Abstract: A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.

Abstract: A computer-implemented method for dynamic resource management can include evaluating, by at least one processor, whether a priority of one or more processes associated with a request for one or more shared resources meets a threshold condition. The method can additionally include determining, by the at least one processor and in response to an evaluation that the priority meets the threshold condition, whether the one or more shared resources is available to meet the request. The method can further include completing, by the at least one processor and in response to a determination that the one or more shared resources is available, execution of the one or more processes. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A circuit design emulation system having a plurality of integrated circuits (ICs) includes a first IC. The first IC includes an originator circuit configured to issue a request of a transaction directed to a completer circuit. The request is specified in a communication protocol. The first IC includes a completer transactor circuit coupled to the originator circuit and configured to translate the request into request data. The first IC includes a first interface circuit configured to synchronize the request data from an originator clock domain to a transceiver clock domain operating at a higher frequency than the originator clock domain. The first IC includes a first transceiver circuit configured to convey the request data over a communication link that operates asynchronously to the originator clock domain.

Abstract: Performance adaptation for an integrated circuit includes receiving, by a workload prediction system of a hardware processor, telemetry data for one or more systems of the hardware processor. A workload prediction is determined by processing the telemetry data through a workload prediction model executed by a workload prediction controller of the workload prediction system. A profile is selected, from a plurality of profiles, that matches the workload prediction. The selected profile specifies one or more operating parameters for the hardware processor. The selected profile is provided to a power management controller of the hardware processor for controlling an operational characteristic of the one or more systems.

Abstract: An electronic device includes a processor that executes a guest operating system; a memory having a guest portion that is reserved for storing data and information to be accessed by the guest operating system; and an input-output memory management unit (IOMMU). The IOMMU writes, in the guest portion, information into guest buffers and/or logs used for communicating information from the IOMMU to the guest operating system. The IOMMU also reads, from the guest portion, information in guest buffers and/or logs used for communicating information from the guest operating system to the IOMMU.

Abstract: A system for providing system level sleep state power savings includes a plurality of memory channels and corresponding plurality of memories coupled to respective memory channels. The system includes one or more processors operative to receive information indicating that a system level sleep state is to be entered and in response to receiving the system level sleep indication, moves data stored in at least a first of the plurality of memories to at least a second of the plurality of memories. In some implementations, in response to moving the data to the second memory, the processor causes power management logic to shut off power to: at least the first memory, to a corresponding first physical layer device operatively coupled to the first memory and to a first memory controller operatively coupled to the first memory and place the second memory in a self-refresh mode of operation.

Abstract: In response to receiving a scene description, a processing system generates a set of planes in the scene and a bounding volume representing a partition of the scene. Using the set of planes in the scene, a compute unit of an accelerated processing unit performs a spatial test on the bounding volume to determine whether the bounding volume intersects one or more planes of the set of planes in the scene. Based on the spatial test, the compute unit generates intersection data indicating whether the bounding volume intersects one or more planes of the set of planes in the scene. The accelerated processing unit then uses the intersection data to render the scene.

Abstract: A method for increasing capacitance density within an integrated passive device can include forming a first trench capacitor within a first insulating layer overlying a substrate, forming a second trench capacitor within a second insulating layer overlying the first insulating layer, and connecting the first and second trench capacitors through connection vias that extend through the second insulating layer to form an integrated passive device (IPD) capacitor. A high capacitance density device can include a stacked and co-integrated architecture of two or more such layers.

Abstract: A method for increasing capacitance density within an integrated passive device can include forming a first trench capacitor within a substrate, forming a second trench capacitor within an insulating layer overlying the substrate, and connecting the first and second trench capacitors through connection vias that extend through the insulating layer to form an integrated passive device (IPD) capacitor. A high capacitance density device can include a stacked and co-integrated architecture of two or more tiers of trench capacitors.

Abstract: A disclosed semiconductor device includes (1) a silicon stack comprising a front-side Back-End-of-Line (BEOL) stack and a back side BEOL stack, the front-side BEOL stack comprising a plurality of signal routes and the back-side BEOL stack comprising a plurality of power delivery routes, and (2) a plurality of auxiliary power paths formed within the front-side BEOL stack and electrically coupled to the plurality of power delivery routes of the back-side BEOL stack via a plurality of programmable switches, the plurality of power delivery routes, the plurality of programmable switches, and the plurality of auxiliary power paths forming a programmable power delivery network (PDN). Various other apparatuses, systems, and methods of operation are also disclosed.

Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

Abstract: Sparse matrix operations using processing-in-memory is described. In accordance with the described techniques, a processing-in-memory component of a memory module receives a request for a vector element stored at a first location in memory of the memory module. The processing-in-memory component identifies an index value for a non-zero element in a sparse matrix using a representation of the sparse matrix stored at a second location in the memory. The processing-in-memory component then outputs a result that includes the vector element by retrieving the vector element from the first location in memory using the index value.

Abstract: Staging memory access requests includes receiving a memory access request directed to Dynamic Random Access Memory; storing the memory access request in a staging buffer; and moving the memory access request from the staging buffer to a command queue.

Abstract: Systems, apparatuses, and methods for dynamically coalescing multi-bank memory commands to improve command throughput are disclosed. A system includes a processor coupled to a memory via a memory controller. The memory also includes processing-in-memory (PIM) elements which are able to perform computations within the memory. The processor generates memory requests targeting the memory which are sent to the memory controller. The memory controller stores commands received from the processor in a queue, and the memory controller determines whether opportunities exist for coalescing multiple commands together into a single multi-bank command. After coalescing multiple commands into a single combined multi-bank command, the memory controller conveys, across the memory bus to multiple separate banks, the single multi-bank command and a multi-bank code specifying which banks are targeted. The memory banks process the command in parallel, and the PIM elements process the data next to each respective bank.

Abstract: In order to efficiently process graphics data, operations are performed including allocating a first set of resource slots for a first execution instance of a pipeline shader program; correlating the first set of resource slots with graphics pipeline passes; and on a second execution instance of the pipeline shader program, assigning resource slots, from the first set of resource slots, to the graphics pipeline passes, based on the correlating.

Abstract: A graphics processing unit (GPU) includes a plurality of programmable processing cores configured to process graphics primitives and corresponding data and a plurality of fixed-function hardware units. The plurality of processing cores and the plurality of fixed-function hardware units are configured to implement a configurable number of virtual pipelines to concurrently process different command flows. Each virtual pipeline includes a configurable number of fragments and an operational state of each virtual pipeline is specified by a different context. The configurable number of virtual pipelines can be modified from a first number to a second number that is different than the first number. An emulation of a fixed-function hardware unit can be instantiated on one or more of the graphics processing cores in response to detection of a bottleneck in a fixed-function hardware unit. One or more of the virtual pipelines can then be reconfigured to utilize the emulation instead of the fixed-function hardware unit.

Abstract: An apparatus includes one or more processors that are configured to determine a pixel-by-pixel bounds for a perturbed image, generate an adversarial example using an adversarial example generation technique, and modify the adversarial example to generate the perturbed image based on the pixel-by-pixel bounds. When an initial perturbed image does not reside within the pixel-by-pixel bounds, the one or more processors adjust the initial perturbed image to generate the perturbed image by a Weber-Fechner based adversarial perturbation to reside within the pixel-by-pixel bounds. The one or more processors provide the perturbed image to a computing device in an image-based Completely Automated Public Turing Test to tell Computers and Humans Apart (CAPTCHA).

Abstract: Systems, apparatuses, and methods for moving data from a memory in a computing system to an I/O device. A system includes a processor, memory, I/O controller, and power management circuitry. An application stores data in the memory that is to be ultimately conveyed to an I/O device. The I/O controller is configured to convey the data to an I/O device according to a service interval. The I/O controller is configured to fetch a first data item from the memory stored by the application, and prefetch one or more additional data items from memory. The first data and prefetched data are stored in a locally accessible buffer of the I/O controller. The I/O controller is then configured to convey each of the first data and one or more data items from the buffer to the I/O device at regular intervals of time during a given period of time, prior to initiating a fetch of additional data from the memory.

Abstract: Techniques are disclosed for communicating between a machine learning accelerator and one or more processing cores. The techniques include obtaining data at the machine learning accelerator via an input/output die; processing the data at the machine learning accelerator to generate machine learning processing results; and exporting the machine learning processing results via the input/output die, wherein the input/output die is coupled to one or more processor chiplets via one or more processor ports, and wherein the input/output die is coupled to the machine learning accelerator via an accelerator port.

Abstract: A method for driver calibration in die-to-die interfaces can include calibrating a delay lock loop of a delay line unit cell, by at least one processor, based on drive and load conditions of one or more driver unit cells of a physical layer of a die-to-die interconnect. The method can additionally include generating a clock signal, by the at least one processor, based on the delay lock loop. The method can further include communicating data, by the at least one processor, over the die-to-die interconnect based on the clock signal. Various other methods and systems are also disclosed.