Patents Represented by Attorney Slater & Matsil, L.L.P.
  • Patent number: 8308052
    Abstract: A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Horng Chang, Yian-Liang Kuo, Chih-Hang Tung, Tsung-Fu Tsai
  • Patent number: 8309986
    Abstract: Semiconductor structures include a trench formed proximate a substrate including a first semiconductor material. A crystalline material including a second semiconductor material lattice mismatched to the first semiconductor material is formed in the trench. Process embodiments include removing a portion of the dielectric layer to expose a side portion of the crystalline material and defining a gate thereover. Defects are reduced by using an aspect ratio trapping approach.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Anthony J. Lochtefeld
  • Patent number: 8311055
    Abstract: In accordance with an embodiment, a method of operating a base station configured to operate with user devices includes scheduling transmission for the user devices. Scheduling transmission includes determining a first fading metric for at least one user device from the at least one user device to the base station, determining at a second fading metric for the at least one user device from the at least one user device to at least one other base station, and determining a priority metric for the at least one user device based on the first and second fading metrics. The priority metric is configured to assign a higher priority to a user device with a first fading metric indicating an up-fade and the second fading metric indicating a down-fade. The method further includes transmitting a transmission schedule to the at least one user device based the priority metric.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: November 13, 2012
    Assignee: Futurewei Technologies, Inc.
    Inventors: Gamini Senarath, Israfil Bahceci, Peiying Zhu, Aaron Callard
  • Patent number: 8304963
    Abstract: A piezoactuator of multilayer design includes piezoelectric layers and electrode layers to form a stack. A predetermined breaking layer for the targeted origination and guiding of cracks is introduced between two adjacent electrode layers. The predetermined breaking layer has a barrier region, in which the formation of continuous electrically conductive paths or the formation of cracks leading through the barrier region is impeded.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: November 6, 2012
    Assignee: EPCOS AG
    Inventors: Reinhard Gabl, Alexander Glazunov, Georg Kuegerl, Martin Galler
  • Patent number: 8306146
    Abstract: A system and method is proposed for progressively quantizing channel state information for application in a MIMO (multiple input multiple output) communication system. A method includes computing an estimate of a communications channel between a subscriber unit and a base station, quantizing the estimate with a first codebook, thereby producing a first quantized estimate, quantizing an (n?1)-th quantized estimate with an n-th codebook, thereby producing an n-th quantized estimate, where n is an integer value ranging from 2 to R, R is a total number of quantizations of the estimate, wherein the n-th codebook is a localized codebook. The method also includes incrementing n, repeating the quantizing an (n?1)-th quantized estimate until n=R, and transmitting information based on the R quantized estimates to the base station.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: November 6, 2012
    Assignee: FutureWei Technologies, Inc.
    Inventors: Robert Wendell Heath, Jr., Tao Wu
  • Patent number: 8304295
    Abstract: Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: November 6, 2012
    Assignee: Infineon Technologies AG
    Inventors: Soon Lock Goh, Swee Kah Lee, Chin Wei Ronnie Tan
  • Patent number: 8305161
    Abstract: A band-stop filter is proposed which is constructed on a multilayered substrate and consists of a parallel circuit comprising a bandpass filter and a high-pass filter. The two filters are at least partly realized in the form of LC-elements integrated into the substrate. Further circuit components can be arranged as discrete components on the substrate. In the filter branch having the bandpass filter, an electroacoustic resonator is arranged in a transverse branch to ground. By means of the filter, a wide stop band is obtained, while the passband or passbands can comprise a plurality of radio bands.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: November 6, 2012
    Assignee: Epcos AG
    Inventors: Thomas Bauer, Andreas Przadka
  • Patent number: 8304805
    Abstract: A photonic device comprises a substrate and a dielectric material including two or more openings that expose a portion of the substrate, the two or more openings each having an aspect ratio of at least 1. A bottom diode material comprising a compound semiconductor material that is lattice mismatched to the substrate occupies the two or more openings and is coalesced above the two or more openings to form the bottom diode region. The device further includes a top diode material and an active diode region between the top and bottom diode materials.
    Type: Grant
    Filed: January 8, 2010
    Date of Patent: November 6, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Anthony J. Lochtefeld
  • Patent number: 8298730
    Abstract: Semiconductor devices, methods of manufacturing thereof, lithography masks, and methods of designing lithography masks are disclosed. In one embodiment, a semiconductor device includes a plurality of first features disposed in a first material layer. At least one second feature is disposed in a second material layer, the at least one second feature being disposed over and coupled to the plurality of first features. The at least one second feature includes at least one void disposed between at least two of the plurality of first features.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: October 30, 2012
    Assignee: Infineon Technologies AG
    Inventors: O Seo Park, Sun-Oo Kim, Klaus Herold
  • Patent number: 8299616
    Abstract: A T-shaped post for semiconductor devices is provided. The T-shaped post has an under-bump metallization (UBM) section and a pillar section extending from the UBM section. The UBM section and the pillar section may be formed of a same material or different materials. In an embodiment, a substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like, having T-shaped posts is attached to a contact of another substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like. The T-shaped posts may have a solder material pre-formed on the pillar section such that the pillar section is exposed or such that the pillar section is covered by the solder material. In another embodiment, the T-shaped posts may be formed on one substrate and the solder material formed on the other substrate.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 30, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Chun Chuang, Chen-Cheng Kuo, Ching-Wen Hsiao, Chen-Shien Chen
  • Patent number: 8301503
    Abstract: A system for, and method of, providing requested information to a client. In one embodiment, the system includes: (1) a core information database that contains core information gleaned from the Internet and restructured according to a predetermined taxonomy and (2) a client communications interface, coupled to the core information database, that receives a request message from a client containing a request for some of the core information, derives a database query from the request message, causes the some of the core information to be retrieved from the core information database, formats the some of the core information into a response message according to display limitations of the client and transmits the response message to the client for display thereby.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: October 30, 2012
    Assignee: Incucomm, Inc.
    Inventors: John P. Volpi, Matthew N. Bowers, Kelly A. Hartley, Steven H. Roemerman, Jodi B. Rubin
  • Patent number: 8300616
    Abstract: A system and method for wireless communications is provided. A method for operating in a communications network includes receiving a codebook, the codebook includes a plurality of codewords, and determining if the codebook satisfies a constant modulus property. The method also includes in response to determining that the codebook does not satisfy the constant modulus property, converting the codebook into a codebook satisfying the constant modulus property, and storing the codebook satisfying the constant modulus property. The method further includes storing the codebook in response to determining that the codebook does satisfy the constant modulus property, and causing to transmit a transmission to a communications device, wherein the transmission is encoded using a codeword in the stored codebook.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: October 30, 2012
    Assignee: FutureWei Technologies, Inc.
    Inventor: Yang Tang
  • Patent number: 8300588
    Abstract: A system and method for user equipment (UE) measurement timing in a relay cell are provided. A method for controller operations includes broadcasting a first pattern of time intervals to communications devices served by a controller, and for a communication device served by the controller, determining a second pattern for the communications device, where the second pattern is based on the first pattern, and transmitting the second pattern to the communications device.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: October 30, 2012
    Assignee: FutureWei Technologies, Inc.
    Inventors: Yufei Blankenship, Deping Liu, Xiang Chen
  • Patent number: 8299729
    Abstract: In one embodiment, a light dimming module is disclosed. The light dimming module has a dimming engine coupled to a digital input interface and an output interface. The dimming engine is configured to provide a N-segment piecewise linear exponential digital control signal, and the output interface is configured to control the intensity of a light source.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: October 30, 2012
    Assignee: Infineon Technologies Austria Ag
    Inventors: Andrea Scenini, Andrea Logiudice, Roberto Filippo, Diego Gaetano Munari, Federico Tosato
  • Patent number: 8300462
    Abstract: A method includes performing an operation on an electrically erasable programmable read-only memory (EEPROM) array. The operation is selected from a program operation and an erase operation. The EEPROM array includes EEPROM cells arranged in rows and columns, and a plurality of word-lines extending in a column direction. Each of the plurality of word-lines is connected to control gates of the EEPROM cells in a same column. The EEPROM array further includes a plurality of source-lines extending in a row direction. Each of the plurality of source-lines is connected to sources of the EEPROM cells in a same row. During the operation, a first source-line in the plurality of source-lines is applied with a first source-line voltage, and a second source-line in the plurality of source-lines is applied with a second source-line voltage different from the first source-line voltage.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: October 30, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Pei Wu, Chia-Ta Shieh, Chih-Wei Hung, Mars Chen
  • Patent number: 8300785
    Abstract: A video conferencing system has a two-way mirror, which is between the observer and the display device, positioned at an angle to reflect a backdrop surface. The backdrop surface, which is further away from the two-way mirror than the image plane of the image display device, appears superimposed in a position behind the image of a person from the remote location. A camera is located in the backdrop at a position along the line of sight of the transmitted image so that a perceived eye contact is achieved. A system is disclosed wherein telepresence systems that are compatible with a pre-defined standard are connected via a network connecting, either directly or via a telepresence operations center, to provide interaction with substantially life-sized images of the remote participant displayed with three-dimensional depth cues in the room setting.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: October 30, 2012
    Assignee: TelePresence Technologies, LLC
    Inventor: Peter McDuffie White
  • Patent number: 8293127
    Abstract: A plasma etching method includes placing a printed circuit board into a processing chamber of a plasma etching machine; operating the plasma etching machine with a low concentration of tetrafluoromethane in the processing chamber if the plasma etching machine is operated at a high power level; and operating the plasma etching machine with a high concentration of tetrafluoromethane in the processing chamber if the plasma etching machine is operated at a low power level.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: October 23, 2012
    Assignee: Lockheed Martin Corporation
    Inventor: Joseph F. Rypl
  • Patent number: 8294197
    Abstract: A flash memory cell includes a substrate, a blocking layer over the substrate, a floating gate over the blocking layer, a retention layer over the floating gate, a control gate over the retention layer, a tunneling layer over the control gate, a top gate over the tunneling layer, and a voltage source electrically coupled between the top gate and the control gate. Various charge tunneling mechanisms may be used for charges to tunnel through the retention layer.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: October 23, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Tsong Wang, Tong-Chern Ong
  • Patent number: 8293616
    Abstract: Semiconductor devices with low junction capacitances and methods of fabrication thereof are described. In one embodiment, a method of forming a semiconductor device includes forming isolation regions in a substrate to form active areas. The sidewalls of the active areas are enclosed by the isolation regions. The isolation regions are recessed to expose first parts of the sidewalls of the active areas. The first parts of the sidewalls of the active areas are covered with spacers. The isolation regions are etched to expose second parts of the sidewalls of the active area, the second parts being disposed below the first parts. The active areas are etched through the exposed second parts of the sidewalls to form lateral openings. The lateral openings are filled with a spin on dielectric.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: October 23, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Hung Chang, Yu-Rung Hsu, Chen-Hua Yu
  • Patent number: D670263
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: November 6, 2012
    Assignee: Huawei Device Co., Ltd.
    Inventor: You Lin