Abstract: In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate, a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls, and a third plurality of holes. A backing plate may include a plurality of heat dissipater mounting posts and a fourth plurality of holes. A plurality of second fasteners may each be mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Abstract: The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.

Abstract: A lighting guide is disclosed for a lighting apparatus, which comprises an elongate and substantially transparent member having opposed ends. A longitudinal portion of an outer surface of the member is linearly recessed symmetrically about a transversal main axis of the member. A transversal distance of the recessed portion relative to a longitudinal portion of the outer surface opposed to the recessed portion increases progressively in either direction away from the transversal main axis of the member. A lighting apparatus is also disclosed, which comprises the lighting guide and two light sources located adjacent respective and opposed ends of the member.

Abstract: Embodiments of an apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one heat-generating device disposed on the substrate. The phase-change material is in direct contact with each heat-generating device of the at least one heat-generating device to absorb and dissipate heat generated by the at least one heat-generating device.

Abstract: A system includes a battery module having a heat sink outer wall feature and a plurality of battery cells. The battery module also includes a plurality of internal heat fins interleaved with the plurality of battery cells, wherein each of the plurality of internal heat fins is in thermal communication with at least one of the plurality of battery cells and in thermal communication with the heat sink outer wall feature. The battery module further includes a plurality of phase change material (PCM) layers interleaved with the plurality of battery cells, wherein each of the plurality of PCM layers is configured to be in thermal communication with at least one of the plurality of battery cells and in thermal communication with at least one of the plurality of internal heat fins.

Abstract: A thermoelectric module includes an insulating substrate, plural electrodes formed on a component side of the insulating substrate, plural peltier elements each mounted on and electrically connected to the electrodes, and a mark for image recognition formed at least one of the electrodes, the mark for image recognition having lightness and/or saturation which is different from lightness and/or saturation of the electrode on an image. An entire of the electrode is usable as an electrical conduction path.

Abstract: New heat spreaders are proposed to connect high power, high heat generating electronic devices to their downstream heat dissipating cooling components. First, the spreaders distribute the high heat flux over a wider surface area, thus reducing the flux to levels more easily handled by the downstream cooling system. Second, the spreaders incorporate flexible columns or elements to join the electronic devices to the main body of the spreader, so as to negate the undesirable effects of CTE mismatch. Columns with a higher standoff distance between the components are more flexible than a direct flat interface attachment between the heat source and the heat sink, and will have less chance of delaminating. Several embodiments are proposed and can be used in appropriate situations. The heat spreaders can be helpful in harsh environments and in high heat generating applications, such as spacecraft, satellites, as well as land locked high power computer systems.

Abstract: A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.

Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.

Abstract: A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost.

Abstract: Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications.

Abstract: Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.

Abstract: Thermal rectifiers using linear nanostructures as core thermal conductors have been fabricated. A high mass density material is added preferentially to one end of the nanostructures to produce an axially non-uniform mass distribution. The resulting nanoscale system conducts heat asymmetrically with greatest heat flow in the direction of decreasing mass density. Thermal rectification has been demonstrated for linear nanostructures that are electrical insulators, such as boron nitride nanotubes, and for nanostructures that are conductive, such as carbon nanotubes.

Abstract: A lighting device may include: a rod-shaped carrier body with at least one first and one second mounting side and a main direction of extent, first semiconductor light-emitting elements on first mounting faces of the first mounting side, and second semiconductor light-emitting elements on second mounting faces of the second mounting side, wherein the first and the second mounting sides face away from one another, wherein the mounting faces are formed by depressions in the mounting sides, which depressions are arranged so as to be spaced apart along the main direction of extent, and wherein the first semiconductor light-emitting elements are identical to one another and the second semiconductor light-emitting elements are identical to one another.

Abstract: Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.

Abstract: An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.

Abstract: A fixture for securing at least one test printed circuit board assembly (PCBA) including a PCB having semiconductor devices mounted thereon during vibration or mechanical shock testing. A top plate includes top features including a continuous top outer ring, at least one inner top aperture within the top outer ring, and a plurality of outer top apertures positioned beyond the top outer ring including a top probe access aperture and a threaded aperture. A bottom plate includes bottom features including a bottom continuous outer ring, at least one inner bottom aperture, and plurality of outer bottom apertures including a bottom probe access aperture and table mounting aperture. The threaded apertures accept a fastener that clamps the top plate to the bottom plate for the outer rings to secure a full periphery of the PCB between the top plate and bottom plate.

Abstract: The present invention provides a front panel of a board, a board, and an electronic apparatus. The front panel of the board includes a main body of the front panel, configured to fixedly connect to a circuit board on the board, and a fixing apparatus, where the fixing apparatus is fixedly disposed on the main body of the front panel, and is configured to fix the board in a shelf after the board is installed into the shelf. The fixing apparatus is fixedly disposed on the front panel of the board. After the board is installed into the shelf, the board may be securely fixed in the shelf through the fixing apparatus that is on the front panel of the board, so that a connector of the board keeps good contact with a connector of the shelf, thereby improving reliability of a connection between the board and the shelf.

Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.

Abstract: A semiconductor module system has a semiconductor module and a protective cover. The semiconductor module has a bottom side with a heat dissipation surface and a top side opposite the bottom side, the top side being separated from the bottom side in a vertical direction. The protective cover can be mounted irreleasably on the semiconductor module in such a way that, in a mounted state, the top side is exposed and the protective cover covers the heat dissipation surface. By virtue of the protective cover, a thermal interface material applied onto the heat dissipation surface can be protected.

Abstract: A controller includes a bypass terminal, a first power circuit, a second power circuit, and a charging control circuit. The bypass terminal is to be coupled to a bypass capacitor coupled to a secondary side of an isolated power converter. The first power circuit is coupled to the bypass terminal and a first terminal to be coupled to a first node of the secondary side. The first power circuit transfers charge from the first terminal to the bypass terminal for storage on the bypass capacitor. The second power circuit is coupled to the bypass terminal and a second terminal to be coupled to a second node of the secondary side. The second power circuit transfers charge from the second terminal to the bypass terminal for storage on the bypass capacitor. The charging control circuit controls which of the first and second power circuits transfers charge to the bypass terminal.

Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract: An electronic device storage case for use in storing a substrate therein, includes a hollow box-shaped case body. The case body includes an open surface with an opening, a bottom surface opposite to the opening and a sidewall extending upright from the peripheral edge of the bottom surface, wherein the sidewall of the case body including a plurality of deformable ribs each having a slant surface inclined inwards toward the bottom surface, and wherein the substrate is introduced into the case body through the opening and slidingly moves along the slant surface of each of the deformable ribs to make pressure contact with the slant surface.

Abstract: A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end of the at least one resilient engaging unit is connected to a side of the main body and the other end of the at least one resilient engaging unit engages with a side of a fastening base. The at least one resilient engaging unit is for resiliently pressing the main body so that the dissipating unit contacts with the at least one heat component closely.

Abstract: A display apparatus is provided including a liquid crystal module which displays an image, at least one circuit board which controls the liquid crystal module, and a case which accommodates the liquid crystal module and the at least one circuit board therewithin, wherein the case is sealed such that gas cannot be transmitted therethrough.

Abstract: Described embodiments include a portable electronic device. The device includes a shell and a heat-generating component. The device includes a first and a second exterior heat-rejection element. Each heat-rejection element is configured to reject heat received from the heat-generating component into an environment. The device includes a controllable thermal coupler configured to regulate heat transfer to the first and second heat-rejection elements. The device includes a first proximity sensor configured to determine if a user touch to the shell is within a first zone of possible heat discomfort. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the first and second heat-rejection elements. The regulated heat transfer includes adjusting heat rejection away from the first heat-rejection element and toward the second heat-rejection element if the user touch is within the first zone.

Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes a proximity sensor configured to determine a location of a user touch to the shell relative to the location of the heat-rejection element. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the determined location of the user touch relative to the location of the heat-rejection element.

Abstract: A mechanical module, such as for a vehicle comprises a body having a first body part and a second body part, a printed board and a battery. The first and second body parts are fixed mechanically relative to one another. The printed board is permanently fixed to the first body part. The battery is positioned between the printed board and the second body part, and the body is designed such that the battery can be exchanged without giving access to a compartment of the body between the printed board and the first part of the body.

Abstract: A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.

Abstract: An electronic control apparatus includes housing members, and a circuit board. At least one of the housing members is opposed to a heat-generating region which is heated by the heat-generating electronic component. A heat radiating portion of the housing member includes a convex portion protruding from an inner wall surface at a location opposed to the heat-generating region, and a concave portion opened to an outer wall surface at a location shifted from the convex portion in a thickness direction. The convex portion is close to the heat-generating region through a clearance. The concave portion has a lateral wall formed in a tapered shape such that an opening area of the concave portion is larger than a bottom area of the concave portion. A thickness of the heat radiating portion is smaller than a thickness of a region peripheral to the heat radiating portion in the housing member.

Abstract: A system for use between a heat generating electronic device having a die having a shape placed thereon and a heat sink, includes a thermally conductive slug having a plurality of edges; a plurality of discrete strips each of the strips having a proximal end attaching to one of the edges of the thermally conductive slug, a distal end wherein the distal end is rigid for attachment to the heat sink, a flexible portion between the distal end and the thermally conductive slug wherein the slug may move as the electronic device moves and wherein the strips are comprised of two of more discrete layers, or strands that create a braid.

Abstract: A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load spring passing through the heat sink, the load spring having a latch arm at a first end and a load screw at a second end actuating the load spring, the load spring when actuated is configured to bear against the raised points to equalize pressure distribution over one or more semiconductor chips on the electronic module.

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract: A cage can include a thermal plate positioned so as to be aligned with a bottom of a channel. An adjustable biasing system is provided to urge a module toward the thermal plate. The adjustable biasing system may be a riding heat sink. The thermal plate may include a fin to help increase its surface area. A housing with a card slot aligned with the channel can be provided in the cage to provide a receptacle that has a card slot aligned with the channel. A receptacle so configured allows for greater thermal energy to be removed from a module.

Abstract: A temperature measuring device includes a heat plate exposed to the ambient, one or more sensor chips, and one or more device electronics that include a power transmitter, a wireless communication receiving block, and a processor. Each sensor chip includes a wireless communication transmitting block, a temperature sensor, a signal processing block, and an energy harvesting circuit. The heat plate and the sensor chips are positioned within an indent formed in an exposed surface of a device cover, such as a glass cover. The energy harvesting circuit harvests energy from an electromagnetic signal transmitted by the power transmitter. Temperature data sensed by each temperature sensor is wirelessly transmitted by the wireless communication transmitting block to the wireless communication receiving block. The processor determines an ambient temperature corrected for heat influences on the temperature sensors by internal device electronics.

Abstract: Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a substrate including a semiconductor device mounting region, a cover coupled to a perimeter of the substrate, and members disposed between the substrate and the cover. The package includes partitions, with each partition being disposed between two adjacent members. The package includes a fluid inlet port coupled to the cover, and a fluid outlet port coupled to one of the partitions.

Abstract: A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent. The multiple heatsinks and associated vents work in concert to improve heat dissipation.

Abstract: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.

Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.

Abstract: An apparatus includes a first electronic device mounted on a first substrate and a second electronic device mounted on a second substrate. In some embodiments, the second substrate is configured to be removably connected to the first electronic device. The second electronic device is mountable on either planar surface of the second substrate.

Abstract: A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.

Abstract: A power conversion device comprises a main circuit section that has a semiconductor module with a switching element therein and including a main electrode terminal, a capacitor with a capacitor element therein and that includes a capacitor terminal, and a bus bar that connects the main electrode terminal and the capacitor terminal. The capacitor terminal extends from a capacitor main body including the capacitor element therein towards the main circuit section. The bus bar provides a bending section on a base end side of a connecting section between the bus bar and the capacitor terminal. The bus bar and the capacitor terminal are connected such as to overlap in a state in which respective tip directions match.

Abstract: A low-cost conductive carrier element provides structural support to a light emitting device (LED) die, as well as electrical and thermal coupling to the LED die. A lead-frame is provided that includes at least one carrier element, the carrier element being partitioned to form distinguishable conductive regions to which the LED die is attached. When the carrier element is separated from the frame, the conductive regions are electrically isolated from each other. A dielectric may be placed between the conductive regions of the carrier element.

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract: LED substrate of the present invention includes: translucent substrate body-in which an LED chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the LED chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face. Heat dissipation path includes: heat transfer path section provided in the through hole; and heat dissipation pattern section provided on the back face of substrate body, and connected to heat transfer path section. Thus, LED substrate having superior heat dissipation is realized.

Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.

Abstract: A circuit board includes a board having a hole formed therein, and an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board.