating film are held in parallel alignment with respect to the length of the junction, with the insulating film adhering to and covering the front portion and a corresponding one of the first wing portion and the second wing portion, in order to prevent leakage of electrolyte, and resulting corrosion of the electrically conducting metal components of the secondary battery.

Abstract: The present invention relates to a semiconductor manufacturing apparatus, and an object of the invention is to prevent breakage and deformation of semiconductor substrates without deteriorating operability in processing. In order to achieve the object, a semiconductor manufacturing apparatus has a stage (100) on which a semiconductor substrate (30) is placed, and the stage (100) has a first metal portion (10) that is made of metal and that comes in contact with the semiconductor substrate (30) placed thereon, and an electroconductive elastic-body portion (20) that is made of an electroconductive elastic body and that comes in contact with the semiconductor substrate (30) placed thereon. A contaminant (40) is embedded in the electroconductive elastic-body portion (20).

Abstract: Methods and apparatuses are disclosed for rinsing the interface area of a liquid and air boundary after a substrate cleaning process using gas barrier. In some embodiments, a protective chuck having an inner gas ring and an outer liquid ring can be used to clean the area under the edge of the protective chuck. A gas flowing outward from the gas ring can enable a liquid to flow outward from the liquid ring, rinsing the outer portion of the protective chuck. The interface rinsing process can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: There is provided a chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.

Abstract: Disclosed is a gripper for use with a disk clamp end effecter in a disk drive manufacturing process used for mounting a disk clamp to a disk in the manufacturing of a disk drive. The gripper comprises: a disk gripper housing, a lip seal gripper mounted to the disk gripper housing, and a vacuum channel. The lip seal gripper includes an upper portion that fits into the disk gripper housing and a lower portion that has a surface. The surface is configured to extend around the disk clamp to press against the disk clamp. The vacuum channel extends from the upper portion of the lip seal gripper to the lower portion of the lip seal gripper to provide a vacuum to the lip seal gripper such that the surface of the lip seal gripper is gripped by the vacuum to the surface of the disk clamp around the disk clamp.

Abstract: A conduit system for conducting activation power to a tool module of a reconfigurable end-effector attachable to a robotic arm includes a fixed conduit portion conforming to a first portion of the reconfigurable end-effector including a master boom and a first portion of a rotatable guide rail. The conduit system includes a translatable conduit portion translatably connected to a second portion of the reconfigurable end-effector including a second lateral portion of the rotatable guide rail and a branch. The conduit system includes a rotatable portion connected between an end of the translatable conduit portion and a workpiece interface tool of the tool module.

Abstract: A protective envelope for a lid of a plastic cup comprises a vacuous plastic film stuck on the top of the lid which was beforehand vaporized by an antiseptic liquid, without alcohol, then dried. The plastic film includes a detachable part, activated by a thread to be pulled, which is positioned above the opening to drink of the lid. So, when a consumer is ready to drink, he removes the detachable part by pulling the thread, so freeing the opening to drink. With such protection the lid is protected from bacteria and virus which can cause diseases. In brief, the steps of conception of the antiseptic lid are: to vaporize the lid with an antiseptic liquid without alcohol, to dry the lid, to put a thin film of plastic onto the lid by positioning the detachable part over the drink opening and to stick the film onto the lid by means of a vacuum.

Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: A main shaft drive includes a supply groove that opens to a friction surface, that extends so as to surround a main shaft within a contact range where the friction surface and a pressing surface oppose each other, and that includes an intersecting groove and a discharge opening. The intersecting groove extends in a direction of intersection with a circumference in which a rotational center of the main shaft is a center. The discharge opening is connected to a location that is outside the contact range. By opening a nozzle hole, used for supplying lubricant, towards the supply groove, as the main shaft rotates, four intersecting grooves move relative to the contact range, so that the lubricant is supplied to the four moved intersecting grooves. Therefore, the lubricant easily reaches a location within the contact range where the friction surface and the pressing surface oppose each other.

Abstract: A workpiece support, which more effectively cools a textured workpiece is disclosed. A layer is added on top of a workpiece support. This layer is sufficiently soft so as to conform to the textured workpiece. Furthermore, the layer has a dielectric constant such that it does not alter the normal operation of the underlying electrostatic clamp. In some embodiments, the locations of the ground and lift pins are moved to further reduce the leakage of backside gas.

Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.

Abstract: A windshield installation device for use by a single technician in replacing a vehicle windshield. The device includes a first assembly attachable to a side window of the vehicle and a second assembly attachable to the windshield to be placed on the vehicle. The second assembly is adapted to couple to the first assembly and pivot with respect to the first assembly.

Abstract: A suction apparatus 1 holds a wafer W by performing vacuum-suctioning on the wafer W. The suction apparatus 1 comprises a suction substrate 2. The suction substrate 2, which is rigid, comprises a plurality of pin-like protrusions 2a formed so that the tip-end faces (upper surfaces) thereof are the same height. An elastic coating layer is coated by way of an undercoat layer 4 on the tip-end faces of the protrusions 2a. When the wafer W is suctioned, even if a foreign matter is interposed between the wafer W and the suction surface, because the foreign matter embeds itself into the coating layer 3, the planarization of the wafer W is improved. In addition, because the coating layer 3 can be made comparatively thinner, undulations in the wafer W can be reduced and, to that end, the planarization of the wafer W in the suctioned state can be improved.

Abstract: Disclosed is a vacuum pick-up end effecter to pick and place a component in a manufacturing process. The vacuum pick-up end effecter may comprise: a vacuum path to provide a vacuum flow to pick-up the component; and a pin moveably mounted within the vacuum pick-up end effecter. When the component is picked-up by the vacuum flow, the pin abuts against the component and is moved to a first position and, when the vacuum flow is cut-off to place the component, the pin moves to a second position and pushes against the component to aid in releasing the component.

Abstract: A non-contact substrate chuck applies to sucking a substrate and comprises a first plate-like element, a second plate-like element paralleled the first plate-like element and a sucking element, wherein through holes of the first plate-like element and the second plate-like element jointly form a channel where the sucking element is accommodated. The chuck lets gas flow through a gas inlet of the sucking element toward the substrate to form a gap between an active surface of the substrate and a first surface of the first plate-like element. At least one side of the substrate is positioned by positioning protrusions of the first plate-like element. A least possible number of supporting points are used and arranged around the sides of the substrate without touching the substrate surface to prevent the substrate surface from being damaged. The present invention also discloses a vertical-type substrate supporting apparatus using the abovementioned chuck.

Abstract: A fixture apparatus for mounting a flat workpiece to a worktable has at least first and second separately positioned vacuum mount elements, wherein each vacuum mount element has a base having a lower contact surface for seating against the worktable and having a clamping surface spaced apart from the lower contact surface. There is a raised portion that extends orthogonal to the lower contact surface and that has an upper contact surface that is parallel to the lower contact surface for positioning against the flat workpiece, wherein a height dimension between the lower and upper contact surfaces is uniform to within +/?0.02 mm. A vacuum chamber hollowed out within the raised portion is in fluid communication with a vacuum port for providing vacuum force through the vacuum chamber to secure the workpiece against the upper contact surface.

Abstract: The invention relates to a negative pressure clamp that includes a bearing plate including a plurality of chambers into each of which gives a suction duct, said working plate being covered with a flexible and formable working plate having suction openings formed therein for drawing a part to be maintained and perforations in which are inserted the lugs of the bearing plate arranged about the chambers.

Abstract: A pressure-loss adjusting-member installation tool having pressure-loss adjusting-member grippers that are configured to freely grip or release a pressure-loss adjusting member which is arranged at a position between a lower nozzle arranged at one end of a fuel assembly having a relatively small pressure-loss when a primary coolant flows and a lower core support plate, and which can cause the primary coolant to pass therethrough in a state with a pressure-loss being increased more than that of when the primary coolant passes through only core support plate flow holes formed on the lower core support plate; and a holding unit that holds the pressure-loss adjusting-member grippers in a same positional relationship as a relative positional relationship between the fuel assemblies arranged in plural on the lower core support plate.

Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Abstract: An ultrasound inspection system includes a part fixture at least partially submerged in a liquid bath. The part fixture includes at least one surface with a plurality of elongated protrusions extending from the surface and a fluid flow ingress aperture in the surface. A part to be inspected is secured on the fixture by circulating the liquid through a channel in the fixture such that the liquid flows around the part and into the ingress aperture. The part engages and is supported by the elongated protrusions, wherein the elongated protrusions are configured such that they do not interfere with the ultrasonic testing performed on the part.

Abstract: A cutting apparatus includes a workpiece supplying member, a positioning mechanism, a transportation robot, and an annular cutting blade. The workpiece supplying member includes a number of slots for receiving a number of plate-shaped workpieces therein. The positioning mechanism includes a number of side surfaces and a number of recesses. The transportation robot is configured for unloading a workpiece from the workpiece supplying member, transporting the workpiece from the workpiece supplying member to the positioning mechanism, and loading the workpiece on the positioning mechanism. The positioning mechanism is rotatable about the central axis such that one of the side faces can be selectively oriented to face the transportation robot so as to load the workpiece transported by the transportation robot in the corresponding recess. The cutting blade is configured for cutting a workpiece loaded on the positioning mechanism.

Abstract: The apparatus comprises holder (20) with a seating face on which a container such as a cupshaped article (1) stands. Air is supplied through channels and air pressure is balanced so as to hold the article (1) against the face. The profile of the apparatus guides a base feature, or “stand” of the article (1) into the holder (20) and onto the seating face (23), and contacts the article (1) radially outside the seating face (23). The apparatus also has a concentric outer sleeve (25) to provide the additional radial contact and resist lateral movement of the article (1) while maintaining concentricity.

Abstract: An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

Abstract: A rotary drum apparatus comprises a drum that is rotatable about an axis of rotation. The apparatus comprises a first set of first shell segments having a first number of first shell segments. Each first shell segment is releasably connectable with the drum and has an outer surface. The outer surfaces of the first shell segments combine to form a continuous first outer circumferential surface defining a maximum radial distance from the axis of rotation. The apparatus comprises a second set of second shell segments having a second number of second shell segments. Each second shell segment is releasably connectable with the drum and has an outer surface. The outer surfaces of the second shell segments combine to form a continuous second outer circumferential surface located within 10% of the maximum radial distance. The first number of first shell segments is greater than the second number of second shell segments.

Abstract: The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.

Abstract: A device for the temporary position fixing of adjacently arranged aircraft structures to be interconnected includes a support frame with at least one vacuum suction cup for temporary surface attachment and with clamping means for the position fixing of the aircraft structures to be interconnected. The support frame with the at least one vacuum suction cup in the region of a transverse gap is attached on the side of one aircraft structure. The support frame includes mechanical contact pressure means for the gap-bridging position fixing of the adjacent other aircraft structure. On the support frame there is a counter support to pressure elements of the contact pressure means.

Abstract: Improved durability and longevity of spin chucks is achieved by using a composite support pin structure in which a pin body of a chemically inert plastic includes a hollow cavity containing an insert formed from a material whose Young's modulus is greater than that of the inert plastic.

Abstract: An apparatus for holding a measurement object, particularly a formed sheet metal component of a vehicle body, in a reference position, comprises at least one carrier which holds the measurement object and has a carrier head that can be placed against the measurement object. The carrier comprises a plurality of carrier heads which can optionally be moved, relative to the rest of the carrier, into contact positions and the carrier heads can be pivoted about an axis.

Abstract: A holding table for holding a platelike workpiece which includes a base and an annular holding member attached to the base. The annular holding member has an annular holding surface for holding the outer circumferential portion of the platelike workpiece thereon. Accordingly, a central recess is defined by the base and the annular holding member so as to be surrounded by the annular holding member. The annular holding member is formed with a suction opening exposed to the annular holding surface, a vacuum line having one end communicating with the suction opening and the other end connected to a vacuum source, a discharge opening exposed to the annular holding surface at a position radially outside of the suction opening, and a fluid line having one end communicating with the discharge opening and the other end connected to a fluid source.

Abstract: The present invention includes a mounting structure for mounting a component between a first member and a second member. According to the mounting structure, the component is first placed on a surface of the first member. Then, the second member is fitted with the component by a fitting device, so that the component is positioned relative to the second member. Thereafter, the component is fixed in position relative to the first member by a joint device.

Abstract: A glass-setting apparatus may include an upper support arm and a lower support arm. The upper support arm may be attachable to a roof of a vehicle and may have a holding mechanism operable to hold a top edge of a sheet of material. The lower support arm may be attachable to a hood of the vehicle and may have one or more notches along a portion of the lower support arm that is operable to receive a bottom edge of the sheet of material.

Abstract: Methods and apparatus are provided for static-biasing a pre-metalized non-conductive substrate within a process chamber. A substrate holder that holds a pre-metalized non-conductive substrate is engaged by a lift mechanism that provides movement of the substrate in a first, upward direction to a contact position within the process chamber and in a second direction to a non-contact position. When the substrate holder is moved to the contact position, the substrate electrically engages a conductive spring-loaded compliance mechanism that is mounted in a fixed position within the process chamber. The spring-loaded compliance mechanism is connected to a bias-voltage feed-through for the process chamber that applies a bias voltage to the substrate via the spring-loaded compliance mechanism.

Abstract: A sputtering bracket includes a curved plate body, a plurality of frames, and a plurality of fastening members. The body defines a plurality of through holes and has an inner concave side. The frames are pivotally connected with the curved plate body and received in the respective through holes. Each frame is rotatable relative to the curved plate body such that either one of opposite sides thereof can be exposed at the inner concave side. The fastening members are mounted on the curved plate body body, and are spring-loaded for resilient engagement with the respective frames.

Abstract: A device forming a clamping pad includes a body (1) presenting a first face (1a) to be secured by suction to a worktable (T) and a second face (1b) to be secured by suction to a workpiece (P). The body (1) contains elements for generating suction, which elements are linked to the first face (1a) to be secured to the worktable (T) and to the second face (1b) to be secured to a workpiece (P). The device is applicable to double-sided clamping of workpieces (P) with a view to treating them or to working on them.

Abstract: This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved.