Patents Represented by Attorney Paul Weinstein

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  • Aluminum alloy semiconductor packages
    Patent number: 4939316
    Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.
    Type: Grant
    Filed: October 5, 1988
    Date of Patent: July 3, 1990
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, James M. Popplewell
  • Apparatus for recrystallization of thin strip material
    Patent number: 4934446
    Abstract: An apparatus and process for recrystallization of thin strip material includes a device for electromagnetically melting the thin strip material to provide a molten surface layer and a substantially solid core. Apparatus provides relative movement between the thin strip and the device for electromagnetically melting. Also, an apparatus resolidifies the molten surface layer to provide a preferred crystal structure in the thin strip material.
    Type: Grant
    Filed: October 12, 1984
    Date of Patent: June 19, 1990
    Assignee: Olin Corporation
    Inventor: Joseph Winter
  • Semiconductor die attach system
    Patent number: 4929516
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.
    Type: Grant
    Filed: February 10, 1986
    Date of Patent: May 29, 1990
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Julius C. Fister, Narendra N. Singhdeo, Deepak Mahulikar, Satyam C. Cherukuri
  • Die set for the formation of cavities for metal packages to house electronic devices
    Patent number: 4928512
    Abstract: A die set includes a punch for stamping a cavity in a work piece to produce a flat base surface and sidewalls which are perpendicular to the base surface. A forming bushing applies a deformation stress perpendicular to the stress applied by the punch to direct metal flow. In one embodiment, the impact surface of the punch contains piercing points to increase the depth of penetration of the punch.
    Type: Grant
    Filed: November 14, 1988
    Date of Patent: May 29, 1990
    Assignee: Olin Corporation
    Inventors: James F. Rooney, Harvey P. Cheskis
  • Process for low chloride 1,2,4-triazol-5-one
    Patent number: 4927940
    Abstract: A process for producing 1,2,4-triazol-5-one reacts an aqueous hydrazine solution with urea to form a reaction mixture of semicarbazide and ammonia, the reaction mixture is concentrated and an aqueous solution of a mineral acid added to form a slurry of a salt of semicarbazide. A formic acid compound is admixed with the slurry, and the slurry heated to produce 1,2,4-triazol-5-one. The novel process results in the production of a semicarbazide salt in situ and eliminates a number of process steps required in processes of the prior art.
    Type: Grant
    Filed: May 1, 1989
    Date of Patent: May 22, 1990
    Assignee: Olin Corporation
    Inventors: Max M. Boudakian, Delmer A. Fidler
  • Method of producing alkyl substituted 5-amidotetrazoles
    Patent number: 4921965
    Abstract: In a process for the production of Alkyl substituted 5-amidotetrazole compounds represented by the formula: ##STR1## wherein A represents NHX or NRR'X represents a lower alkyl groupR represents a lower alkyl group, andR' represents a lower alkyl group.reacts 5-aminotetrazole with an alkyl isocyanate or a dialkyl carbamoyl halide in a polar solvent.
    Type: Grant
    Filed: October 2, 1989
    Date of Patent: May 1, 1990
    Assignee: Olin Corporation
    Inventors: Eugene F. Rothgery, Steven A. Manke
  • Controlled operation of high current density oxygen consuming cathode cells to prevent hydrogen formation
    Patent number: 4919791
    Abstract: A process for the electrolysis of an alkali metal halide brine is operated in an electrolytic cell having an anode compartment containing at least one anode, a cathode compartment containing at least one cathode, and a cation exchange membrane separating the anode compartment from the cathode compartment.
    Type: Grant
    Filed: October 9, 1985
    Date of Patent: April 24, 1990
    Assignee: Olin Corporation
    Inventors: Ronald C. Miles, David D. Justice, Kenneth E. Woodard, Jr.
  • Chlorine bleach compositions with reduced fabric dye attack
    Patent number: 4909956
    Abstract: Chlorine bleaching granules for colored fabrics which minimize fabric dye attach and fabric damage.This is accomplished in a bleaching granule for preventing dye attack of fabrics during bleaching, the granule comprising an alkali metal chloroisocyanurate, a buffering agent, and a mitigating agent, where the active alkalinity of the granule is from about 0 to about -9.
    Type: Grant
    Filed: September 9, 1988
    Date of Patent: March 20, 1990
    Assignee: Olin Corporation
    Inventor: Ralph S. Webber
  • Interdiffusion resistant Fe-Ni alloys having improved glass sealing property
    Patent number: 4905074
    Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermediate compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.
    Type: Grant
    Filed: November 24, 1986
    Date of Patent: February 27, 1990
    Assignee: Olin Corporation
    Inventors: Chung-Yao Chao, John F. Breedis
  • Metal electronic package
    Patent number: 4897508
    Abstract: A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.
    Type: Grant
    Filed: February 10, 1988
    Date of Patent: January 30, 1990
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Sheldon H. Butt, Jacob Crane, Anthony M. Pasqualoni, Edward F. Smith
  • Sealed semiconductor casing
    Patent number: 4889960
    Abstract: Reinforced glass composites are disclosed which are useful in hermetic semiconductor packaging as well as other applications. The disclosed composites include discrete particles in a tin-phosphorous-oxyfluoride glass mixture having a low glass transition temperature to prevent serious degradation of the discrete particles.
    Type: Grant
    Filed: February 1, 1985
    Date of Patent: December 26, 1989
    Assignee: Olin Corporation
    Inventor: Sheldon H. Butt
  • Semiconductor package
    Patent number: 4888449
    Abstract: A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.
    Type: Grant
    Filed: January 4, 1988
    Date of Patent: December 19, 1989
    Assignee: Olin Corporation
    Inventors: Jacob Crane, Barry C. Johnson, Deepak Mahulikar, Sheldon H. Butt
  • Products formed of a ceramic-glass-metal composite
    Patent number: 4883778
    Abstract: The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: November 28, 1989
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Rigid magnetic recording disks and method of producing same
    Patent number: 4882236
    Abstract: The present invention discloses a rigid magnetic recording disk and a method of making the same. The substrate is formed by metallurgically bonding at least a first and second layer of clad materials. The hardness and mechanical strength of the first layer is substantially greater than the second layer. The first layer has a thickness which is from about 0.2% to about 20% the thickness of the second layer. The unbonded surface of the first layer is substantially flat and asperity free. The second layer is less dense than the first layer. A magnetic layer is deposited on the unbonded surface of the first layer.
    Type: Grant
    Filed: February 10, 1988
    Date of Patent: November 21, 1989
    Assignee: Olin Corporation
    Inventors: Charles W. Smith, Sheldon H. Butt, Eugene Shapiro
  • Electronic packaging of components incorporating a ceramic-glass-metal composite
    Patent number: 4882212
    Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: November 21, 1989
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Method and composition for controlled thickening of thermosetting resins using microencapsulated thickeners
    Patent number: 4876296
    Abstract: A method and composition employing microencapsulated thickeners for providing controlled thickening of thermosetting resins, including sheet molding compositions.
    Type: Grant
    Filed: April 27, 1987
    Date of Patent: October 24, 1989
    Assignee: Olin Corporation
    Inventors: J. Stanley Miller, Thomas J. Bowles
  • Semiconductor die attach system
    Patent number: 4872047
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
    Type: Grant
    Filed: November 7, 1986
    Date of Patent: October 3, 1989
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Satyam C. Cherukuri, Deepak Mahulikar, Brian E. O'Donnelly
  • Semiconductor package
    Patent number: 4866571
    Abstract: A semiconductor package for mounting a chip is disclosed. The package includes a first metal or metal alloy component having a first thin refractory oxide layer on a first surface. The chip is bonded to the first component. A skirt extends from the first component for strengthening the first component and providing heat transfer from the semiconductor package. A second metal or metal alloy lead frame having second and third refractory oxide layers on opposite surfaces is electrically connected to the chip and is bonded to the first oxide layer. Also, the lead frame is insulated from the first component by the first and second refractory oxide layers. A second metal or metal alloy component has a fourth refractory oxide layer on one surface and is bonded to the third refractory oxide layer so that the chip is hermetically sealed between the first and second components.
    Type: Grant
    Filed: August 23, 1984
    Date of Patent: September 12, 1989
    Assignee: Olin Corporation
    Inventor: Sheldon H. Butt
  • Chip carrier
    Patent number: 4862323
    Abstract: A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion.
    Type: Grant
    Filed: May 22, 1985
    Date of Patent: August 29, 1989
    Assignee: Olin Corporation
    Inventor: Sheldon H. Butt
  • Chip carrier
    Patent number: 4853491
    Abstract: A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion.
    Type: Grant
    Filed: September 27, 1985
    Date of Patent: August 1, 1989
    Assignee: Olin Corporation
    Inventor: Sheldon H. Butt