Abstract: A method performed in a computing device. The computing device is configured to store data and retrieve stored data from storage. The computing device further stores parameters for use in soft decoding stored data. The method comprises retrieving data from storage using soft decoding based on the stored soft decoding parameters, using retrieved, soft decoded data to estimate updates of one or more of the parameters for soft decoding and storing the updates.

Abstract: A semiconductor memory device includes a memory cell array including first and second groups of memory strings respectively coupled to first and second groups of bit-lines, wherein the first and second groups of memory strings respectively include first and second groups of selection transistor cells; a peripheral circuit suitable for applying a program voltage, and performing program verification operation for the memory cell array; and a control logic suitable for controlling the peripheral circuit to perform a first program verification operation for the first group of selection transistor cells and a second program verification operation for the second group of selection transistor cells.

Abstract: Boost converter in memory chip. A non-volatile memory including an in-chip boost converter includes: a first memory structure defines control circuitry disposed on a first substrate, and a first metal layers disposed adjacent the control circuitry, where the first metal layer couples elements of the control circuitry; and a second memory structure defines a memory array disposed on a second substrate, and a second metal layer disposed adjacent the memory array, where the first and second metal layers are bonded together by a permanent physical bond formed between the first and second metal layers; and a boost converter defining an inductor disposed in the first and second metal layers, and a transistor circuit disposed in the control circuitry. The non-volatile memory, where the inductor further defines a first terminal coupled to a voltage source, and a second terminal coupled to a load by way of a transistor circuit.

Abstract: A sensor device may include a substrate, and first and second semiconductor structures arranged over the substrate. The first semiconductor structure may be an ion-sensitive field effect transistor and may include a floating gate, and a sensing element electrically coupled to the floating gate. The second semiconductor structure may be capacitively coupled to the first semiconductor structure, and may include a first diffusion region and a second diffusion region having opposite polarity type dopants, and a channel region arranged therebetween. The second semiconductor structure may be configured to receive a bias voltage to tune an electrical characteristic of the first semiconductor structure through the first diffusion region and the second diffusion region and the channel region. In some embodiments, the substrate may be a crystalline-on-insulator substrate which may be coupled to a back gate bias to reduce an effective total capacitance of the ISFET and further improve the coupling ratio.

Abstract: A method can be used for programming a group of memory cells of a non-volatile memory device in a programming window that has a duration longer than a programming duration of a memory cell. The programming window is subdivided into a number of time intervals. A programming profile that was determined by simulation while taking into account a reference criterion is retrieved. The programming profile includes, for each time interval, a maximum number of memory cells that can be triggered for programming within each time interval. The memory device is programmed in the programming window, interval-wise, using the programming profile.

Abstract: A method for determining degradation in performance of an electronic device connected to a communication network for an aerial vehicle includes monitoring, by one or more computing device(s), communications on the communication network during a validation period. The method further includes generating, by the computing device(s), a baseline operating profile of the electronic device based, at least in part, on the communications monitored during the validation period. In addition, the method includes monitoring, by the computing device(s), communications on the communication network during a post-validation period. The method further includes determining, by the computing device(s), a present operating profile of the electronic device based, at least in part, on the communications monitored during the post-validation period.

Abstract: A non-volatile storage apparatus comprises a non-volatile memory structure and an I/O interface. A portion of the memory die is used as a pool capacitor for the I/O interface.

Abstract: A storage device with a charge trapping (CT) based memory may include improved data retention performance. Data retention problems, such as charge loss in CT memory may increase for a particular programmed state when a neighboring state is at erased state. Modifying the erase state with post write erase conditioning (PWEC) by pushing up deeply erased states can reduce the lateral charge movement and improve high temperature data retention. In particular, the erase state may be reprogrammed such that the erase distribution is tighter with a higher voltage.

Abstract: According to one embodiment, a semiconductor memory device includes: a substrate; a first conductive layer arranged above the substrate; a stacked body arranged on the first conductive layer with a plurality of dielectric layers and a plurality of second conductive layers being alternately stacked; a pillar-shaped channel extending in a stacking direction of the stacked body, penetrating through the stacked body, and protruding into the first conductive layer; and a memory layer covering a side surface of the channel, in which a bottom surface of the channel and the side surface of the channel protruding into the first conductive layer are in contact with the first conductive layer, and in which the first conductive layer includes: an upper layer; and a lower layer having a protrusion penetrating through the upper layer.

Abstract: An apparatus and a method for accessing a plurality of memory blocks is disclosed. The An apparatus comprises: a memory circuit configured to store a recording table, wherein the recording table corresponds to quality index of the plurality of memory blocks; and a control circuit configured to group the plurality of memory blocks to a first memory group and a second memory group according to the quality index; to enable to access the memory blocks in the first memory group, and to disable to access the memory blocks in the second memory group.

Abstract: A nonvolatile memory device performs a read operation comprising first and second intervals. In the first interval the device applies a turn-on voltage to string selection lines and ground selection lines connected to the string selection transistors and the ground selection transistors, respectively. In the second interval, the device applies a turn-off voltage to unselected string selection lines and unselected ground selection lines while continuing to apply the turn-on voltage to a selected string selection line and a selected ground selection line. In both the first and second intervals, the device applies a first read voltage to a selected wordline connected to memory cells to be read by the read operation and applying a second read voltage to unselected wordlines among connected to memory cells not to be read by the read operation.

Abstract: Systems and method are directed to Universal Flash Storage (UFS) memory system configured to support deep power-down modes wherein the UFS memory system is not required to be responsive to commands received from a host device coupled to the UFS memory system. Correspondingly, in the deep power-down modes, a link or interface between the UFS memory system and the host device may also be powered down. The UFS memory system may enter the deep power-down modes based on a command received from the host device or a hardware reset assertion, and exit the deep power-down modes based on a hardware reset de-assertion or power cycling. While in deep power-down modes, the power consumption of the UFS memory device is substantially lower than the power consumption of the UFS memory device in conventional power modes.

Abstract: It is to optimize the initial threshold voltages of each memory area in a semiconductor memory device including a plurality of memory areas. A semiconductor memory device according to the embodiment includes a first memory area for storing data and a second memory area for storing the information related to the first memory area. In the respective memory cells arranged in the first and the second memory areas, the initial threshold voltages of the memory cells arranged in the second memory area are designed to be higher than those of the memory cells arranged in the first memory area.

Abstract: An AND type flash memory includes a memory cell array, a plurality of page buffers and a plurality of voltage shifting circuits. The memory cell array is coupled to a plurality of bits lines and source lines. The page buffers are respectively coupled to the bit lines through a plurality of switches, and respectively provides a plurality of control signals. The control signals are transited between a first voltage and a reference voltage. The voltage shifting circuits respectively receive the control signals, generates a plurality of driving signals by shifting voltage values of the control signals, and provides the driving signals to the bit lines. Wherein, the driving signals are transited between a second voltage and the reference voltage, the second voltage is larger than the first voltage.

Abstract: A data access method, a memory storage apparatus and a memory control circuit unit are provided. The memory storage apparatus includes a rewritable non-volatile memory module and the memory control circuit unit for controlling the rewritable non-volatile memory module. The data access method includes: receiving an access command; detecting a temperature of the memory storage apparatus; determining whether the temperature of the memory storage apparatus is lower than a first threshold; if the temperature of the memory storage apparatus is lower than the first threshold, performing a dummy access command or adjusting an operating voltage. The data access method further includes performing the access command after the dummy access command is performed or the operating voltage is adjusted.

Abstract: A non-volatile memory device includes a substrate; a memory cell array on the substrate; a control logic circuit configured to output an erase enable signal for controlling an erase operation with respect to the memory cell array; a substrate bias circuit configured to, in response to the erase enable signal, output a first target voltage to the substrate as a substrate bias voltage during a first delay time and, after the first delay time, output the substrate bias voltage to the substrate while gradually increasing a level of the substrate bias voltage to that of an erase voltage having a higher level than the first target voltage; and a row decoder configured to apply a ground voltage to the ground select line based on control of the control logic circuit during the first delay time.

Abstract: A semiconductor device that has a split gate charge trapping memory cell having select and memory gates of different heights is presented herein. In an embodiment, the semiconductor device also has a low voltage transistor and a high voltage transistor. In one embodiment, the gates of the transistors are the same height as the select gate. In another embodiment, the gates of the transistors are the same height as the memory gate.

Abstract: The present disclosure includes apparatuses and methods related to selectable trim settings on a memory device. An example apparatus can store a number of sets of trim settings and select a particular set of trims settings of the number of sets of trim settings based on desired operational characteristics for the array of memory cells.

Abstract: In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Abstract: The present disclosure includes apparatuses and methods related to determining trim settings on a memory device. An example apparatus can determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells.

Abstract: An ion-sensitive field effect transistor (ISFET) is provided that has enhanced sensitivity due to an increased passivation capacitance, Cp. The increased Cp is obtained by increasing the surface area of the passivation layer by forming particles (metallic, semiconductor or dielectric) in a micro-well, and by embedding the particles in an electrically conductive liner that is formed under the passivation layer and within the micro-well.

Abstract: According to one embodiment, a semiconductor memory device includes the following configuration. A second word line is provided above a first word line on a substrate. A third word line is provided above the second word line. A semiconductor layer includes a first part that passes through the first word line, a second part that passes through the second and the third word lines, and is provided above the first part, and a joint provided between the first and second parts. When a write operation is performed on a memory cell of the third word line, prior to applying a write voltage to the third word line, a first voltage is applied to a bit line, a second voltage is applied to the third word line, and a third voltage higher than the second voltage is applied to the second word line.

Abstract: A global word line decoder may include a voltage switching unit and a plane switching unit. The voltage switching unit may decode a plurality of operating voltages to output a selected voltage and an unselected voltage, and the plane switching unit may receive the selected voltage and the unselected voltage, and decode the selected voltage and the unselected voltage to output decoded voltages to a global word line coupled to a selected plane, among a plurality of planes. The selected voltage may include a first pre-decoded voltage and a second pre-decoded voltage, and the plane switching unit may swap and output the first pre-decoded voltage and the second pre-decoded voltage according to a position of a selected word line.

Abstract: A CMOS anti-fuse cell is disclosed. In one aspect, an apparatus includes an N? well and an anti-fuse cell formed on the N? well. The anti-fuse cell includes a drain P+ diffusion deposited in the N? well, a source P+ diffusion deposited in the N? well, and an oxide layer deposited on the N? well and having an overlapping region that overlaps the drain P+ diffusion. A control gate is deposited on the oxide layer. A data bit of the anti-fuse cell is programmed when a voltage difference between the control gate and the drain P+ diffusion exceeds a voltage threshold of the oxide layer and forms a leakage path from the control gate to the drain P+ diffusion. The leakage path is confined to occur in the overlapping region.

Abstract: Some embodiments include a memory cell which has, in the following order; a control gate, charge-blocking material, charge-trapping material, a first oxide, a charge-passage structure, a second oxide, and channel material. The charge-passage structure has a central region sandwiched between first and second regions. The central region has a lower probability of trapping charges and/or a lower rate of trapping charges than the first and second regions. Some embodiments include an integrated structure having a vertical stack of alternating conductive levels and insulative levels, and having a charge-passage structure extending vertically along the vertical stack. Some embodiments include a NAND memory array having a vertical stack of alternating insulative levels and wordline levels, and having a charge-passage structure extending vertically along the vertical stack.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, a word line connected in common to gates of the memory cells, and a control circuit configured to execute a read operation on the memory cells by applying a first read voltage to the word line to determine for each of the memory cells whether or not the memory cell has a threshold voltage that is below the first read voltage and a second read voltage to the word line to determine for each of the memory cells whether or not the memory cell has a threshold voltage that is below the second read voltage. The control circuit determines the first read voltage by applying at least first to third voltages to the word line, and determines the second read voltage based on the first read voltage.

Abstract: The embodiments of the present disclosure disclose a DC/DC test system and a method. In the solution, based on a test system composed of a test host, a main control unit, a DC/DC unit, a programmable power supply, an input monitoring unit, an output monitoring unit and a load unit, the efficiency test of the DC/DC unit can be automatically realized, the test of linear adjustment rate and load regulation rate can be realized, and the test efficiency can be improved.

Abstract: A non-volatile memory device having a memory chip is provided. The memory chip having a memory cell array including a plurality of memory planes sharing a pad, the pad configured to communicate input and output signals. The memory chip also having a control circuit configured to monitor operations of the plurality of memory planes, and control an operation of at least one of the plurality of memory planes based on a result of the monitoring such that peak power intervals of the plurality of memory planes are at least partially distributed.

Abstract: A memory control device includes a memory and a controller. The memory includes a plurality of memory blocks. The controller is coupled to the memory and configured to select a first memory block from the memory blocks and program data into the first memory block. When the memory control device is deactivated and re-activated, the controller is further configured to read a voltage distribution of the first memory block to determine a deactivation interval, and determine a reference time according to the deactivation interval and an initial time, and the voltage distribution of the first memory block correspond to the data.

Abstract: A read window budget (RWB) corresponding a group of memory cells is determined. The determined RWB and a target RWB is compared. In response to the determined RWB being different than the target RWB, one or more program step characteristics are adjusted to adjust the determined RWB toward the target RWB.

Abstract: Techniques are described for programming memory cells with reduced widening of the threshold voltage distributions. Bit line voltages are adjusted during verify tests for memory cells assigned to the upper data state in a pair of adjacent data states which are concurrently verified. An elevated bit line voltage is applied and then stepped up in successive program loops. A lower, fixed bit line voltage is used for verifying the lower data state in the pair of adjacent data states. In one option, the step size increases progressively over the program loops. In another option, the minimum level of the elevated bit line voltage is lower for higher data states. In another option, the minimum level of the elevated bit line voltage is set as a function of data states, program-erase cycles and/or temperature.

Abstract: A semiconductor memory device includes a memory cell array, an input/output circuit configured to output read data from the semiconductor memory device, a first data latch configured to latch data read from the memory cell array as the read data, a second data latch to which the read data is transferred from the first data latch and from which the read data is transferred to the input/output circuit, a signaling circuit configured to output a ready signal or a busy signal, and a control circuit configured to control the signaling circuit to output the busy signal while the read data is being latched in the first data latch during a read operation performed on the memory cell array and to output the ready signal while the read data latched in the first data latch is being transferred from the first latch to the second latch.

Abstract: A method of performing an operation on a non-volatile memory (NVM) cell of a memory device is disclosed. The pass transistor of the NVM cell is an asymmetric transistor including a source with a halo implant. The source of the pass transistor is coupled to a common source line (CSL) that is shared among NVM cells of a sector of NVM cells. The operation may be performed by applying a first signal to a word line (WLS) coupled to a gate of a memory transistor of the NVM cell and applying a second signal to a bit line (BL) coupled to a drain of the memory transistor of the NVM cell.

Abstract: An operating method of a non-volatile memory device including a plurality of memory cells respectively connected to a plurality of word lines is provided. The operating method includes applying an erase detect voltage to a selected word line of the plurality of word lines to perform an erase detect operation on memory cells connected to the selected word line in response to a program command, applying a program voltage to the selected word line after the erase detect operation, and counting a number of undererased cells of the memory cells on which the erase detect operation has been performed.

Abstract: A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.

Abstract: Embodiments of semiconductor structures including word line contact structures for three-dimensional memory devices and fabrication methods for forming word line contact structures are disclosed. The semiconductor structures include a staircase structure having a plurality of steps, and each step includes a conductive layer disposed over a dielectric layer. The semiconductor structures further include a barrier layer disposed over a portion of the conductive layer of each step. The semiconductor structures also include an etch-stop layer disposed on the barrier layer and an insulating layer disposed on the etch-stop layer. The semiconductor structures also include a plurality of conductive structures formed in the insulating layer and each conductive structure is formed on the conductive layer of each step.

Abstract: According to one embodiment, a semiconductor device includes a substrate, a stacked body, and a columnar portion. The stacked body, provided on the substrate, includes first conductive layers and first insulating layers provided alternately along a first direction. The columnar portion extends through the stacked body in the first direction. The columnar portion includes a blocking layer, a charge storage layer, a tunneling layer, and a semiconductor layer. The columnar portion includes a first portion and a second portion. The second portion is provided on the substrate side of the first portion. A dimension in the second direction of the second portion is smaller than a dimension in a second direction of the first portion. A portion of the blocking layer is provided at the second portion being thicker than a portion of the blocking layer provided at the first portion.

Abstract: A flash memory device includes: a flash memory array; and control logic. The control logic is coupled to the flash memory array. The control logic is arranged to: program a plurality of memory cells of the flash memory array according to at least one first page of data in a first programming pass; sense the memory cells that are programmed in the first programming pass to obtain the at least one first page of data and preserve the at least one first page of data in a first register circuit inside the flash memory device before a second programming pass; and program the memory cells according to the at least one first page of data and a second page of data in the second programming pass.

Abstract: An apparatus having an erase controller configured to perform a two-sided gate-induced drain leakage (GIDL) erase of non-volatile memory cells is disclosed. The erase controller is configured to apply a first voltage pulse having a first value for a voltage pulse attribute to the first end of a first pathway. The erase controller is configured to apply a second voltage pulse having a second value for the voltage pulse attribute to the first end of a second pathway. The first value and the second value are configured to compensate for different impedances such that a first erase voltage at a first select transistor is substantially symmetric with a second erase voltage at a second select transistor.

Abstract: A memory device includes a plurality of data lines, a common source, and control logic. The control logic is configured to implement a seed operation by biasing each of the plurality of data lines to a first voltage level with the common source biased to a second voltage level lower than the first voltage level. With each data line biased to the first voltage level, the control logic is configured to float each data line and bias the common source to the first voltage level such that the bias of each data line is boosted above the first voltage level due to capacitive coupling between each data line and the common source.

Abstract: A device includes a memory device and a controller. The memory device includes read/write circuitry and a plurality of memory dies. The controller is coupled to the memory device. The controller is configured to, responsive to determining that at least one storage element of a first die of the plurality of memory dies has a characteristic indicative of an aging condition, increase the temperature of the first die by performing memory operations on the first die until detecting a condition related to the temperature.

Abstract: A read table management method for a solid state storage device includes the following steps. If the lowest computation value in a hot group is lower than the highest computation value in a cold group when a read table adjusting process is enabled, a first read voltage set corresponding to the lowest computation value in the hot group and a second read voltage set corresponding to the highest computation value in the cold group are swapped with each other. Consequently, the second read voltage set becomes to belong to the hot group, and the first read voltage set becomes to belong to the cold group.

Abstract: Methods of operating a memory including applying an intermediate read voltage to a selected access line for a read operation, determining a value indicative of a number of memory cells of a plurality of memory cells connected to the selected access line that are activated in response to applying the intermediate read voltage to the selected access line, and determining an expected data age of the plurality of memory cells in response to the value indicative of the number of memory cells of the plurality of memory cells that are activated in response to applying the intermediate read voltage to the selected access line.

Abstract: A read control method of a memory controller for controlling a memory device including a plurality of memory pages respectively connected to a plurality of word lines includes identifying a selected memory page connected to a selected word line among the plurality of memory pages has undergone a suspend operation, determining a read offset level of the selected memory page based on suspend operation information associated with the selected memory page according to a result of the identifying the selected memory page, and controlling a read operation of the memory device based on a read voltage associated with the read offset level that was determined.

Abstract: A data reading method is provided. The method includes updating a target optimized count value corresponding to a target physical page, in response to determining that a read voltage optimization operation needs to be performed to the target physical page among a plurality of physical pages according to a plurality of monitor results corresponding to the physical pages of the target wordline; performing a first type read voltage optimization operation, a second type read voltage optimization operation, or a third type read voltage optimization operation corresponding to the target wordline according to the target optimized count value, so as to obtain an optimized read voltage set corresponding to the target wordline, wherein the target wordline is read by using the optimized read voltage set.

Abstract: A method of operating a nonvolatile memory device includes erasing data within a NAND string of memory cells within the memory device by applying a non-zero erase voltage to a source/drain terminal at a first end of the NAND string. This erase voltage is applied concurrently with establishing gate-induced drain leakage (GIDL) in a pair of selection transistors within the NAND string. This GIDL can occur by applying unequal and non-zero first and second voltages to respective first and second gate terminals of the pair of selection transistors. The selection transistors can be string selection transistors or ground selection transistors.

Abstract: There are provided a memory device and an operating method thereof. A memory device may include a memory block, peripheral circuits, and a control logic. The memory block may include a plurality of memory cells. The peripheral circuits may perform a program operation on the memory cells. The control logic may control the peripheral circuits to apply, during the program operation, a program voltage to a selected word line and selectively apply, to one or more unselected word lines, a second pass voltage lower than a first pass voltage set as a default voltage during a blind program period which does not include a verify operation.

Abstract: A plurality of semiconductor layers have longitudinally a first direction, have a peripheral area surrounded by the plurality of control gate electrodes, and are arranged in a plurality of rows within the laminated body. A controller controls a voltage applied to the control gate electrodes and bit lines. The controller, during a writing operation, applies a first voltage to a first bit line connected to the semiconductor layer positioned in a first row closer to the insulation separating layer, and applies a second voltage larger than the first voltage to a second bit line connected to the semiconductor layer positioned in a second row positioned further from the insulation separating layer with respect to the first row, among the plurality of rows.

Abstract: Apparatus and methods are disclosed, including a method that raises an electrical potential of a plurality of access lines to a raised electrical potential, where each access line is associated with a respective charge storage device of a string of charge storage devices. The electrical potential of a selected one of the access lines is lowered, and a data state of the charge storage device associated with the selected access line is sensed while the electrical potential of the selected access line is being lowered. Additional apparatus and methods are described.

Abstract: Provided herein may be a memory device including a voltage generating circuit. The memory device may include a memory block including a channel layer formed between Junctions included in a well, and a source select line, word lines, and drain select lines that are sequentially stacked on the well while enclosing the channel layer, a first voltage source configured to generate a first operating voltage to be applied to the well during a program operation or an erase operation, and a second voltage source configured to generate a second operating voltage to be applied to source lines that are coupled to the junctions during the program operation or the erase operation.