Precision Device Or Process - Or With Condition Responsive Control Patents (Class 451/1)
  • Patent number: 5948204
    Abstract: The present invention discloses an improvement on a wafer carrier ring for use in a chemical-mechanical polishing apparatus for uniformly polishing semiconductor wafers. The apparatus comprises of a ring assembly, a stainless steel backing plate and a rubber bladder for holding the ring assembly and the backing plate. The ring assembly comprises of two rings. The first ring is made of a soft material such as Delrin or PBT for holding the stainless steel backing plate which is attached to the wafer. A top portion of the first ring is cutoff to leave an annular notch. The second ring is made of a hard material such as stainless steel and is fitted into the annular notch of the first ring. Both rings are attached to the rubber bladder through two sets of screws which are evenly spaced through a circular path concentric to the circumference of the first ring.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: September 7, 1999
    Assignee: Intel Corporation
    Inventors: James G. Maveety, George T. Waller, Wayne Gaynor
  • Patent number: 5947799
    Abstract: Method for identifying, monitoring, and controlling the blank frequencies in each separate carrier of a planetary lap machine, based on measuring blank frequency signals via an electrode imbedded in a lap plate, analyzing the time frequency pattern of these signals as they pass the electrode, correlating it with the sequence of carriers passing the electrode, and from that identifying and correlating groups of signals with the loads of blanks in each carrier, then monitoring the frequencies and the frequency spread in each carrier and, optionally, terminating lapping when frequencies and spread in a carrier exceed a target value.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: September 7, 1999
    Inventors: Michihiko Kaoyashi, Franz L. Sauerland
  • Patent number: 5816890
    Abstract: An electrical lap guide (ELG) system and method are disclosed for use in lapping a bar 10 of magnetic transducer carrying sliders to a desired transducer height. A first ELG ELG1 contained within the bar has at least two first ELG resistive elements R.sub.11 and R.sub.12. A second ELG ELG 2 contained within the bar has at least two second ELG resistive elements R.sub.21 and R.sub.23. A first of the at least two first ELG resistive elements is electrically coupled to a first of the at least two second ELG resistive elements to thereby reduce a total number of leads needed between a data acquisition unit 100 and the bar 10 during lapping. The reduction in required data acquisition unit 100 leads allow more ELGs to be included on each bar 10 in order to more accurately control the lapping process.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: October 6, 1998
    Assignee: Seagate Technology, Inc.
    Inventors: Shanlin X. Hao, Lance E. Stover, Beat G. Keel
  • Patent number: 5755612
    Abstract: An electrical lap guide (ELG) for use in lapping a bar of magnetic transducer carrying sliders to a desired height is disclosed. A first lapped or analog ELG element is positioned in a first dice lane on the bar between first and second sliders. A first electrical connection is positioned on a surface of the first dice lane for coupling the first ELG element to external circuitry. A second reference ELG element is positioned in the first slider at a position recessed from the lapped surface. A second electrical connection is positioned on the first slider for coupling the second ELG element to external circuitry.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: May 26, 1998
    Assignee: Seagate Technology, Inc.
    Inventors: Mark J. Schaenzer, Beat G. Keel, Lance E. Stover, Shanlin X. Hao
  • Patent number: 5738566
    Abstract: A lapping guide system, method and article of manufacture is disclosed. A method of fabricating a lapping guide for use in conjunction with the machining of a magnetic recording transducer includes the following steps. A plurality of lap switch fingers of the lapping guide and a bottom pole of the transducer are fabricated at the same time and from the same material. Each lap switch finger has the same topology as the topology of the bottom pole. An insulating layer is fabricated on the plurality of lap switch fingers of the lapping guide and on the bottom pole of the transducer. A top conductor is fabricated on the insulating layer above a plurality of lap switch fingers, while a top pole is fabricated on the insulating layer above the bottom pole. The top conductor and top pole are fabricated at the same time and from the same material.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: April 14, 1998
    Assignee: Seagate Technology, Inc.
    Inventors: Zhihao Li, Ganesan Doraisami, Beat G. Keel
  • Patent number: 5688159
    Abstract: A device for automatically polishing a mother blank of sheet copper has a starting sheet auto-stripping line including a delivery device for carrying in mother blanks of sheet copper, a stripping device for stripping starting sheets from the mother blanks, a removal device for carrying out mother blanks after the starting sheets are stripped off and a device for polishing the surfaces of a mother blank from which starting sheets have been stripped off at a forward position in the direction in which the mother blanks are transferred.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: November 18, 1997
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Mineharu Kusano, Kenzou Takabatake, Yutaka Kataoka
  • Patent number: 5683287
    Abstract: At least one brush rotatable about an axis parallel to the plate (1) and to a plane containing a row of bearing surfaces (4) of openings (2) of the plate (1), is moved along a rectilinear path (5a, 5b, 5c) parallel to the plane of the bearing surfaces (4) of the openings (2) of the row of the plate (1). Preferably, the device comprises a brushing unit mounted at the end of an articulated arm of a robot permitting the movement of the brushing unit in succession along rectilinear paths (5a, 5b, 5c) constituting several groups in which the paths are parallel to the same direction.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: November 4, 1997
    Assignee: Framatome
    Inventors: Francois Martineau, Noel Martin
  • Patent number: 5660579
    Abstract: The metal bond wheel forming apparatus includes rotation speed control means 11 for controlling the rotation speed of a grinding wheel 6; energy control means 9 for controlling discharge energy that is supplied to the gap between a wire electrode 1 and the grinding wheel 6; relative speed control means 17 for controlling a relative movement speed either for the wire electrode 1 or for the grinding wheel 6; and detailed machining control means 23 for controlling the rotation speed control means, the energy control means and the relative speed control means, for setting the rotation speed of the grinding wheel and discharge energy appropriate for detailed machining, and for setting the relative movement speed for the wire electrode or for the grinding wheel to enable high speed shaping during the detailed machining.
    Type: Grant
    Filed: August 13, 1996
    Date of Patent: August 26, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshiro Nakayama, Osamu Yasuda, Kouzo Nomura
  • Patent number: 5649849
    Abstract: A method for interferometrically determining error continuously in the radius of curvature of a planetary polishing surface and for providing compensating correction of the surface shape while the polishing machine is in operation. A conditioner glass body disposed on the polishing surface for reshaping the surface is itself a Fizeau cavity having upper and lower partially-reflective surfaces which are parallel or slightly non-parallel for plano polishing and spherical polishing. The conditioner is illuminated by a plano, monochromatic, coherent light wavefront substantially perpendicular to the polishing surface, preferably over the entire upper surface of the conditioner. A portion of the incident wavefront is reflected from the upper surface as a reference wavefront, and another portion of the incident wavefront is reflected from the lower surface as a measurement wavefront.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: July 22, 1997
    Assignee: Eastman Kodak Company
    Inventors: David Pileri, John Hannon, Donald A. Gildner, Mark Baumler
  • Patent number: 5641321
    Abstract: The invention provides a novel cutting tool used in wood working, which has a sufficiently thick cutting edge allowing stable cutting of a veneer from a log as well as an apparatus for and a method of grinding the cutting edge to have a favorable shape and a relatively large angle. The apparatus of the invention includes a table which an elongated cutting tool extending along a longitudinal axis of the table is mounted on, a fixing element for pressing the cutting tool upright against an upright plate, and a carriage which is reciprocatingly movable along the longitudinal axis of the table. The carriage is provided with a pair of grinding wheels which are respectively movable into and out of endwise grinding contact with an upper surface and a lower surface of the cutting edge of the upright cutting tool at desirable angles.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: June 24, 1997
    Assignee: Kabushiki Kaisha Taihei Seisakusho
    Inventor: Hiromi Suzuki
  • Patent number: 5616063
    Abstract: A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.
    Type: Grant
    Filed: September 20, 1994
    Date of Patent: April 1, 1997
    Assignees: Kabushiki Kaisya Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Masako Kodera, Shirou Mishima, Atsushi Shigeta, Masayoshi Hirose, Norio Kimura, Seiji Ishikawa
  • Patent number: 5613894
    Abstract: Method to hone curved and shaped profiles which belong to furniture elements, which are advantageously of furniture of an antique style, such as surfaces of tables, mouldings of furniture or pictures, panels, doors of kitchen cupboards, seat elements, etc.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: March 25, 1997
    Assignee: Delle Vedove Levigatrici SpA
    Inventor: Gaetano Delle Vedove
  • Patent number: 5580298
    Abstract: A method of producing flank surface modifications in gear teeth by controlled removal of stock material from a work gear with a tool. The method comprises providing a gear producing machine the tool and work gear being movable with respect to one another along and/or about a plurality of axes. A theoretical basic machine is provided comprising a plurality of machine settings for relatively positioning and moving said tool and work gear with respect to one another. Each of the machine settings is defined as an active setting with each active setting being represented by a function. A desired tooth flank surface modification is determined and defined by a set of coefficients for each of the active settings. The function for each active setting is then determined based upon the respective coefficients for each active setting and the functions are transformed from the theoretical machine to the axes arrangement of the gear producing machine.
    Type: Grant
    Filed: September 27, 1994
    Date of Patent: December 3, 1996
    Assignee: The Gleason Works
    Inventor: Hermann J. Stadtfeld
  • Patent number: 5562523
    Abstract: In a grinding method wherein a rotating workpiece and a rotating grinding wheel are relatively moved toward and away from each other and wherein at least three of rough, fine and finish grinding step are performed successively at high, medium and low infeed rates respectively for grinding the workpiece, the grinding wheel is retracted to a back-off position at the end of the rough grinding step.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: October 8, 1996
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Hiroaki Asano, Takao Yoneda, Takayuki Hotta
  • Patent number: 5562524
    Abstract: Apparatus for polishing a side of a thin, flat wafer of a semiconductor material includes first and second polishing heads which each hold a wafer against a wetted polishing surface and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head is moved away from the polishing surface to clean, eject, and replace its wafer, the second polishing head occupies the space over the polishing surface normally occupied by the first polishing head so that the polishing surface is used substantially continuously, and not intermittently.
    Type: Grant
    Filed: May 4, 1994
    Date of Patent: October 8, 1996
    Inventor: Gerald L. Gill, Jr.
  • Patent number: 5525091
    Abstract: A transfer tool is provided with a block which has an elongated slot. With the elongated slot a beam is formed in a lower portion of the block. The beam can be adjusted for row bow of a slider row which includes magnetic heads. Three holes extend through the block to the slot, opening three exposed portions of the beam, one exposed portion being centrally located and the other two exposed portions being located laterally on each side of the central portion near the ends of the beam. The ends of the slot have transverse slots which allow the beam to flex more readily when pressures are applied to the exposed portions near the ends of the beam. Pins extend through the holes with their downward ends engaging the exposed beam portions. Actuators are employed to apply appropriate forces to the pins so that the beam can be selectively adjusted to compensate for row bow of the slider row.
    Type: Grant
    Filed: June 24, 1994
    Date of Patent: June 11, 1996
    Assignee: International Business Machines Corporation
    Inventors: Chung-Fai Lam, Yew-Nam Yong
  • Patent number: 5494473
    Abstract: The invention provides a new method and apparatus for electrically accessing a lapping sensor positioned along a row of slider sites on a wafer. The apparatus for accessing the lapping sensor may be positioned outside of the boundaries of the slider sites. The apparatus may also provide top conductors electrically connecting target pads to contact pads. The process for lapping rows of slider sites includes coupling a measurement device to a target pad, coupling a lapping sensor to the top conductor, and lapping the row until the measurement device detects a predetermined signal from the lapping sensor.
    Type: Grant
    Filed: July 7, 1993
    Date of Patent: February 27, 1996
    Assignee: Quantum Corporation
    Inventors: David J. Dupuis, David J. Kindler, Alan B. Smith
  • Patent number: 5463805
    Abstract: A system for lapping a magnetoresistive (MR) sensor on a slider to a proper height is disclosed. The system comprises simultaneously lapping the MR lap monitor and the MR sensor positioned on the slider until a resistance of a variable resistor located within the MR lap monitor is approximately equal to a resistance of a target resistor located within the MR lap monitor. During the lapping process, a reference resistor located within the lap monitor is compared to both the variable and target resistors to prevent a lapping failure. In one preferred embodiment, the reference, target, and variable resistors are formed from a ferromagnetic metal alloy. The MR lap monitor and the MR sensor are lapped until a height of the ferromagnetic metal alloy forming the variable resistor is approximately equal to a height of the ferromagnetic metal alloy forming the target resistor.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: November 7, 1995
    Assignee: Seagate Technology, Inc.
    Inventors: Gregory S. Mowry, Phillip E. Gorka, Brian D. Strayer, Alan G. Kracke
  • Patent number: 5456147
    Abstract: An automatic saw is provided having a rotatable saw blade for cutting through a workpiece which is carried on a movable arm, which permits the workpiece to be moved into engagement with the saw blade. The saw blade is mounted on a first shaft while the workpiece and arm are mounted on a second, rotary shaft. Typically, a load cell is carried on the second shaft to sense torsional stress created by the pressure of the saw against the workpiece. This torsional stress is a direct measurement of the pressure of the saw against the load cell, and may be used in a feedback system for automatic adjustment of the sawing conditions. Also, it is preferred for the second shaft to be longitudinally movable in an automatic manner by means of a threaded, rotary arrangement for longitudinally advancing and retracting the second shaft between predetermined positions. A rotary encoder may be used to monitor the rotary position of the second shaft and arm.
    Type: Grant
    Filed: May 27, 1992
    Date of Patent: October 10, 1995
    Assignee: Buehler, Ltd.
    Inventor: Horst Stange, Jr.
  • Patent number: 5441437
    Abstract: A floating-type or compliant follower system for use in conjunction with a robotic or automated workpiece finishing apparatus. The follower device in a preferred embodiment cooperates with the tool to create a contact force with the workpiece which can be maintained constant with a high degree of accuracy and with a high responsiveness. The follower device in a preferred embodiment includes a constant-torque rotatable electric motor, such as a servo motor, which torque remains constant even when the motor is held in a stall condition by an external load or is driven backwards by the load. The motor output is drivingly coupled through a rotary-to-linear drive mechanism to a follower which is coupled to a driving tool such as a belt grinder.
    Type: Grant
    Filed: February 18, 1993
    Date of Patent: August 15, 1995
    Inventor: Bryan A. Hulstedt
  • Patent number: 5413520
    Abstract: The conical internal teeth (7) of a spur gear grinding tool (2) mesh with the teeth (6) of a spur gear workpiece (1) or a dressing spur gear. The tool axis (4) forms an acute angle (.gamma.) with the workpiece axis (3). To grind and to dress, the spur gear tool (2) is fed relative to the workpiece (1) in the direction of the tool axis (4). In this manner an optimal tooth meshing between the tool (2) and the workpiece (1) over a wide dressing range and a constant finishing are achieved.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: May 9, 1995
    Assignee: Reishauer AG.
    Inventor: Armin Feisel
  • Patent number: 5413521
    Abstract: The open end of the nozzle 42 is positioned close to and facing the surface of the metal base 20 on the side were the portion of the semiconductor ingot is to be cut off. An electromagnetic valve 46 is provided in the passage through which compressed air is supplied to the nozzle 42. The initial position of the blade 19 is detected by the detector 50U and the counter 52 measures the distance the blade 19 travels downward from the detected position and then the comparator 56 detects the point at which the measured value matches the value set on the numeric value setting device 54. The electromagnetic valve 46 is opened to emit compressed air from the nozzle 42 after this detection, until the detection of the lower limit position of the blade 19 by the detector 50D.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: May 9, 1995
    Assignee: Shin-Etsu Handotai Company, Ltd.
    Inventors: Seiichi Terashima, Masao Kita
  • Patent number: 5411430
    Abstract: The present invention provides a hybrid lens having an axially asymmetrical non-spherical shape, good mass productivity, and excellent shape precision surface precision as well as environment resistant property, and a method for fabricating same, as well as a method and a device for a laser printer using that hybrid lens. In particular, there are disclosed a method, by which, when an axially asymmetrical non-spherical convex lens is formed by the replica method, the shape thereof is transcribed with a high precision, as well as a method and a device for fabricating an axially asymmetrical non-spherical concave lens (female die) serving as an original for the transcription. In a device for fabricating a female die by direct grinding, the positions of a rotation axis of an object to be worked and a rotation axis of a grinding wheel are controlled and it has further a function of correcting mounting errors, when the object to be worked and the grinding wheel are mounted.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: May 2, 1995
    Assignees: Hitachi Ltd., Hitachi Koki Co., Ltd.
    Inventors: Takashi Nishimura, Akira Arimoto, Yoshinori Miyamura, Yumiko Anzai, Yoshimasa Kondo, Fumihiko Uchida, Shigeo Moriyama
  • Patent number: 5405285
    Abstract: The diameter, the orientation flat width/notch depth and the length of the block 10p are measured by the measuring devices 71a, 71b and 71c respectively and then the machining errors .DELTA.Dp, .DELTA.Wp and .DELTA.Lp in the measured values against the set values are calculated at the error calculation unit 833. Then .DELTA.Dp, .DELTA.Wp and .DELTA.Lp are stored in memory at the memory unit 834 in correspondence with the identification codes IDi and IDj of the grinding device 5i (i=1-N) and the cutting device 6j (j=1-M) that performed the machining. Then at the average value calculation unit 835, the average values of .DELTA.Dp and .DELTA.Wp for each of the grinding devices 51-5N and the average value of the .DELTA.Lp for each of the cutting devices 61-6M are calculated. The average values of .DELTA.Dp and .DELTA.Wp are supplied to the corresponding grinding device 5i as the diameter correction value and the width/depth correction value respectively and the average value of .DELTA.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: April 11, 1995
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Yoshihiro Hirano, Atsushi Ozaki
  • Patent number: 5404680
    Abstract: A method for polishing a slight region of the surface of a workpiece utilizes an actuator or actuators having piezoelectric elements. The actuators cause slight movement of a polishing portion disposed at the leading end of a polishing tool in an XY-direction parallel with the surface of the workpiece and/or a Z-direction perpendicular to the surface of the workpiece. A polishing material, including a magnetic fluid and nonmagnetic abrasive grains dispersed in the magnetic fluid, is held magnetically in a space between the polishing portion and the workpiece.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: April 11, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shinichi Mizuguchi, Koji Kato, Noritsugu Umehara
  • Patent number: 5377453
    Abstract: Apparatus for automatically polishing run-out table rolls, comprising: (a) a run-out table polisher take-up reel operatively connected to a carrier belt having abrasive material affixed thereto; and (b) control means for paying out and then retrieving the carrier belt onto the run-out table in response to one or more permissive signals indicative of the operational status of the run-out table. A method of automatically polishing run-out table rolls, comprising: (a) receiving one or more signals indicative of the operational status of a run-out table; (b) processing the signal(s) to determine whether a permissive condition for polishing the run-out table rolls exists; (c) in response to a determined permissive condition, paying out from a take-up reel a carrier belt having abrasive material affixed thereto; and (d) retrieving the carrier belt onto the take-up reel.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: January 3, 1995
    Inventor: George C. Perneczky
  • Patent number: 5377452
    Abstract: A grinding apparatus for grinding a stamper for forming a signal recording part, of an information signal recording disc is disclosed. The grinding apparatus includes a turntable holding and rotationally driving the stamper and an abrasive head for bringing a mounting surface of the stamper opposite to its surface carrying projections and recesses for molding the signal recording part of the information signal recording disc into sliding contact with an abrasive member. The rotational velocity of the turntable is controlled depending on the position of the abrasive head with respect to the stamper for rendering the relative speed of sliding contact between the stamper and the abrasive member constant for uniform grinding of the mounting surface of the stamper uniformly across its inner and outer peripheries.
    Type: Grant
    Filed: November 30, 1992
    Date of Patent: January 3, 1995
    Assignee: Sony Corporation
    Inventor: Yoshihiro Yamaguchi