Abstract: The present invention provides a method of depositing an amorphous fluorocarbon film using a high bias power applied to the substrate on which the material is deposited. The invention contemplates flowing a carbon precursor at rate and at a power level so that equal same molar ratios of a carbon source is available to bind the fragmented fluorine in the film thereby improving film quality while also enabling improved gap fill performance. The invention further provides for improved adhesion of the amorphous fluorocarbon film to metal surfaces by first depositing a metal or TiN adhesion layer on the metal surfaces and then stuffing the surface of the deposited adhesion layer with nitrogen. Adhesion is further improved by coating the chamber walls with silicon nitride or silicon oxynitride.

Abstract: The present invention provides an effective barrier layer for improved via fill in high aspect ratio sub-micron apertures at low temperature, particularly at the contact level on a substrate. In one aspect of the invention, a feature is filled by first depositing a barrier layer onto a substrate having high aspect ratio contacts or vias formed thereon. The barrier layer is preferably comprised of Ta, TaNx, W, WNx, or combinations thereof. A CVD conformal metal layer is then deposited over the barrier layer at low temperatures to provide a conformal wetting layer for a PVD metal. Next, a PVD metal layer is deposited onto the previously formed CVD conformal metal layer at a temperature below that of the melting point temperature of the metal to allow flow of the CVD conformal layer and the PVD metal layer into the vias.

Abstract: A temperature-controlled exhaust assembly with cold trap capability. One embodiment of the exhaust assembly comprises a multi-heater design which allows for independent multi-zone closed-loop temperature control. Another embodiment comprises a compact multi-valve uni-body design incorporating a single heater for simplified closed-loop temperature control. The cold trap incorporates a heater for temperature control at the inlet of the trap to minimize undesirable deposits. One embodiment also comprises a multi-stage cold trap and a particle trap. As a removable unit, this cold trap provides additional safety in the handling and disposal of the adsorbed condensables.

Abstract: The present invention generally provides a vacuum processing system with a process chamber and a rotating member, such as a magnetron in a PVD chamber, disposed in a cooling cavity of the process chamber, where the rotating member includes a deflection member for deflecting cooling fluid in the cooling cavity toward interior portions of the rotating member. In one embodiment, a base plate of the rotating member defines an upper surface of the rotating member and a magnet retainer defines a lower surface of the rotating member. Magnets are mounted between the base plate and the magnet retainer. The deflection member is mounted between the magnets and can be coupled to the magnets on one or both ends. One end of the deflection member is disposed toward the outer perimeter of the magnetron and the other end of the deflection member is disposed toward the interior portions of the rotating member.

Abstract: A method of accessing an array of storage devices comprising the steps of analyzing a data request from a user to determine the optimal storage device from which data should be retrieved, assigning the user to a first group of users that will access the optimal storage device in a first time period, retrieving data to fulfill the data request from the optimal storage device, and buffering the data in a buffer. Thereafter, the method assigns the user to a second group of users that will be supplied data from the buffer in a second time period, and then retrieving the data from the buffer and transmitting the data to the user to fulfill the data request.

Abstract: A method and apparatus for providing an interactive menu structure within an interactive information distribution system. The menu structure is embodied in a combination of software, which provides a so-called navigator and a set top terminal that provides certain functionality for the navigator and a video session manager which provides support functionality for the set top terminal. The menu structure has each menu (e.g., menu instructions, graphics and video) contained in downloadable applets which are sent upon request from the service provider equipment to the set top terminal for display. As such, the navigator functions are actually distributed between the service provider equipment and the subscriber's equipment. Such distribution provides an enjoyable, real-time interactive session that allows the user to rapidly navigate through a plethora of menus to find particular information which they desire to view.

Abstract: A more linear duty cycle modulator is made by converting the sine wave bias into a triangle wave bias utilizing a sample and hold circuit as the base band signal is added; on readout, low pass filtering of the high frequency content of the duty cycle modulated waveform, the base band signal is recovered at full amplitude as if saturation recording was being utilized. In a further preferred approach, quadature amplitude modulation and demodulation is utilized.

Abstract: The present invention generally provides a metallization process for forming a highly integrated interconnect. More particularly, the present invention provides a dual damascene interconnect module that incorporates a barrier layer deposited on all exposed surface of a dielectric layer which contains a dual damascene via and wire definition. A conductive metal is deposited on the barrier layer using two or more deposition methods to fill the via and wire definition prior to planarization. The invention provides the advantages of having copper wires with lower resistivity (greater conductivity) and greater electromigration resistance than aluminum, a barrier layer between the copper wire and the surrounding dielectric material, void-free, sub-half micron selective CVD Al via plugs, and a reduced number of process steps to achieve such integration.

Abstract: A magnetic drive system for moving a substrate transfer shuttle along a linear path between chambers in a semiconductor fabrication apparatus. A rack with rack magnets is secured to the shuttle, and a rotatable pinion with pinion magnets is positioned adjacent the rack so that the pinion magnets can magnetically engage the rack magnets. Thus, rotation of the pinion will cause the shuttle to move along the linear path. The magnets may be oriented with a helix angle between their primary axis and the axis of rotation of the pinion. One rack and one pinion are located on each side of the shuttle. A set of lower guide rollers supports the shuttle, and a set of upper guide rollers prevents the shuttle from lifting off the lower guide rollers.

Abstract: The present invention provides a method of reducing the overhead time associated with a high density ion metal plasma process. The method provides flowing a gas at a first flow rate and exhausting the chamber at a constant rate so that the rate at which gases are exhausted from the chamber at a steady state equals the flow rate of gases into the chamber. Another method provides flowing a gas at a first rate and then at a second flow rate which is about equal to the rate at which the gas is exhausted from the chamber at a steady state.

Abstract: A damascene structure, and a method of fabricating same, containing relatively low dielectric constant materials (e.g., k less than 3.8). A silicon-based, photosensitive material, such as plasma polymerized methylsilane (PPMS), is used to form both single and dual damascene structures containing low k materials. During the manufacturing process that forms the damascene structures, the silicon-based photosensitive material is used as both a hard mask and/or an etch stop.

Abstract: A fluid delivery system for delivering a process fluid to a vacuum processing system includes a secondary containment line surrounding a process fluid line. A purge gas flows through the secondary containment line and around the process fluid line in order to flow away any leaked process fluid. Alternatively, a heated fluid flows through the secondary containment line forming a heat trace around the process fluid line to heat the process fluid line and the process fluid by means of convection, which provides for precise uniformity of temperature throughout the length of the secondary containment line. The heated fluid loses heat to the ambient environment creating a temperature gradient through which the process fluid flows. The secondary containment line may have a heating element along its length for adding heat to the heated fluid to change the temperature gradient.

Abstract: A cleaning and filtering apparatus and method for a tank such as an aquarium. The major components are an inlet water controller, a suction unit, and a filter container unit. The filter container is selectively connected to the suction unit and a waste outlet to clean the tank and discharge waste water from the tank. The inlet water controller comprises a float connected to a valve to automatically replace the discharged water when the water level in the tank drops.

Abstract: The present invention generally provides a copper metallization method for depositing a conformal barrier layer and seed layer in a plasma chamber. The barrier layer and seed layer are preferably deposited in a plasma chamber having an inductive coil and a target comprising the material to be sputtered. One or more plasma gases having high molar masses relative to the target material are then introduced into the chamber to form a plasma. Preferably, the plasma gases are selected from xenon, krypton or a combination thereof.

Abstract: A method and apparatus for producing schedules for a wafer in a multichamber semiconductor wafer processing tool comprising the steps of providing a trace defining a series of chambers that are visited by a wafer as the wafer is processed by the tool; initializing a sequence generator with a value of a variable defining initial wafer positioning within the tool; generating all successor variables for the initial variable value to produce a series of values of the variable that represent a partial schedule; backtracking through the series of variables to produce further partial schedules; and stopping the backtracking when all possible variable combinations are produced that represent all possible valid schedules for the trace. All the possible schedules are analyzed to determine a schedule that produces the highest throughput of all the schedules.

Abstract: A substrate center-finding method and apparatus, for determining the center of a substrate being passed through a substrate handling chamber of a substrate processing system, includes any number of sensors arranged in any configuration and permits the substrate to pass through any trajectory that triggers the sensors. The locations of the sensors are calibrated by homing in on the sensors using a point, the reference point, near the tip of an arm assembly on a substrate handler. The substrate handler has an encoder for sensing the pivot angles of links in the arm assembly, whereby the coordinates of the reference point can be calculated from the angles and lengths of the links. When the substrate triggers a sensor, the location of the reference point is again calculated, and the coordinates of the trigger point on the edge of the substrate is determined relative to the reference point.

Abstract: The present invention generally provides a workpiece handling device and, more particularly, a vacuum operated chuck for securing a substrate to a substrate handling device. In one embodiment, the invention provides a chuck having three vacuum chuck rings projecting from a chuck base and having no resilient materials such as o-rings or the like exposed to the operating environment within which the wafer is being handled. In another embodiment, the present invention provides a substrate handling chuck having removable vacuum chuck rings for permitting interchangeable chuck ring elements for a particular application.

Abstract: A method and apparatus for retaining a substrate, such as a semiconductor wafer, upon an electrostatic chuck within a semiconductor wafer processing system. Specifically, the invention contains high voltage, DC power supply that is capable of both sourcing and sinking current at any polarity of output voltage level. This power supply is coupled to at least one electrode of an electrostatic chuck. Consequently, the power supply can be used to dynamically control the chucking voltage in response to any indicia of optimal chucking including leakage current, wafer-to-chuck potential, backside gas leakage rate, and the like.

Abstract: A chemical mechanical polisher includes a substrate carrier and support system which employs at least one motor to drive the substrate carrier through polishing motions. An additional driver for driving at least a portion of the carrier in directions perpendicular to the motions supplied by the motor(s) is also included. A clamping flexure is provided to selectively lock the substrate carrier in a vertical position. The substrate carrier, in one embodiment is mounted to a vertical driver via a column. The column is guided by spiral flexures to prevent motion in directions normal to vertical. An air mount is provided to support the majority of the mass of the substrate carrier, so that only a small force need be applied by the additional driver for movements in the vertical direction. Another drive mechanism is also described which provides both polishing motions as well as vertical force application.

Abstract: Films, made of polyethylenes and fillers, and articles made therefrom greater WVTR than previously available films based on conventional Ziegler-Natta based polyethylenes. The polyethylenes are produced in a metallocene-catalyzed production process. The films may be made by a cast film process, and may be made in widely varying filler content, generally polyethylene to filler ratios of 30/70 to 70/30. The metallocene based polyethylenes when combined with filler also permit the extrusion of thinner films leading to lighter weight and softer films. The m-polyethylenes utilized for making such films typically have a Composition Distribution Breadth Index above 50%, a Mw/Mn below 3, and a Mz/Mw below 2.