Abstract: In accordance with this invention a procelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the procelain to the surfaces of the core.

Abstract: A method for preparing an abrasive coating from silane and an oxygen-containing gaseous compound such as N.sub.2 O, CO.sub.2, H.sub.2 O and the like is disclosed. The abrasive coating is prepared using the glow discharge method. The coating may be used to lap submicron articles.

Abstract: A III-V quaternary alloy photodiode comprises an n-type III-V binary alloy body; a III-V quaternary alloy layer chosen to have about the same lattice constant as that of said body grown on a major surface of said body; an electrically insulating layer grown on said quaternary alloy layer and having an opening therein extending through said second layer; a p-type layer of the same III-V binary alloy as said body, grown on said quaternary alloy layer in the area contiguous with the opening in said electrically insulating layer; a p-type region in said quaternary alloy layer in the region contiguous with the opening in said electrically insulating layer; and electrically conducting layers overlying a portion of said p-type binary alloy layer and of a second major surface of said body to provide electrical contact to the photodiode. The III-V quaternary alloy layer may be of n-type conductivity, electrically insulating, or have n-type and electrically insulating regions.

Abstract: A stamper protector is disclosed which is comprised of a recording cover and a center cover. The recording cover is made of a laminated material which has a tough outer layer and a resilient soft inner layer. The recording cover is cut in the form of an annular ring of a size such that it will cover the entire recorded area of the stamper from the outer molding land to the unrecorded center portion of the stamper. The center cover is cut to a size which will cover the entire center of the recording cover when it is adhered to the outer layer of the recording cover.

Abstract: An improved plasma etching apparatus having a light pipe inserted through the chamber wall for coupling light emitted by different chemical species out of the chamber. The light pipe collects the emission directly or after reflection from the coated surface of a substrate. Stabilization of the intensity of the collected emission is indicative of the end point of the etching process.The invention includes a method for detecting the end point of the etching process by monitoring the intensity of light emitted by a component of a gas contained in the chamber which passes out of the chamber through the light pipe. The light may be coupled directly into the light pipe or the light pipe may be so positioned as to detect the emitted light after it is reflected from the surface of the substrate. The intensity of the light is monitored until it stabilizes, indicating that the etching process is complete.

Abstract: The flash is removed from a freshly molded recorded disc by first bringing a knife against the edge of the disc and rotating the disc about its center to remove the major portion of the flash. A rotary cutter is then brought into contact with the edge of the rotating disc to remove the remaining portion of the flash. The rotary cutter provides the disc with a smooth edge and allows an accurate control of the diameter of the disc. The cutter is mounted on a pivotal bracket which is selectively moved toward and away from the disc by means of an air cylinder and piston which is connected to the bracket.

Abstract: An apparatus for cleaning a surface of an article such as a semiconductor wafer with cleaning fluid includes a nozzle extending from a chamber for developing a jet of cleaning fluid. The fluid is pressurized and megasonic energy is applied to the fluid by a megasonic transducer. The nozzle is shaped to provide a ribbon-like jet of cleaning fluid vibrating at megasonic frequencies for impingement on the surface of the article.

Abstract: The quality of the as-sawn surfaces of a wafer is improved by preventing the saw blade from striking the wafer surfaces during the blade return stroke by leaning the just-sawn wafer away from the blade and by slightly retracting the face of the ingot from the plane of the saw blade. A fluid-jet-induced deformation of the binding compound portion of the ingot is preferred as a means of leaning the wafer away from the saw blade. Using this technique a number of wafers may be successively sawn from an ingot and kept attached to the ingot by the binding compound without the surfaces of the wafers being scored during the return strokes of the blade.

Abstract: A chuck for use in the testing of semiconductor pellets comprising first and second electrically conductive members alternately arranged to provide a wafer receiving surface. The members are substantially completely electrically isolated from each other. An electric power lead and a measurement sensing lead are provided to the first and second conductive members, respectively.

Abstract: A mold for molding an information record having a relatively large diameter hole therethrough includes upper and lower mold members movable toward and away from each other. The upper mold member has a hole-forming pin extending therethrough and slidable therein. The pin has a recess in its end surface which faces the lower mold member. The recess has in a surface thereof at least one re-entrant which forms a lip. In molding a record, a plastic preform is placed between the mold members. The heated mold members are closed against the preform causing the plastic material to flow outwardly and fill the cavity between the mold members. The hole-forming pin is pushed through the plastic material with some of the plastic material filling the recess to form the hole in the record. When the mold members are separated the plastic material in the recess in the pin is retained in the recess by the lip.

Abstract: High density information discs comprising a conductive carbon loaded polyvinylchloride disc is lubricated with a fractionated methyl alkyl siloxane lubricant which contains an amino alkoxy silane.

Abstract: High density information discs that have been compression molded from a conductive carbon-containing polyvinylchloride molding composition are cleaned with a water based solution to remove water soluble salts from the surface of the disc, followed by a high temperature aqueous wash wherein the temperature is from about 110.degree. to about 130.degree. F. These discs have improved environmental stability.

Abstract: Apparatus for transferring material from one vacuum tight hopper to another includes funnel means having a valve member at one end adjacent the one hopper for controlling flow and valve means the other end of the funnel means for similarly controlling flow. Between the other end of the funnel means and the valve means there is provided collector door means movable between open and closed positions to prevent the material to be transferred from impinging on the sealing surfaces of the valve means.

Abstract: An evaporimeter is formed of a capillary tube hydraulically coupled to a sheet of filter paper to form a capillary system establishing hydraulic continuity of liquid between the tube and the surface of the filter paper. The rate of evaporation from the surface of the filter paper of a liquid such as water in the tube and filter paper is measured by the water front movement in the tube as the water is drawn from the tube to replace the evaporated water.

Abstract: A monocrystalline semiconductor substrate is provided, and a thin film pattern is defined on a surface thereof. An epitaxial layer is then grown on the substrate surface such that it overgrows the thin film pattern a predetermined distance. That portion of the thin film not covered by the epitaxial layer is then removed.

Abstract: A novel hydrogen rich single crystalline silicon material having a band gap energy greater than 1.1 eV can be fabricated by forming an amorphous region of graded crystallinity in a body of single crystalline silicon and thereafter contacting the region with atomic hydrogen followed by pulsed laser annealing at a sufficient power and for a sufficient duration to recrystallize the region into single crystalline silicon without out-gasing the hydrogen. The new material can be used to fabricate semi-conductor devices such as single crystalline silicon solar cells with surface window regions having a greater band gap energy than that of single crystalline silicon without hydrogen.

Abstract: A lapping machine includes a circular drive plate mounted on the end of a driven shaft and a circular lapping plate mounted on the drive plate. A pair of leveling levers are mounted between the drive plate and the lapping plate with each lever being in a groove in the drive plate. Each lever has a pivot point adjacent one end which is pivotedly seated on the drive plate and projects from the groove in the drive plate so that the lapping plate engages the lever. An adjustment screw is at the other end of each lever for adjustably pivoting the lever and thereby tilts the lapping plate with respect to the drive plate. Either the lapping plate or the drive plate has holes therethrough to permit access to the adjustment screws. A drive pin projects from the drive plate and fits in a groove in the bottom of the lapping plate to drive the lapping plate with the drive plate.

Abstract: A method and apparatus for welding a header to a heat sensitive cap to form an electro-optic device housing without weld flanges. A collet electrode is used to provide a radially compressive force which provides good electric and thermal contact to the wall of the heat sensitive cap and maintains the glass to metal seal under compression.

Abstract: An integral graphite susceptor of the barrel type comprising a hollow polyhedron arranged to support one or more semiconductor substrates on its outer planar wall surfaces. The substrates are supported in a novel column and row array in which each wafer is mounted on a wall surface portion that is related to the other adjacent wall surface portions in an equilateral triangular configuration to provide an efficient substrate support susceptor. Wafer edges extending beyond corners of the susceptor cause a disturbance in the gas flow resulting in more uniform deposition of epitaxial material.

Abstract: An electron flood exposure apparatus is disclosed which is comprised of an electron gun for providing an electron beam; a dispersing means for converting the electron beam into an electron flood; a post dispersion collimation and acceleration grid; and a target holder for holding a microlithographic resist which is to be exposed by the flood of electrons after collimation and acceleration by the acceleration grid.