Abstract: Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.

Abstract: Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. Formation of printed objects having various colors may sometimes be desirable. Thermoplastic particulates incorporating a color-changing material capable of forming different colors under specified activation conditions may impart different colors to a printed object. Such particulate compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer and a color-changing material associated with the thermoplastic particulates, wherein the color-changing material is photochromic and thermochromic. Conjugated diynes, such as 10,12-pentacosadiynoic acid or a derivative thereof, may be particularly suitable color-changing materials having photochromic and thermochromic properties for forming a range of colors upon a printed object.

Abstract: A method for producing a polyimide precursor having a structural unit represented by the following formula (1), comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond: (i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and (ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1): wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):

Abstract: A method of manufacturing a semiconductor device includes placing a polymer raw material mixture over a substrate. The polymer raw material may include a polymer precursor, a photosensitizer, and an additive. The polymer raw material mixture is exposed to radiation to form a dielectric layer and cured at a temperature of between about 150° C. and about 230° C.

Abstract: A photosensitive resin composition including a polyamide-imide resin having a specific structure, a film comprising a cured product of the photosensitive resin composition, a method for preparing the film and a method for forming a resist pattern using the photosensitive resin composition.

Abstract: The present invention relates to a series of novel polymerizable compounds based on 3-ketocoumarins, which are useful as photoinitiators and sensitizers, to compositions comprising said compounds and to a process for photopolymerizing comprising them.

Abstract: Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. Formation of printed objects having various colors may sometimes be desirable. Thermoplastic particulates incorporating a color-changing material capable of forming different colors under specified activation conditions may impart different colors to a printed object. Such particulate compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer and a color-changing material associated with the thermoplastic particulates, wherein the color-changing material is photochromic and thermochromic. Conjugated diynes, such as 10,12-pentacosadiynoic acid or a derivative thereof, may be particularly suitable color-changing materials having photochromic and thermochromic properties for forming a range of colors upon a printed object.

Abstract: A method of manufacturing an electronic device includes preparing a solder mask with a radiation curable solder mask inkjet ink containing at least one cationic polymerizable compound and a photoinitiating system, wherein the photoinitiating system includes a specified sulphonium compound and a thioxanthone.

Abstract: Techniques herein include processes and systems by which a reproducible CD variation pattern can be mitigated or corrected to yield desirable CDs from microfabrication patterning processes, via resolution enhancement. A repeatable portion of CD variation across a set of wafers is identified, and then a correction exposure pattern is generated. A direct-write projection system exposes this correction pattern on a substrate as a component exposure, augmentation exposure, or partial exposure. A conventional mask-based photolithographic system executes a primary patterning exposure as a second or main component exposure. The two component exposures when combined enhance resolution of the patterning exposure to improve CDs on the substrate being processed without measure each wafer.

Abstract: A resist composition including a resin component whose solubility in a developing solution is changed due to an action of an acid, in which the resin composition has a constitutional unit derived from a compound containing a chain-like aliphatic acid dissociable group or a monocyclic aliphatic acid dissociable group and a constitutional unit derived from a compound containing an aromatic hydrocarbon group-containing acid dissociable group.

Abstract: In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprises 10-70 wt. % cyclopolymerizable monomer, based on the total weight of the ink. The cyclopolymerizable monomer comprises a first ethenyl or ethynyl moiety and a second ethenyl or ethynyl moiety. Additionally, the ?-carbon of the first ethenyl or ethynyl moiety and the ?-carbon of the second ethenyl or ethynyl moiety have a 1,5-, 1,6-, 1,7-, or 1,8-relationship.

Abstract: A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.

Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.

Abstract: The rinsing composition for a silicon wafer of the present invention contains: a water-soluble polymer A containing a constitutional unit A having a betaine structure; and an aqueous medium. The water-soluble polymer A preferably contains a constitutional unit expressed by Formula (1) below. The water-soluble polymer preferably further contains a constitutional unit B expressed by Formula (2) below. The weight average molecular weight of the water-soluble polymer A is preferably 1,000 or more and preferably 3,000,000 or less. The rinsing composition for a silicon wafer of the present invention contains a pH regulator as needed.

Abstract: Thermal protective materials suitable for use in a spacecraft include a substrate, such as carbon fibers or carbon felt, and cyanate ester resin or phthalonitrile resin, and cross-linkers. These thermal protective materials have a density of about 0.2 to about 0.35 g/cm3. Methods of making the thermal protective materials include mixing a cyanate ester resin or a phthalonitrile resin and a cross-linker to result in a resin solution, infusing the resin solution into a substrate, and curing the resin to result in the thermal protective material.

Abstract: In an example, a halftone screen is generated. A plurality of amplitude-modulated dot clusters is arranged in correspondence with a grid. Each of the amplitude-modulated dot clusters comprises a plurality of frequency-modulated dots.

Abstract: The present invention has an object to provide a pattern forming method capable of providing good DOF and EL, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method of the present invention includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer to form a pattern, in which the active-light-sensitive or radiation-sensitive resin composition contains a hydrophobic resin.

Abstract: The present invention relates to a modified polyimide including a terminal group represented by Formula 1: wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

Abstract: An organic layer composition, an organic layer, and associated methods, the composition including a polymer that includes a moiety represented by Chemical Formula 1, a monomer represented by Chemical Formula 2, and a solvent,

Abstract: A resist composition is provided comprising a polymer comprising recurring units (a) having a succinimide structure and recurring units (b) containing a group capable of polarity switch with the aid of acid. The resist composition suppresses acid diffusion, exhibits a high resolution, and forms a pattern of satisfactory profile with low edge roughness.

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

Abstract: Techniques and mechanisms to reduce toxicity in manufacturing of a polyamideimide and polyamide amic acid resin polymer. In an embodiment, a polyamideimide is produced using at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from the group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ?-caprolactone and methylcyclohexane.

Abstract: The present invention relates to a polarizing plate including: a polarizer; and a protective layer formed on at least one surface of the polarizer, in which the protective layer is a cured product of a radical curable composition including: (A) a radical polymerizable compound having at least one hydrophilic functional group in a molecule thereof; (B) a phosphate-based compound having three (meth)acryl groups in a molecule thereof; and (C) a radical initiator, and an image display device including the same.

Abstract: Provided are a curable coloring composition which is useful for formation of a colored pattern of a color filter, having high heat resistance, excellent solvent resistance, and a high voltage holding ratio; a color filter; a method for manufacturing a color filter; a solid-state image pickup element; a picture display device; and a triarylmethane compound. The curable coloring composition includes a triarylmethane compound having a structure represented by the following General Formula (1) and a structure represented by the following General Formula (2) in the same molecule.

Abstract: The invention relates to a composition and to a process for producing the composition comprising (meth)acrylamido-functional siloxanes, and to the use thereof.

Abstract: A method of stabilizing a fluorine-containing acid amplifier.

Abstract: A pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed. A developer solution used in developing the exposed resist film includes no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a first polymer and a radiation-sensitive acid generator. The first polymer includes a first structural unit having an acid-labile group and an alicyclic group. The alicyclic group is capable of avoiding dissociation from a molecular chain by an action of an acid.

Abstract: A pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed. A developer solution used in developing the exposed resist film includes no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a first polymer and a radiation-sensitive acid generator. The first polymer includes a first structural unit having an acid-labile group and an alicyclic group. The alicyclic group is capable of avoiding dissociation from a molecular chain by an action of an acid.

Abstract: A resin comprising: a structural unit which has, at a side chain, a carbonyl group and a thiolactone ring-containing amino group where the thiolactone ring may have a substituent, and a structural unit having an acid-labile group.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: There is provided a pattern forming method including: (a) a process of forming a film by resin (P) having a repeating unit (a) having a cyclic structure and a partial structure represented by the following Formula (I), (II-1) or (II-2), and a repeating unit (b) having a group which decomposes by the action of an acid to generates a polar group, and an actinic ray-sensitive or radiation-sensitive resin composition containing compound (B) which generates acid upon irradiation with an actinic ray or radiation; (b) a process of exposing the film; and (c) a process of forming a negative-type pattern by performing development using a developer including an organic solvent, an actinic ray-sensitive or radiation-sensitive resin composition used therefor, a resist film, a method of manufacturing an electronic device, and an electronic device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor including a functional group at a terminal end thereof, wherein the functional group is dissociated by light of about 400 nm to about 550 nm wavelength region and is acidified; (B) a photosensitive diazoquinone compound; and (C) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition.

Abstract: A photosensitive compound represented by formula (1) or formula (2). (Chemical formula 1) (In formula (1) and formula (2), n is an integer of 1-3; R1 is a linear or branched alkyl group having 1-6 carbon atoms or an alkylene group having 2-6 carbon atoms formed from two R1 together; R2 is —NR3R4; R3 and R4 are each independently a linear or branched alkyl group or alkenyl group having 1-6 carbon atoms, a linear or branched alkylene group having 2-6 carbon atoms formed by R3 and R4 together, or a linear or branched alkylene group or alkenylene group having 3-8 carbon atoms optionally containing an oxygen atom or nitrogen atom.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: Lithographic printing plates and processes for preparing the lithographic printing plates are provided. The plates have excellent printing durability, staining resistance and staining resistance over time. The lithographic printing plate precursor includes: a substrate; a photosensitive layer provided on the substrate; and an extra layer optionally provided between the substrate and the photosensitive layer. The photosensitive layer or the extra layer adjacent to the substrate contains (A) a copolymer. The copolymer (A) includes: (a1) a repeating unit of formula (a1-1) below in a side chain, and (a2) a repeating unit having at least one of the structures represented by formulae (a2-1) to (a2-6) shown in the specification in a side chain. L1, Z1, R1, and R21, R22 and R23 in formula (a1-1) and the variables in formulae (a2-1) to (a2-6) are as defined in the specification.

Abstract: Embodiments in accordance with the present invention encompass water soluble polycyclic vinyl addition polymers having a norbornene type repeat unit derived from a norbornene type of monomer that encompasses a saccharide functional moiety. Embodiments in accordance with the present invention also encompass low and high molecular weight polymers with low catalyst loading.

Abstract: A resist composition including a base component which exhibits changed solubility in a developing solution under action of acid and an acid generator which generates acid upon exposure, the base component containing a polymeric compound containing a structural unit represented by general formula (a0-1) and the acid generator containing a compound represented by general formula (b1). In the formulae, R represents H, an alkyl group of C1 to 5 or a halogenated alkyl group of C1 to 5; Ya1 represents a single bond or a divalent linking group; La1 and La2 represents —SO2— or —C(?O)—; Ra1 represents a cyclic group which may have a substituent and the like; n1 and n2 represents 0 or 1; R11 represents a cyclic group of C5 to 30 which may have a substituent; V11 represents a single bond or an alkylene group of C1 to 6; L11 represents an ester bond; Y11 represents an alkylene group of C1 to 5 which may have a fluorine atom; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m.

Abstract: A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.

Abstract: A polyimide precursor and a polyimide precursor resin composition, the polyimide precursor having repeating units represented by formula (1) and a photosensitive resin composition comprising the polyimide precursor and a photoacid generator or photobase generator: where R1 is a tetravalent organic group; R2 is a divalent organic group; R1s may be the same or different from each other and R2s may be the same or different from each other in the repeating units; R3 and R4 respectively represent a monovalent organic group having a structure represented by formula (2) and may be the same or different from each other; and R3s and R4s in the repeating units may be the same or different from each other, respectively. R5, R6, R7 and R8 are as described in the specification.

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.

Abstract: To provide a lithographic printing plate precursor which is excellent in the gum development property, running processing property and scratch resistance and a lithographic printing plate precursor which is good in all performances of the on-press development property, ink receptivity, sensitivity and printing durability, and a method of producing thereof. A lithographic printing plate precursor has a support, an image-recording layer containing a radical polymerization initiator and a radical polymerizable compound, and an overcoat layer containing a polymer resin which has a cloud point in an aqueous solution and includes a monomer unit containing at least any of an amino group and an amido bond, in this order.

Abstract: Disclosed are a pigment dispersion composition including a pyridone azo-based compound including a monomer represented by the following Chemical Formula 1, a polymer including a repeating unit represented by the following Chemical Formula 2, or a combination thereof, wherein each substituents of Chemical Formulae 1 and 2 are the same as defined the detailed description, (B) a pigment, (C) a binder resin, (D) a dispersing agent, and (E) a solvent; a photosensitive resin composition including the same; and a color filter including the same.

Abstract: A pattern forming method including: (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) having a repeating unit having a group generating a polar group upon being decomposed by the action of an acid, and a repeating unit having an aromatic group, a compound (B) generating an acid upon irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film; and (iii) developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the resin (A) is a resin having a repeating unit having a naphthyl group, and the like, and/or the actinic ray-sensitive or radiation-sensitive resin composition contains a compound (D) having a naphthalene ring, and the like.

Abstract: Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a dye represented by the following Chemical Formula 1, (B) an alkali soluble resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent.

Abstract: A negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the resin composition; a cured film, an insulating film, a color filter formed using resin composition; and a display device provided with the cured film, insulating film, or color filter. The resin composition contains a compound represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.

Abstract: The present invention provides a composition for forming a bottom anti-reflective coating, and also provides a photoresist pattern formation method employing that composition. The composition gives a bottom anti-reflective coating used in a lithographic process for manufacturing semiconductor devices, and the coating can be developed with a developing solution for photoresist. The composition contains a solvent, a polymer having a condensed polycyclic aromatic group, and a compound having a maleimide derivative or a maleic anhydride derivative. The composition may further contain a photo acid generator or a crosslinking agent.

Abstract: There are disclosed sulfonic acid precursor compositions, as are methods of using these compositions in, for example, photolithography. Other embodiments are also disclosed.

Abstract: A positive-working lithographic printing plate precursor is disclosed which comprises on a support having a hydrophilic surface or which is provided with a hydrophilic layer a heat and/or light-sensitive coating including an infrared absorbing agent and a compound including a benzoxazine group.

Abstract: The present invention provides a polymer compound represented by the following Formula (1) and a method for production thereof, a pigment dispersant, a pigment dispersion composition, and a photocurable composition respectively using the polymer compound, and a color filter and a method for production thereof [R1: an organic linking group having a valency of (m+n); R2: a single bond or a divalent organic linking group; A1: a monovalent organic group containing at least one moiety selected from an organic dye structure, a heterocyclic structure, an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, an alkoxysilyl group, an epoxy group, an isocyanate group, and a hydroxyl group; m=1 to 8, n=2 to 9 (m+n=3 to 10); and P1: polymer skeleton].