Abstract: A test carrier includes a base member and a cover member. The base member includes a multi-layer board including a wiring line that is electrically connected to a die and a base film that supports the multi-layer board. The cover member includes a frame-shaped cover frame having an opening formed therein. The size of the multi-layer board is larger than the size of the die and is smaller than the size of the opening in a direction along a surface that is opposite to the die.

Abstract: A system including an automated test equipment (ATE) and an interface board. The interface board includes a temperature monitor that compares a sensor temperature to a predetermined temperature. The associated temperature sensor may be located near one or more selected components on the device under test or the interface board. If the sensor temperature exceeds the predetermined temperature the temperature monitor turns off one or more power supplies of the ATE.

Abstract: An automatic tuning assist circuit is coupled with a transmission antenna. The automatic tuning assist circuit injects a correction current into, or otherwise draws the correction current from, the transmission antenna. An H-bridge circuit is arranged between a first terminal and a second terminal coupled with the transmission antenna. The H-bridge circuit is switched on and off with a frequency that is equal to the frequency of a driving voltage. A third auxiliary coil is arranged between the output terminals of the H-bridge circuit.

Abstract: In an embodiment, a test floor apparatus includes at least one conveyor, a vertical stack buffer, and an automated handling station. The vertical stack buffer is operable to hold a plurality of DUT (device under test) receptacles and operable to place a DUT receptacle on the at least one conveyor to enable a corresponding DUT to be inserted into the DUT receptacle. The automated handling station is operable to access the DUT receptacle from the at least one conveyor and is operable to open the DUT receptacle to position the corresponding DUT in a manner that couples the corresponding DUT to an electrical interface of the DUT receptacle and that encloses the corresponding DUT inside the DUT receptacle to facilitate testing of the corresponding DUT.

Abstract: An automatic tuning assist circuit is coupled with a transmission antenna. Multiple switches SW and a first auxiliary capacitor CA are arranged between a first terminal and a second terminal of the automatic tuning assist circuit. A first control unit is configured to switch on and off the multiple switches SW in synchronization with a driving voltage VDRV. A power supply is configured to apply the driving voltage VDRV across a series circuit that comprises the transmission antenna and the automatic tuning assist circuit.

Abstract: A semiconductor device includes a first wafer having i) a plurality of semiconductor dies, ii) a plurality of scribe lines adjacent one or more of the semiconductor dies, iii) a test access interface positioned in one or more of the scribe lines, wherein the test access interface has a first plurality of through-substrate conductors with a standardized physical layout, and iv) electrical couplings between at least some of the through-substrate conductors and at least one of the semiconductor dies. Methods, apparatus and systems for testing this and other types of semiconductor devices are also disclosed.

Abstract: In an embodiment, a method includes causing a test floor system to insert a DUT (device under test) into a DUT receptacle. This is performed in a manner that couples the DUT to an electrical interface of the DUT receptacle and that encloses the DUT inside the DUT receptacle to facilitate testing of the DUT. Also, the method includes causing the test floor system to transport the DUT receptacle that encloses the DUT to a tester of the test floor system and to insert the DUT receptacle into a DUT testing module of the tester. Further, the method includes causing the test floor system to determine identification information of the DUT. Furthermore, the method includes, based on the identification information, sending a test routine to the DUT testing module to perform on the DUT.

Abstract: In an embodiment, a testing apparatus includes an air mixing chamber, a docking unit, and a DUT (device under test) test execution unit. The air mixing chamber includes a first air inlet operable to receive a first air flow, a second air inlet operable to receive a second air flow, and an air outlet operable to output a mixed air flow. The docking unit is operable to receive and to securely hold a DUT (device under test) receptacle including an electrical interface, an air flow interface, and a DUT coupled to the electrical interface. The DUT receptacle is configured to enclose and hold inside the DUT. The docking unit is operable to couple to the electrical interface and to the air flow interface. The docking unit is operable to receive and to send the mixed air flow to the DUT receptacle. A DUT test execution unit is coupled to the docking unit. The DUT test execution unit is operable to perform a test on the DUT that is inside of the DUT receptacle.

Abstract: An ATE system performs RA over NAND flash memory DUTs. A first UBM captures fresh failure related data from a DUT. A second UBM transmits existing failure related data. A fail engine accesses the stored existing failure related data and generates a failure list based thereon. The storing and the accessing the existing failure related data, and/or the generating the failure list, are performed in parallel contemporaneously in relation to the capturing the fresh data. The generated failure list is queued. A failure processor, which may be operable for controlling the capturing, computes a redundancy analysis based on the queued failure list. The first and second UBMs then ping-pong operably.

Abstract: There is provided a charged particle beam exposure apparatus which turns an array beam including a plurality of charged particle beams, being arranged side by side in a line in a direction intersecting line patterns, on and off at predetermined blanking timing, and thus performs irradiation when irradiated positions of the charged particle beams arrive at pattern positions. The charged particle beam exposure apparatus improves data processing control by segmenting a sample provided with line patterns into a plurality of exposure ranges each at a predetermined length in a direction of movement, and performing on-off control of the beams based on a point of time when the array beam passes on a reference position set in the exposure region.

Abstract: A holder and apparatus for terahertz imaging and/or spectroscopy of beads, particles or microparticles, and methods for terahertz imaging and/or spectroscopy of beads, particles or microparticles and making the holder are disclosed. The holder includes a tray having a substantially planar upper surface, and one or more offsets above or below the substantially planar upper surface. Each offset is configured to hold one of the beads, particles or microparticles, and has a height or depth configured to minimize or eliminate interference between reflections of the terahertz radiation from the tray and reflections of the terahertz radiation from the bead, particle or microparticle in or on the offset.

Abstract: Provided is a handler apparatus that conveys a device under test to a test socket, including: a socket fitting unit which the test socket fits, prior to fitting of a device holder holding the device under test to the test socket; a test-socket position detecting section that detects a relative position of the socket fitting unit with respect to the test socket in a state in which the socket fitting unit fits the test socket; an actuator that adjusts a position of the device under test on the device holder, based on the detected relative position of the socket fitting unit; and a conveyer that conveys the device holder in which the position of the device under test has been adjusted, to fit the test socket.

Abstract: A system and method for testing devices are presented. Embodiments of the present invention use a central controller to coordinate the testing of a plurality of devices under test as well as a plurality of channel circuits that are each operable to be coupled to at least one I/O pin of a device under test of the aforementioned plurality of devices under test. Also, embodiments of the present invention include a plurality of intermediate processors that are each coupled to the central controller and operable to receive and send control signals. These intermediate processors are each coupled to a different set of channel circuits of the plurality of channel circuits and are operable to execute their own instantiation of a test program that is independent of any other intermediate processor of the plurality of intermediate processors for the testing of a device under test associated therewith.

Abstract: A method for testing a semiconductor device is disclosed. The method comprises positioning a probe card comprising a plurality of probes above the semiconductor device and moving the probe card in a vertical direction towards the semiconductor device. The plurality of probes are moving in a vertical direction towards a plurality of electrical structures of the semiconductor device until each probe of the plurality of probes has made mechanical contact with a corresponding electrical structure of the plurality of electrical structures with a minimum quantity of force. The each probe of the plurality of probes absorbs a portion of vertical overdrive after contacting their corresponding electrical structures. The probe card absorbs any remaining vertical overdrive. The vertical overdrive is a continuing vertical movement of the plurality of probes after a first probe of the plurality of probes mechanically contacts a first corresponding electrical structure.

Abstract: According to the present invention, an electromagnetic wave measurement device includes an electromagnetic wave output device and an electromagnetic wave detector. The electromagnetic wave output device outputs an electromagnetic wave having a frequency equal to or more than 0.01 [THz] and equal to or less than 100 [THz] toward a sample acquired by adhering a plurality of specimens to each other by an adhesive and a reflective body arranged behind the sample. The electromagnetic wave detector detects a reflected electromagnetic wave, which is the electromagnetic wave reflected by one of the sample and the reflective body. The electromagnetic wave measurement device determines whether a joint by the adhesive is excellent or not based on the detected reflected electromagnetic wave.

Abstract: A probe includes a transmission line support substrate, a probe tip and a probe tip support substrate. The transmission line support substrate supports a transmission line through which a terahertz wave is transmitted. The probe tip transmits the terahertz wave, and is contact with an object to be measured. The probe tip support substrate supports the probe tip. The probe tip support substrate is detachable from the transmission line support substrate.

Abstract: According to the present invention, an electromagnetic wave measurement device includes an electromagnetic wave output device and an electromagnetic wave detector. The electromagnetic wave output device outputs and electromagnetic wave having a frequency equal to or more than 0.01 [THz] and equal to or less than 100 [THz] toward a sample acquired by adhering a plurality of specimens to each other by an adhesive. The electromagnetic wave detector detects a transmitted electromagnetic wave, which is the electromagnetic wave having transmitted through the sample. The electromagnetic wave having transmitted through the sample. The electromagnetic wave measurement device determines wherein whether a joint by the adhesive is excellent or not based on the detected transmitted electromagnetic wave.

Abstract: Provided is an electronic device handling apparatus capable of increasing the number of simultaneous measurements while suppressing the increase in cost. An electronic device handling apparatus, which moves bare dies relative to a probe card, includes: a thermal head which includes a plurality of holding regions each of which holds the bare die and has openings; at least one lift unit which is movably held by the thermal head so as to correspond to the holding regions and is able to advance and retreat through the openings; a moving device which moves the thermal head; and a fixed arm which is able to support the one lift unit.

Abstract: An automatic tuning assist circuit is coupled with a transmission antenna. The transmission antenna injects a first correction current into, or otherwise draws the first correction current from, the transmission antenna. In the first state, the first auxiliary coil is coupled with the transmission antenna. In this state, the first correction current IA, which corresponds to a current that flows through the first auxiliary coil, is injected into or drawn from the transmission antenna. In the second state, the first auxiliary coil is decoupled from the transmission antenna. In this state, the current that flows through the first auxiliary coil flows through a current path which is independent of the transmission antenna. The state is switched between the first state and the second state with the same frequency as that of the driving voltage.

Abstract: There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays. An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.