Abstract: A structure and method for fabricating integrated circuits which provides for the detection of residual conductive material. A first conductive layer is deposited over the integrated circuit and patterned to define a first interconnect layer. An insulating layer is then formed over the integrated circuit. A second conductive layer is then deposited and patterned to define a second interconnect layer. Residual conductive material can be formed during patterning of the second interconnect layer when portions of the second conductive layer remain adjacent to the vertical sidewalls of the first interconnect layer. To make the residual conductive material easier to detect, the conductivity of the residual conductive material is increased by either implanting impurities into the integrated circuit or siliciding the residual conductive material with a refractory metal.

Abstract: A method for forming a self-aligned contact utilizes a thin insulating layer formed on the upper surface of a conductive layer. A barrier layer is deposited over the insulating layer, and gate electrodes are then defined. Sidewall spacers are formed along the vertical sidewalls of the gate electrodes. During formation of the sidewall spacers the barrier layer protects the gate electrodes. A second insulating layer is then deposited and a via is opened to the substrate. A contact can now be created by depositing conductive material into the via.

Abstract: A relatively large number of test fixtures are provided for an available tester. The tester is programmed to access the individual test fixtures independently, and does so only when the devices connected to them are to be tested. When the test fixtures are not in such a test mode, local power sources provided for each fixture are used to apply stress voltages to the devices being tested. This frees the tester from the requirement for providing stressing voltages to the devices, allowing it to be efficiently used to perform testing on a larger number of devices concurrently.

Abstract: An isolation structure is provided to give improved protection from below ground current injection. A first epitaxial region is provided between a power field effect device and nearby control circuitry. The first epitaxial region is tied to the substrate, and the ties are located between the first epitaxial region and the power field effect device. On the opposite side of the power device, preferably adjacent an edge of the integrated circuit chip, a second epitaxial region is formed. This epitaxial region is connected to the first epitaxial region, preferably by a metal interconnect line. A second set of substrate contacts is located between the power device and the second epitaxial region, and is tied to ground. The second epitaxial region encourages injection of current at a location spaced away from the control circuitry.

Abstract: A method is provided for forming a field programmable device of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A first conductive layer is formed. A first, fusible, dielectric layer is formed over the first conductive layer. The dielectric layer is patterned and etched to form a plurality of dielectric regions exposing portions of the first conductive layer. A second dielectric layer is then formed over the dielectric regions and the exposed portions of the first conductive layer. A plurality of contact openings through the second dielectric layer are formed to expose portions of the first conductive layer and portions of the dielectric regions. A second conductive layer is then formed over the second dielectric layer and in the contact openings.

Abstract: A polycrystalline silicon layer is deposited and patterned to define a level of interconnect. Contact opening to lower conductive layers are then defined and patterned. A refractory metal such as tungsten is selectively deposited over the device, so that it adheres to the polycrystalline silicon in the interconnect leads and silicon of the lower conductive layer which is exposed in the contact openings. This provides a low resistance interconnect, and good, metal, contacts to underlying layers. Shared contacts between two or more polycrystalline silicon interconnect layers and in underlying conductive layers such as a substrate are easily formed using this technique.

Abstract: An interconnect structure, and method for forming same, is suitable for use in integrated circuits such as SRAM devices. The structure uses masking of a polycrystalline silicon interconnect level to move a P-N junction to a region within a polycrystalline silicon interconnect line, rather than at the substrate. This P-N junction can then be shorted out using a refractory metal silicide formed on the polycrystalline silicon interconnect structure.

Abstract: A local application connected to a remote application over a computer network can interrupt processing of the remote application. To do so, a new communications link is opened, and an identifier of the remote process to be interrupted is passed to the remote node. The new communications link is then closed. A manager process on the remote node raises the interrupt to the desired remote application, which returns acknowledgement of the interrupt over the original connection.

Abstract: A memory system including a memory array having at least two pairs of data lines, first and second data lines, that correspond to columns in the memory array. A first stage is included having inputs connected to the two pairs of data lines. The first stage also has a pair of output lines, a true output lines and a complement output line, wherein output signals generated in the output lines are controlled by a first and second set of transistors. Each transistor in the first set has a gate connected to one of the input lines, and each transistor in the second set is connected in series with one of the transistors in the first set and may be selectively turned on and turned off, wherein of one of the two pairs of data lines may be selected by turning transistors on and off in the second set.

Abstract: A method for planarization of an integrated circuit. After a first conducting layer is deposited and patterned, a first insulating layer is deposited over the device. A planarizing layer is then deposited over the integrated circuit and etched back. Portions of the planarizing layer may remain in the lower topographical regions of the first insulating layer to planarize the surface of the device. A second insulating layer is then deposited over the integrated circuit, followed by a third insulating layer. A contact via is formed through the layers to expose a portion of the first conducting layer. A second conducting layer can now be deposited and patterned on the device to make electrical contact with the first conducting layer.

Abstract: A system for supporting graphics display sessions on remote terminals contains a processing subsystem dedicated to graphics support. Applications execute on a central processor, and display related graphics commands are executed on the separate graphics controller subsystem. The graphics subsystem is preferably connected to multiple remote terminals over a network, and communicates with them without requiring all work to be performed by the central processor which is executing the applications.

Abstract: A method and circuit is provided for reading a memory array which utilizes multiple clocking signals during one read cycle to enable a dynamic sense amplifier to read data from the memory array. A dynamic sense amplifier is connected to an input line, a complementary input line, and a latch. A first equilibrating signal is input into the sense amplifier, followed thereafter by a first clocking signal. The first clocking signal enables the sense amplifier to read data on the input line and complementary input line. While the sense amplifier reads the data, the sense amplifier is isolated from the input and complementary input lines. Based upon the data read by the sense amplifier, an output state is provided for the latch. After reading the data, the sense amplifier is reconnected to the input and complementary input lines.

Abstract: A memory system comprising a memory array having at least two pairs of data lines, first and second data lines corresponding to columns in the memory array. The memory array also includes two level shifter circuits, a first shifter circuit connected to the first lines and a second level shifter circuit connected to the second data lines, wherein the level shifter circuits produce output signals and may be enabled and disabled. A selection signal is used to selectively enable and disable the level shifter circuits, wherein one pair of data lines may be selected. An amplification circuit is connected to the level shifters for amplifying the output signals from the level shifter circuits, and a logic circuit is used to generate logic output signals in response to the amplified output signals from the amplification circuit.

Abstract: An interconnect structure, and method for forming same, is suitable for use in integrated circuits such as SRAM devices. The structure uses masking of a polycrystalline silicon interconnect level to move a P-N junction to a region within a polycrystalline silicon interconnect line, rather than at the substrate. This P-N junction can then be shorted out using a refractory metal silicide formed on the polycrystalline silicon interconnect structure.

Abstract: A memory system that includes a memory array having at least two pairs of data lines, first and second data lines that correspond to columns in the memory array. The memory array also includes two disabling sense amplifier circuits, a first disabling sense amplifier circuit connected to the first data lines and a second disabling sense amplifier circuit connected to the second data lines, wherein the disabling sense amplifier circuits produce output signals and may be enabled and disabled. A selection signal is provided for selectively enabling and disabling the disabling sense amplifier circuits, wherein one pair of data lines may be selected. An amplification circuit connected to the disabling sense amplifier circuits provides for amplifying the output signals from the disabling sense amplifier circuits.

Abstract: A conductive layer is formed over an insulating layer and extending down into a contact opening. An insulating layer is then deposited over the device and in the opening, and etched back to form a plug of dielectric material in the bottom of the opening. An aluminum layer is then deposited over the device and in the opening under such conditions as to cause a substantially complete fill of the opening by the aluminum, and result in a planar surface above the opening.

Abstract: A method is provided for depositing a silicon nitride layer to protect and isolate underlying layers during wet etching. The silicon nitride layer maintains the integrity of interconnect leads, bond pads, and die boundaries by acting as a wet etch stop. The silicon nitride layer stops the chemicals used in a wet etch from reaching underlying layers in the integrated circuit.

Abstract: A comparator system for a cache tag RAM memory that makes use of data bus lines already available on the cache tag RAM. The true data bus lines are connected together at a connection point and form a "wired" connection or configuration. A "wired" connection may be for example, a "wired OR" "wired NOR" "wired AND" or "wired NAND" according to the present invention. The complement data bus lines on the cache tag RAM are connected in a similar fashion. The comparator system is connected to the cache tag RAM data bus lines and generates a hit or miss signal based on the data on the cache tag RAM data bus lines and input data that controls transistors connected to the cache tag RAM data bus lines, resulting in a faster comparison function.

Abstract: An interface for making information available to a user provides a display similar to a printed book or magazine. In order to "turn the page" of the displayed book, the user touches the screen with his hand or a pointing device, and moves it across the screen. Movement across the screen, while touching the screen, causes an animated turning of the page of the displayed printed material. This page turning technique is very similar to the turning of a page with an actual book or magazine.

Abstract: A method for forming integrated circuit structures includes the formation of high-value resistive elements and low resistance interconnect in a single polycrystalline layer. In one embodiment, interconnect regions of the polycrystalline silicon layer are masked, and resistive element regions are partially oxidized to reduce the thickness of the polycrystalline layer in such regions. Resistivity of the interconnect regions may then be reduced by implanting a high level of impurities in them, or by forming a refractory metal silicide layer over the interconnect regions. The oxide formed over the resistive elements during the oxidation thereof protects them from either of the following process steps, so that no masking is required. In an alternative embodiment, silicidation of the interconnect regions of the polycrystalline silicon layer may be performed without the prior local oxidations of the resistive element regions.