Abstract: A water pervious concrete surface is described that is formed of a water pervious layer of concrete having interconnected voids, and a water permeable grout within the voids in the pervious layer. The permeable grout is formed of sand particles bonded in an open matrix with a two-part epoxy resin.

Abstract: Advanced epoxy resins comprising the reaction product of an epoxy resin comprising a diglycidyl ether of Formula 1 as defined herein, and at least on difunctional compound selected from an aromatic diol and a dicarboxylic acid are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. Purified diglycidyl ether is used to obtain substantially linear, high molecular weight, advanced epoxy resin. Curable compositions, cured compositions, and articles comprising the advanced epoxy resins are also disclosed. The advanced epoxy resins provide cured coatings having improved flexibility and low total chlorine content.

Abstract: The present invention provides Mannich base derivatives of N,N?-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a material comprising a UV curable polymer resin composition or a UV transmitting polymer resin composition; and (b) a tack-free adhesive layer formed with a material comprising a UV curable polymer resin. The sealing film has excellent sealing properties and is tack-free at room temperature, and thus it is possible to minimize freezing of electrostatic particles inside a microcup sticking to the surface of a sealing material during manipulation thereof.

Abstract: A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %.

Abstract: An epoxy or hardener mixture comprising (a) optionally water, (b) at least one hardener or epoxy resin, and (c) from 0.1 to 20 weight percent, based on epoxy resin of at least one distyryl phenol, tristyryl phenol or cumylphenol based additive surfactant with phosphate or sulfonate end groups having the structure R—OXn-W wherein R designates a polystyrylphenol or cumylphenol, preferentially chosen from among distyrylphenol, tristyrylphenol or cumylphenol, and mixtures thereof, and wherein OX designates ethylene oxide and/or propylene oxide. The number of groups “n” varies from 0 to 200, and W designates H, sulfate (—SO3?) or phosphate (—PO3H or —PO2—OXnR). Freeze thaw resistance and improved stability is obtained in epoxy mixtures used in dispersion form. Improved pot life and cure time is obtained using either the epoxy mixture, the hardener mixture or a combination of the two in epoxy hardener formulations.

Abstract: The present invention relates to an active energy ray curable compound (A) comprising: at least one (poly)lactone-containing moiety (a1), at least one fluorine-containing moiety (a3), and at least one further moiety (a2) present between moieties (a1) and (a3). The invention further relates to ways of making such compounds and to their use in providing water-oil repellency properties to a coating composition.

Abstract: An improvement in the production of 1,1-disubstituted ethylenes is attained by contacting a 1,1-disubstituted ethylene with alumina and separating the alumina to obtain a 1,1-disubstituted ethylene with a good combination of cost, purity, shelf life and cure rate.

Abstract: A rubbery polymer comprising: (a) butyl acrylate or a mixture of butyl acrylate and 2-ethylhexyl acrylate, (b) at least one member selected from the group consisting of methyl methacrylate, ethyl methacrylate, methyl acrylate, and ethyl acrylate, (c) acrylonitrile, (d) styrene, (e) a half ester maleate soap, and (f) a crosslinking agent selected from allyl methacrylate, and mixtures of allyl methacrylate with glycidyl methacrylate, trimethylolpropanetrimethyl acrylate, dicyclopentenyloxyethyl methacrylate and divinylbenzene.

Abstract: An article of manufacture is disclosed for incorporating into a civil engineering structure, for example a concrete structure, such as a floor. The article comprises a substantially fully cured thermosetting polymer resin and a particulate aggregate material having a Mohs hardness of from 3 to 9, preferably from 5 to 8. The article optionally comprises a reinforcing fiber. The hardness of the article can be closely matched to that of the surrounding structure. The article can be ground with a diamond tool to form a smooth transition with the surrounding structure. The article is particularly suitable for incorporation into an exposed surface of the structure.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: Crosslinkable random copolymers comprising atom transfer radical polymerization (ATRP) initiators and crosslinked copolymer films formed from the copolymers are provided. The random copolymers, which are polymerized from one or more alkyl halide functional inimers and one or more monomers having a crosslinkable functionality, are characterized by pendant ATRP initiating groups and pendant crosslinkable groups.

Abstract: The present invention is to provide a method for preparing an emulsion resin composition for a cationic electrodeposition paint, which prepare a cationic electrodeposition paint composition as reducing time for desolvation time or eliminating desolvation step.

Abstract: A latent curing agent obtained by the reaction of a coumarin compound of the general formula (1), where X and Y can be independently H, an alkyl group, a heteroalkyl group, an aromatic group, a heteroaromatic group or an acetyl group and Z can be H, OH, an alkyl group, a heteroalkyl group, an aromatic group, a heteroaromatic group with an amine of the general formula (2), where “a” is 1 or 2, A can be an alkylene group, a heteroalkylene group, an aromatic group, a heteroaromatic group, and B can be an alkyl group (if a=1), an alkylene group (if a=2), a heteroalkyl group (if a=1), a heteroalkylene group (if a=2), an aromatic group, a heteroaromatic group, a hydroxyl group (if a=1), a secondary amino group (if a=2), O or S (if a=2), whereby B has the valency “a”, or where B alone or where A and B together form a ring system selected from an aliphatic ring system, a heteroaliphatic ring system, or an aromatic ring system, can be used for curable compositions with a polyepoxide which has at least 2 1,2-ep

Abstract: Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the color of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the colored composition until the composition changes its color and use of polymeric colorants as curing degree indicator, wherein the curing indicator is a polymeric colorant consisting of chromophores which are chemically bound to polymers having reactive groups.

Abstract: A carbon fiber sizing agent imparts good bonding performance to carbon fiber, is used to reinforce a thermoplastic matrix resin, and provides a carbon fiber strand applied with the sizing agent and a fiber-reinforced composite reinforced with the carbon fiber strand. The sizing agent for carbon fiber is used to reinforce thermoplastic matrix resin. The sizing agent essentially contains a polymer component having a glass transition temperature of at least 20 deg.C. and exhibits no endothermic peaks indicating an endothermic heat of fusion due to crystalline melting of at least 3 J/g in a determination with a DSC. The weight ratio of the polymer component is 10 to 100 wt % of the nonvolatile components of the sizing agent. The polymer component is at least one component selected from the group consisting of an aromatic polyester resin, aromatic polyester-polyurethane resin and amine-modified aromatic epoxy resin.

Abstract: It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).

Abstract: The present invention describes a linear polyester resin comprising a di-epoxide monomer and a di-acid monomer useful in energy curable lithographic inks. The linear polyester resin exhibits a number average molecular weight less than 20,000. The present invention also describes an energy curable lithographic ink formulation including the linear polyester resin. The ink exhibits improved print density, print contrast, water window and rheological (total body) characteristics.

Abstract: A thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) a liquid oligomeric butadiene homopolymer; and (4) a curing agent including one or more alkylphenol novolac resins or alkyphenol co-novolac resins, and one or more poly(2,6-dimethyl-1,4-phenylene oxides), which resin composition may be used to prepare composites, prepregs, or laminates.

Abstract: The present invention provides a gel time controllable epoxy adhesive, which includes a first part comprising an epoxy resin containing two or more epoxy groups in one molecule, and a second part comprising a thiol curing agent, wherein a peroxide is comprised in part A, part B and/or a third separate part C.

Abstract: The invention relates to an epoxy/rubber composition comprising an epoxy resin which comprises an epoxy compound X, the epoxy compound X has epoxy equivalent weight (EEW) from 150 up to 200 and viscosity from 2,000 up to 10,000 cps (25 C), a curing agent, a liquid rubber that is liquid at room temperature and comprises at least 1.5 reactive terminated group, a fluorine contained organic matter, selected from a group, including where: n=1-20; X=—COOH, —CONH2, —CON(C6H5)2, —CH2OH. b) CF3(CF2)nCOOH, where: n=7-9. where: n=3-20.

Abstract: Provided are a fiber-reinforced composite material capable of achieving excellent CAI, ILSS, and bending fracture toughness concurrently at high levels, and maintaining a high glass transition temperature of the resin material therein, and prepreg and a benzoxazine resin composition therefor. The composition contains, at a particular ratio, (A) a compound having in its molecule a benzoxazine ring represented by formula (1), (B) an epoxy resin, (C) a curing agent, (D) a toughness improver, and (E) polyamide 12 particles of a particular particle size, and component (D) is dissolved: (R1: C1-C12 chain alkyl group or the like, and H is bonded to at least one of Cs of the aromatic ring at o- or p-position with respect to the carbon atom to which the oxygen atom is bonded).

Abstract: A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Abstract: The present invention relates to a curable composition which comprises epoxy resin, epoxy-group-bearing reactive diluent and the hardener 2,2?,6,6?-tetramethyl-4,4?-methylenebis(cyclohexylamine), curing thereof, and the cured epoxy resin obtainable therefrom, and the use of 2,2?,6,6?-tetramethyl-4,4?-methylenebis(cyclohexylamine) as a hardener for epoxy resins in curable compositions with epoxy-group-bearing reactive diluent.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: Epoxy containing phosphonate monomers, polymers, copolymers, oligomers and co-oligomers and methods for making the same are describes herein. These materials can be used to make polymers, and can be combined with other polymers, oligomers or monomer mixtures to make resins with excellent fire resistance that can be used in a variety of industrial and consumer products.

Abstract: Provided is a film having a thickness of less than 500 ?m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

Abstract: A coating composition adapted for application on a fastener, the coating composition composed of a binder component composed of a polymeric resin present in the composition at a concentration between 1.0% and 15.0% by total composition weight, wherein the binder component is composed of at least one of a solvent dispersible compound; a reactive cross-linking component present in the composition in an amount between 1.0% and 80.0%; at least one curing agent; optionally at least one expansion agent, wherein at least one of the curing agent or the reactive cross-linking component are physically and reactively isolated from other components of the composition.

Abstract: Co-cured urethane and vinyl ester, epoxy, or unsaturated polyester gel coats having improved toughness and flexibility compared with conventional polyester gel coats are disclosed. The gel coats, which have 10-50 wt. % urethane content, adhere well to structural layers and can be used in a traditional in-mold process. Co-cured elastomeric coatings comprising from 50 to 95 wt. % of a urethane component and an unsaturated polyester, epoxy, or vinyl ester are also disclosed. Unlike conventional urethane coatings, the elastomeric coatings adhere well to structural layers and can be used in a traditional in-mold process. Castings or structural layers comprising a reinforced thermoset of co-cured urethane and vinyl ester, epoxy, or unsaturated polyester components, including 10-95 wt. % of the urethane component, are also described. The invention includes in-mold processes for making laminates that utilize the gel coats, elastomeric coatings, and/or structural layers.

Abstract: The present disclosure provides curable compositions such as curable compositions including: (i) at least one epoxy resin comprising at least one aromatic or aromatic-derived moiety but not containing an aromatic amine moiety; (ii) an epoxide hardener system comprising: (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines have a difference in melting points of at least 10° C.; and (iii) a filler capable of reducing the density of the curable composition. Also provided are compositions obtainable by curing the curable composition and methods of using the curable composition to fill voids in honeycomb structures.

Abstract: To provide a novel polymer having an excellent non-specific adsorption inhibitory effect, a surface-hydrophilizing agent comprising the polymer, and a method for producing a substrate having a hydrophilic surface. The polymer comprises a hydrophilic repeating unit having a sulfinyl group in a side chain thereof.

Abstract: A re-epoxidized polyfunctional epoxy resin composition comprising the reaction product of: (I) an epoxidized polyfunctional epoxy resin oligomeric composition comprising a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of: (i) an aliphatic or cycloaliphatic hydroxyl-containing material; (ii) an epihalohydrin, (iii) a basic-acting substance, in the presence of (iv) a non-Lewis acid catalyst; and (v) optionally, one or more solvents; (II) an epihalohydrin; (III) a basic acting substance; in the presence of (IV) a non-Lewis acid catalyst; and (V) optionally, one or more solvents. A curable epoxy resin composition of the re-epoxidized polyfunctional epoxy resin composition and a thermoset of the curable composition is also disclosed.

Abstract: The present invention relates to a photosensitive alkali-soluble silicone resin composition comprising an alkali-soluble silicone resin (A) which comprises a carboxyl group or a dicarboxylic acid anhydride group in one molecule; an alkali-soluble resin (B) whose acid value is between 10 mgKOH/g and 200 mgKOH/g; and a photoinitiator (C). The (A) or (B) ingredient may comprise a photosensitive unsaturated double bond group, or the photosensitive alkali-soluble silicone resin composition may further comprise a compound (D) which comprises a photosensitive unsaturated double bond.

Abstract: A composition suitable for forming a paint marking on a roadway comprises a polyfunctional acrylate having at least four acrylate groups, an epoxy component and a polyfunctional amine. The polyfunctional acrylate reacts with the polyfunctional amine to form an adduct with secondary amine groups. The secondary amine reacts with the epoxy component to yield a chemically high crosslinked material having a no track time of less than about five minutes.

Abstract: The present invention provides an insulation resin material containing a filler for high voltage equipment includes a polar resin, a hardener, a filler, and fine particles added to at least one of the polar resin and the hardener, and having polar organic substituents exposed at the surface thereof. According to this invention, an insulation resin material for high voltage equipment which is easy to control viscosity, does not cause a problem of filler settling, and provides easy handling in the molding process such as molding, and high voltage equipment using the insulation resin material can be provided.

Abstract: An adhesion improver for amine curing epoxy resin paint which, when added in a small amount to amine curing epoxy resin paint, is capable of preventing the inhibition of adhesion caused by amine blushing and of giving good interlayer adhesion is provided. This adhesion improver is a composition which contains a polymer obtained by the polymerization of (A) acrylic acid ester and/or methacrylic acid ester which has a formula as follows: wherein R1 denotes a hydrogen atom or a methyl group, and R2 denotes a branched alkyl group having 3 to 18 carbon atoms, and (B) acrylic acid ester other than (A) above and/or methacrylic acid ester other than (A) above and/or vinyl ether.

Abstract: A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: An adhesive film, an adhesive composition, and a semiconductor device wherein, in the adhesive film, a difference between a storage modulus (A) of the adhesive film after 4 cycles and a storage modulus (B) of the adhesive film after 1 cycle is about 3×106 dyne/cm2 or less, the storage modulus (A) of the adhesive film after 4 cycles is about 7×106 dyne/cm2 or less, and the storage modulus (B) of the adhesive film after 1 cycle is about 2×106 dyne/cm2 or more, when curing at 125° C. for 1 hour and then at 150° C. for 10 minutes is defined as 1 cycle.

Abstract: The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.

Abstract: A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:

Abstract: Epoxy resins comprising a diglycidyl ether of Formula 1 as defined herein are described. The diglycidyl ether contains a cycloaliphatic ring of 3-5 carbon atoms. The epoxy resins are made by a method comprising the steps of: (a) forming a reaction mixture comprising a diol of Formula 3 as defined herein, an epihalohydrin, a phase transfer catalyst, and optionally an organic solvent; (b) contacting a basic acting substance and water with the reaction mixture of step (a); (c) washing the mixture of step (b) with an aqueous solvent to substantially remove salts; and (d) isolating the epoxy resin. Curable and cured compositions comprising the epoxy resins are also disclosed. The epoxy resins have increased glass transition temperatures and reduced viscosity compared to epoxy resins derived from cyclohexanedimethanol.

Abstract: A fiber reinforced powder paint provides improved flexural fatigue resistance for composites substrates. Fiber loading in the powder is greater than 40%. Aramid fiber loading in an epoxy based powder paint is exemplified. A composite bow limb coated with the powder paint survives a remarkably greater number of bending cycles before failure when coated with the powder paint.

Abstract: This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.

Abstract: A sizing composition includes a texturing agent, a film-forming agent, and a cationic polymer having a polyalykyleneimine backbone. A glass fiber strand is formed from a plurality of individual glass fibers coated with the sizing composition. A composite material includes such glass fiber strands.

Abstract: The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).

Abstract: An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.

Abstract: There is provided a resist underlayer film composition for EUV lithography that is used in a device production process using EUV lithography, reduces adverse effects of EUV, and is effective for obtaining a good resist pattern, and to a method for forming a resist pattern that uses the resist underlayer film composition for EUV lithography. A resist underlayer film-forming composition for EUV lithography, including: a polymer having a repeating unit structure of formula (1): [where each of A1, A2, A3, A4, A5, and A6 is a hydrogen atom, a methyl group, or an ethyl group; X1 is formula (2), formula (3), formula (4), or formula (0): Q is formula (5) or formula (6): and a solvent. A resist underlayer film-forming composition for EUV lithography, comprising: the polymer having the repeating unit structure of formula (1); a crosslinkable compound; and a solvent.

Abstract: Anti-corrosion coatings comprising electroconductive polymers polymerized in the presence of one or more film forming polymers are provided. These coatings can be used with metal substrates such as cold-rolled steel and other metals to inhibit corrosion.

Abstract: Methods of forming a curable pre-impregnated composite precursor material with radiation (e.g., actinic or electron-beam) curable resin composition systems are provided, as are the curable pre-impregnated composite precursor materials themselves. The resin systems have reversible temperature-viscosity control, which are advantageously used to form curable pre-impregnated composite precursor materials (pre-preg) that can be cured to form a composite article. The uncured resin composition comprises: (a) an acrylate or a methacrylate monomer; (b) an oligomer species selected from the group consisting of: polyethers, polyesters, epoxies, and combinations thereof; and (c) a photoinitiator. The uncured resin has a first viscosity at 21° C. (70° F.) of ?about 200,000 centipoise (cP) and a second viscosity of ?about 5,000 cP at 65° C. (149° F.) or above.