Abstract: In a memory element with a first number of memory cells having a first retention time for holding a content of the memory cells and a second number of memory cells having a second retention time for holding the content of the memory cell, a method for refreshing the memory cells comprises a step of refreshing the first number of memory cells when reaching the first retention time and a step of refreshing the second number of memory cells when reaching the second retention time. An apparatus for refreshing the memory cells of the memory element is provided for refreshing the first number of memory cells when reaching the first retention time, and for refreshing the second number of memory cells when reaching the second retention time.

Abstract: A watercraft or assembly for a watercraft will reduce the shock and vibration of high speed travel that is transmitted to the occupants. The assembly provides shock and vibration reduction to the seats and control console. The assembly is pivotally connected to the watercraft at an aft element such as the transom. When a vessel is under way at high speeds, the transom is subjected to the least up and down motion, and the bow to the greatest motion. The assembly of the invention includes a horizontal base that is hingedly connected to the transom to pivot about a horizontal axis. Since the transom suffers the least motion, the axis will be most stable. The base is supported by spring bias means connected to the hull. Shock absorbers may also be connected to reduce the vibration of the base when the hull is moving at high speeds. Seats, console, and floor or foot rests may all be mounted on the base so that the occupants are shielded from the vibrations of the hull.

Abstract: A method and a semiconductor wafer configuration for producing an alignment mark for semiconductor wafers. In the method, an alignment mark region surrounded by a metal frame is formed on the semiconductor wafer. Subsequently, the alignment mark region and the metal frame are completely buried in at least one dielectric layer, in order to define an alignment mark area in the alignment mark region on the dielectric layer with a photolithography process. The boundary of the alignment mark area lies at a uniform distance within the boundary of the alignment mark region, defined by the metal frame. Subsequently (to uncover the alignment mark area by an anisotropic etching of the dielectric layer), the etching depth is defined in such a way that the alignment mark opening extends at least as far as the level of the metal frame.

Abstract: The integrated circuit has a test circuit, which is connected to an input terminal of the integrated circuit via a line connection. An isolating device is provided between an input terminal of the test circuit in order to completely isolate the line connection between the test circuit and the input terminal after the test circuit has performed a test procedure.

Abstract: A pyrolysis plant for refuse and a method for screening solid residues provide a sure and trouble-free sieving of a solid material using a sieving device having a configuration which is as simple as possible. A spiral formed by a rod which is wound in a helicoidal manner, or a plurality of such rods, are provided as the sieving device. The rod or rods can rotate around a longitudinal axis. The solid material is introduced into an interior formed by the rod for sieving, preferably with the assistance of an aligning device for longitudinally extended solid material parts. The spirals include, in particular, a bend so that the lodged solid materials can automatically detach themselves. The sieving device is especially suited for sieving pyrolysis residual material.

Abstract: Adhesion promoters for polymer coatings on metals are articulated into at least two head groups connected by a hydrocarbon spacer group. One head group reacts particularly well with polymer molecules. Other head groups form a durable bond with a metal surface. The length of the spacer group is such that a substance deposited in a substance layer on a metallic surface of a body or particle has hydrophobic properties. Suitable adhesion promoters can be sulfur compounds, amino compounds, hydroxyl or carbonyl compounds. A plastic composite body, a compound and a process of preparing a compound are also provided.

Abstract: The circuit configuration allows selective transmission of information items to a chip of a wafer during chip fabrication, and an apparatus having a needle card. During the test procedure of chips of a wafer which are tested in parallel, the problem can arise that, by way of example, an individual chip has a repairable defect or an incorrectly set voltage. Since a plurality of chips, for example memory modules, are tested simultaneously by a measuring device, it is not readily possible to transmit targeted information items to the individual chip. An external memory is thus assigned to each contact array on a needle card. In that memory, the individual information items are buffer-stored and transmitted to the individual chip. This affords the advantage that specific defective chips can be repaired in a simple manner without additional, costly control devices being necessary.

Abstract: A switching network with trimmable resistors lies in a control loop of a voltage generator that can be switched off from the supply voltage by a logic device. The logic device and also the switching network are driven by the same signals. The circuit configuration can be used for trimming or switching off the output voltage generated by the voltage generator during the functional test. As many settings as possible for the output voltage can be tested by a small number of control signals.

Abstract: A wheelslip is calculated from wheel speed, recorded by speed sensors (6), by a controller (8). A pre-set value for the wheelslip is regulated by means of a proportional controller. Parallel thereto, a set brake pressure for the wheel brakes (3) is fixed, which is determined by the controller (8), by means of the instantaneous wheel torque (Mmomentan) transferred to the ground by the particular wheel (2).

Abstract: A light-emitting semiconductor component having: a semiconductor element containing an active layer, electrical contacts for impressing a current into the active layer (heat being generated at the active layer and at the electrical contacts during operation), and a carrier with a large thermal capacity for absorbing the heat generated during operation. The rear side of the semiconductor element is electrically and thermally connected to the carrier by a conductive adhesive. Recesses, which accommodate a part of the conductive adhesive when the semiconductor element is connected to the carrier, are provided in the rear side of the semiconductor element.

Abstract: A game board includes concentric circular areas (outer, middle, and center) each having a respective subset of piece locations. A barrier separates locations in the outer and middle areas and/or in the middle and center areas. Outer and middle area locations and some center area locations are disposed in a ring. Other center area locations are disposed inside the center ring. The barrier has two to four openings for pieces to pass through. A barrier separating the center and middle areas has at most four openings, preferably two aligned on a single diameter. Outer area locations have at least two different visual identifiers. A game includes providing a playing piece set to players, each set having one special piece and different other pieces identical to one another. Each player takes turns to prevent an opponent's special piece from being able to move without elimination of any piece during the game.

Abstract: A device detects properties of a textile in appliances for treating textiles is provided. The device is fitted into the appliance. Examples of appliances with which the device can be used include washing machines, laundry dryers, spin dryers, machines for dry cleaning, and machines for dying textiles. The device includes sending element and a receiving element respectively for sending and receiving electromagnetic radiation. The receiving element is connected to an evaluation circuit. The evaluation circuit evaluates the radiation reflected and/or transmitted by the textile to render properties and composition of the textile and filling level of the appliance.

Abstract: An additional test mode is introduced in a semiconductor memory. A multiplicity of word lines are simultaneously activated by a word line decoder in the test mode. After a potential equalization of complementary bit lines, a logic “0” or a logic “1” is applied to an equalization circuit via a voltage generator. It is thus possible for the entire memory cell array to be preallocated an identical data value or, in strip form, alternating data values. Test time is thereby saved.

Abstract: An electronic output module, especially an electronic output module for CMOS-LVDS levels (LVDS-low voltage differential signalling), is suitable for analogue and digital high-frequency circuits. The output module has a first and a second transistor which are connected to a current source at a first connection and to input terminals by a control connection. A third and a fourth transistor are connected to a supply voltage potential by a first connection, to a second connection of the first and second transistors, and to an output terminal by a second connection and to converted input signals by a control connection.

Abstract: A configuration is described for making electrical contact between a flexible printed circuit board disposed on a supporting element and a contact spring has a sliding element which is disposed between the flexible printed circuit board and the contact spring so as to be incapable of being displaced with respect to the supporting element. When the contact spring is pushed onto the supporting element, the contact spring on the sliding element slides into its end position.

Abstract: A water-feed configuration for household appliances includes a hot-water hose 6 and a cold-water hose 8 connected to a single water inlet 32 of the household appliance through a branching section 24.

Abstract: A product care label to be attached to a textile product includes a textile carrier part with printed-on or woven-in care instructions reproducing information on the suitable treatment of the textile product and at least one transponder having an electronic component applied thereto. The transponder contains information on the suitable treatment of the textile product, with the information corresponding to the care instructions. Thus, machine readability of the care instructions is achieved and the situation where textile products are damaged due to improper treatment is avoided. A method for producing the product care label includes the steps of printing at least one of a care symbol and a care instruction onto a carrier tape, and simultaneously attaching at least one transponder onto the carrier tape.

Abstract: A process for producing a printing form includes forming a multiplicity of blind holes opening into a surface of a spatial or three-dimensional structure of the printing form, the blind holes serving for receiving a medium therein, and providing a propellant in the printing form for assisting in expelling the medium from the blind holes. A printing form produced by the process is also provided.

Abstract: The invention relates to an arrangement for operating an optical transmission or reception module at high data rates of up to 10 Gbit/s, having a TO package with electrical connections, an optical transmission or reception module arranged in the TO package, and a circuit board for making electrical contact with the electrical connections of the TO package. According to the invention, the circuit board (6) has RF lines (81, 82) and the electrical connections (41, 42) are connected to the RF lines (81, 82) in an arrangement parallel to the plane of the board. Preferably, provision is also made for an RF matching circuit to be produced on the board and for SMD components to be fitted directly and without further solder pads onto planar RF lines on the RF board. The cited measures serve to improve the RF properties of a TO module.