Abstract: A LED current control system for use with an LED drive system which includes LED strings connected in series with respective current sink circuits, each of which causes a current to be conducted by the LED string to which it is connected. The drive system includes 3 or more ‘dimming’ inputs with which the LED string currents can be adjusted. The LED current control system comprises at least one minimum circuit which receives two or more dimming inputs and produces an output which is proportional to the lesser of the inputs, a multiplier circuit which receives the outputs of the minimum circuits and at least one other dimming input and produces an output ILED which is proportional to the product of the received signals, and a sink control circuit which receives ILED and controls the current sink circuits such that the string currents vary with ILED.

Abstract: A system and method to level-shift multiple signals from a first voltage domain to a second voltage domain with minimized silicon area. A level-shifting system may be organized by implementing a static level-shifter coupled to a plurality of dynamic level-shifters. The static level-shifter may provide a voltage control signal for each of the dynamic level-shifters. Each of the dynamic level-shifters may level-shift an individual input signal from a first voltage domain to a second voltage domain.

Abstract: A control circuit for use with a four terminal sensor, the sensor having first and second drive terminals and first and second measurement terminals, the control circuit arranged to drive at least one of the first and second drive terminals with an excitation signal, to sense a voltage difference between the first and second measurement terminals, and control the excitation signal such that the voltage difference between the first and second measurement terminals is within a target range of voltages, and wherein the control circuit includes N poles in its transfer characteristic and N?1 zeros in its transfer characteristic such that when a loop gain falls to unity the phase shift around a closed loop is not substantially 2? radians or a multiple thereof, where N is greater than 1.

Abstract: Disclosed is a micro-electro-mechanical switch, including a substrate having a gate connection, a source connection, a drain connection and a switch structure, coupled to the substrate. The switch structure includes a beam member, an anchor and a hinge. The beam member having a length sufficient to overhang both the gate connection and the drain connection. The anchor coupling the switch structure to the substrate, the anchor having a width. The hinge coupling the beam member to the anchor at a respective position along the anchor's length, the hinge to flex in response to a charge differential established between the gate and the beam member. The switch structure having gaps between the substrate and the anchor in regions proximate to the hinges.

Abstract: A receiver architecture for processing spread spectrum signals. The receiver has an RF front end to receive and down convert a broadcast signal to an intermediate frequency carrier. The IF signal is digitized and provided to a processor (which may be a software-driven DSP, an ASIC or other embodiment) for processing. A given IF carrier is removed and the signal is low pass filtered. The signal is provided to a number of channels, each, for example, correspond to a unique transmitter. On each channel the sample rate is reduced to a predetermined fixed rate with timing mismatch compensated. The Doppler frequency shift, as estimated for the channel, is removed succeedingly. A locally generated copy of the spreading code used by the transmitter is applied to the carrier and Doppler removed signal at the predetermined fixed sample rate. The de-spread signal is used to provide estimates of the Doppler shift and for subsequent sample selection.

Abstract: A sigma-delta analog-to-digital converter (“?? ADC”) may include a loop filter, ADC, a feedback digital-to-analog converter (“DAC”), and a control circuit. The feedback DAC may include several unit elements (resistors, capacitors, or current sources) that, ideally, are identical to each other but vary due to mismatch errors introduced during manufacture. Mismatch errors may introduce signal errors that generate undesirable noise frequencies and non-linearities in a ?? ADC output signal. Embodiments of the present invention provide a stability corrected second order shuffler that allows for the shaping of the frequency response by the ?? ADC to reduce the effect of the mismatch error between DAC unit elements. The second order shuffler may include accumulation correctors, to suppress saturation for accumulators within the shuffler. The suppression may compress the range of accumulation values for each accumulator while maintaining context for the values to stabilize operation of the second order shuffler.

Abstract: A gated-clock shift register including a series of clocked flip-flops with preceding outputs connected to subsequent inputs as a horizontal digital shift register. Each flip-flop (or other state holding device) includes a clock buffer between the respective flip-flop's clock, and the global clock. Each clock buffer propagates the clock signal when it determines the associated flip-flop will have a state change during that clock cycle (e.g., via an XOR of the flip-flops input and output signals). In the absence of a state change, that buffer does not propagate the clock signal, essentially only clocking the relevant flip-flops. Further, the clock buffer may be implemented with only NMOS devices (or alternatively, only PMOS devices), which offers power savings over an otherwise required CMOS implementation.

Abstract: An amplifier includes a fault protection control circuit biased from the signal pin and a fault protection circuit including a first PMOS transistor and a second PMOS transistor. The sources and bodies of the first and second PMOS transistors can be connected to one another, the drain of the first PMOS transistor can be connected to the amplifier's output, and the drain of the second PMOS transistor can be connected to a signal pin. During normal operating conditions, the fault protection control circuit can turn on the first and second PMOS transistors. However, the fault protection control circuit can turn off the first PMOS transistor and turn on the second PMOS transistor when an overvoltage condition is detected, and can turn on the first PMOS transistor and turn off the second PMOS transistor when an undervoltage condition is detected, even when the integrated circuit is unpowered.

Abstract: A switch may include a MOS transistor alternatively operating in an ON phase and an OFF phase, a first voltage level shifter, and a second voltage level shifter. The MOS transistor may include a source for receiving an input signal, a drain for connecting to a load, and a gate. The first voltage level shifter may be selectively coupled between the source and the gate during the ON phase, and the second voltage level shifter may be selectively coupled between the gate and the source during the OFF phase.

Abstract: A semiconductor circuit comprising a digital circuit portion, which comprises a combinatorial logic block. The semiconductor circuit further comprises a scan chain for loading and applying a predefined digital test pattern to inputs of the combinatorial logic block. A bi-directional communication port is adapted for writing incoming data to an address space of the digital circuit portion. Scan control hardware comprises a plurality of individually addressable scan control registers which are mapped to the address space of the bi-directional communication port. A method of testing the digital circuit portion involves, using the scan chain, writing bit values to inputs of the individually addressable scan control registers, and reading bit values from at least one output of an individually addressable scan control register. The method and semiconductor circuit allow thorough testing and diagnosing of failing semiconductor devices, including core logic thereof, while mounted on a printed circuit board.

Abstract: Timing generators and methods of generating timing signals are disclosed. In one implementation, a timing generator for an imaging device includes a timing generator memory configured to store timing information, a timing core coupled to the timing generator memory and configured to read the timing information from the timing generator memory, and a processor core coupled to the timing core and configured to control a plurality of counters. The timing core can be further configured to generate a plurality of timing patterns based on the timing information and the plurality of counters. The timing generator can also be configured to generate a plurality of toggle positions for a plurality of timing signals based on the plurality of timing patterns.

Abstract: A method for self-testing a dual-mass linear accelerometer in which a self-test voltage is applied to urge the two masses to move in opposite directions. Self-test signals are then applied to obtain a differential mode signal to detect masses repositioned in opposing directions. During testing, common disturbances to the two masses are rejected as common mode signals.

Abstract: A packaged integrated device can include a die attach pad having a top surface and a bottom surface. A plurality of leads physically and electrically separated from the die attach pad can be positioned at least partially around the perimeter of the die attach pad. An integrated device die can be mounted on the top surface of the die attach pad. A package body can cover the integrated device die and at least part of the plurality of leads, and at least a portion of the bottom surface of each of the plurality of leads can be exposed through the package body. A plating layer can cover substantially the entire width of an etched lower portion of the outer end of each lead and at least the exposed portion of the bottom surface of each lead.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A switching power supply control system may include logic to generate a greater number of second switching control signals in response to a first number of original switching control signals. For example, the logic may increase the number of phases that may be controlled by an existing switching power supply controller. The logic may be configured to steer feedback signals from the increased number of phases back to original feedback inputs on the controller.

Abstract: Apparatus and methods are disclosed, such as those involving a receiver device. One such apparatus includes an equalizer configured to process an input signal transmitted over a channel. The equalizer can include a programmable gain amplifier (PGA) block which includes an input node configured to receive the input signal; an output node; and a programmable gain amplifier (PGA). The PGA amplifies the input signal with an adjustable gain. The PGA block also includes a gain control block having an input electrically coupled to the input node. The gain control block is configured to adjust the gain of the PGA at least partly in response to the input signal from the input node such that the PGA generates an output signal with a substantially constant amplitude envelope to the output node.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A switched-capacitor digital-to-analog converter (DAC) circuit can include first and second sets of capacitors, an amplifier, a reference signal generator and interconnecting switches. The first and second sets of capacitors can be connected to first and second analog input signals responsive to a first clock signal, and to first and second reference voltages responsive to a second clock signal and digital control signals. The amplifier can be connected to the first and second sets of capacitors in response to the second clock signal. The reference signal generator can provide to the first and second sets of capacitors, responsive to the first clock signal, a common-mode reference signal to set a common-mode voltage at inputs of the amplifier, and can include components to replicate the operation of the first and second sets of capacitors. The switched-capacitor DAC circuit can be used to implement a multiplying DAC in a pipeline analog-to-digital converter.

Abstract: Techniques to generate boosted multi-level switched output voltages from a boosted multi-level Class D amplifier. The amplifier may include a multi-level H-bridge, which may include pairs of transistor switches coupled to a first, second, and third supply potential. The second supply potential may be a boosted representation of the first supply potential. The amplifier may receive an input signal, and from the input signal may generate pulse-modulated control signals to control the switching for the transistor switches of the multi-level H-bridge. The amplifier may generate the boosted multi-level switched output voltages from output nodes of the multi-level H-bridge.

Abstract: A system provides for a voltage reference having a small temperature coefficient spread. The voltage reference includes a PTAT voltage trimming circuit that accurately trims the CTAT voltage component of the bandgap type voltage reference. The voltage trimming circuit includes two bipolar transistors that are biased by biasing currents to create a specific base-emitter voltage difference at an output. The bias currents can be digitally trimmed by a current digital-to-analog (“DAC”) converter. This may result in the ability to trim the voltage reference at a single temperature, without the need to trim at two or more temperatures.