Abstract: An embodiment includes a transparent sash mounted integral to the perforated doors on racks which hold computer servers typically installed in data centers. The racks are arrayed in rows forming cold aisles and hot aisles. Cooled air introduced into the cold aisle flows through the racks and cools the servers, and subsequently is removed from the hot aisle. Embodiment sashes slide vertically and extend above the tops of the racks and form a sealing relationship with the data center ceiling and adjacent sashes, thereby preventing wasteful mixing and recirculation of cooled and heated air over the tops of the racks. Embodiments are raised and lowered manually or automatically. The controls for the movement of the sashes are tied to the building automation and fire alarm systems and the sashes are lowered automatically upon activation of the data center fire suppression system, thereby complying with code requirements and avoiding interference with the fire sprinkler and suppression systems.

Abstract: A cooling system for a mobile computing device configured to drive two devices, a fan and an alert device. The fan cools components of the mobile computing device by exchanging air between an inner cavity of the mobile computing device and an outer environment surrounding the mobile computing device. The alert device produces an alert, e.g., a vibration, for the mobile computing device. The cooling system includes a motor operably connected to a first device (either the fan or the alert device) and operably connected via a clutch to a second device (either the fan or the alert device). The clutch allows the second device to be selectively activated depending on a speed or rotational direction of a drive shaft of the motor.

Abstract: An improved computer cooling apparatus includes: at least one evaporator installed on a surface of at least one heat generating source which is a central processing unit in a computer system unit; a compressor, connected to the evaporator; a condenser, connected to the compressor; an expansion valve, connected between the condenser and the evaporator; a fan, installed on a side of the condenser; and a coolant, circulating among the evaporator, the compressor, the condenser and the expansion valve. The evaporator, compressor, condenser, fan, expansion valve and coolant are used for achieving the effect of quickly dispersing a heat generating source in the computer system unit.

Abstract: A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

Abstract: An exemplary server system includes a server cabinet, racks arranged in the server cabinet, servers mounted on the racks, and a heat dissipation device. The heat dissipation device includes a heat exchanger arranged over the racks, a first fan module arranged under the racks for drawing cooling air from the heat exchanger to the servers to exchange heat, and a second fan module including drawing fans respectively arranged on the racks for drawing up heated air from the servers to the heat exchanger.

Abstract: A fixing device for fixing a first element to a second element is provided. The fixing device includes a main body including at least one leg, at least one biasing member movably mounted on the at least one leg for generating a compressive force. At least one hook member rotatably connected to an end of the at least one leg, cooperating with the biasing member to fix the first element to the second element. A heat sink assembly using the fixing device are also provided.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A computer system includes a chassis, a motherboard, a backplane, riser cards, and disk drives. The chassis includes a bottom wall. The motherboard is secured to and parallel to the bottom wall. The backplane is secured to the bottom wall, and electrically connected to and parallel to the motherboard. The riser cards are electrically and perpendicularly connected to the backplane. The disk drives are electrically connected to the riser cards.

Abstract: An electrical connector assembly electrically connecting a CPU and a printed circuit board includes an electrical connector mounted on the printed circuit board, and a heat dissipating device mounted upon the CPU. The heat dissipating device includes a load plate, a heat pipe, and a heat plate. The load plate is mounted upon the CPU under condition that heat generated from the CPU is absorbed by the heat pipe and the heat plate. The load plate is sandwiched between the heat plate and the heat pipe. The load plate has two clips each of which has two cantilever arms extending toward and engaging with the other clip.

Abstract: A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber.

Abstract: A power supply device includes a transformer and a heat-dissipating mechanism. The heat-dissipating mechanism includes a heat-dissipating fan unit and an activating unit. The heat-dissipating fan unit is connected pivotally to the transformer, and is pivotable relative to the transformer to lie on a top surface of the transformer. An inclination angle of the heat-dissipating fan unit relative to the top surface of the transformer is adjustable. The activating unit includes a control switch for controlling activation of the heat-dissipating fan unit.

Abstract: A storage unit includes: a storage section containing an information processing apparatus; an intake section allowing intake of a cooling medium into the information processing apparatus for cooling the information processing apparatus; a discharge section receiving the cooling medium discharged from the information processing apparatus; a cooling medium flow generating section configured to control intake and discharge of the cooling medium; a partition section isolating the intake section and the discharge section from each other; an aperture formed in the partition section; a detector section configured to detect an inflow of the cooling medium, discharged from the discharge section, through the aperture; and a controller section configured to control the cooling medium flow generating section in accordance with a result of the detection of the detector section.

Abstract: The present invention relates to a method of processing analyte using a portable incubator apparatus. The incubator apparatus 10 has a plurality of cavities 20 each configured to receive analyte to be incubated. The method comprises: receiving analyte in each of the plurality of cavities; incubating the analyte in the plurality of cavities, the incubator apparatus being operable to control temperatures of analyte contained in the plurality of cavities independently of each other; and moving the incubator apparatus from a first location to a second location while the analyte is being incubated, the incubator apparatus being configured to maintain desired incubation conditions independently of a supply of electrical power and apparatus external to the incubator apparatus as the incubator apparatus is being moved.

Abstract: A cooling system for computer systems is disclosed. In one aspect, a method includes providing a flow of liquid coolant through conduits positioned within a server system, and spraying the liquid coolant via at least one outlet mechanism of each of the conduits. The outlet mechanisms are adapted to be placed in close proximity to a corresponding target component of one of the servers, to cool the target component.

Abstract: Individually cooling one or more computers in a rack of computers in a data center including an air intake chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center and a plurality of openings at a top end for providing air into a plurality of flexible air channels; and a plurality of flexible air channels, each air channel having a first end opening into the air intake chamber and having an opening at a second end and having a connector to connect the second end of the flexible air chamber to a particular position in the rack corresponding to the location of a particular computer in the rack.

Abstract: A display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a ventilation part defined outside the accommodation room and leading to outside of the housing, a display panel arranged inside the accommodation room and including a display screen viewable from a front surface side of the housing, and one or a plurality of heat pipes arranged on a rear surface side of the display panel. The heat pipe passes through a side surface wall forming the accommodation room and extends from inside of the accommodation room to inside of the ventilation part.

Abstract: A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly is connected to the liquid tank. When pressed against the clip assembly by a user, the liquid tank is fastened by the clip assembly and thus retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. An electronic device using the liquid cooling system is also provided.

Abstract: According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposite to the first surface; an opening; and a plurality of pads provided around the opening at the first surface to be electrically connected with the connection terminals, respectively; a heat receiving member that has a heat receiving portion faced to the heating element and that is thermally connected to the heating element; a pressing member that presses the heat receiving member toward the first circuit board; and a support member that supports the first circuit board at a periphery of the opening from the second surface.

Abstract: An electronic device module includes an electronic device, a rack accommodating the electronic device, and a shield adjusting assembly. The rack defines a number of ventilation holes, and the shield adjusting assembly defines a number of through holes. The electronic device is placed in the rack to drive the shield adjusting assembly to a first position in which the through holes align with the ventilation holes. When the electronic device is detached from the rack, the shield adjusting assembly is restored by a resilient element to a second position in which the through holes offset the ventilation holes such that the ventilation holes are shielded.

Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

Abstract: An information handling system tray component is selected for a depth to fit into chassis support components to provide processing resources in a space having different depths. An end user selects a chassis component having a depth that fits a data center and then installs tray components into the chassis component by selecting the tray component depths to fit in that of the chassis component. The tray component supports different processing components depending upon the selected depth so that information handling system features are adapted to chassis depth while using a common infrastructure component.

Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: A LCD device includes color LEDs, a light-mixing optical guide plate and a main optical guide plate for guiding lights from the color LEDs, a LCD panel for receiving lights from the main optical guide plate, a housing for supporting the LCD panel, light-mixing optical guide plate and main optical guide plate in block, and a heat sink for dissipating the heat transferred from the LEDs. On the rear surface side of the light-mixing optical guide plate, a heat receiving member is provided having a higher heat receiving capability than the rest of the housing.

Abstract: The distributed data handling and processing resources system of the present invention includes a) a number of data handling and processing resource nodes that collectively perform a desired data handling and processing function, each data handling and processing resource node for providing a data handling/processing subfunction; and, b) a low latency, shared bandwidth databus for interconnecting the data handling and processing resource nodes. In the least, among the data handling and processing resource nodes, is a processing unit (PU) node for providing a control and data handling/processing subfunction; and, an input/output (I/O) node for providing a data handling/processing subfunction for data collection/distribution to an external environment. The present invention preferably uses the IEEE-1394b databus due to its unique and specialized low latency, shared bandwidth characteristics.

Abstract: A keyboard adjusting heat dissipation efficiency of a heat dissipation unit disposed in a host device and including a switching unit, a control unit, and a communication port is disclosed. The switching unit is switched to different states. The control unit generates a control signal according to the state of the switching unit. The communication port transmits the control signal to the host device. The host device adjusts the heat dissipation efficiency of the heat dissipation unit according to the control signal.

Abstract: An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.

Abstract: A storage module for computer systems includes a housing defining an opening, a power supply unit and an air cooling unit, a storage unit detachably received in the housing through the opening, a bracket for mounting the storage unit, and a magnetic member. The bracket includes a tray plate defining a plurality of heat dissipation holes, a first side plate, an opposite second side plate, a stop plate including a first end detachably coupled to the second side plate and a second end pivotally connected to the first side plate, and a resilient member resiliently biasing the stop plate away from the first side plate. The storage unit is moveably and insertably positioned between the first and the second side plates. The magnetic member is positioned in one of the second side plate and the stop plate such that the second side plate and the stop plate are magnetically attracted.

Abstract: In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.

Abstract: A container data center includes a movable container, two server systems having a cold aisle and two hot aisles, two fan apparatuses, an exchanger, and an air intake apparatus. The air intake apparatus includes a number of air intake elements each defining an air channel. The fan apparatuses are operable to transfer hot airflow in the hot aisles into the heat exchanger, and then the heat exchanger transforms the hot airflow into cold airflow and transfers the cold airflow into the cold aisle through the air intake apparatus. The air intake elements are connected together and cover the cold aisle. The air intake elements of the air intake apparatus are arranged in a “V” shape along an orientation toward the airflow of the cold aisle.

Abstract: A display apparatus has a display panel, a circuit unit which controls the display panel, a first chamber which accommodates the display panel, a second chamber which arranged behind the first chamber, the second chamber accommodates the circuit unit, a cooling device which cools the display panel, and a ventilating part which ventilates between the first and the second chamber. The air emitted from the cooling device is led to the back side of the display panel via the front side thereof, and then ventilates the ventilating part.

Abstract: Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

Abstract: A DC to AC inverter used in a solar cell power system can include an improved control scheme for cooling itself and optimizing power output.

Abstract: A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. The fins form an enclosure for the computer systems to protect the at least one computer system from environmental conditions. The system can operate in an outdoor environment.

Abstract: Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: An electronic device is provided, including a processing unit and a G-sensor electrically connected thereto. The G-sensor detects the posture of the electronic device and outputs a measurement signal to the processing unit accordingly. The processing unit produces a thermal control signal according to the measurement signal, so as to reduce heat generated from the electronic device or increase cooling efficiency of the electronic device.

Abstract: A computer system is disclosed having an enclosure having a plurality of components. The computer system further includes a first chamber including a first set of cooling devices; and a second chamber including solely a set of components and a second set of cooling devices. The second chamber is located adjacent to the first chamber, and the set of components includes components not included in the first chamber. The set of components includes solely a plurality of storage components selected from the group consisting of a CD-ROM and a hard drive. Air flow is unidirectional from a front side of the enclosure to a rear side of the enclosure. Further, air flow is prevented from flowing between the first chamber and the second chamber by a solid separation mechanism there between. The first chamber has an air flow path independent of the air flow path of the second chamber.

Abstract: An electronic device housing includes a housing body, a movable foot pad mechanism disposed in housing body, a ventilation grille, a fan, and a fan switch connected electrically to the fan. The movable foot pad mechanism includes a foot pad pivoted to a bottom wall of the housing body. The foot pad is turnable pivotally to prop up the housing body so as to increase a space below a bottom of housing body. When the foot pad is being turned pivotally to prop up the housing body, the ventilation grille is moved simultaneously so as to make the space inside the housing body open to the ambient environment, and the fan is activated for heat dissipation, thereby increasing the heat dissipation efficiency of the electronic device housing.

Abstract: A computer-implemented method for sequential placement of cooling resources in a data center comprises: defining a weighted, higher-order cooling metric, , representing an overall performance of the cooling resources in the data center; enumerating all possible locations in the data center for placing an additional c cooling resources; and placing the c cooling resources in locations in the data center for which is closest to an optimum value. For a performance metric Mi, the weighted, higher-order cooling performance metric can be defined as M ^ = ? k = 0 C - 1 ? ? i = 1 R ? a ? ( i , k ) ? M i ( k ) , where R represents a number of racks in the data center, C represents a total number of cooling resources placed in the data center, i represents one of the R racks in the data center, Mi(k) represents a value of metric Mi when k cooling resources are shut down, and a(i,k) is a weighting function for rack i with the k cooling resources shut down.

Abstract: An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board.

Abstract: An exemplary embodiment of the present invention provides a silencer. The silencer includes an enclosure with a first airflow path configured to allow air to pass through the enclosure and attenuate noise entering the enclosure. The enclosure also includes an opening configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

Abstract: Embodiments of the invention are directed towards passive cooling systems for handheld mobile computing devices. An electro-hydrodynamic air mover (EAM) may be included in a handheld mobile computing device, the EAM to include an inlet and an outlet. The inlet and outlet are each included in at least one surface side of the handheld mobile computing device. In embodiments of the invention the EAM produces an airflow by accelerating charged particles surrounding an electrode near the inlet towards an second electrode near the outlet in response to an electric field applied to the electrodes. The airflow will result from air drawn into the inlet of the EAM (i.e., air external to the computing device) and air expelled from the outlet of the EAM (i.e., air expelled away from the computing device).

Abstract: An exemplary server rack includes a box adapted for receiving a plurality of servers therein, a plurality of pivoting members pivotally connected to the box; and a plurality of covers fixed to the pivoting members respectively. The box includes a front board and a back board opposite to the front board. The front board and the back board both define a plurality of though holes adapted for airflow to pass therethrough. Each cover is operable to pivot relative to the box via the corresponding pivoting member, and thereby cover some of the through holes of the front board of the box.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Abstract: According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility.

Abstract: A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

Abstract: A server cabinet for receiving a number of servers includes a top plate, a bottom plate, a left side plate, a right side plate, a front side plate, and a rear side plate cooperatively defining a receiving space for receiving the servers. The server cabinet defines a first channel and a second channel in the receiving space. The top plate defines an inlet port communicating with the first channel, and an outlet port communicating with the second channel. Cold air blows from the inlet port into the first channel of the server cabinet, flows through the servers and to the second channel, and flows out from the outlet port for dissipating heat generated by the servers.

Abstract: Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.