Abstract: The present invention relates to a thermally curable binder resin including an epoxy group-containing ethylenic unsaturated monomer and an aqueous monomer including an ethylene oxide group; or an epoxy group-containing ethylenic unsaturated monomer, a compound including an acidic component, and an aqueous monomer including an ethylene oxide group, a thermally curable resin composition including the same, a cured film prepared therefrom, a color filter, and a liquid crystal display device. The thermally curable binder resin of the present invention may significantly enhance the coatability of a cured film forming composition and increase the surface energy of a coated protective film to significantly enhance the recoating properties in subsequent processes after formation of the protective film.

Abstract: Optical films are described having a polymerized microstructured surface that comprises the reaction product of a polymerizable resin composition comprising at least one polymerizable ethylenically unsaturated triphenyl monomer. Also described are certain triphenyl(meth)acrylate monomers and polymerizable resin compositions.

Abstract: Provided are curable resin compositions capable of giving cured articles that have high light reflectivity, are satisfactorily resistant to heat and light, are tough, and less suffer from light reflectivity reduction with time. A curable resin composition for light reflection includes an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), a curing agent (D), and a curing accelerator (E). Another curable resin composition for light reflection includes an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), and a curing catalyst (F).

Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

Abstract: A solid semiconductor sealing composition that includes (A) an epoxy resin, and (B) a clathrate complex. The clathrate complex contains (b1) at least one of 5-hydroxyisophthalic acid and 5-nitroisophthalic acid; and (b2) at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. A method of sealing a solid semiconductor using the sealing composition.

Abstract: The invention relates to compositions of ?,?-branched alkane carboxylic acids glycidyl esters with a defined isomeric composition where the sum of the concentration of the blocked and of the highly branched isomers is maximum 55% preferably below 40%, and most preferably below 30%. The mixture of neononanoic acid glycidyl esters comprising at least 2,2-dimethyl heptanoic acid glycidyl ester and 2-methyl 2-ethyl hexanoic acid glycidyl ester and 2-methyl 2-ethyl 3-methyl pentanoic acid glycidyl esters.

Abstract: A nanocomposite comprises: a polymer; and a nanofiller disposed in the polymer, the nanofiller comprising a first nanoparticle bonded to a second nanoparticle. A process of making a nanocomposite comprises: combining a silsesquioxane and a nanoparticle; bonding the nanoparticle to the silsesquioxane to make a nanofiller; and dispersing the nanofiller in a polymer to make the nanocomposite.

Abstract: The invention relates to a method for manufacturing a mineral fibre-containing composite and the novel mineral fibre-containing element produced by that method.

Abstract: The present invention relates to a heat-curable composition comprising (a) at least one compound which is capable of undergoing cationic polymerization; and (b) at least one sulfonium sulfate selected from compounds of the formulae Ia and Ib where Yn? is a monovalent or divalent anion selected from (1) where n, M, R1 to R10 are as defined in claim 1 and in the description. The present invention also relates to novel sulfonium sulfates of the formulae Ia and Ib, to a process for curing cationically polymerizable material and to the cured material obtained by said process.

Abstract: The invention provides a pigment-containing heat-curable composition including a pigment dispersion solution obtained by dispersing a composition containing a heat-curable resin, a solvent, and a pigment, wherein the concentration of the pigment is 50% or more and less than 100% with respect to the total solid contents.

Abstract: Disclosed is a thermoplastic melt-mixed composition including: a) a semicrystalline polyamide resin; b) a polyepoxy compound including at least two or more epoxy groups; the polyepoxy compound having a number average molecular weight of less than 8000; one or more carboxylic acid compounds selected from the group consisting of polyacids, acid alcohols and combinations of these, the carboxylic acid compounds have a number average molecular weight of less than 2000; and optionally, d) reinforcing agent; e) polymeric toughener; and f) further additives.

Abstract: Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a polyetherol compound provided by reacting: b1) one or more polyepoxy compound having at least two or more epoxy groups; and b2) one or more polyhydric alcohols having two or more hydroxyl groups; c) 10 to 60 weight percent of reinforcing agent; d) 0 to 30 weight percent polymeric toughener; and e) 0 to 10 weight percent further additives. Also disclosed are molded parts derived from the composition.

Abstract: Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a poly(amino acid)-polyol compound provided by reacting: b1) one or more amino acids selected from the group consisting of primary amino acids and secondary amino acids and combinations of these; the amino acid having no more than one hydroxyl group; and b2) one or more polyepoxy compound comprising at least two or more epoxy groups; the poly(amino acid)-polyol compound having a range of at least 10 percent conversion of epoxy equivalents of component (b1) up to, but excluding, the gel point of the components b1) and b2) and c) reinforcing agent; and, optionally, d) polymeric toughener; and f) further additives. Processes for making the composition are also disclosed.

Abstract: It is provided an implantable device including a polymer blend that contains a polymer formed of fluorinated monomers and hydrocarbon monomers and another biocompatible polymer.

Abstract: The disclosure provides a thermosetting composition, including: (a) about 1-35 wt % of an oligomer, wherein the oligomer is obtained by reacting a liquid epoxy resin with an aromatic primary amine having four active hydrogen atoms, and the liquid epoxy resin and the primary amine have an equivalent mole ratio of 1:0.15-1:2.50; (b) about 5-10 wt % of a long chain resin; (c) about 50-80 wt % of an epoxy resin having at least two functional groups; and (d) about 5-15 wt % of a plasticizer.

Abstract: An unsaturated polyester resin composition comprising an unsaturated polyester, an acetoacetate functional monomer; a multifunctional di- or tri-acrylate monomer; and an allyl ether-functional monomer/oligomer, wherein the resin composition is substantially free of styrene.

Abstract: Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.

Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.

Abstract: This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Abstract: Exemplary embodiments provide systems, devices and methods for the fabrication of three-dimensional polymeric fibers having micron, submicron, and nanometer dimensions, as well as methods of use of the polymeric fibers.

Abstract: A curable one-part epoxy resin composition is described. The composition comprises an epoxy component comprising at least one epoxy compound which has two or more groups per molecule; a latent hardener component; a thixotropy-conferrring component; a polythiol component comprising a polythiol having at least one secondary or tertiary thiol group per molecule; and a stabilising component comprising a solid organic acid. The compositions according to the invention are particularly suitable for use in the field of microelectronics.

Abstract: The invention relates to a decorative coating having at least one layer of two-component paint and one protective resin surface layer. The resin is translucent or transparent and the two-component paint has at least one first component of prepolymer type based on bisphenol and epichlorohydrin and at least one second component of polyamine type. Another subject of the invention is the use of such a coating for covering surfaces such as a floor or a worktop or a sink or sanitary ware of wash basin, shower cubicle, etc. type.

Abstract: The invention relates to reinforced pultruded polyurethane and to a method for the production thereof by pultrusion.

Abstract: This invention relates to certain poly(1,4-cyclohexylenedimethylene terephthalate) copolyesters which are useful for the preparation of clear and tough thick wall molded parts, produced at good cycle times. The copolyesters can be molded into desired shapes such as cosmetic jars, fragrance caps, tool handles, and toothbrushes. These molded articles can have thick or thin walls and may be molded in a two shot molding process. The copolyesters also have good flow and reduced cycle times.

Abstract: A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: where R1 and R2 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; and where R3 and R4 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group. The process includes adding amino hardeners, where 0.1% to 50% by weight of the amino hardeners are aliphatic, cycloaliphatic or aromatic amine compounds having 1 to 4 primary amino groups and optionally further functional groups, selected from secondary amino groups, tertiary amino groups, and hydroxyl groups.

Abstract: A coating composition comprising the reaction product of an epoxy-functional backbone resin having free hydroxyl groups and a lactide is disclosed.

Abstract: Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.

Abstract: An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; and [D] a curing accelerator.

Abstract: A new class of poly(beta-amino alcohols) (PBAAs) has been prepared using combinatorial polymerization. The inventive PBAAs may be used in biotechnology and biomedical applications as coatings (such as coatings of films or multilayer films for medical devices or implants), additives, materials, excipients, non-biofouling agents, micropatterning agents, and cellular encapsulation agents. When used as surface coatings, these PBAAs elicited different levels of inflammation, both in vitro and in vivo, depending on their chemical structures. The large chemical diversity of this class of materials allowed us to identify polymer coatings that inhibit macrophage activation in vitro. Furthermore, these coatings reduce the recruitment of inflammatory cells, and reduce fibrosis, following the subcutaneous implantation of carboxylated polystyrene microparticles. These polymers may be used to form polyelectrolyte complex capsules for cell encapsulation.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

Abstract: The invention relates to thermosetting compositions containing isocyanurate ring(s) prepared through chain extension of an epoxy resin (a) with carboxyl-functional oligomers (b), which are the reaction product of polyols (i) containing one or more isocyanurate ring(s) and polycarboxylic acids or their anhydrides (ii). The polyols (i) containing one or more isocyanurate ring(s) can be prepared from the reactions of tris (2-hydroxyalkyl) isocyanurates with a modifier from a caprolactone or alkylene oxide, or glycidyl ester or glycidyl ether and mixtures thereof. The epoxy-functional thermosetting compositions containing an isocyanurate ring(s) can be further reacted with unsaturated acids, preferably (meth)acrylic acid, to obtain a curable polyacrylate. Both epoxy-functional isocyanurate and acrylate-functional isocyanurate thermosetting compositions can be further modified with a polyisocyanate to produce a composition that is useful as a reactive adhesive, binder or in other applications.

Abstract: The present invention provides a film suitable for applications requiring high water vapor transmission rates. The film comprises a polyolefin polymer together with from 1 to 30 percent by weight of the film of a hydrophilic polymer and from 30 to 75 percent by weight of the film of a filler having a hydrophilic surface functionality.

Abstract: Improved anti-corrosion systems or products are disclosed containing individual epoxy and curing agent fractions dispersed in low VOC ester-containing dispersants. Preferably, the epoxy fraction is a conventional epoxy resin, whereas the curing agent is an imidazoline. The dispersant advantageously includes a mixture of carboxylic acid esters, such as alkyl glutarate, succinate, and adipate esters.

Abstract: A process for printing a substrate comprising applying thereto an ink by means of an ink jet printer, wherein the ink comprises a latex binder, a liquid medium comprising water and organic solvent, and polymer-encapsulated pigment particles comprising a carboxy-functional dispersant crosslinked around a pigment core by a crosslinking agent, wherein the ink has a minimum film-forming temperature below 70° C. Inks are also claimed. The process and inks are useful for printing temperature-sensitive substrates, e.g. foil balloons and wrapping materials for special occasions.

Abstract: To provide a secondary battery porous membrane which is produced using a slurry for secondary battery porous membranes having excellent coatability and excellent dispersibility of insulating inorganic particles and is capable of improving the cycle characteristics of a secondary battery that is obtained using the secondary battery porous membrane, said secondary battery porous membrane having high flexibility and low water content and being capable of preventing particle fall-off. [Solution] A slurry for secondary battery porous membranes of the present invention is characterized by containing: insulating inorganic particles, each of which has a surface functional group that is selected from the group consisting of an amino group, an epoxy group; a mercapto group and an isocyanate group; a binder which has a reactive group that is crosslinkable with the surface functional group; and a solvent.

Abstract: The invention relates to heat-curing sealing compound compositions comprising at least epoxy resin, a heat-activatable hardening agent or accelerators (B) for epoxy resins, isocyanate group-containing polyurethane polymer (PUP) and a special polyaldimine. Said single-component sealing compound compositions are characterized by a good skin formation time and extraordinarily good storage stability and low blistering. Due to these properties, said sealing compound compositions are optimally suitable for use as sealants in autobody work because they can be excellently coated with a KTL paint.

Abstract: The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 ?m or less, and the ratio of particles having a particle diameter in excess of 20 ?m is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound.

Abstract: Provided are: a fiber-reinforced composite material which has mode I interlaminar fracture toughness, mode II interlaminar fracture toughness and compressive strength under heat and humidity conditions at the same time; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements (A), (B), (C) and (D). (A) An epoxy resin (B) Resin particles that satisfy the following conditions (b1)-(b3) and are insoluble in an epoxy resin (b1) The particle size distribution index is 1.0-1.8. (b2) The particle sphericity is 90 or more. (b3) The glass transition temperature of the particles is 80-180° C. (C) At least one elastomer component that is selected from among block copolymers containing a block having a glass transition temperature of 20° C.

Abstract: A non-aqueous pigment ink is provided, wherein the non-aqueous pigment ink comprises a pigment complex including a pigment, a dispersant comprising a functional group having reactivity with a polyvalent isocyanate compound, and a polyvalent isocyanate compound, and a non-aqueous solvent.

Abstract: A dry adhesive consisting at least of component A and component B. Component A being red in color and consisting of at least an epoxy resin, a coupling agent, an active diluting agent, an inorganic filler, and a red organic paste. Component B being green in color and consisting of at least an organic compound-modified amine as a curing agent, the coupling agent, the inorganic filler, an accelerator, a thickener, the active diluting agent, and a green organic paste. Also provided is a preparation method for the dry adhesive. The dry adhesive has high strength, good weather resistance, and is easy to prepare.

Abstract: Polyarylene sulfide compositions are described that exhibit high strength and flexibility. Methods for forming the polyarylene sulfide compositions are also described. Formation methods include dynamic vulcanization of a polyarylene sulfide composition that includes an impact modifier dispersed throughout the polyarylene sulfide. A crosslinking agent is combined with the other components of the composition following dispersal of the impact modifier throughout the composition. The crosslinking agent reacts with the impact modifier to form crosslinks within and among the polymer chains of the impact modifier. The compositions can exhibit excellent physical characteristics at extreme temperatures and can be used to form, e.g., tubular member such as pipes and hoses and fibers.

Abstract: Described herein is a UV-radiation curable pressure sensitive adhesive comprising: a polymerization reaction product of: (a) 0.5 to 25 wt % of a hydroxyl-containing (meth)acryate monomer of formula (I): wherein R1 is CH3 or H; and R2 is (i) a hydrocarbon moiety comprising at least 3 carbon atoms and a hydroxide group, or (ii) the hydrocarbon moiety comprising at least 4 carbon atoms, a catenary heteroatom, and a hydroxide group; (b) 0 to 3 wt % of polar crosslinkable monomer; (c) 40 to 99.5 wt % of a C4 to C20 (meth)acrylate ester monomer; (d) 5 to 30 parts of a hydrogenated hydrocarbon tackifier per 100 parts the weight sum of all monomers; and (e) 0.01 to 3 parts (solid/solid) of a cross-linking agent per 100 parts the weight sum of all monomers; and wherein the polymerization reaction product is substantially free of solvent.

Abstract: The present invention relates to (i) a reactive ink for ink jet printing comprising a two-component system, the first component comprising a polymerizable monomer, and the second component comprising a polymerization catalyst, wherein the monomer is able to form a polymeric film at low temperature within thirty minutes, preferably within ten minutes, from contacting the catalyst, (ii) a process of making an image on a non-porous substrate using such a reactive ink, and an ink jet print head including a two component ink-system.

Abstract: A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×104 or more.

Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of which the melt viscosity is not more than 0.5 Pa·s under the temperature of 150 ° C.; (B) phenolic resin, of which the structure is as shown in the formula 1: wherein, n represents an integer of 0-10. The epoxy resin composition of the present invention can provide the prepreg and copper clad laminate made therefrom with high glass transition temperature, high heat resistance, low expansion coefficient and low moisture absorption, which can meet demands of high reliability of high density multi-layer PCBs.

Abstract: Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths.

Abstract: The invention provides an improved appearance, glossy, autodepositing coating composition that maintains its desirable properties such as moisture barrier properties, although it is still able to deliver a glossy finish. No additional coatings are necessary over the instant coating to achieve a gloss. The glossy composition is accomplished by narrowing the molecular weight distribution and the molecular weight of an autodepositing epoxy dispersion coating by adding a chain transfer agent. The chain transfer agent is a thiol-containing compound made from an epoxy resin mixed with at least one ethylenically unsaturated monomer polymerized through a polymerization process, a curing agent, and a starter composition of peroxide, FeF3, and hydrofluoric acid. By eliminating the starter composition, a bath concentrate suitable for selling is manufactured.

Abstract: The present invention relates to compositions which comprise an olefinic component and a compound reactive or curable with the olefinic component, and which are suitable for production of release layers

Abstract: There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200° C. or less and a liquid resin that is in a liquid state at 10 to 50° C. at a ratio (solid resin/liquid resin) of 0.