Abstract: A lithographic printing plate precursor comprises an imageable layer comprising a free radically polymerizable component, an initiator composition capable of generating free radicals upon exposure to imaging infrared radiation, an infrared radiation absorbing dye that is defined by Structure (I) shown in the disclosure, which dyes comprise one or more ethylenically unsaturated polymerizable groups in an organic group that is attached to the methine chain. These infrared radiation absorbing dyes exhibit a reduced tendency to crystallize in the imageable layers in the presence of tetraaryl borate counter anions and therefore provide improved shelf life.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition capable of forming a hole pattern which has an ultrafine pore diameter (for example, 60 nm or less) and has an excellent cross-sectional shape with excellent local pattern dimensional uniformity; and a resist film, a pattern forming method, a method for preparing an electronic device, and an electronic device, each using the same, are provided.

Abstract: A negative-working lithographic printing plate precursor is disclosed that can be developed on the press without going through a development processing step, and a method of lithographic printing is also disclosed that uses this negative-working lithographic printing plate precursor. Also disclosed are a negative-working lithographic printing plate precursor that can be developed by a water-soluble resin-containing aqueous solution and a method of lithographic printing that uses this negative-working lithographic printing plate precursor. A negative-working lithographic printing plate precursor is provided that exhibits an excellent fine line reproducibility in nonimage areas even when printing is performed using ultraviolet-curing ink (UV ink). Also provided is a negative-working lithographic printing plate precursor that exhibits an excellent combination of fine line reproducibility and printing durability and that resists the production of scum during on-press development.

Abstract: A photoresist composition for a color filter is provided which includes a) a coloring agent, b) a binder resin, c) a photopolymerization initiator, d) a photopolymerizable monomer, and e) a solvent, wherein a siloxane-based material is bonded to the binder resin.

Abstract: Provided are novel symmetrical and asymmetrical bifunctional photodecomposable bases (PDBs) with dicarboxylate anion groups that show increased imaging performance. Also provided are photoresist compositions prepared with the bifunctional dicarboxylated PDBs and lithography methods that use the photoresist compositions of the present invention.

Abstract: A lithographic printing plate precursor includes, in the following order: a support; an image-recording layer which is capable of forming an image by removing an unexposed area by an automatic development processor in the presence of a developer having pH of from 2 to 14 after exposure and contains (A) a sensitizing dye, (B) a polymerization initiator, (C) a polymerizable compound and (D) a polymer which is insoluble in water and alkali-soluble; and a protective layer, and the protective layer contains (E) a hydrophilic polymer which has a repeating unit represented by the formula (1) as defined herein and a repeating unit represented by the formula (2) as defined herein and a sum of the repeating unit represented by the formula (1) and the repeating unit represented by the formula (2) is at least 95% by mole based on total repeating units constituting the polymer.

Abstract: Provided is a method of forming a pattern, including forming an actinic-ray- or radiation-sensitive resin composition into a film, the actinic-ray- or radiation-sensitive resin composition including a resin (A) including a repeating unit containing a group that when acted on by an acid, is decomposed to thereby produce a polar group and including an aromatic group, which resin when acted on by an acid, decreases its solubility in an organic solvent, a nonionic compound (B) that when exposed to actinic rays or radiation, generates an acid and a solvent (C), exposing the film to actinic rays or radiation, and developing the exposed film with a developer including an organic solvent to thereby form a negative pattern.

Abstract: A negative pattern is formed by coating a resist composition comprising a methylol-substituted urea, amide or urethane compound, a polymer comprising recurring units having an acid labile group-substituted hydroxyl group, and an acid generator onto a substrate, prebaking, exposing to high-energy radiation, and developing in an organic solvent developer such that the unexposed region of resist film is dissolved away and the exposed region of resist film is not dissolved. In image formation via positive/negative reversal by organic solvent development, the resist film is characterized by a high dissolution contrast between the unexposed and exposed regions.

Abstract: The invention provides a planographic printing plate precursor that is capable of providing a planographic printing plate in which ablation at the time of infrared laser exposure is inhibited and which has excellent developability of a non-image portion and printing durability of an image portion. The photosensitive planographic printing plate precursor, includes: an image recording layer on a hydrophilic support, the image recording layer including: (A) an infrared absorber; and (B) a copolymer having a repeating unit having a zwitterionic structure in a side chain thereof, and a repeating unit having a heteroalicyclic structure or a repeating unit having a hetero atom and an alicyclic structure in the main chain thereof.

Abstract: A positive resist composition comprising a polymer having carboxyl groups substituted with an acid labile group having formula (1) exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a good pattern profile and minimal edge roughness. In formula (1), A is —(CR22)m—, B is —(CR52)n—, R2 and R5 are hydrogen or alkyl, m and n are 1 or 2, R3 is alkyl, alkenyl, alkynyl or aryl, R6 is alkyl, alkoxy, alkanoyl, alkoxycarbonyl, hydroxyl, nitro, aryl, halogen, or cyano, and p is 0 to 4.

Abstract: The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

Abstract: Disclosed are a photosensitive composition containing an aqueous dispersion and having excellent storage stability, and a photosensitive lithographic printing plate material using the photosensitive composition and being capable of being developed using water, which is advantageous not only in that the photosensitive lithographic printing plate material exhibits high sensitivity and high image quality as well as excellent storage stability, but also in that even when the printing plate material is repeatedly subjected to developing treatment using water, the generation of sludge derived from the photosensitive composition in the developer repeatedly used is suppressed, achieving excellent developing properties.

Abstract: The actinic ray-sensitive or radiation-sensitive resin composition according to the present invention includes a resin (A) which contains at least one type of repeating unit which is represented by the general formula (PG1), at least one type of repeating unit which is selected from the repeating units which are represented by the general formula (PG2) and the general formula (PG3), and at least one type of repeating unit which includes a lactone structure, a compound (B) which is a compound which is represented by the general formula (B1) and where the molecular weight of an anion moiety is 200 or less, and a solvent (C).

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, (B) an onium salt containing a nitrogen atom in its cation moiety, which onium salt when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, and (C) a compound that when exposed to actinic rays or radiation, generates an acid, the compound being any of compounds of general formulae (1-1) and (1-2) below.

Abstract: The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.

Abstract: The invention provides a colored composition including a dye multimer having an alkali-soluble group as a dye, the dye multimer having a weight-average molecular weight (Mw) of from 5,000 to 20,000 and a dispersity (weight-average molecular weight (Mw)/number-average molecular weight (Mn)) of from 1.00 to 2.50.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: To provide a process for producing an azo pigment showing excellent coloring characteristics such as tinctorial strength and hue and showing excellent fastness such as light fastness and ozone fastness, an azo pigment dispersion, a coloring composition, and an ink for inkjet recording. A process for producing, for example, an azo pigment represented by the general formula (9), which includes a step of preparing a solution containing a compound represented by the following general formula (7) and an acid, and a step of bringing the solution incontact with a diazonium salt (8) derived from a heterocyclic amine.

Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).

Abstract: To provide a resist composition capable of prevention of the formation of abnormal resist pattern shapes for efficient, high-precision formation of fine, high-resolution resist patterns, a resist pattern forming process capable of efficient, high-precision formation of finer, high-resolution resist patterns by using the resist composition, and a method for manufacturing a semiconductor device. The resist composition of the present invention includes a base resin, a photoacid generator, a first additive, and a second additive, wherein the pKa of the second additive is higher than the pKa of the first additive, and at a resist formation temperature, the vapor pressure of the second additive is lower than the vapor pressure of the first additive.

Abstract: A sulfonate resin according to the present invention has a repeating unit of the following general formula (3): where X each independently represents a hydrogen atom or a fluorine atom; n represents an integer of 1 to 10; R represents a hydrogen atom, a halogen atom or a C1-C3 alkyl or fluorine-containing alkyl group; J represents a divalent linking group; and M+ represents a monovalent cation. This sulfonate resin contains a sulfonic acid onium salt in a side chain thereof, with an anion moiety of the sulfonic acid onium salt fixed to the sulfonate resin, and thus functions as a resist resin with good resist characteristics such as DOF, LER, sensitivity and resolution.

Abstract: A positive photosensitive resin composition that forms an image for a liquid crystal display device and an organic EL display device, for example. The resin is made of a cured film that is highly water repellent and highly oleophobic on the surface. The resin has insulating properties, retains an excellent image and causes no reflow, for example, when being cured to form a film having excellent reworkability. A positive photosensitive resin composition comprising component (A), component (B), component (C) and component (D); Component (A) is an acrylic polymer containing an acid dissociable group, an aliphatic hydroxy group, and an N-substituted maleimide group; Component (B) is an acrylic polymer containing an acid dissociable group and a blocked isocyanate group; Component (C) is an acrylic polymer containing an acid dissociable group, an aliphatic hydroxy group, a C3-10 fluoroalkyl group, and a silyl ether group, and Component (D) is a photoacid generator.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: The present invention provides a photosensitive flexographic printing original plate provided with a heat sensitive mask layer having high light blocking effect and durability yet prepared as a thin film. A photosensitive flexographic printing original plate including at least (A) a supporting member, (B) a photosensitive resin layer, (C) a protective layer and (D) a heat sensitive mask layer that are successively laminated, wherein the heat sensitive mask layer (D) contains carbon black and, as a dispersion binder therefor, a butyral resin as well as polyamide containing polar group selected from the group consisting of polyamide containing a tertiary amine group, polyamide containing a quaternary ammonium salt group, polyamide containing an ether group and polyamide containing a sulfonic group.

Abstract: Disclosed are a novel compound, a pigment dispersion composition including the same, a photosensitive resin composition including the same, and a color filter using the same.

Abstract: The invention provides a pigment dispersion composition including an azo pigment represented by formula (1), in which the azo pigment represented by formula (1) does not have an ionic hydrophilic group, an azo pigment derivative and a dispersant. In formula (1), G represents a hydrogen atom, an aliphatic group, an aryl group or a heterocyclic group; R1 represents an amino group, an aliphatic oxy group, an aliphatic group, an aryl group or a heterocyclic group; R2 represents a substituent; A represents a heterocyclic group; m represents an integer of 0 to 5; and n represents an integer of 1 to 4, wherein: when n=2, the azo pigment is a dimer formed via R1, R2, A or G; when n=3, the azo pigment is a a trimer formed via R1, R2, A or G; and when n=4, the azo pigment is a tetramer formed via R1, R2, A or G.

Abstract: A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.

Abstract: A positive-working lithographic printing plate precursor is disclosed which comprises on a support having a hydrophilic surface or which is provided with a hydrophilic layer a heat and/or light-sensitive coating including an infrared absorbing agent, said heat and/or light-sensitive coating comprising a first layer comprising a binder including a monomeric unit including a sulfonamide group; characterized in that the binder further comprises a monomeric unit including a phosphonic acid group or a salt thereof, and that the monomeric unit comprising the phosphonic acid group is present in an amount comprised between 2 mol % and 15 mol %.

Abstract: A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and R1 and R2 each independently represents fluoroalkyl group having 1 to 3 carbon atoms.

Abstract: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains (A) a resin capable of increasing the solubility in an alkaline developer by the action of an acid, and (C) at least one selected from the group of compounds represented by the following formula (ZI-3), (ZI-4) or (ZI-5) and capable of generating an acid upon irradiation of actinic rays or radiation, wherein the resin (A) contains at least one repeating unit having a group capable of decomposing by the action of an acid to leave a leaving group having a ring structure, and the leaving group having a ring structure has at least one of a polar group as a substituent and a polar atom as a part of the ring structure, and a compound derived from the leaving group having a ring structure has a log P value of not less than 0 and less than 2.8.

Abstract: A composition for forming a resist underlayer film to be used in a lithography process, that includes: a polymer containing unit structures of Formula (1), Formula (2), and Formula (3): the polymer being a polymer in which the unit structure of Formula (1) has a ratio of mole number (a) within a range of 0.20?a?0.90, the unit structure of Formula (2) has a ratio of mole number (b) within a range of 0.05?b?0.60, and the unit structure of Formula (3) has a ratio of mole number (c) within a range of 0.001?c?0.40, when a total mole number of all unit structures constituting the polymer is 1.0, and the polymer having a weight average molecular weight of 3,000 to 100,000; a crosslinkable compound; a photoacid generator; and a solvent.

Abstract: Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350° C. or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.

Abstract: Provided is a radiation-sensitive colored composition that enables formation of color cured films in which color concentration unevenness is inhibited and which have uniform color and exhibit a superior development property and excellent pattern formability in the formation of color patterns. The radiation-sensitive colored composition contains (A) a dye polymer containing a structural unit having a dye structure polymerized using a chain-transfer agent having a LogP value of 5 or less, and (B) a solvent.

Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” indicates a bonding hand bonded to R1.

Abstract: A lithographic printing plate precursor includes, in the following order: a support; an image-recording layer which is capable of forming an image by removing an unexposed area of the image-recording layer with at least one of printing ink and dampening water on a printing machine after exposure and contains an infrared absorbing dye, a polymerization initiator, a polymerizable compound and a binder polymer having an alkylene oxide group; and a protective layer containing a hydrophilic polymer which contains at least a repeating unit represented by the formula (1) as defined herein, a repeating unit represented by the formula (2) as defined herein, and a repeating unit represented by the formula (4) as defined herein, and in which a content of the repeating unit represented by the formula (4) is from 0.3 to 5.0% by mole based on total repeating units of the hydrophilic polymer.

Abstract: A polymer comprising 0.5-10 mol % of recurring units having acid generating capability and 50-99.5 mol % of recurring units providing for dissolution in alkaline developer is used to formulate a chemically amplified negative resist composition. When used in a lithography process, the composition exhibits a high resolution and forms a negative resist pattern of a profile with minimized LER and undercut.

Abstract: A composition. The composition includes a polymer and a photosensitive acid generator capable of generating a first amount of acid upon exposure to a first dose of radiation and a second amount of acid upon exposure to a second dose of radiation. The second amount of acid is greater than the first amount of acid. The second dose is greater than the first dose. The composition includes a photosensitive base generator capable of generating a first amount of base upon exposure to the first dose and a second amount of base upon exposure to the second dose, where the first amount of base is greater than the first amount of acid and the second amount of base is less than the second amount of acid. The photosensitive base generator may include benzoin carbamates, O-carbamoylhydroxylamines, O-carbamoyloximes, aromatic sulfonamides, ?-lactones, N-(2-Arylethenyl)amides, azides, amides, oximines, quaternary ammonium salts, or amineimides.

Abstract: Disclosed is a pigment composition comprising a metal complex of azo compound of formula 1 containing at least one pyrimidine or a pyrimidine derivative. The pigment composition exhibits improved color characteristics, improved stability and easy dispersion.

Abstract: A resist composition comprising a salt of a mono- to tetrafunctional carboxylic acid with a metal selected from magnesium, chromium, manganese, iron, cobalt, nickel, copper, zinc, silver, cadmium, indium, tin, antimony, cesium, zirconium, and hafnium, and a solvent is improved in film uniformity when coated, and exhibits a high resolution, high sensitivity, and minimal LER when processed by the EB or EUV lithography.

Abstract: A resist composition comprising a polymer having recurring units having an acid labile group and recurring units of a magnesium, copper, zinc or cesium salt of (meth)acrylic acid, styrenecarboxylic acid or vinylnaphthalenecarboxylic acid copolymerized together exhibits a high resolution, high sensitivity, and minimal LER. The resist composition is best suited as the patterning material for VLSIs and photomasks.

Abstract: A compound synthesis method includes bonding a first compound to a substrate to form a first film. A second film is formed on the first film using an acid-transfer composition including (A) a polymer that includes a structural unit shown by a following formula (1) and a structural unit shown by a following formula (2), (B) a photoacid generator shown by a following formula (3), and (C) a sensitizer shown by a following formula (4). The second film is exposed to remove the protecting group from the first compound under an exposed are of the second film. An acid generated in the exposed area of the second film is transferred to the first film. The second film after being exposed is removed. A second compound is bonded to the first compound from which the protecting group has been removed.

Abstract: The present invention is to provide a photosensitive resin composition which has excellent resolution, is low in cost and is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The present invention is also to provide a base generator which is applicable to such a photosensitive resin composition. Disclosed is a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating. Also disclosed is a photosensitive resin composition which comprises the base generator and a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance.

Abstract: A pattern is formed by applying a resist composition comprising a polymer comprising recurring units having a nitrogen atom bonded to an acid labile group, an acid generator, and an organic solvent onto a substrate, prebaking to form a resist film, exposing the resist film to high-energy radiation, baking, and developing the exposed film with an organic solvent developer to form a negative pattern wherein the unexposed region of film is dissolved and the exposed region of film is not dissolved.

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.

Abstract: A positive resist composition includes at least: (A) a polymer containing a repeating unit (a1) and an acid labile repeating unit (a2), wherein the repeating unit (a1) generates an acid of a structure represented by general formula (1) as a result that the repeating unit (a1) is sensed to a high-energy radiation, the polymer being changed in solubility in alkali by the acid; and (B) an onium sulfonate represented by general formula (2). Also, a positive resist composition, which simultaneously establishes a lower acid diffusing characteristic and a higher dissolution contrast, and which suppresses volatilization of components originated from the resist composition such as a generated acid, a quencher, and the like, to suppress a chemical flare, thereby improving a DOF, a circularity, an LWR, and the like of a hole pattern, trench pattern, and the like; and a patterning process using the positive resist composition.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds of general formula (I) below, a compound that when exposed to actinic rays or radiation, generates an acid and a hydrophobic resin. (The characters used in general formula (I) have the meanings mentioned in the description.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a resin (P) containing not only at least one repeating unit (A) that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and is expressed by any of general formulae (I) to (III) below but also a repeating unit (B) containing at least an aromatic ring group provided that the repeating unit (B) does not include any of those of general formulae (I) to (III). (The characters used in general formulae (I) to (III) have the meanings mentioned in the description.

Abstract: Disclosed are an N-acyl-?-lactam derivative represented by the following general formula, from which a photoresist composition capable of controlling an acid diffusion length to be short is obtained; a polymer obtained by polymerizing the N-acyl-?-lactam derivative represented by the following general formula as one of starting materials; and a photoresist composition containing the polymer.

Abstract: A chemically amplified resist composition comprising a base polymer, an acid generator, and an amine quencher in the form of a ?-alanine, ?-aminobutyric acid or 5-aminovaleric acid derivative having an acid labile group-substituted carboxyl group has a high contrast of alkaline dissolution rate before and after exposure and forms a pattern of good profile at a high resolution, minimal roughness and wide focus margin.