Abstract: A circuit for the filtering of a pulse signal comprises means to detect an output pulse upon the detection of an input pulse, the shape of this output pulse being based on elementary delays obtained by the charging and discharging of capacitors. During the generation of the output pulse, no new input pulse can be taken into account.
Abstract: A monolithically integrated, transistor bridge circuit of a type suiting power applications, comprises at least one pair of IGBT transistors (M1,M2) together with vertically-conducting bipolar junction transistors transistors (T1,T2). These IGBT transistors are laterally conducting, having drain terminals (9,19) formed on the surface of the integrated circuit (1), and through such terminals, they are connected to another pair of transistors (T1,T2) of the bipolar type.
Type:
Grant
Filed:
September 20, 1993
Date of Patent:
November 7, 1995
Assignee:
Consorzio per la Ricerca sulla Microelectronica nel Mezzogiorno
Abstract: A plurality of integrated circuit devices are bonded to a substrate. Signal traces for corresponding pins of the devices are run to the same location, but are not electrically connected. They are, however, located in close physical proximity at a designated location. At this designated location, a properly shaped and sized contact can be used to contact all of the corresponding traces simultaneously, allowing parallel burn-in of all devices on the substrate to be performed. The devices can still be tested individually after burn-in. Once functionality of the overall subsystem has been confirmed and encapsulation completed, a permanent contact can be made at the designated location to all traces simultaneously so that the devices will be in parallel, and the substrate can be encapsulated to form a completed subsystem.
Abstract: In a 2-D graphics rendering system having a plurality of processors (PROC 0 to PROC 3) which receive instructions from a common instruction register (IR) and render polygons in a framestore (FS), in order to permit asynchronous performance of the instructions and yet ensure that overlapping polygons are properly rendered, each instruction includes an ordering code, and before writing a pixel to the framestore (FS) each processor checks that the ordering code of the polygon it is rendering is more significant than an ordering code for that pixel stored in an ordering buffer in which case the pixel is written to the framestore (FS) and the order buffer (OB) is updated, but if not the pixel is not written.
Abstract: A method for the programming of a data element in an electrically programmable memory in integrated circuit form comprising a data input/output bus, an address bus, a register for the control of instruction sequencing modes and an enable signal (/OE), said signal enabling the data output bus in an active state. When the control register receives a uniform programming instruction, it sends a uniform programming sequencing mode signal so that an inactive state of the enable signal triggers the programming of the data element at a memory address present in the address bus and so that the active state of the enable signal triggers the stopping of the programming operation. Also disclosed is an electrically programmable memory in integrated circuit form, implementing a method such as this. The disclosure can be applied to electrically programmable memories.
Abstract: An integrated transconductor circuit in which the input transistor(s) passes a current across a reference resistor. This conventional arrangement produces current error terms of Vbe/R and Ib. According to the present invention, these terms are compensated by providing a compensation resistor which is matched to the first resistor, and a compensation transistor which is matched to the input transistor, interconnected to feed the appropriate current components to the output. For even better compensation, an additional transistor is optionally added to remove the effect of base current of the compensation transistor. In differential embodiments, the compensation resistor may be bridged or split. Zero, one, or more stages of current mirroring can optionally be used to provide the desired output.
Abstract: A mold is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate and a body of solidified plastic resin. It consists of two plates which delimit at least one hollow adapted to receive the plate and to contain resin for forming the device body. Two elements of the mold push the plate from opposed sides against the bottom of the hollow. The hollow has two side extensions which are delimited by the side surfaces of the plate edges, thereby solidified projections are formed thereon which separate readily after the molding process. Thus, a structure is obtained wherein the plate has its bottom surface and two side edge portions fully exposed to allow optimum and controllable soldering to a printed circuit board.
Abstract: A pen-operable computer which also functions as a fully keyboard-operable computer. The keyboard contains an independent power supply, and is linked to the main chassis only by an infrared interface. The system chassis is very compact, but includes a full-width docking bay into which the keyboard can be latched for storage. When keyboard interface is desired, the user takes the keyboard module out of its docking bay and uses it in whatever position is most comfortable. When keyboard interface is not desired, the user simply snaps the keyboard module back into its docking bay for safe storage and/or transport.
Abstract: An integrated circuit unerasable memory cell which includes at least one memory cell consisting of a floating gate transistor with drain, source, and gate terminals, and a metallic shield embedded in the semiconductor substrate and covering the cell. Also provided are a diffused region defining a closed loop path on the substrate surface all around the transistor, and having said shield connected peripherally thereto in an unbroken fashion, and first and second wells extending in the substrate from the transistor to outside the diffused region, the first of said wells being connected directly to the gate terminal of the transistor. A contact inside the shield connects the shield's top surface to the cell's source. A protection diode (inside the shield) prevents charging of the floating gate during manufacture.
Abstract: A method for self-aligned zero-margin contacts to active and poly-1, using silicon nitride or other dielectric material with low reflectivity and etch selectivity to oxide for an etch stop layer and also for sidewall spacers on the gate.
Abstract: A circuit for the detection of a high threshold supply voltage comprising a voltage divider and an inverter. The voltage divider is formed by a reverse-biased voltage breakdown device, such as a Zener diode, and a resistive element, such as a forward-biased transistor or a resistor. The use of the reverse-biased voltage breakdown device in the divider makes the detection threshold voltage (Vo) of the circuit stable and precise even with variations in threshold voltages due to temperature and manufacturing process variations.
Abstract: A supply-voltage-monitoring circuit, for low-power integrated circuits, in which charge-sharing through a switched-capacitor chain is used to couple the supply voltage to a dynamic sensing node. The dynamic sensing node drives a half-latch, which is stable in a no-alarm condition. In this circuit, the state of the output gets switched over in the first phase if the voltage at the terminals of the capacitor at the start of this stage (this voltage being equal to a fraction of the input voltage) crosses a determined threshold. This threshold is determined as a function of technical parameters for the construction of the circuit. These technical parameters are chiefly the threshold voltage of the transistor and the characteristics of the transistors that form the locking circuit.
Abstract: A method for planarizing integrated circuit topographies, wherein, after a first layer of spin-on glass is deposited, a layer of low-temperature oxide is deposited before a second layer of spin-on glass.
Abstract: A novel electrically programmable and erasable memory cell, comprising a single transistor, which is a floating gate transistor and has no selection transistor. Means are provided for establishing a high capacitive coupling between the drain and the floating gate. The capacitive coupling between the source and the floating gate is low, as is normally the case. Preferably, the control gate only partly covers the floating gate. Another part of the floating gate is covered by a semiconductor layer connected to the drain. It is the latter layer which establishes the high capacitive coupling according to the invention. Programming can then take place by the Fowler-Nordheim effect with the source under high impedance, i.e. without hot electron effect.
Abstract: The use of electromechanical devices for the configuration of the address for access to a peripheral unit in a data-processing system is avoided by replacing them with a non-volatile EEPROM-type memory. The dam in non-volatile memory is read as soon as the peripheral unit is put into operation, and the information that it delivers is stored in volatile memory and used as a comparison address to validate the operation of the peripheral unit.
Abstract: A resistor-capacitor-transistor type of integrated circuit comprises mainly a non-self-aligned N diffusion bar 1 covered with a polysilicon plate, and a drain type N diffusion, self-aligned by the polysilicon plate. The resulting structure is a distributed resistor-capacitor-transistor quadripole whose main characteristics are that it is very compact and that the time taken by the capacitor to get discharged through the transistor is independent of the dimensions of the structure.
Abstract: The breakdown voltage of a VDMOS transistor is markedly increased without depressing other electrical characteristics of the device by tying the potential of a field-isolation diffusion, formed under the edge portion of a strip of field oxide separating a matrix of source cells from a drain diffusion, to the source potential of the transistor. This may be achieved by extending a body region of a peripheral source cell every given number of peripheral cells facing the strip of field-isolation structure until it intersects said field-isolation diffusion. By so connecting one peripheral source cell every given number of cells, the actual decrement of the overall channel width of the integrated transistor is negligible, thus leaving unaltered the electrical characteristics of the power transistor.
Abstract: A multiprocessor system which includes a control processor and a high-level data-transfer processor. Both of these two processors are docked by a shared variable-duration clock. The duration of the clock is adjusted on the fly, to accommodate whichever of the two processors needs the longest cycle time on that particular cycle. Thus, the control processor 110 and the data transfer processor 120 are enabled to run synchronously, even though they are concurrently running separate streams of instructions.
Abstract: A method for stress testing a memory array in an integrated circuit. Control circuitry selects a plurality of row lines at one time. An overvoltage suitable for stressing the cells of the array is placed on the bit lines. Because a block of cells has been selected, the overvoltage is applied to all cells of the block. The block of cells selected may be either the entire memory array or a portion of the memory array. The selected rows remain selected for the duration of the stress test. Because the overvoltage is applied directly to selected cells, the full overvoltage will be used to stress the transistor gates for the entire test period. In this manner, latent defects within the memory array can be detected.
Abstract: An overvoltage protection circuit comprises three protection components (21, 22, 23) connected by their first terminal to a common point (C) and by their second terminal to a first conductor (A), second conductor (B) and ground, respectively. Each protection component comprises the anti-parallel association of a protection component (T1, T2, T3) and a diode (D1, D2, D3), the common point being connected to a same polarity terminal of each protection component. In case one of the conductors exhibits, at the normal state, a polarization difference higher than the other with respect to ground, the cathodes or anodes of the protection components are connected to the common point according as the higher polarized conductor is negative or positive with respect to ground.