Abstract: Each of a plurality of memories includes a terminating resistor for preventing signal reflection, and a memory control circuit includes an ODT control circuit for driving the terminating resistor of each memory, and a selector for selecting, from memories except for a memory to be accessed, at least one memory for which driving of the terminating resistor is to be suppressed, in accordance with the memory to be accessed.

Abstract: A signal aligning circuit includes a plurality of pads receiving input signals in parallel 1 bit by 1 bit; a first transferring unit for transferring the input signals as first signals in synchronization with a first clock signal of an internal clock, and transferring the input signals as second signals in synchronization with a second clock signal of the internal clock; a second transferring unit for transferring the first signals in synchronization with the second clock signal of the internal clock; and an aligning unit for aligning the first and second signals transferred from the first and second transferring units and outputting the aligned signal as output signals.

Abstract: An active termination circuit is used to set the input impedance of a plurality of input terminals. Each of the input terminals is coupled to a supply voltage through at least one PMOS transistor and to ground through at least one NMOS transistor. The impedances of the transistors are controlled by a control circuit that generates a first control signal to set the impedance of another PMOS transistor to be equal to a first predetermined resistance, and generates a second control signal to set the impedance of another NMOS transistor to be equal to a second predetermined resistance. The first control signal is used to control all of the PMOS transistors and the second control signal is used to control all of the NMOS transistors. As a result, the PMOS and NMOS transistors coupled to each input terminal have impedances corresponding to the first and second resistances, respectively.

Abstract: A stacked semiconductor memory device is provided which includes a first memory chip including a first transmission line, a second transmission line, and a logic circuit configured to execute a logic operation on a first signal of the first transmission line and a second signal of the second transmission line. The stacked semiconductor memory device further includes a second memory chip stacked over the first memory chip, an inter-chip connection unit electrically coupled between the second memory chip and the first transmission line of the first memory chip, and a dummy inter-chip connection unit electrically coupled to the second transmission line of the first memory chip and electrically isolated from the second memory chip.

Abstract: Semiconductor device and semiconductor memory device include a plurality of internal circuits configured to perform test operations in response to their respective test mode signals and a plurality of test-mode control units configured to control the test operations of the internal circuits to be disabled in response to a test-off signal.

Abstract: A memory module includes a plurality of buses and a plurality of memory chips arranged close to each other along each of the plurality of buses. An N-th memory chip, where N is an integer, of the plurality of memory chips is connected to any one of the plurality of buses, and each of the other memory chips of the plurality of memory chips, except for the N-th memory chip, is connected to the other one of the plurality of buses.

Abstract: A semiconductor memory device and a semiconductor memory system. The semiconductor memory device includes channels configured to transmit signals from a transmitter to a receiver, and a crosstalk compensator. The crosstalk compensator may be connected between the channels to compensate for crosstalk. The crosstalk compensator may comprise a capacitor connected in parallel between the channels, and a switching unit connected between the capacitor and one of the channels. The switching unit may control connections or disconnections between the capacitor and the channel. Therefore, the semiconductor memory device and the semiconductor memory system compensate for crosstalk occurring between transmitted signals that are out of phase with each other.

Abstract: An on-die termination circuit includes a termination resistor unit connected to an external pin, and a termination control unit connected to the termination resistor unit. The termination resistor unit provides termination impedance to a transmission line connected to the external pin. The termination control unit varies the termination impedance in response to a plurality of bits of strength code associated with a data rate.

Abstract: A memory chip has a signal line and a complex impedance which is connected to the signal line for termination of the signal line. A memory having such a memory chip and a method for operating a memory chip are also described. The memory chip on the memory having a signal line that is terminated with a complex impedance.

Abstract: An apparatus is provided that includes a memory controller to provide a first on-die termination (ODT) signal and a second ODT signal, a memory channel, a first memory module to couple to the memory channel, and a second memory module to couple to the memory channel. The first memory module may include a first memory having a first ODT circuit to receive the first ODT signal, and a second memory having a second ODT circuit to receive the first ODT signal. The first ODT signal may disable the ODT circuit of the first memory when the first memory is to be ACTIVE.

Abstract: Methods and memory devices are disclosed, for example a memory device that has both an analog path and a digital path that both share the same input/output pad. One of the two paths on each pad is selected in response to command signals that indicate the nature of the signal being either transmitted to the device or read from the device. Each digital path includes a latch for latching digital input data. Each analog path includes a sample/hold circuit for storing either analog data being read from or analog data being written to the memory device.

Abstract: A read, write, and match circuit for a low-voltage content addressable memory. A write circuit inputs signals for storing data in the memory cells, a read circuit retrieves the stored data from the memory cells, and a match circuit compares the data stored in the memory cell with the data searched by the match circuit. The circuits for writing, reading and matching are separated from each other and exempt from mutual interference.

Abstract: A method and system are provided for coupling a DRAM and a memory controller during driver training to reduce mismatches by controlling impedances within the system environment. A memory device initializes a bit level voltage on a data net. A driver impedance in a driving element in the controller is modified to yield improvements in timing margins.

Abstract: A solid state memory system includes a first memory chip that includes a plurality of storage elements, and a controller. Each of the plurality of storage elements have a measurable parameter that varies between a lower limit and an upper limit. The controller receives write data, converts the write data to N target values, and transmits the N target values to the first memory chip. The first memory chip adjusts corresponding measurable parameters of N storage elements of the plurality of storage elements to the N target values, where N is an integer greater than zero.

Abstract: A memory interface circuit is provided, comprising: a first signal output circuit configured to output a first signal via a first signal line to a first I/O terminal; a second signal output circuit configured to output a second signal via a second signal line to a second I/O terminal; and a noise cancellation circuit having at least one phase adjusting element and at least one gain adjusting element to reduce a noise signal induced on the second signal line due to the presence of the first signal on the first signal line, wherein the second signal line is disposed adjacent to the first signal line.

Abstract: A CMOS latch-type sense amplifying circuit is disclosed. The circuit comprises a CMOS differential amplifier configured to amplify a voltage signal of an input line pair to generate a first amplified voltage signal pair, and provide the first amplified voltage signal pair to an output line pair, a first pre-charge voltage having a first voltage level being applied to the input line pair. The circuit further comprises a CMOS latch-type sense amplifier configured to amplify a voltage signal of the output line pair to generate a second amplified voltage signal pair, and provide the second amplified voltage signal pair to the output line pair. The circuit additionally comprises a first common node controlled by a first common enable signal and connected to both the CMOS differential amplifier and the CMOS latch-type sense amplifier, such that the first common enable signal controls both the CMOS differential amplifier and the CMOS latch-type sense amplifier.

Abstract: The present invention relates to a semiconductor memory, and more specifically, to a data output circuit capable of differentiating global data lines in accordance to an operation mode to output them to a data input/output pin. The present invention includes: a multiplexer selecting any one of a plurality of global input/output lines which can receive variable data bandwidth directed by control signals and which can output data carried on the selected global input/output line, and a controller generating the control signals in accordance to operation mode signals corresponding to a data bandwidth and address signals provided for selecting data and providing them to the multiplexer. Thereby, the present invention can realize an improved data read speed by reducing the loading of the global input/output line.

Abstract: A method for initializing a memory device is provided. The method includes a step for transmitting at least N+1 clock cycles to the memory device, wherein the N is an amount of bits of output serial data of the memory device. During a clock cycle of the at least N+1 clock cycles, a first start/stop signal is transmitted to the memory device. During another clock cycle of the at least N+1 clock cycles, a second start/stop signal is transmitted to the memory device.

Abstract: A semiconductor memory device and an operating method thereof prevent the mal-operation of the semiconductor memory device induced by misrecognizing addresses or data as commands. The semiconductor memory device includes a plurality of input pads, a data information path, a command path, a transfer block configured to transmit signals coupled through the input pads to the data information path and the command path, a command decoding block configured to decode signals transmitted through the command path to verify an inputting of a command, and a transmission control block configured to generate a control signal for controlling the signal transmission from the transfer block to the command path according to the verified result of the command decoding block.

Abstract: An apparatus is provided that includes a memory controller to provide a first on-die termination (ODT) signal and a second ODT signal, a memory channel, a first memory module to couple to the memory channel, and a second memory module to couple to the memory channel. The first memory module may include a first memory having a first ODT circuit to receive the first ODT signal, and a second memory having a second ODT circuit to receive the first ODT signal. The first ODT signal may disable the ODT circuit of the first memory when the first memory is to be ACTIVE.

Abstract: A semiconductor memory device, a semiconductor memory module, and a semiconductor memory system including the same, the semiconductor memory device including a command/address input buffer that receives a command/address signal and a command/address reference voltage signal, wherein the command/address input buffer is configured to amplify a difference between the command/address signal and the command/address reference voltage signal, and is further configured to output the amplified difference between the command/address signal and the command/address reference voltage signal, and a chip selection input buffer that receives a chip selection signal and a chip selection reference voltage signal, wherein the chip selection input buffer is configured to amplify a difference between the chip selection signal and the chip selection reference voltage signal, and is further configured to output the amplified difference between the chip selection signal and the chip selection reference voltage signal, wherein a volt

Abstract: A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: first and second memory banks located at a predetermined distance from each other; a common column selection signal transmission line configured to transfer a column selection signal for controlling data access to corresponding memory cells in the first and second memory banks; and a column selection signal repeater inserted in the common column selection signal transmission line, and configured to transfer the column selection signal for controlling data access to the memory cell in the first memory bank. A transmission path of the column selection signal for controlling data access to the memory cell in the first memory bank is longer than that of the column selection signal for controlling data access to the memory cell in the second memory bank.

Abstract: A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: a plurality of memory banks disposed at a predetermined distance from each other in a first direction; a common column selection control unit disposed at an outside region of the plurality of memory banks in the first direction, and configured to commonly control access to column areas of the plurality of memory banks; and a common column selection signal transmission line configured to transfer a column selection signal for controlling data access to the corresponding memory cells of the plurality of memory banks. The common column selection control unit generates the column selection signal, and a delay length of the column selection signal is adjusted based on a length of a transmission path of the column selection signal.

Abstract: A semiconductor memory apparatus is provided. The semiconductor memory apparatus comprises: first and second memory banks located a predetermined distance from each other in a first direction; a common column selection control unit located at an outside region in the first and second memory banks in the first direction, and configured to commonly control access to column areas in the first and second memory banks and generate a column selection signal that controls data access to the corresponding memory cells in the first and second memory banks; a first data read/write unit configured to sense and amplify read data transferred from the first memory bank and transfer write data to the first memory bank; and a second data read/write unit configured to sense and amplify read data transferred from the second memory bank and transfer write data to the second memory bank.

Abstract: A repeater of a global input/output line includes a data transmitter including first and second drivers for outputting data signals of the global input/output line through different transmission routes in response to a transmission direction control signal, and a third driver for driving the global input/output line in response to an output signal of the data transmitter.

Abstract: A semiconductor device includes a data transmission line and a data transmission line precharge circuit. The data transmission line precharge circuit sets a precharge potential of the data transmission line to a first potential at the time of a first write mode in which data masking is not performed. The data transmission line precharge circuit sets the precharge potential to a potential different from the first potential at the time of a second write mode in which data masking is performed. When data masking is not carried out, precharging to a potential at which data can be written in excellent fashion can be performed. When data masking is carried out, precharging to a potential that inhibits a fluctuation in bit-line potential can be performed.

Abstract: A method may be provided to communicate a plurality of groups of output data bits representing a respective plurality of groups of input data bits over a data bus with each group of output data bits and each group of input data bits have an equal data width. Each of the plurality of groups of input data bits at may be received at a data register. For each group of input data bits received at the data register, if a number of data bits of the group of input data bits having a first logic level is greater than half of the data width, the group of input data bits are inverted, the inverted group of input data bits are transmitted as a respective group of output data bits in parallel over the data bus, and an inversion flag associated with the respective group of output data bits is transmitted.

Abstract: Components of a memory controller are calibrated in a select sequence to compensate for variances in skew and signal level variations. The offset bias of the receiver of the I/O cell and the termination resistance of the I/O cell are calibrated. The duty cycles of the transmit path and receive path associated with the I/O cell can be calibrated using the calibrated receiver. In one aspect, the driver of the I/O cell can be calibrated prior to calibrating the receiver. Performing the calibration processes of the memory controller in one of the particular sequences described herein improves the timing budgets for the signaling conducted by the memory controller.

Abstract: An apparatus for removing crosstalk in a semiconductor memory device includes pads for receiving externally provided signals, transmission lines for delivering the signals received by each of the pads to corresponding elements in the apparatus, and capacitors, coupled between adjacent ones of the lines, for adjusting the transmission delay of the signals depending on a signal transmission mode between the adjacent lines.

Abstract: A method, device, and system are disclosed. In one embodiment, the method includes programming a first On Die Termination (ODT) value into a first plurality of dynamic random access memory (DRAM) devices. The first plurality of DRAM devices are located on a dual inline memory module (DIMM). Additionally, the method also includes programming a second ODT value into a second plurality of additional DRAM devices. The second plurality of additional DRAM devices are also located on the DIMM. The method also specifies that the first and second ODT values are not the same value.

Abstract: A mat compress circuit includes a pre-control signal generator that generates a first pre-control signal and a second pre-control signal alternatively activated in response to an up/down bank selection address in a mat compression test, and a control signal transmitter that inverts and transfers the first and second pre-control signals in response to a switching signal activated when there is an input of a block selection address in the mat compression test.

Abstract: An integrated semiconductor memory with generation of data comprises a clock connection to apply a clock signal, a memory cell array with memory cells to store data of a first data record and a data generator circuit with a first input connection to apply the data of the first data record, with a first output connection to output data of a second data record, and with a second output connection to generate a first control signal. The data generator circuit includes an evaluation unit whose input is supplied with the first data record, the second data record and a second control signal, the second control signal being delayed by one clock period of the clock signal with respect to the first control signal. The data generator circuit is adapted to generate the data values of the data of the second data record in dependence on the evaluation of the data values of the first and second data record and the second control signal.

Abstract: A semiconductor memory device and an operating method thereof prevent the mal-operation of the semiconductor memory device induced by misrecognizing addresses or data as commands. The semiconductor memory device includes a plurality of input pads, a data information path, a command path, a transfer block configured to transmit signals coupled through the input pads to the data information path and the command path, a command decoding block configured to decode signals transmitted through the command path to verify an inputting of a command, and a transmission control block configured to generate a control signal for controlling the signal transmission from the transfer block to the command path according to the verified result of the command decoding block.

Abstract: A semiconductor memory apparatus includes a clock generator configured to generate an internal clock signal, an asynchronous data input buffer configured to buffer a data input signal through a data pad to output a buffered data signal, and a synchronous data input buffer configured to buffer the buffered data signal synchronously with the internal clock signal, wherein a length of a line, through which the internal clock signal is transmitted to the synchronous data input buffer, is configured to be substantially the same with a length of a line, through which the buffered data is transmitted to the synchronous data input buffer.

Abstract: A memory device has multiple bi-directional data paths. One of the multiple bi-directional data paths is configured to transfer data at one speed. Another one of the multiple bi-directional data paths is configured to transfer data at another speed.

Abstract: A memory device includes terminals for transferring input data and output data to and from a memory array. The memory device also includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information and time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: A termination impedance control circuit is capable of controlling a dynamic ODT operation in a DDR3-level semiconductor memory device. The termination impedance control circuit includes a counter unit configured to count an external clock and an internal clock to output a first code and a second code, respectively, and a dynamic controller configured to enable a dynamic termination operation by comparing the first code with the second code in response to a write command and disable the dynamic termination operation after a predetermined time, determined according to a burst length, has lapsed after the dynamic termination operation is enabled.

Abstract: A storage device includes a storage array having a group of storage elements. Each storage element can written to a discrete set of physical states. A read circuit selects one or more storage elements and generates, for each selected storage element, an analog signal representative of the physical state of the selected storage element. A signal processing circuit processes the analog signal to generate a plurality of outputs, with each output representing a degree of an association of the selected storage element with a different subset of one or more of the discrete set of physical states.

Abstract: A semiconductor memory device includes a first memory bank and a second memory bank and a common write driver configured to drive write data to an activated memory bank of the first memory bank and the second memory bank. The common write driver of the semiconductor memory device includes a common write control block configured to generate common drive control signals corresponding to write data, and a common write drive block configured to drive transmission lines of a first memory bank or transmission lines of a second memory bank that are selected by a bank selection signal in response to the common drive control signals.

Abstract: A cell inferiority test circuit includes a compression data generator configured to compress selected data in response to selection signals and to generate compression data including information about cell inferiority, a strobe signal delayer configured to delay a strobe signal by an amount of time set by a test signal and to generate a delayed strobe signal, and an input/output line driver configured to receive the compression data in sync with the delayed strobe signal and to drive a global input/output line.

Abstract: An output buffer includes first and second input transistors, first and second output loads and a current source. The first and second input transistors have first current electrodes that are commonly coupled to each other and control electrodes that are respectively coupled to a first differential input signal and a second differential input signal. The first and second output loads are coupled between a first power supply voltage and the first and second input transistors, respectively, wherein an output terminal is coupled to a node where the first output load is coupled to the first input transistor. The current source is coupled between the first current electrodes of the first and second input transistors and a second power supply voltage, wherein the second output load has an impedance value substantially one half of an impedance value of the first output load. Therefore, a differential output signal may be outputted through a single output terminal.

Abstract: An active termination circuit is used to set the input impedance of a plurality of input terminals. Each of the input terminals is coupled to a supply voltage through at least one PMOS transistor and to ground through at least one NMOS transistor. The impedances of the transistors are controlled by a control circuit that generates a first control signal to set the impedance of another PMOS transistor to be equal to a first predetermined resistance, and generates a second control signal to set the impedance of another NMOS transistor to be equal to a second predetermined resistance. The first control signal is used to control all of the PMOS transistors and the second control signal is used to control all of the NMOS transistors. As a result, the PMOS and NMOS transistors coupled to each input terminal have impedances corresponding to the first and second resistances, respectively.

Abstract: Nanotube-based switching elements with multiple controls and circuits made from such. A switching element includes an input node, an output node, and a nanotube channel element having at least one electrically conductive nanotube. A control structure is disposed in relation to the nanotube channel element to controllably form and unform an electrically conductive channel between said input node and said output node. The output node is constructed and arranged so that channel formation is substantially unaffected by the electrical state of the output node. The control structure includes a control electrode and a release electrode, disposed on opposite sides of the nanotube channel element. The control and release may be used to form a differential input, or if the device is constructed appropriately to operate the circuit in a non-volatile manner. The switching elements may be arranged into logic circuits and latches having differential inputs and/or non-volatile behavior.

Abstract: A memory controller includes a transmit circuit coupled to an output node and a receive circuit coupled to an input node. The transmit circuit transmits first data to a memory device through the output node and the receive circuit is configured to receive second data from the memory device through the input node. The memory controller includes a calibration circuit and control logic coupled to the calibration circuit, where the calibration circuit and the control logic are configured to select a first reference voltage and a driver impedance for the transmit circuit and are configured to select a second reference voltage and a termination impedance for the receive circuit. The first reference voltage, the second reference voltage, the driver impedance and the termination impedance are selected from a set of pre-determined values, which are associated with different signaling modes for communication of the first data and the second data.

Abstract: An electronic memory device includes a bank of memories provided with a cache, a sequencer for providing physical access to said bank of memories, a physical interface for receiving high level memory access requests, a request manager between the physical interface and the sequencer, said request manager includes an input queue for storing the high level memory access requests and an arbitration function which takes account of the data of the cache and the data of the input queue to designate a request which is to be executed, thus allowing the memory bank, the sequencer and the request manager to be provided on a single chip, the physical interface providing the connection of the chip with the outside.

Abstract: A semiconductor device is capable of minimizing data skew among respective data which are transmitted to a receiver through respective data lines. The semiconductor device includes a synchronization unit connected to at least one portion of the respective data lines, for synchronizing time that the plurality of data transferred through the respective data lines take to arrive at the receiver.

Abstract: A data driver is presented in which the data driver includes a termination/pull-up driver and a pull-down driver. The termination/pull-up driver is configured to perform a termination operation and a pull-up operation at the same time for a data output terminal during an active interval of a semiconductor memory. The pull-down driver is configured to be activated when the semiconductor memory performs a read operation, and configured to pull down the output terminal in response to a level of an input data.

Abstract: The present invention discloses a read and match circuit for a low-voltage content addressable memory, wherein the write circuit inputs the signals needing storing into the memory cells, and the read circuit retrieves the stored signals from the memory cells, and the match circuit compares the data stored in the memory cell with the data searched by the match circuit. As the circuits for writing, reading and matching are separated from each other and exempt from mutual interference, the present invention can achieve high reliability and low power consumption under a low-voltage operation environment without using a special fabrication process. In the present invention, the circuit is optimized to meet different requirements. The present invention enables the user to determine whether to have high speed or to have low power consumption. Further, the present invention can overcome the problems of current leakage and noise allowance in a low-voltage environment.

Abstract: A data writing apparatus includes a distributed transmission unit configured to transmit first data and second data, having been aligned to have the same timing, to data lines at mutually different timings, and a data writing unit configured to synchronize the first data and the second data having been transmitted through the data lines and to write the synchronized data in a memory area.

Abstract: A nonvolatile memory, such as a write-once memory, includes a memory cell array that has first memory cells and at least one second memory cell. The memory also includes a first writing circuit that is capable of writing data to the first memory cells and the second memory cell, a second writing circuit, and a verify circuit which is capable of confirming whether the data is normally stored in the first memory cells. When the writing of data to one of the first memory cells fails, the second writing circuit is arranged to assign an address of the one of the first memory cells to the second memory cell. The first memory cells and the second memory cell are arranged to irreversibly change their electrical resistance when the data is stored in them. The first memory cells and the second memory cell include an organic compound layer interposed between a pair of electrodes.