Abstract: A method for supplying a plurality of capacitance values to a plurality of heating, ventilation, air-conditioning, and refrigeration (HVAC/R) components is provided. The method includes configuring a first set of terminals of a connection device to couple a first capacitor to the connection device and configuring the connection device to couple the first capacitor to at least one of the plurality of HVAC/R components. The method further includes configuring a second set of terminals of the connection device to couple a second capacitor to the connection device and configuring the connection device to selectively couple the second capacitor to at least one of the plurality of HVAC/R components.

Abstract: An aligning device for electronic components and a bonding device using the aligning device. The aligning device includes a chamber, a flexible bellows within the chamber, two block used to hold an electronic component, a driving unit configured to move either of the two blocks relative to each other and located in an airtight chamber and an image port having a window through which one of the electronic components can be observed.

Abstract: Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame.

Abstract: The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.

Abstract: In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.

Abstract: An assembly tool is provided. The assembly tool comprises a body, a first vacuum channel defined within the body, and a first locating pin attached to the body. The first locating pin has a shaft portion arranged within a surrounding portion of the body. The first locating pin is configured to engage a first alignment feature of a hard drive component at a first contact area to align the hard drive component with the assembly tool. The body is configured to couple the first vacuum channel to a vacuum source and to facilitate particle evacuation from the first contact area via the first vacuum channel when a vacuum is applied by the vacuum source.

Abstract: An installation (1) for continuous application of thermally or electrically insulating material (6) around an elongate element (2) having a generally circular cross-section. The installation includes a forcing device (3), in form of a conical tube into which the element (2) is fed simultaneously at the large base end of the conical tube, a sheet (4), on which the insulating material (6) is placed, means for translation of the element through a circular section (2) of the sheet (4), and a device (7) for depositing of insulating material onto the sheet. Such an installation produces thermally insulated tubes or electrically insulated cables.

Abstract: A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.

Abstract: A mounting apparatus includes a bottom panel, a first mounting member, and a second mounting member. The bottom panel includes a top surface and a bottom surface. The first mounting member includes a positioning portion and an installation portion. A concave portion is defined in the bottom surface, for receiving and preventing the positioning portion from rotating relative to the bottom panel. The bottom panel defines a through hole, for an installation portion. The second mounting member includes a locking portion. The locking portion defines an installation hole, for locking the installation portion. The bottom panel top surface t is between locking portion and positioning portion. The positioning portion bottom surface place in the same plane with the bottom panel bottom surface or is between the bottom panel top surface and the bottom panel bottom surface.

Abstract: Closely spaced, high aspect-ratio gridline structures are formed on the surface of a substrate using two or more co-extrusion heads that co-extrude gridline material and sacrificial material such that the deposited gridline material is compressed between opposing portions of the sacrificial material. The co-extrusion heads include three-channel cavity structures that converge to a relatively small outlet orifice that dispenses the gridline material with relatively fine features and a relatively high aspect ratio. The outlet orifices of the co-extrusion heads are disposed in a staggered arrangement such that gridlines extruded from the first co-extrusion head are disposed between two gridlines extruded from the second co-extrusion head. Photovoltaic cells are produced with metal gridlines formed in this manner.

Abstract: A method of manufacturing an electrophoretic device includes: forming a partition wall on a one substrate with a predetermined pattern; forming an adhesive layer on the partition wall; filling each region as a cell, which has been partitioned by the partition wall, with a display medium, after having formed the adhesive layer; and adhering the other substrate onto the adhesive layer on the partition wall so as to enclose the display medium. The forming of the adhesive layer is performed, with the use of a transfer film with a heat sealing agent formed thereon, by heat-transferring the heat sealing agent. The adhering of the other substrate includes heating the heat sealing agent for again softening the heat sealing agent, which has been transferred as the adhesive layer, so as to obtain an adhesive force.

Abstract: A handheld tool device to facilitate maintenance and installation of hollow through-hole audio input jacks on electrical guitars and other electronic musical devices. The tool has an expandable tip that can be placed inside the hollow opening of the through-hole audio input jack, and then be expanded by the operator. The device enables the operator to hold the audio input jack in a fixed position while a nut or other jack fastening device is tightened. Other applications for the device include stabilizing a large variety of different through-hole connectors, embedded in a wide variety of different surfaces.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: An apparatus for manufacturing wireless communication devices for use in tracking or identifying other items uses cutting techniques that allow the size of an antenna for the wireless communication device to vary. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: The disclosure is related to a method and a device of manufacturing a speaker. First, a roll element is fabricated by a roll-based manufacturing process and by using a material feeder, and the roll element is cut into many sheet elements by using a cutter. An inserting device is used to insert the sheet elements into a temporary storage device, and an extracting device is used to extract the sheet elements from the temporary storage device and place the sheet elements on another roll element fabricated by another roll-based manufacturing process and by using another material feeder. The sheet elements and the other roll element are combined. The roll elements and sheet elements may be vibrating membranes and porous electrodes of a flat speaker.

Abstract: A mounting system including: a storage that stores plural formats for each substrate including divisional information of a mounting apparatus indicating which of plural mounting apparatuses that divisionally mount plural electronic components on a substrate mounts what electronic component on the substrate and information on a deviation amount of an electronic component indicating how much each of the electronic components mounted on the substrate and inspected by an inspection apparatus is deviated from its regular position; and a controller that changes, according to a change of an assignment of mounting, the divisional information in a format corresponding to the substrate for which the assignment has been changed, and controls the mounting apparatus that has mounted the electronic component and has been specified from the mounting apparatuses to mount the electronic component on the substrate after correcting a deviation amount based on the information on a deviation amount.

Abstract: The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is configured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly.

Abstract: An electronic device includes a device unit including a rotation mechanism, a bracket on which the device unit is mounted, a chassis including an arrangement area onto which the bracket is installed, plural vibration absorbing members provided in the arrangement area, and first and second support panels having the arrangement area provided therebetween. A first engagement mechanism is provided between the first support panel and the bracket, and a second engagement mechanism is provided between the second support panel. The first and the second engagement mechanisms are configured to engage the chassis and the bracket by compressing the plural vibration absorbing members between the chassis and the bracket.

Abstract: A mounting component includes a fixed frame to be fixed to a board and a sliding frame. The fixed frame includes first and second fixed side plates having through holes formed in positions corresponding to engaging holes of an electronic component, and first and second fixed arms connecting the first and second fixed side plates. The sliding frame includes first and second sliding side plates including engaging pins to be inserted via the through holes into the engaging holes of the electronic component, first and second sliding arms extending from the front and back ends of the first sliding side plate, and third and fourth sliding arms extending from the front and back ends of the second sliding side plate. The first, second, third, and fourth sliding arms are configured to slide the first and second sliding plates away from the first and second fixed side plates.

Abstract: A mounting method for a circuit board. The circuit board is formed with pilot holes that are placed onto pilot pins of a tool such that the pilot pins protrude through and beyond the circuit board. Then the tool is displaced toward a circuit board holder of the housing whereupon the pilot pins engage with a form fit in corresponding centering holes of the circuit board holder. After fixing the circuit board in the housing, the tool is withdrawn by detaching the pilot pins from the pilot holes, the circuit board remaining in the circuit board holder. The tool has an upper plate with associated pilot pins and a lower plate with a housing holder for positioning the housing. The circuit board, with the pilot pins engaging the pilot holes, is displaced by moving the upper plate toward the lower plate.

Abstract: The disclosure describes installing an antenna canister in a portion of a concealed antenna pole at a location that is below a top of the pole while the antenna pole is erect and associated components to facilitate the procedure, as well as multi-piece vertical rods, pole mounting bracket assemblies and retrofit kits,

Abstract: A pick-up jig is adapted to be dismountably mounted to an electronic component which has two buckling blocks. The pick-up jig includes a pick-up board and two buckling arms. The pick-up board is against a top of the electronic component. The pick-up board has a flat top surface for the convenience of the pick-up jig being picked up by a SMT machine. The two buckling arms perpendicularly extend downward from two opposite ends of a bottom surface of the pick-up board. An inside of each of the buckling arms protrude inward to form two blocking pillars spaced from each other to define a fastening groove therebetween. A buckling hook is protruded at a bottom of the buckling arm. The buckling blocks slide over the corresponding buckling hooks to be buckled in the corresponding fastening grooves and the buckling hook grappling a bottom of the corresponding buckling block.

Abstract: Method for applying an electrical contact to a hole (2) of a metal wall portion (1), comprising the steps of providing a bush (12), a punch (11) with a shaft (16), an expansion portion (19) and a connecting portion (20) thereof, a pulling device (21) with an abutment portion (22) and a pulling mechanism (23) for engaging the punch (11) and to pulling it proximally with respect to the abutment portion (22), inserting the punch (11) in a passage hole (25) of the bush (12) so that the connecting portion (20) protrudes proximally from the bush and the expansion portion (19) is located on end (14), bush connecting the punch (11) to the pulling device (21), inserting the preassembled bush (12)-punch (11)-unit from a proximal side of the wall portion (1) distally in the hole (2) and activating the pulling device (21) to pull the punch (11) proximally through the bush, thereby radially expanding bush and permanently anchoring it in the hole (2).

Abstract: Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.

Abstract: An apparatus for applying solder to semiconductor chips is provided that employs a plurality of apertured decals to define areas for engaging solder on a semiconductor chip. Each of the plurality of decals includes an upper, center and bottom layer having apertures present therethrough. The apparatus fills the apertures with solder. The upper and bottom layers of the apertured decals are removed to provide solder portions projecting from the center layer. The apparatus provides a station for applying an adhesive layer to the exposed surfaces of the center layer having the solder portions projecting therefrom. The apparatus includes a station for contacting the solder and adhesive to the semiconductor chip. The apparatus also includes a separating structure for detaching the portion of the center layer that is in contacting to the semiconductor chip through the solder.

Abstract: A battery replacing apparatus includes a battery mount portion, vehicle hoist members, and a lifting-lowering means for lifting and lowering the battery mount portion. When attaching a battery unit to or detaching a battery unit from the battery support portion of an electric vehicle, the vehicle hoist members are moved together with the battery mount portion to be brought into contact with the vehicle body. The vehicle hoist members are formed like rods extending in the front-rear direction of the vehicle. The vehicle hoist members are arranged on the left and right sides of the battery unit placed on the battery mount portion. The battery unit is attached to the battery support portion of the vehicle or detached from the battery support portion from below.

Abstract: A packaging structure for assembling to a printed circuit board (PCB) comprises a captive screw having a screw head, a threaded shank and a sleeve; and a fixture pressing against the screw head for a part of the threaded shank to expose from a distal end of the sleeve, and clamping the fixture on the sleeve.

Abstract: Disclosed is a stator which can be made compact and can produce high output, and also disclosed is a method for manufacturing the stator. A stator comprises a split stator core provided with teeth portions and slots, and a double coil formed of a flat type conductor, wherein the split stator core has a first block of six slots of U, V and W phases and a second adjoining block, the flat type conductor in the first slot of U phase forms a first loop coil together with the flat type conductor in the second slot of U phase, the flat type conductor in the second slot of U phase forms a second loop coil together with the flat type conductor in the first slot of U phase, and the second loop coil is arranged on the inner circumference of the first loop coil.

Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.

Abstract: A multi-functional assembly device includes a fixed barrel, a number of supporting boards, a rotatable barrel, and a driving device for rotating the rotatable barrel. The fixed barrel includes a number of sidewalls and defines a chamber surrounded by the sidewalls. The supporting boards are configured for holding the lens modules and are able to be secured on the inner surfaces of the sidewalls. The rotatable barrel includes a main body, a number of carrying devices, a number of glue dispensers, and a number of glue solidifying devices. The main body includes a first side surface, a second side surface, and a third side surface facing the inner surfaces of the sidewalls. The carrying devices, the glue dispensers, and the glue solidifying devices are installed on the first side surface, the second side surface, and the third side surface respectively.

Abstract: A novel method and apparatus for performing the method is disclosed the apparatus comprises a laser (17), at least one ink jet print head (14), means for holding a transparent substrate having a transparent conductive layer, means (22) for adjusting the relative positions of the laser and at least one ink jet print head to the transparent conducting layer (2) and a controller to control the laser and ink jet print head whereby in a first step to inkjet print one or more coarse metal borders (15) onto the deposited TCM layer and in a second step by means of a single laser ablation process, ablating tracks in both the metal border and underlying TCM layer to form a plurality of discrete electrical busbars (12) and optionally also to form electrodes in the remainder of the TCM layer.

Abstract: A probe insertion auxiliary and a method of probe insertion are provided. A light source illuminates holes on a lower die to make the position of the holes clear for an operator. The probe insertion auxiliary includes a bottom and a clamp pair disposed on the bottom. The clamp pair has two clamp parts. The two clamp parts define a slit for disposing a probe chassis. Furthermore, the two clamp parts and the bottom form a space. A light source is disposed inside the space for illuminating the holes.

Abstract: A method of operation of a programmer actuator system includes: placing a programming assembly, having socket boxes, in the programming actuator system; and clamping the programming assembly in the programming actuator system using a pivoting arm bracket.

Abstract: Implementations of the present invention comprise systems, methods, and apparatus for distributing electric power to a plurality of access points within a plurality of spaces. In particular, implementations of the present invention allow for the distribution of electric power from a centralized panel manager, to one or more access points without the use of zone boxes. For example, a panel manager for distributing electric power in accordance with an implementation of the present invention can include a housing configured to allow at least one main input therein. The panel manager can also include a plurality of planar connection interfaces secured within the housing. The planar connection interface can be configured to mate with planar electrical connectors for the distribution of electric power to the plurality of access points.

Abstract: Methods and systems for altering the electrical resistance of a wiring path. The electrical resistance of the wiring path is compared with a target electrical resistance value. If the electrical resistance of the wiring path exceeds the target electrical resistance value, an electrical current is selectively applied to the wiring path to physically alter a portion of the wiring path. The current may be selected to alter the wiring path such that the electrical resistance drops to a value less than or equal to the target electrical resistance value.

Abstract: A system for performing bonding of a first substrate including a first plurality of solder pads to a second substrate including a second plurality of solder pads comprises a first alignment mark set and a first plurality of dots on the first substrate. The system further comprises a second alignment mark set and a second plurality of dots on the second substrate. The second plurality of dots are configured to interlock and form an interlocking key with the first plurality of dots. The first alignment mark set is aligned with the second alignment mark set corresponding to the first and second plurality of dots being aligned and the first and second plurality of solder pads being aligned. The first and second plurality of dots are configured to remain substantially solid during a reflow of the first plurality of solder pads.

Abstract: There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip.

Abstract: Apparatus (1) for manufacturing solar cell matrices includes several stringers (2) for forming strings from solar cells, a lay-up and interconnection station (5) for arranging and interconnecting the strings to form a solar cell matrix, and a transportation system (3) for transferring the strings from the stringers (2) to the lay-up and interconnection station (5), wherein the stringers (2) are arranged perpendicular to the direction of flow of the transportation system (3), or in an acute angle to an axis perpendicular to the direction of flow of the transportation system (3). Furthermore, a process for operating such apparatus (1), wherein the several stringers (2) are controlled such that collision between different strings is avoided in the transportation system (3).

Abstract: A rework soldering jig is used for heating a surface mounted slot. The rework soldering jig includes a body and an assembly frame. The assembly frame is detachably disposed on the body. The body and the assembly frame together wrap the surface mounted slot. Since the rework soldering jig has the detachable assembly frame, a size thereof can be adjusted according to different forms of slots.

Abstract: A stable wire can be formed continuously over a long period. In a wire forming device supplying a paste material on an insulating substrate by a paste material attaching unit to form a wiring pattern, the paste material attaching unit includes: an atomizing unit atomizing the paste material; and a nozzle spraying the paste material atomized in the atomizing unit on the insulating substrate, and the atomizing unit includes: a medium supplying portion mixing a gas obtained by atomizing a medium with a carrier gas and supplying a mixed gas to an atomizing portion; the atomizing portion atomizing a paste solvent, taking it into the mixed gas from the medium supplying portion, and making a mist stream; and a mixing ratio adjusting unit adjusting a mixing ratio of the mist stream.

Abstract: Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device.

Abstract: A component placement machine that includes a movable housing that is adapted for movement in an X and a Y axis above a printed circuit board. The housing includes a rotatable frame having at least one pick and place head configured to pick up a component and place the component on the printed circuit board. The housing further includes a fluid application station configured to apply fluid to the component after being picked up by the pick and place head and before being placed on the printed circuit board.

Abstract: An object of the present invention is a device for assembling the components of a panel antenna that comprises at least one volumic radiating element comprising a base atop which is mounted a radiating plane, and at least one component of the antenna's mechanical structure. The device comprises a dielectric member comprising a central area comprising a first fastening means cooperating with the radiating component, lateral areas comprising second fastening means cooperating with longitudinal edges of the antenna's mechanical structure, and an intermediate area comprising a third means of flexible linking between the first and the second fastening means.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: A method includes forming a slot in a sheet through a conductive layer thereof, the slot having width in a first direction between first and second edges and length in a second, transverse direction between first and second ends, providing a non-conductive layer on the sheet, the non-conductive layer having at least one window including a first window with length greater than the slot length and width less than the slot width, the first window positioned with respect to the slot such that edges of the first window are inside the edges of the slot and ends of the first window are outside the ends of the slot, placing a component on the conductive layer within the first window so as to bridge the slot and cutting through the sheet and the non-conductive layer along first and second lines outside sides of the component and within the edges the slot.

Abstract: A bracket and junction box assembly and method allows simplified wiring at a prefab production facility and at a construction site. A junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads attached to the switch or outlet, at a prefab facility. A Metal Clad (MC) cable may be attached to the junction box and wires carried in the MC Cable may be connected to the leads. A mounting bracket is generally sandwiched between the junction box and the plaster ring for mounting to framing members at the construction site. Following assembly at the prefab facility, the prefab junction box is shipped to the construction site where the bracket and junction box assembly is mounted to framing members. Connections to wires carried by MC Cables are then facilitated by removing the rear cover plate to access the interior of the junction box.

Abstract: A method, and apparatus, wherein an effect of establishing electrodes in a region of a liquid is achieved by providing a core of magnetically-conductive material around a lateral wall containing the region of the liquid, the core of magnetically conductive material passing through a primary coil energised by an electrical signal, and wherein respective parts of the region of the liquid on opposite sides of the magnetically conductive core are connected by a passage containing the liquid, the passage and liquid affording a selected electrical resistance.

Abstract: A backlight module assembling apparatus for attaching a reflector plate to a driving circuit board is disclosed. The backlight module assembling apparatus includes an assembling portion and a pressing movably connected to the assembling portion. The assembling portion defines a receiving space configured for receiving and positioning a driving circuit board therein. The assembling portion includes a top plate and a first opening defined in the top plate. The first opening communicates with the receiving space. The assembling portion includes a number of blades arranged around the first opening for cutting a reflector plate. The pressing portion includes a pressing plate. The pressing plate is movable toward and away from the blade and configured for pressing the reflector plate against the blades thus allowing the blades cutting the reflector plate to a shape conforming to the first opening and attaching the reflector plate to the driving circuit board.

Abstract: A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole, for impeding fluid flow between adjacent conductive tracks. The method may further comprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either side of the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.