Abstract: In one embodiment, a protection device is used to protect a circuit. The protection device has a maximum rated power dissipation that is less than a maximum rated power dissipation of the circuit that is being protected.
Abstract: In one embodiment, a power supply controller is configured to switch a power switch of a power supply when a voltage across the switch is at a minimum value.
Abstract: In one embodiment, a power supply controller is configured to form a reference signal that has selectable values. The power supply controller is also configured to form a feed-forward signal in response to change in the value of the reference voltage and to use this feed-forward signal control the value of an output current.
Abstract: In one embodiment, a multi-channel power supply controller adjusts the value of an error signal to minimize overshoot and undershoot during load transients.
Abstract: In one embodiment, the ESD device uses highly doped P and N regions deep within the ESD device to form a zener diode that has a controlled breakdown voltage.
Abstract: In one embodiment, a transistor is formed to have a first current flow path to selectively conduct current in both directions through the transistor and to have a second current flow path to selectively conduct current in one direction.
Abstract: In one embodiment, a PWM controller is configured to form a drive signal that has an operating frequency that varies around a center by a percentage of the center frequency.
Abstract: In one embodiment, a zero crossing detector couples a plurality of comparators in parallel and operates at least a portion of the comparators at different time periods.
Abstract: In one embodiment, a linear regulator is formed with a variable miller compensation circuit that varies a zero of the linear regulator proportionally to a load current supplied by the regulator.
Abstract: In one embodiment, a secondary side power supply controller is configured to enable a secondary side power switch independently of a state of a drive signal used to control a primary side of the power supply.
Abstract: In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.
Abstract: In one embodiment, an in-rush limiter is configured to control an output voltage to increase at a rate that is independent of the load that is powered by the in-rush limiter.
Abstract: In one embodiment, a power supply controller utilizes a plurality of reference signals that operate at different frequencies to form a switching signal that is suitable to control a power device to regulate an output voltage.
Abstract: In one aspect, an operational amplifier is configured to form a quiescent current that is a ratio of a current of a current source of the operational amplifier and to provide a load current to a load that is not ratioed to the current of the current source.
Abstract: In one embodiment, a switching power supply controller decouples the power supply controller from receiving a sense signal during one portion of the operation of the power supply controller and couples the switching power supply controller to receive the sense signal during another portion of the operation.
Abstract: A fan speed control system (200) for an electronic equipment enclosure comprises means for determining temperature (201, 202, 203, 210, 211) at a plurality of locations within the enclosure, means for determining operating parameters (201, 202, 203, 212) for the fan control system, means for setting operating speed (201) of at least one cooling fan, and means for exchanging information signals (205, 217, 218) relating to fan speed control system operation with an external controller. A method is also provided for controlling fan speed for an electronic equipment enclosure comprising the steps of determining temperature at a plurality of locations within the enclosure, determining operating parameters for the fan control system, setting operating speed of at least one cooling fan, and exchanging information signals relating to fan speed control system operation with an external controller.
Abstract: In one embodiment, a start-up controller for a PWM power supply controller is formed to generate a current that is substantially constant for changes in temperature and for changes in an output voltage received by the start-up controller.
Abstract: A power supply monitoring system generates a monitor signal having information on more than one aspect of the power supply output. In one example embodiment, the monitor signal may be implemented as a square wave in which the duty cycle is proportional to output current, the peak amplitude is proportional to output voltage, and the average value is equal to output power.
Abstract: In one embodiment, a trench semiconductor device is formed to have an oxide of a first thickness along the sidewalls of the trench, and to have a greater thickness along at least a portion of a bottom of the trench.