Abstract: An active termination circuit is used to set the input impedance of a plurality of input terminals. Each of the input terminals is coupled to a supply voltage through at least one PMOS transistor and to ground through at least one NMOS transistor. The impedances of the transistors are controlled by a control circuit that generates a first control signal to set the impedance of another PMOS transistor to be equal to a first predetermined resistance, and generates a second control signal to set the impedance of another NMOS transistor to be equal to a second predetermined resistance. The first control signal is used to control all of the PMOS transistors and the second control signal is used to control all of the NMOS transistors. As a result the PMOS and NMOS transistors coupled to each input terminal have impedances corresponding to the first and second resistances, respectively.

Abstract: The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.

Abstract: A register file is often used within integrated circuitry to temporarily hold data. Sometimes this data needs to be retained within the register file for a period of time, such as when there is a stall operation. Conventional register files have utilized a hold multiplexor to perform such a stall operation. The multiplexor however inserts a delay that is undesirable in high performance integrated circuitry. The multiplexor is replaced with a tri-state inverter coupled to the global bit line of the register file, which minimizes this additional delay from the register file data access time.

Abstract: A semiconductor memory apparatus includes a clock generator configured to generate an internal clock signal, an asynchronous data input buffer configured to buffer a data input signal through a data pad to output a buffered data signal, and a synchronous data input buffer configured to buffer the buffered data signal synchronously with the internal clock signal, wherein a length of a line, through which the internal clock signal is transmitted to the synchronous data input buffer, is configured to be substantially the same with a length of a line, through which the buffered data is transmitted to the synchronous data input buffer.

Abstract: A data input/output circuit includes an output unit for outputting a first data strobe signal and first data in response to an internal clock generated in a delay locked loop, a first transmission line unit having a clock tree structure for transmitting the internal clock to the output unit, a second transmission line unit for transmitting the internal clock from the delay locked loop to the first transmission line unit, a duty cycle ratio correcting unit interconnected between the first transmission line unit and the second transmission line unit for correcting a duty cycle ratio of the internal clock, a data strobe signal input unit for receiving a second data strobe signal from an outside of a semiconductor memory device and generating an internal data strobe signal, and a plurality of data input units for outputting a second data in response to the internal data strobe signal.

Abstract: A system, method, and computer program product are provided for driving a memory circuit. In one embodiment, the memory circuit is driven utilizing a first resistance value in a first mode of operation. Further, in a second mode of operation, the memory circuit is driven utilizing a second resistance value. In another embodiment, a device is provided for driving a memory circuit without active termination utilizing a resistor.

Abstract: A semiconductor memory device includes an I/O line for transmitting read data that has been read from a memory cell, a plurality of driver circuits for driving the I/O line on the basis of the read data, a read circuit for receiving the read data transmitted through the I/O line, and an assist circuit for amplifying the read data transmitted through the I/O line. The assist circuit is disposed farther away from a prescribed drive circuit included in the plurality of drive circuits as viewed from the read circuit. The signal level can thereby rapidly change levels even in memories having relatively long I/O lines.

Abstract: A cell core unit and its peripheral circuit are driven by a relatively low voltage power supply. A constant voltage that does not depend on the power supply voltage is provided as a boosted voltage (VBOOST) to be supplied to a control signal for a word line of the cell core unit. A sense amplifier amplifies a higher voltage level of a bit line to the power supply voltage. Then, a circuit for generating a signal for defining the transition timing and/or the pulse width of a control signal from the peripheral circuit to the cell core unit performs signal delay using a delay circuit having a characteristic in which a delay time thereof decreases with reduction of the provided power supply voltage.

Abstract: A system includes a plurality of memory devices arranged in a fly-by topology, each of the memory devices having on-die termination (ODT) circuitry for connection to an address and control (RQ) bus. The ODT circuitry has at least one input for controlling termination of one or more signal lines of the RQ bus. Application of a first logic level to the at least one input enables termination of the one or more signal lines. Application of a second logic level to the at least one input disables termination of the one or more signal lines.

Abstract: An integrated circuitry operable in a normal and test mode has a processing circuit, an output circuit associated with the processing circuit and a storage with a plurality of memory cells. The output circuit is formed to process in normal mode an output signal of the processing circuit and to provide a processed output signal to an output terminal. The output circuit further provides in test mode a test signal as processed output signal based on a drive signal which may be supplied externally or from the processing circuit. The storage receives in test mode the test signal and performs an evaluation of a memory property of at least one memory cell of the plurality of memory cells based on the test signal, and, in response to this evaluation, to output an evaluation signal indicating the memory property of the at least one cell of the plurality of memory cells.

Abstract: A semiconductor device with a packaging circuit portion connected to a semiconductor chip therein. The semiconductor chip includes a plurality of pad electrodes, and the packaging circuit portion includes wiring connected to the pad electrodes on the semiconductor chip, mounting terminals, and a first signal path for receiving a signal output from the predetermined one of the pad electrodes and transmitting the signal to other one of the pad electrodes. The first signal path includes delay elements comparable to delays in a second signal path extending from the predetermined one of the mounting terminals to the other one of the mounting terminals through the semiconductor chip, and is disposed on a feedback path for phase comparison for synchronizing the phase of an output signal from the second signal path to the phase of an input signal to the second signal path.

Abstract: A circuit for reducing current leakage in hierarchical bit-line architectures includes a sense amplifier having transistors, the sense amplifier coupled to bit-lines of cells in a memory array, the sense amplifier configured for detecting stored data from one of the cells; an output latch having transistors, the output latch selectively coupled to a global bit-line of the sense amplifier having a logical state, the output latch configured for selectively reading out stored data from one of the cells through the global bit-line; and a transmission gating device coupled between the sense amplifier and the output latch for selectively coupling the sense amplifier to the output latch correspondingly eliminating a first leakage path and forming a second leakage path, the first leakage path being between the sense amplifier and the output latch, the second leakage path formed within the sense amplifier.

Abstract: An apparatus for removing crosstalk in a semiconductor memory device includes pads for receiving externally provided signals, transmission lines for delivering the signals received by each of the pads to corresponding elements in the apparatus, and capacitors, coupled between adjacent ones of the lines, for adjusting the transmission delay of the signals depending on a signal transmission mode between the adjacent lines.

Abstract: In some embodiments, a method, apparatus and system for global shared memory using serial optical memory are presented. In this regard, a memory device is introduced to circulate a signal among a plurality of optical emitters and receivers. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, a method, apparatus and system for n-dimensional sparse memory using serial optical memory are presented. In this regard, a memory device is introduced to circulate a signal among a plurality of optical emitters and receivers. Other embodiments are also disclosed and claimed.

Abstract: A power supply control circuit and a control method secure an accurate operation of a GIO in a burst data transmission having a high compression rate. The power supply control circuit of a semiconductor memory device includes: a counter which is reset in response to a read command signal or a write command signal to count an input clock and then, to output a counting completion signal; and a power supply enable signal generator enabled in response to the read command signal or the write command signal and disabled in response to the counting completion signal, for generating a power supply enable signal.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: An integrated circuit comprises a sampling circuit arranged at a data output of an operating section and operated by sampling edges, data packets appearing at the data output in response to a sequence of request commands, and a control section configured to produce the sampling edges, the control section comprising at least two transmission branches each comprising a copy of the operating section. Pulse trains are applied to the transmission branches which have the same waveform as the sequence of request commands and are delayed relative to one another, wherein the first pulse train is contemporaneous with the sequence of request commands. The sampling edges are produced from leading edges of the pulse trains which appear at the outputs of the transmission branches.

Abstract: A semiconductor memory device and a semiconductor memory system. The semiconductor memory device includes channels configured to transmit signals from a transmitter to a receiver, and a crosstalk compensator. The crosstalk compensator may be connected between the channels to compensate for crosstalk. The crosstalk compensator may comprise a capacitor connected in parallel between the channels, and a switching unit connected between the capacitor and one of the channels. The switching unit may control connections or disconnections between the capacitor and the channel. Therefore, the semiconductor memory device and the semiconductor memory system compensate for crosstalk occurring between transmitted signals that are out of phase with each other.

Abstract: A controller converts a parallel command signal and address signal, or a parallel write data signal into a first serial signal, and outputs the converted signal as a first optical signal with a single wavelength to a memory device via an optical transmission line. The memory device converts the first optical signal into the original parallel command signal, address signal, and write data signal, and outputs the converted parallel signals to a memory unit. The memory device converts a parallel read data signal from the memory unit into a second serial signal, and outputs the converted signal to the controller via the optical transmission line as a second optical signal with a single wavelength. It is unnecessary to transmit the optical signal using an optical multiplexer, an optical demultiplexer, etc., thereby improving transmission rate of signals transmitted between the controller and the memory device at minimum cost.

Abstract: A bus structure comprises a plurality of driver circuits, each driver circuit comprising an input for a first signal and a terminal for an output signal wherein each driver circuit is capable of providing the output signal at the terminal upon receipt of the first signal, a parallel bus comprising a plurality of output signal lines at a receiving end, being connectable to a target component, each of the signal lines extending at least from the receiving end to the terminal of a different one of the plurality of driver circuits, such that a length of the output signal line between the receiving end and the respective driver circuits decreases in a connection order among the plurality of driver circuits, and a signal line coupled to each of the inputs of the driver circuits in the connection order.

Abstract: The present invention provide circuits, methods, and apparatus directed to an integrated circuit having a memory interface that is configurable to have one of a multiple different bus widths. The memory interface has a first set of lines and a second set of lines. The first and second set of lines are arranged such that there are multiple locations at which a via may be placed to connect a line of the first set to a line of the second set. The placement of the vias determines the bus width of the memory interface.

Abstract: Methods and apparatus for setting various terminations of a memory chip. The memory chip includes a terminal, a termination circuit that can be connected to the terminal in order to terminate the terminal with a settable resistance value, a control command port for receiving a control command signal, and a control circuit that is connected to the termination circuit in order to set a resistance value as a function of a received control command signal.

Abstract: Semiconductor device and semiconductor memory device include a plurality of internal circuits configured to perform test operations in response to their respective test mode signals and a plurality of test-off units configured to control the test operations of the internal circuits to be disabled in response to a test-off signal.

Abstract: A semiconductor memory device for testing whether an ODT circuit is on or off during a data read mode includes an on-die termination (ODT) circuit and an ODT state information output unit. The ODT circuit includes at least one ODT resistor. The ODT state information output unit outputs an ODT state information signal indicating whether the ODT circuit is on or off, in response to an ODT control signal during a data read mode when data is output from memory cells. With a semiconductor memory device and method capable of testing whether an ODT resistor is on or off during a data read mode, it is possible to test whether an ODT circuit is on or off during reading of data.

Abstract: A voltage regulator provides an operation voltage to a memory system and a transient voltage supply adjusts the operation voltage provided by the voltage regulator during transient events of the memory system.

Abstract: A fuse peripheral circuit includes a fuse, a potential difference imparting circuit, a potential difference reducing circuit, a terminal, a memory circuit, a transfer gate, and a logic gate. The logic gate is connected to the input end of the transfer gate. The logic gate serves as a transmission prevention circuit preventing a signal stored in the memory circuit from being transmitted to the fuse, when the disconnection judgment takes place.

Abstract: A memory module having a DRAM device configured to generate a low DQS state on a DQS line, and a buffer coupled to the DRAM device, the buffer having a plurality of drivers, wherein the buffer is configured to detect the low DQS state by comparing the low DQS state to a low voltage level of one of the plurality of drivers.

Abstract: Programmable logic device integrated circuits with differential communications circuitry are provided in which the differential communications circuitry is used to support programming, testing, and user mode operations. Programming operations may be performed on a programmable logic device integrated circuit by receiving configuration data with the differential communications circuitry and storing the received configuration data in nonvolatile memory. The nonvolatile memory may be located in an external integrated circuit such as a configuration device or may be part of the programmable logic device integrated circuit. The stored configuration data may be loaded into configuration memory in the programmable logic device to program the device to perform a desired custom logic function. The differential communications circuitry may be used to handle boundary scan tests and programmable scan chain tests. During user mode operations the differential communications circuitry carries user data traffic.

Abstract: A semiconductor memory device having read and write operations includes a discrimination signal generating unit for generating a discrimination signal during the write operation; and a selective delay unit for receiving and selectively delaying a command-group signal in response to the discrimination signal.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.

Abstract: A memory device having a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information or time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: A memory device having a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information, and time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: A semiconductor device comprises a memory cell block and a sense amplifier zone. A selection gate included in the sense amplifier zone is turned on for selectively coupling the memory cell block with the sense amplifier zone. Local drivers are dispersively arranged on a BLI wire transmitting a gate control signal, and a driver is arranged on an end of the BLI wire. The driver pulls down the potential of the BLI wire at a high speed.

Abstract: Disclosed is a nonvolatile memory device using a variable resistive element, and a data read circuit for use in variable resistive memory devices. More specifically, embodiments of the invention provide a data read circuit with one or more decoupling units to remove noise from one or more corresponding control signals. For instance, embodiments of the invention remove noise from a clamping control signal, a read bias control signal, and/or precharge signal. The disclosed decoupling units may be used alone or in any combination. Embodiments of the invention are beneficial because they can increase sensing margin and improve the reliability of read operations in memory devices with variable resistive elements.

Abstract: A ZQ calibration circuit performs a ZQ calibration additionally in an initial operation of a semiconductor memory device. The ZQ calibration controller of the ZQ calibration circuit includes a first signal generator, a second signal generator, and a control unit. The first signal generator generates a pre-calibration signal during an initialization of the semiconductor memory device. The second signal generator generates ZQ calibration signals in response to a ZQ calibration command. The control unit outputs signals to control a ZQ calibration in response to the pre-calibration signal and the ZQ calibration signals.

Abstract: A memory device has multiple bi-directional data paths. One of the multiple bi-directional data paths is configured to transfer data at one speed. Another one of the multiple bi-directional data paths is configured to transfer data at another speed. The memory device has different modes. Depending on a certain mode, the memory device uses different combinations of the multiple bi-directional data paths to transfer data either at a single speed or at multiple speeds. In some cases, the data represents data information to be stored in memory cells of the memory device. In other cases, the data represents control information and feedback information to be transferred to and from internal circuits, besides the memory cells, of the memory device.

Abstract: A memory device includes a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information or time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: The present invention provides a power supply control circuit and a control method thereof, capable of securing an accurate operation of a GIO in a burst data transmission having a high compression rate. The power supply control circuit of a semiconductor memory device includes: a counter which is reset in response to a read command signal or a write command signal to count an input clock and then, to output a counting completion signal; and a power supply enable signal generator enabled in response to the read command signal or the write command signal and disabled in response to the counting completion signal, for generating a power supply enable signal.

Abstract: A device includes a number of terminals for transferring input data and output data to and from a memory array. The memory device includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information or time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: A semiconductor memory device with a mirror function enables two memory devices such as two DRAMs to share the same address and control signals. A pair of semiconductor memory devices are mounted on both sides of a substrate to be symmetrical to each other. A mirror function transfers a first transmission signal and a second transmission signal input on respective pads to any one of a mirror “on” path and a mirror “off” path. The mirror function can vary or reduce path delay differences between the mirror function “on” path and the mirror function “off” path by means of the delay and the mixture of phases in the semiconductor memory device, and reduce skew occurred in the operation of the mirror function.

Abstract: A double-data-rate two synchronous dynamic random access (DDR2) memory circuit includes a low-speed input path and a high-speed input path coupled thereto by an input coupling and forming a common input, the common input coupled to a memory core, the memory core having a common output wherein a high-speed output path and a low-speed output path are coupled together by an output coupling and further coupled to the common output of the memory core.

Abstract: A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.

Abstract: An embodiment of the present invention receives a data signal and at least one data shift signal that facilitates adjustment of the data signal and produces a resulting data signal with a data rate greater than a data rate of the data signal.

Abstract: An active termination circuit is used to set the input impedance of a plurality of input terminals. Each of the input terminals is coupled to a supply voltage through at least one PMOS transistor and to ground through at least one NMOS transistor. The impedances of the transistors are controlled by a control circuit that generates a first control signal to set the impedance of another PMOS transistor to be equal to a first predetermined resistance, and generates a second control signal to set the impedance of another NMOS transistor to be equal to a second predetermined resistance. The first control signal is used to control all of the PMOS transistors and the second control signal is used to control all of the NMOS transistors. As a result, the PMOS and NMOS transistors coupled to each input terminal have impedances corresponding to the first and second resistances, respectively.

Abstract: The invention relates to a procedure and a device for measuring memory cell currents, in particular for non-volatile memory components, where the device has a current mirroring device for mirroring a current flowing through a memory cell when it is being read, and delivering an analog current signal generated during the mirroring, or an analog current signal derived from it, to an analog output pad of a memory component.

Abstract: A control signal training system in an integrated circuit comprises a signal transmitting unit, the signal transmitting unit outputting control signals and sampling clock signals, the control signals and the sampling clock signals having a predetermined time phase with respect to each other, a signal receiving unit, the signal receiving unit latching control signals in relation to the sampling clock signals, and an evaluation unit connected to a reading unit and the signal transmitting unit, the evaluation unit determining concordance of the control signals outputted by the signal transmitting unit and the control signals read out by the reading unit from the signal receiving unit, the evaluation unit adapting the time phase between the control signals and the sampling clock signals step-by-step until concordance of the control signals outputted by the signal transmitting unit and the control signals read out the reading unit from the signal receiving unit is determined by the evaluation unit.

Abstract: Apparatuses and methods for transmitting and receiving a data signal on a line pair having a first transmission line and a second transmission line are provided. In one embodiment, a data signal which represents the data to be transmitted by means of a sequence of first and second signal levels is applied to the first transmission line, and a reference signal which changes between a first and a second reference level only when a level change between the first and the second signal level is suppressed between two successive signal levels of the data signal on the first transmission line is applied to the second transmission line.

Abstract: A semiconductor memory module (1) includes a circuit substrate (2), a first (100), a second (200), a third (300) and a fourth (400) rank of memory chips (3), a first register (10) and a second register (20). The first register (10) and the second register (20) each comprise a first input (11, 21) for receiving a respective chip select signal (CS0, CS2), a second input (12, 22) for receiving a respective other chip select signal (CS1, CS3) at least one third input (13, 23) for receiving command/address signals (CA), and at least one third output (16, 26).